CN100524746C - 用于局部照明的高功率led模块 - Google Patents

用于局部照明的高功率led模块 Download PDF

Info

Publication number
CN100524746C
CN100524746C CNB028123662A CN02812366A CN100524746C CN 100524746 C CN100524746 C CN 100524746C CN B028123662 A CNB028123662 A CN B028123662A CN 02812366 A CN02812366 A CN 02812366A CN 100524746 C CN100524746 C CN 100524746C
Authority
CN
China
Prior art keywords
light
heat conduction
emitting diode
light emitting
core body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB028123662A
Other languages
English (en)
Other versions
CN1518768A (zh
Inventor
克里斯托弗·L·博勒尔
安东尼·D·波拉德
格雷格·E·伯克霍尔德
詹姆士·T·彼得罗斯基
马休·L·萨默斯
小罗伯特·F·卡尔利切克
小斯坦特恩·E·韦弗
查尔斯·A·贝克尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Current Lighting Solutions LLC
Original Assignee
Gelcore LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26743954&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN100524746(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Gelcore LLC filed Critical Gelcore LLC
Publication of CN1518768A publication Critical patent/CN1518768A/zh
Application granted granted Critical
Publication of CN100524746C publication Critical patent/CN100524746C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/0005—Fastening of light sources or lamp holders of sources having contact pins, wires or blades, e.g. pinch sealed lamp
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • F21V29/81—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires with pins or wires having different shapes, lengths or spacing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0083—Array of reflectors for a cluster of light sources, e.g. arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/041—Optical design with conical or pyramidal surface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/06—Optical design with parabolic curvature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Abstract

一种发光模块，包括一个发光二极管组件，该组件设置了一个前侧发光二极管阵列和一个后侧。后侧与一个导热的延伸片热联通，一个导热芯体与传导性的延伸片热联通。导热芯体包括一个电导体，在工作中与前侧发光二极管阵列联系，以及多个附件置于导热芯体的周围，以便它们与传导性的延伸片热联通。

Description

用于局部照明的高功率LED模块
技术领域
本发明一般涉及照明应用的发光二极管(LED)技术。它得到与局部模块照明(spot module illumination)应用有关的具体应用并具体参照其进行描述。然而，可以认识到本发明也可以修改为其他类似的应用。
背景技术
目前的局部模块灯技术主要依靠用于微型反射器(MR)和抛物线反射器(PAR)类型的灯照明的卤素类型的灯。但是使用卤素类型的灯用于局部照明有一些缺点。例如，过热会限制这些类型的灯用于商业和消费者应用。现有的LED方案在光源阵列中利用标准的、成品的、环氧树脂封装的、通孔的LED源。这些配置严重的限制了灯的输出亮度。因此，可以被LED技术实现的潜在市场突破相应地很有限。
到目前为止，在这个技术领域的努力主要集中在输出光的多色数字控制，以便在各种风格的封装件中提供“彩色薄涂(color wash)”能力。基于LED的灯已经被设计用于模仿MR灯的照明区域。然而，由于用来形成这些灯的LED不可以导热，这种灯的热阻系数大约为300℃/W，这些LED灯产生过热。因此，热负载对于传统的基于LED的MR灯是关键的问题。
解决热问题的一个尝试是将表面安装装置封装到金属包层(metal clad)印刷电路板(PCB)上。然而，这仅是平面的方法，在这种情况下PCB没有直接集成到包括在灯体中的吸热器固定装置中。因此，不可能将高功率LED灯包含在MR封装件中。
本发明提供一种新的和改进的装置和方法，克服了上述问题和其他问题。
发明内容
根据本发明的一个方面，提供了一种发光模块。它包括发光二极管组件，设置了前侧发光二极管阵列和后侧。后侧与一个导热延伸片热联通，一个导热芯体与该导热延伸片热联通。导热芯体包括一个电导体，在工作中与前侧发光二极管阵列联系，多个附件置于导热芯体的周围以便它们与该导热延伸片热联通。
根据本发明的另一方面，一个发光二极管阵列包括由电连接元件穿过的本体支撑的发光面。该本体包括与发光面热联通的导热芯体，导热芯体包括与发光面中的发光二极管电联通的电连接元件。多个导热附件围绕该导热芯体，并且它们与发光二极管组件热联通。
根据本发明的又一方面，提供了一种使用局部模块平台的灯。该灯包括安排在具有反向前向和后向侧面的LED组件中的多个LED。当将电供至那里时前向侧面选择性的从该LED提供照明。一个吸热器与LED组件的后向侧热联通，它用于吸收来自LED的热量。散热装置与吸热器热联通，它通过对流将来自吸热器的热散掉。
本发明的一个优点是它将会减少MR或PAR类型的灯或其他新颖的灯配置中的基于LED的局部模块(spot modules)的热阻系数。
本发明的另一个优点是它使得在MR或PAR类型的灯或其他新颖的灯配置中的局部模块中应用高功率LED成为可能。阵列中的LED数量可以根据具体应用的需要而改变。
本发明的另一个优点是它制造出了基本上可以模仿传统的MR灯的照明区域的基于LED灯。同样的方法也可以用于PAR类型灯的情况。
本发明的另一个优点是它产生的亮度水平超过传统的用夹子夹住的(clip-on)过滤MR灯。
本发明的另一个优点是初级或者初级和次级镜头结合的配置可以用于将光输出聚焦，以提供来自局部模块的从10°到65°光谱半波宽(full-width-half-maximum)范围的角度输出。
本发明的另一个优点是LED的工作温度被降低了，从而增加了基于LED的灯的工作寿命。
本发明的另外的优点将在本领域的技术人员阅读和理解了以下优选实施例的描述后变得明显。
附图说明
本发明可以以各种元件和元件的安排的形式、以及以各种步骤和步骤的排列而实现。附图只是为了解释优选实施例，而不被解释为对本发明的限制。
图1图解了适合于实施本发明的装置的第一实施例。
图2图解了适合于实施本发明的装置的第二实施例。
图3图解了适合于实施本发明的装置的第三实施例。
图4图解了适合于实施本发明的装置的第四实施例。
图5图解了适合于实施本发明的装置的另一实施例。
具体实施方式
参照图1，装置8包括分别安装到各自的电绝缘子安装架(submount)20，22，24的高功率LED 10，12，14的集成阵列。子安装架20，22，24固定到各自的井(well)30，32，34内的金属制成的后侧衬底26上。可以选择的是，LED 10，12，14直接固定到金属衬底26，由此可以不使用子安装架。LED 10，12，14所在的井30，32，34通常是直接冲压或钻孔到衬底材料中，以便优选地形成“反射器”形状。然而，还可以预见其它LED和井的配置。子安装架20，22，24(或者可选择的是LED 10，12，14)通过高导热材料(例如焊料、填充的环氧树脂、热胶带(heat tape)和/或其他具有优良导热性的粘合剂)固定到作为吸热器的后侧衬底26。LED 10，12，14通过导体38连接到电接触点36。
透镜40，42，44分别覆盖LED 10，12，14。可以选择的是，包括一个次级光学透镜阵列的帽被固定到井中的LED上。在这种情况下，透镜阵列中各个小透镜与LED和井以一对一的关系对应。
衬底26被固定到散热延伸片60上，它包括像金属这样的导热材料。在使用中，LED 10、12、14产生的热量被传递给衬底26，然后传送到散热延伸片60。热量在散热延伸片60上被基本均匀分布。散热延伸片60固定到导热芯体62上。导热的散热鳍片64包围芯体并从芯体62延伸。在所解释的实施例中，散热鳍片64形成了一个与芯体62干涉配合的独立的组件。在一个实施例中，在装配前通过收缩芯体62和扩大散热鳍片64来确保紧密的干涉配合。更具体而言，通过冷却芯体62(例如冷冻)将芯体的外径暂时收缩，通过加热散热鳍片64将吸热器散热鳍片64的内径暂时扩大。然后，散热鳍片组件被滑动到或被置于芯体62的周围。一旦部件恢复到周围环境的温度，就在散热鳍片组件和芯体62之间形成了紧密的干涉配合。由于散热鳍片64接触芯体62，热量通过散热鳍片64从芯体传导到外部环境。另外，散热延伸片60和鳍形的吸热器64可以作为一个单独的导热材料成型。电导体68、70穿过芯体62和散热延伸片60，以便将被引脚72、74接收的电供给LED 10，12，14。除了所示的例子外，也可以预见吸热器用于增加外表面区域以改进热控制的鳍形吸热器，同时提供给“灯”更具美感的外观。
本领域的技术人员可以理解阵列中LED的数量可以根据灯输出的需要而变化。
图2-5图解了本发明的其它实施例。这些实施例中的元件的参考标号采用与图1中图解的实施例中对应的元件参考标号相同的标号并在其后加了(’)符号。新的元件标示有新的标号。
参照图2，装置77包括基本为平面的衬底78，高功率LED10’，12’，14’安装在其上。盖子80固定在衬底78上。盖子80包括与LED10’，12’，14’具有一对一对应关系的凹进部分82，84，86。凹进部分82，84，86被成型用来形成各自的反射器(例如蜂窝形状)，反射器的形状可以是圆锥形、抛物线形或者是提供所需要的光线输出方向特性的具有特定断面形状的外形。
参照图3，本发明的另一个实施例包括一个装置90，具有安装到金属芯子(例如散热延伸片)110的多个高功率LED 100，102，104。可以选择的是，每个LED通过电绝缘的子安装架安装到金属芯子110。在这个实施例中，每个LED 100，102，104单独的封装为离散元件。此外，每个封装件包括单个的初级光学部件(例如透镜)112，114，116。封装件利用电路板120电连接。电路板120设计用于将从离散的封装件的散热最优化，例如带有金属芯的印刷电路板。可以选择的是，该板包含通孔122，124，126以允许包括在封装件中的吸热器直接连接到作为组件的吸热器的金属芯子110。LED 102，102，104通过导热粘合剂或焊料(例如热胶带)固定到金属芯子110。另外，导热粘合剂或焊料将LED 100，102，104固定到各自的子安装架，此外，将子安装架固定到金属芯子110。板120上的电路(未显示)将LED 100，102，104电连接到电源。电路最好由标准的金属或陶瓷材料形成；然而，还可以预见其它材料。
现在参照图4，另一个实施例的LED模块130包括多个导热柱或从LED阵列后侧伸出的成形的突出部分132，与上述的从导热芯体伸出相对。现在对于本领域的技术人员显而易见的是发光模块上的散热延伸部分或突出部分的位置是可以变化的，其他等同的功能布局也是可能的。此外，对于具体的应用，延伸部分或突出部分的形状、物理连续性和材料也可以变化。
图4还图解了外壳136，由塑料、金属或其他材料制成，附着在发光面周边的周围。在LED的对面，一个光学部件140优选的是通过螺纹、咬合、夹子、螺钉或类似物附着到外壳136上。光学部件140可以根据需要被着色(tinted)，或者与下面的LED颜色匹配来提供想要的颜色输出，或者可以是透明的，可以作为一个扁平的窗口、一个透镜、或其它光调节系统或者光线整形器、一个多菲涅耳光学系统、一个漫射片或者另外的装置而形成。可以选择的是，光学部件140可以包括一个微透镜板或这一个具有与下面的LED对准的光轴的小透镜阵列。在任何情况下，优选的是光学部件140附着到外壳136，以便其不同类型的种类根据需要易于互换，从而选择性地为各种应用定制模块130。另外，外壳136可以选择高度可调和/或可与各种不同高度的外壳互换，从而选择光学部件140和下面的LED之间需要的距离。技术人员将意识到，通过以这种方式在LED和光学部件140之间形成各种分隔，可以适应不同焦距的透镜。
参照图5，备用的固定装置150包括金属衬底152或折叠作为灯具的外壳的散热固定装置。包含在内的是高功率LED 156，158和对应的透镜160，162。这种本体152最好由铝或其他导热材料以适当铸造或机械加工的形状制成。用于将LED内连到电源(未图解)的电路170可以是直接在外壳组件上形成图案，或由附在外壳的顶表面的印刷线路板构成。该电路包括用于LED 156，158的开口并且还可以选择包括用于附加镜头160，162的机械特征。到电路170的电连接通过中间部分的接头174进行，其可以适合于接收电源或来自装置外的电源的引线。另外，可以通过在外壳中的通路或孔电连接。外壳中空的中间部分还可以用于容纳其它用于LED 156，158的电气控制电路，外壳的底部可以连接到一个合适的连接器设计中，以便连接到一个插座。散热片178包围组件的外部。本领域的技术人员可以理解一个单独的外壳中的阵列中的LED的数量和颜色可以根据灯输出的需要而改变。此外，附加的散热片的数量和排布可以根据需要而改变。
本发明的装置中公开的机械设计具有与约40℃/W或者更少的相似(例如大约15℃/W)的热阻系数。此外，可以理解装置8，77，90，130，150可以设计为模仿传统的MR或PAR类型的灯(例如MR-16灯)的照明区域。
优选的是，本发明使用的高功率LED产生饱和色(例如绿色，蓝色，青色，红色，橙色，黄色，或者琥珀色)和/或白光，以便各个灯产生至少大约60流明(lumens)的光。还可以预见到在阵列中的多种颜色。
优选的是，本发明的透镜和小透镜是折射、绕射、或菲涅耳透镜类型的并设计用于产生用于聚光灯应用的范围从大约10°到大约65°范围的局部照明光线。
还可以预见电源转换元件也被包括在装置8，77，90，130，150中，用于将交流(AC)输入(例如，12VAC，120VAC，或220VAC)转换成为LED供电的直流、低电压电源。还可以预见到用于通用的AC输入的电源转换元件。
还可以预见到装置8，77，90，130，150中的单个LED被选择性的操作。在这种情况下，单个的或成组的LED寻址(addressing)可以局部的通过位于灯具中的合适的控制电路实现，或者通过通信装置选择性地远程寻址单个的LED。
已经参照优选实施例对本发明进行了说明。显然，其他人在阅读和理解了以上详细描述后可以想到修改和变化。本发明意图构造成将所有这样的修改和变化包括在所附的权利要求和其等价物的范围之内。

Claims (17)

1.一种发光模块，包括：
发光二极管组件，包括一个平面的前侧发光二极管阵列和一个后侧，所述后侧与一个导热延伸片热联通；
拉长的导热芯体，具有与所述导热延伸片热联通的第一端，所述导热芯体被沿着相对于所述平面的前侧发光二极管阵列的横向的方向被拉长，以定义远离所述导热延伸片的第二端；和
多个附件，围绕所述导热芯体，所述多个附件与所述导热延伸片热联通，并沿远离所述导热芯体的方向延伸。
2.根据权利要求1所述的发光模块，还包括：
外壳，围绕所述前侧发光二极管阵列；和
光学部件，可拆卸地固定到与所述前侧发光二极管阵列相对的所述外壳。
3.根据权利要求1所述的发光模块，其中所述多个附件包括附着在所述导热芯体周围的散热片。
4.根据权利要求1所述的发光模块，其中所述发光二极管组件包括多个发光二极管，每个发光二极管放置在一个成形的凹进部分中，所述凹进部分和发光二极管被一个透镜覆盖。
5.根据权利要求1所述的发光模块，其中所述发光二极管组件包括单独封装的发光二极管元件。
6.根据权利要求5所述的发光模块，其中所述单独封装的发光二极管元件以与所述导热延伸片热联通的方式被固定。
7.根据权利要求1所述的发光模块，其中所述发光模块具有小于40摄氏度每瓦特的热阻系数。
8.根据权利要求1所述的发光模块，其中所述导热芯体和所述电导体的物理尺寸和外部形状设计成被容纳在一个固定装置中，所述固定装置从包含微型反射器类型的固定装置和抛物线反射器类型的固定装置的组中选择。
9.根据权利要求1所述的发光模块，其中所述前侧发光二极管阵列产生饱和色光，所述饱和色光产生于发出窄带光的发光二极管。
10.根据权利要求1所述的发光模块，其中所述前侧发光二极管阵列产生白光。
11.根据权利要求1所述的发光模块，其中所述前侧发光二极管阵列产生基于来自各种饱和色LED的混合的不饱和的颜色。
12.根据权利要求1所述的发光模块，其中所述前侧发光二极管阵列产生至少50流明的光。
13.根据权利要求1所述的发光模块，还包括在所述前侧发光二极管阵列中的可单独供电的多组二极管。
14.一种发光二极管组件，包括由一个本体支撑的发光面，电连接元件通过所述本体，所述本体包括：
一个拉长的导热芯体，与所述发光面热联通，所述拉长的导热芯体沿着相对于所述发光面的横向的方向被拉长，所述导热芯体提供一个路径用于所述电连接元件与所述发光面中的发光二极管电联通；
多个围绕所述导热芯体的拉长的导热附件，所述多个导热附件与所述发光二极管组件热联通。
15.根据权利要求14所述的发光二极管组件，其中所述多个导热附件包括附着到所述导热芯体的散热片。
16.根据权利要求15所述的发光二极管组件，其中所述散热片包括附着到所述导热芯体的一个附件边缘，所述附件边缘与所述导热芯体的中心轴平行。
17.根据权利要求15所述的发光二极管组件，其中所述导热附件包括附着到与所述发光面相对一侧的拉长的柱。
CNB028123662A 2001-05-26 2002-05-24 用于局部照明的高功率led模块 Expired - Lifetime CN100524746C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US29382701P 2001-05-26 2001-05-26
US60/293,827 2001-05-26
US10/063,924 US6799864B2 (en) 2001-05-26 2002-05-24 High power LED power pack for spot module illumination
US10/063,924 2002-05-24

Publications (2)

Publication Number Publication Date
CN1518768A CN1518768A (zh) 2004-08-04
CN100524746C true CN100524746C (zh) 2009-08-05

Family

ID=26743954

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028123662A Expired - Lifetime CN100524746C (zh) 2001-05-26 2002-05-24 用于局部照明的高功率led模块

Country Status (5)

Country Link
US (1) US6799864B2 (zh)
EP (2) EP1393374B1 (zh)
JP (1) JP4452495B2 (zh)
CN (1) CN100524746C (zh)
WO (1) WO2002097884A1 (zh)

Families Citing this family (238)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286746B1 (en) * 1997-08-28 2001-09-11 Axya Medical, Inc. Fused loop of filamentous material and apparatus for making same
US6712486B1 (en) * 1999-10-19 2004-03-30 Permlight Products, Inc. Mounting arrangement for light emitting diodes
US6578986B2 (en) * 2001-06-29 2003-06-17 Permlight Products, Inc. Modular mounting arrangement and method for light emitting diodes
US6974234B2 (en) * 2001-12-10 2005-12-13 Galli Robert D LED lighting assembly
CN1653297B (zh) 2002-05-08 2010-09-29 佛森技术公司 高效固态光源及其使用和制造方法
USRE47011E1 (en) 2002-05-29 2018-08-28 Optolum, Inc. Light emitting diode light source
US6573536B1 (en) * 2002-05-29 2003-06-03 Optolum, Inc. Light emitting diode light source
US20050269581A1 (en) * 2002-05-29 2005-12-08 Optolum, Inc. Light emitting diode light source
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
JP2004265986A (ja) 2003-02-28 2004-09-24 Citizen Electronics Co Ltd 高輝度発光素子及びそれを用いた発光装置及び高輝度発光素子の製造方法
US7095053B2 (en) * 2003-05-05 2006-08-22 Lamina Ceramics, Inc. Light emitting diodes packaged for high temperature operation
US7528421B2 (en) * 2003-05-05 2009-05-05 Lamina Lighting, Inc. Surface mountable light emitting diode assemblies packaged for high temperature operation
WO2004100213A2 (en) * 2003-05-05 2004-11-18 Gelcore Llc Led-based light bulb
US7777235B2 (en) * 2003-05-05 2010-08-17 Lighting Science Group Corporation Light emitting diodes with improved light collimation
US7300182B2 (en) * 2003-05-05 2007-11-27 Lamina Lighting, Inc. LED light sources for image projection systems
US7633093B2 (en) * 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US7001047B2 (en) * 2003-06-10 2006-02-21 Illumination Management Solutions, Inc. LED light source module for flashlights
TW576614U (en) * 2003-06-30 2004-02-11 Yi-Chen Tang Low-voltage driven high-brightness LED
TWI329724B (en) * 2003-09-09 2010-09-01 Koninkl Philips Electronics Nv Integrated lamp with feedback and wireless control
US7300173B2 (en) 2004-04-08 2007-11-27 Technology Assessment Group, Inc. Replacement illumination device for a miniature flashlight bulb
US7777430B2 (en) 2003-09-12 2010-08-17 Terralux, Inc. Light emitting diode replacement lamp
WO2005029185A2 (en) * 2003-09-16 2005-03-31 Matsushita Electric Industrial Co., Ltd. Led lighting source and led lighting apparatus
US7198386B2 (en) * 2003-09-17 2007-04-03 Integrated Illumination Systems, Inc. Versatile thermally advanced LED fixture
US7329024B2 (en) * 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
US7520628B1 (en) 2003-10-23 2009-04-21 Sloanled, Inc. High flux led lamp
US8632215B2 (en) 2003-11-04 2014-01-21 Terralux, Inc. Light emitting diode replacement lamp
US7281818B2 (en) * 2003-12-11 2007-10-16 Dialight Corporation Light reflector device for light emitting diode (LED) array
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
CN1316608C (zh) * 2004-02-13 2007-05-16 上海三思科技发展有限公司 一种改善led温升的散热针结构
IES20050086A2 (en) 2004-02-17 2005-09-21 William M Kelly A utility lamp
US7964883B2 (en) * 2004-02-26 2011-06-21 Lighting Science Group Corporation Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
DE102004011974A1 (de) * 2004-03-10 2005-09-22 Conrad Electronic Gmbh Leuchtmittel für eine Beleuchtungseinrichtung
TWI257718B (en) * 2004-03-18 2006-07-01 Phoseon Technology Inc Direct cooling of LEDs
US20050212439A1 (en) * 2004-03-25 2005-09-29 Integrated Illumination Systems, Inc. Integrating flex circuitry and rigid flexible circuitry, with high power/high brightness LEDs
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
EP1751732B1 (en) 2004-04-14 2014-11-19 Sloanled, Inc. Channel letter lighting system using high output white light emitting diodes
DE102004031685A1 (de) * 2004-06-30 2006-01-19 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement und optoelektronisches Bauelement
US7201497B2 (en) * 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
US7252408B2 (en) * 2004-07-19 2007-08-07 Lamina Ceramics, Inc. LED array package with internal feedback and control
US7490954B2 (en) * 2004-07-30 2009-02-17 Lumination Llc LED traffic signal
US7096678B2 (en) * 2004-09-01 2006-08-29 Gelcore Llc Method and apparatus for increasing natural convection efficiency in long heat sinks
DE102004047324A1 (de) 2004-09-29 2006-04-13 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung
TWI257465B (en) * 2004-10-11 2006-07-01 Neobulb Technologies Inc Lighting device with high heat dissipation efficiency
US20060098165A1 (en) * 2004-10-19 2006-05-11 Manuel Lynch Method and apparatus for disrupting digital photography
US7315048B2 (en) * 2004-10-22 2008-01-01 Avago Technologies Ecbu Ip (Singapore) Pte Ltd Method and apparatus for mixing light emitted by a plurality of solid-state light emitters
KR101170401B1 (ko) * 2004-11-19 2012-08-02 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 복합 발광 다이오드 모듈
JP2006154523A (ja) * 2004-11-30 2006-06-15 Fuji Photo Film Co Ltd 撮影装置
DE102004062989A1 (de) * 2004-12-22 2006-07-06 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Beleuchtungseinrichtung mit mindestens einer Leuchtdiode und Fahrzeugscheinwerfer
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
WO2006102785A1 (fr) * 2005-03-28 2006-10-05 Neobulb Technologies, Inc. Lampe led de grande puissance et efficace
KR101023177B1 (ko) * 2005-03-31 2011-03-18 네오벌브 테크놀러지스 인크 높은 열발산성을 갖는 고출력의 ｌｅｄ 조명 장비
US7726844B2 (en) * 2005-03-31 2010-06-01 Neobulb Technologies, Inc. Illuminating equipment using high power LED with high efficiency of heat dissipation
JP4849305B2 (ja) * 2005-04-08 2012-01-11 東芝ライテック株式会社 電球型ランプ
US7633177B2 (en) * 2005-04-14 2009-12-15 Natural Forces, Llc Reduced friction wind turbine apparatus and method
US8016457B2 (en) * 2005-05-12 2011-09-13 Finelite Inc Workspace lighting system
US7918591B2 (en) * 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
CN1869504B (zh) * 2005-05-25 2010-04-07 新灯源科技有限公司 发光二极管群集灯泡
US20070007558A1 (en) * 2005-06-27 2007-01-11 Mazzochette Joseph B Light emitting diode package and method for making same
KR20080036195A (ko) * 2005-07-13 2008-04-25 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 조명 시스템
KR100592508B1 (ko) * 2005-07-15 2006-06-26 한국광기술원 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지
US7850345B2 (en) 2005-08-17 2010-12-14 Illumination Management Solutions Inc. Optic for LEDs and other light sources
JP4492486B2 (ja) * 2005-08-24 2010-06-30 パナソニック電工株式会社 Ｌｅｄを用いた照明器具
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
JP2007087712A (ja) * 2005-09-21 2007-04-05 Toshiba Lighting & Technology Corp ランプ
TWI303302B (en) * 2005-10-18 2008-11-21 Nat Univ Tsing Hua Heat dissipation devices for led lamps
KR20080072671A (ko) * 2005-10-21 2008-08-06 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 조명 장치 및 광학 소자
US8465175B2 (en) 2005-11-29 2013-06-18 GE Lighting Solutions, LLC LED lighting assemblies with thermal overmolding
CN100454595C (zh) * 2005-12-09 2009-01-21 富准精密工业(深圳)有限公司 发光二极管模组
EP1963741B1 (en) * 2005-12-14 2020-08-19 Signify Holding B.V. Lighting device and method for manufacturing same
TWI333580B (en) * 2006-02-08 2010-11-21 Chimei Innolux Corp Backlight module and liquid crystal display using the same
US7488097B2 (en) * 2006-02-21 2009-02-10 Cml Innovative Technologies, Inc. LED lamp module
US7218056B1 (en) 2006-03-13 2007-05-15 Ronald Paul Harwood Lighting device with multiple power sources and multiple modes of operation
US7784969B2 (en) * 2006-04-12 2010-08-31 Bhc Interim Funding Iii, L.P. LED based light engine
US9335006B2 (en) 2006-04-18 2016-05-10 Cree, Inc. Saturated yellow phosphor converted LED and blue converted red LED
US7777166B2 (en) * 2006-04-21 2010-08-17 Cree, Inc. Solid state luminaires for general illumination including closed loop feedback control
JP4863203B2 (ja) * 2006-04-28 2012-01-25 スタンレー電気株式会社 半導体発光装置
US7824075B2 (en) * 2006-06-08 2010-11-02 Lighting Science Group Corporation Method and apparatus for cooling a lightbulb
DE202007007437U1 (de) * 2006-08-07 2007-09-06 Maas & Roos Lichtwerbung Gmbh Leuchtkörpersystem sowie Leuchtkörper für ein Leuchtkörpersystem
EP1898144A3 (de) * 2006-09-08 2010-08-25 Robert Bosch Gmbh Leuchtaggregat mit mehreren LED-Bauelementen und Verfahren zu seiner Herstellung
US7420811B2 (en) * 2006-09-14 2008-09-02 Tsung-Wen Chan Heat sink structure for light-emitting diode based streetlamp
US20080074874A1 (en) * 2006-09-22 2008-03-27 Peter Bradshaw Lighting systems
US7527397B2 (en) * 2006-09-26 2009-05-05 Chia-Mao Li Solid state lighting package structure
US7744259B2 (en) * 2006-09-30 2010-06-29 Ruud Lighting, Inc. Directionally-adjustable LED spotlight
DE102006049299A1 (de) * 2006-10-19 2008-04-30 Hella Kgaa Hueck & Co. Beleuchtungsvorrichtung für Fahrzeuge
US7566144B2 (en) * 2006-11-01 2009-07-28 Mcdermott Kevin Broad beam light
US10295147B2 (en) * 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
DE102007024390A1 (de) 2006-11-16 2008-05-21 Robert Bosch Gmbh LED-Modul mit integrierter Ansteuerung
CN101210664A (zh) * 2006-12-29 2008-07-02 富准精密工业(深圳)有限公司 发光二极管灯具
US20080175003A1 (en) * 2007-01-22 2008-07-24 Cheng Home Electronics Co., Ltd. Led sunken lamp
US7922360B2 (en) * 2007-02-14 2011-04-12 Cree, Inc. Thermal transfer in solid state light emitting apparatus and methods of manufacturing
CN101622907B (zh) * 2007-02-26 2012-06-13 皇家飞利浦电子股份有限公司 驱动照明设备
KR200437242Y1 (ko) * 2007-03-06 2007-11-16 광성전기산업(주) 교류 전원용 발광 다이오드 램프
US7540761B2 (en) * 2007-05-01 2009-06-02 Tyco Electronics Corporation LED connector assembly with heat sink
KR101500977B1 (ko) * 2007-05-04 2015-03-10 코닌클리케 필립스 엔.브이. 열 관리를 위한 ｌｅｄ 기반 설비들 및 관련 방법들
US8226270B2 (en) * 2007-05-23 2012-07-24 Sharp Kabushiki Kaisha Lighting device
TW200847469A (en) * 2007-05-23 2008-12-01 Tysun Inc Substrates of curved surface for light emitting diodes
US8075172B2 (en) 2007-06-08 2011-12-13 A66, Incorporated Durable super-cooled intelligent light bulb
EP2167866B1 (en) 2007-06-14 2016-04-13 Koninklijke Philips N.V. Led-based luminaire with adjustable beam shape
WO2009014707A2 (en) 2007-07-23 2009-01-29 Qd Vision, Inc. Quantum dot light enhancement substrate and lighting device including same
US7575339B2 (en) * 2007-07-30 2009-08-18 Zing Ear Enterprise Co., Ltd. LED lamp
DE102007040444B8 (de) * 2007-08-28 2013-10-17 Osram Gmbh LED-Lampe
CN101861759B (zh) * 2007-10-09 2012-11-28 飞利浦固体状态照明技术公司 用于控制多串联负载中的各个负载电流的方法和设备
CN100546058C (zh) * 2007-10-15 2009-09-30 佛山市国星光电股份有限公司 功率发光二极管封装结构
ITFI20070235A1 (it) * 2007-10-23 2009-04-24 Iguzzini Illuminazione Dispositivo di dissipazione per led e connesso metodo di produzione.
CA2706098C (en) * 2007-11-19 2014-09-09 Nexxus Lighting, Inc. Apparatus and method for thermal dissipation in a light
CA2706092C (en) * 2007-11-19 2014-08-19 Nexxus Lighting, Inc. Apparatus and methods for thermal management of light emitting diodes
US8118447B2 (en) 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
CN101493217B (zh) * 2008-01-25 2011-02-16 富士迈半导体精密工业（上海）有限公司 照明系统
ES2360260T3 (es) * 2008-02-01 2011-06-02 Fhf Funke + Huster Fernsig Gmbh Disposición de circuito eléctrico, especialmente piloto de señalización.
US8442403B2 (en) 2008-03-02 2013-05-14 Lumenetix, Inc. Lighting and control systems and methods
WO2009110683A2 (ko) * 2008-03-06 2009-09-11 화우테크놀러지주식회사 무팬 통풍 방열 엘이디 조명기구
US20090231868A1 (en) * 2008-03-11 2009-09-17 A-Sheng Yang Led indicating assembly for car or motorcycle
CN101541156A (zh) * 2008-03-21 2009-09-23 富准精密工业(深圳)有限公司 电源驱动模组装置
DE102008017580A1 (de) * 2008-04-07 2009-10-08 Osram Opto Semiconductors Gmbh Gehäuseanordnung
US8360599B2 (en) 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US20090296387A1 (en) * 2008-05-27 2009-12-03 Sea Gull Lighting Products, Llc Led retrofit light engine
GB0809650D0 (en) * 2008-05-29 2008-07-02 Integration Technology Ltd LED Device and arrangement
US8061868B2 (en) * 2008-06-01 2011-11-22 Jack Dubord Adjustable LED lighting system, kit and method of using same
TWM353308U (en) * 2008-06-09 2009-03-21 qiu-shuang Ke LED illumination device
US8492179B2 (en) 2008-07-11 2013-07-23 Koninklijke Philips N.V. Method of mounting a LED module to a heat sink
US20100046221A1 (en) * 2008-08-19 2010-02-25 Jason Loomis Posselt LED Source Adapted for Light Bulbs and the Like
EP2332189A4 (en) * 2008-09-11 2014-12-10 Nexxus Lighting Inc LIGHTING AND METHOD FOR PRODUCING A LIGHTING
KR100901180B1 (ko) * 2008-10-13 2009-06-04 현대통신 주식회사 가변형의 방열통로가 구비된 방열부재 및 이를 이용한 ｌｅｄ 발광 조명등
JP4651702B2 (ja) * 2008-10-17 2011-03-16 三洋電機株式会社 照明装置
KR100903192B1 (ko) * 2008-10-17 2009-06-17 현대통신 주식회사 나노스프레더를 이용한 이중 방열판 구조의 ｌｅｄ 발광 조명등
JP4651701B2 (ja) * 2008-10-17 2011-03-16 三洋電機株式会社 照明装置
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US7938562B2 (en) 2008-10-24 2011-05-10 Altair Engineering, Inc. Lighting including integral communication apparatus
US8214084B2 (en) 2008-10-24 2012-07-03 Ilumisys, Inc. Integration of LED lighting with building controls
US8653984B2 (en) 2008-10-24 2014-02-18 Ilumisys, Inc. Integration of LED lighting control with emergency notification systems
US8324817B2 (en) 2008-10-24 2012-12-04 Ilumisys, Inc. Light and light sensor
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
KR100902631B1 (ko) 2008-10-24 2009-06-12 현대통신 주식회사 나노스프레더를 이용한 원형구조의 ｌｅｄ 발광 조명등
US7800909B2 (en) * 2008-10-27 2010-09-21 Edison Opto Corporation Lamp base having a heat sink
KR100905502B1 (ko) 2008-11-10 2009-07-01 현대통신 주식회사 엘이디 조명 장치
WO2010056324A1 (en) * 2008-11-12 2010-05-20 Neos International, Llc Device and method for cooling chips and leds
KR101359675B1 (ko) 2008-11-14 2014-02-10 삼성전자주식회사 방열 디바이스를 구비한 ｌｅｄ 램프
US7972037B2 (en) * 2008-11-26 2011-07-05 Deloren E. Anderson High intensity replaceable light emitting diode module and array
US20100226139A1 (en) 2008-12-05 2010-09-09 Permlight Products, Inc. Led-based light engine
US20100149771A1 (en) * 2008-12-16 2010-06-17 Cree, Inc. Methods and Apparatus for Flexible Mounting of Light Emitting Devices
FR2940679B1 (fr) 2008-12-31 2016-06-10 Finan Trading Company Systeme d'eclairage a diodes electroluminescentes.
US8152322B1 (en) 2009-01-29 2012-04-10 Mcginty Patrick Heat dissipating helmet and light
WO2010119872A1 (ja) 2009-04-13 2010-10-21 パナソニック電工株式会社 Ｌｅｄユニット
US8299695B2 (en) * 2009-06-02 2012-10-30 Ilumisys, Inc. Screw-in LED bulb comprising a base having outwardly projecting nodes
US20100308731A1 (en) * 2009-06-03 2010-12-09 Anthony Mo Light Engine
CN102667326B (zh) 2009-06-03 2016-08-10 沃克斯材料有限公司 灯组件及制造方法
US20110030920A1 (en) * 2009-08-04 2011-02-10 Asia Vital Components (Shen Zhen) Co., Ltd. Heat Sink Structure
US8662704B2 (en) * 2009-08-14 2014-03-04 U.S. Pole Company, Inc. LED optical system with multiple levels of secondary optics
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
TW201107655A (en) * 2009-08-21 2011-03-01 Nat Univ Tsing Hua LED lamp
US20110047901A1 (en) * 2009-09-03 2011-03-03 Dierbeck Robert F Extruded Aluminum Deck Plank with Lighting and Heating Features
EP2530373B1 (en) 2009-09-09 2015-09-23 Panasonic Intellectual Property Management Co., Ltd. Bulb-shaped lamp and lighting device
TW201109578A (en) * 2009-09-09 2011-03-16 Elements Performance Materials Ltd Heat dissipation structure of lamp
US8672518B2 (en) 2009-10-05 2014-03-18 Lighting Science Group Corporation Low profile light and accessory kit for the same
US9581756B2 (en) 2009-10-05 2017-02-28 Lighting Science Group Corporation Light guide for low profile luminaire
US9772099B2 (en) 2009-10-05 2017-09-26 Lighting Science Group Corporation Low-profile lighting device and attachment members and kit comprising same
WO2011059527A1 (en) * 2009-11-10 2011-05-19 Lumenetix, Inc. Lamp color matching and control systems and methods
US8410512B2 (en) * 2009-11-25 2013-04-02 Cree, Inc. Solid state light emitting apparatus with thermal management structures and methods of manufacturing
US8210715B2 (en) * 2009-12-09 2012-07-03 Tyco Electronics Corporation Socket assembly with a thermal management structure
US8845130B2 (en) * 2009-12-09 2014-09-30 Tyco Electronics Corporation LED socket assembly
US8878454B2 (en) 2009-12-09 2014-11-04 Tyco Electronics Corporation Solid state lighting system
US8241044B2 (en) * 2009-12-09 2012-08-14 Tyco Electronics Corporation LED socket assembly
US8235549B2 (en) * 2009-12-09 2012-08-07 Tyco Electronics Corporation Solid state lighting assembly
US8511851B2 (en) 2009-12-21 2013-08-20 Cree, Inc. High CRI adjustable color temperature lighting devices
DE102010002235A1 (de) * 2010-02-23 2011-08-25 Zumtobel Lighting GmbH, 32657 Kühlkörper für eine Lichtquelle
US8540401B2 (en) 2010-03-26 2013-09-24 Ilumisys, Inc. LED bulb with internal heat dissipating structures
EP2553320A4 (en) 2010-03-26 2014-06-18 Ilumisys Inc LED LAMP COMPRISING A THERMOELECTRIC GENERATOR
US20110242807A1 (en) * 2010-03-31 2011-10-06 Aphos Lighting Llc Light cover and illuminating apparatus applying the same
JP2011233469A (ja) * 2010-04-30 2011-11-17 Excel Kk Ｌｅｄランプおよびこれを用いた照明装置
USD797980S1 (en) 2010-05-06 2017-09-19 Lighting Science Group Corporation Low profile light
US8547391B2 (en) 2011-05-15 2013-10-01 Lighting Science Group Corporation High efficacy lighting signal converter and associated methods
US8550650B1 (en) 2010-08-10 2013-10-08 Patrick McGinty Lighted helmet with heat pipe assembly
US8858040B2 (en) * 2010-08-23 2014-10-14 Cooliance, Inc. Cooling methodology for high brightness light emitting diodes
US8506105B2 (en) 2010-08-25 2013-08-13 Generla Electric Company Thermal management systems for solid state lighting and other electronic systems
US8415704B2 (en) 2010-09-22 2013-04-09 Ut-Battelle, Llc Close-packed array of light emitting devices
US8523394B2 (en) 2010-10-29 2013-09-03 Ilumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
TWI469404B (zh) * 2010-11-17 2015-01-11 Advanced Optoelectronic Tech 發光二極體模組
US8870415B2 (en) 2010-12-09 2014-10-28 Ilumisys, Inc. LED fluorescent tube replacement light with reduced shock hazard
US20130039070A1 (en) * 2010-12-20 2013-02-14 Daniel J. Mathieu Lamp with front facing heat sink
RU2607531C2 (ru) 2011-01-11 2017-01-10 Конинклейке Филипс Н.В. Осветительное устройство
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US20140091697A1 (en) * 2011-02-11 2014-04-03 Soraa, Inc. Illumination source with direct die placement
DE102011005047B3 (de) 2011-03-03 2012-09-06 Osram Ag Leuchtvorrichtung
US8461752B2 (en) * 2011-03-18 2013-06-11 Abl Ip Holding Llc White light lamp using semiconductor light emitter(s) and remotely deployed phosphor(s)
US8272766B2 (en) 2011-03-18 2012-09-25 Abl Ip Holding Llc Semiconductor lamp with thermal handling system
US8803412B2 (en) 2011-03-18 2014-08-12 Abl Ip Holding Llc Semiconductor lamp
EP2695189A1 (de) * 2011-04-04 2014-02-12 CeramTec GmbH Keramische leiterplatte mit al-kühlkörper
GB201109095D0 (en) 2011-05-31 2011-07-13 Led Lighting South Africa Close Corp Cooling of LED illumination devices
USD700584S1 (en) 2011-07-06 2014-03-04 Cree, Inc. LED component
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
US9072171B2 (en) 2011-08-24 2015-06-30 Ilumisys, Inc. Circuit board mount for LED light
US9249955B2 (en) 2011-09-26 2016-02-02 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US9423119B2 (en) 2011-09-26 2016-08-23 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US9429309B2 (en) 2011-09-26 2016-08-30 Ideal Industries, Inc. Device for securing a source of LED light to a heat sink surface
US20120069566A1 (en) * 2011-11-20 2012-03-22 Foxsemicon Integrated Technology, Inc. Illumination apparatus with heat dissipating tubes
US8568001B2 (en) 2012-02-03 2013-10-29 Tyco Electronics Corporation LED socket assembly
US8960964B2 (en) * 2012-02-06 2015-02-24 Lumenetix, Inc. Thermal dissipation structure for light emitting diode
US20130221873A1 (en) * 2012-02-17 2013-08-29 Lumenetix, Inc. Led color channels including phosphor-based leds for high luminous efficacy light source
WO2013131002A1 (en) 2012-03-02 2013-09-06 Ilumisys, Inc. Electrical connector header for an led-based light
JP5450707B2 (ja) * 2012-04-27 2014-03-26 フューチャー ライト リミテッド ライアビリティ カンパニー 照明装置
US9255685B2 (en) 2012-05-03 2016-02-09 Lighting Science Group Corporation Luminaire with prismatic optic
US9366409B2 (en) 2012-05-06 2016-06-14 Lighting Science Group Corporation Tunable lighting apparatus
US9163794B2 (en) 2012-07-06 2015-10-20 Ilumisys, Inc. Power supply assembly for LED-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US9062873B2 (en) 2012-07-30 2015-06-23 Ultravision Technologies, Llc Structure for protecting LED light source from moisture
US8870410B2 (en) 2012-07-30 2014-10-28 Ultravision Holdings, Llc Optical panel for LED light source
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
CN104520642A (zh) * 2012-08-03 2015-04-15 普司科Led股份有限公司 光学半导体照明装置
US9016899B2 (en) 2012-10-17 2015-04-28 Lighting Science Group Corporation Luminaire with modular cooling system and associated methods
US9115857B2 (en) 2012-10-26 2015-08-25 Mind Head Llc LED directional lighting system with light intensity controller
US9322516B2 (en) 2012-11-07 2016-04-26 Lighting Science Group Corporation Luminaire having vented optical chamber and associated methods
US9494285B2 (en) 2013-01-13 2016-11-15 Mag Instrument, Inc Lighting devices
US20160178182A1 (en) 2014-12-22 2016-06-23 Mag Instrument, Inc. Efficiency Lighting Apparatus with LED Directly Mounted to a Heatsink
DE212013000276U1 (de) 2013-01-29 2015-10-09 Mitsubishi Chemical Corporation LED-Lampe
CN103968273A (zh) * 2013-02-04 2014-08-06 中山伟强科技有限公司 可提升散热效率的散热结构及其灯泡
US9347655B2 (en) 2013-03-11 2016-05-24 Lighting Science Group Corporation Rotatable lighting device
US9459397B2 (en) 2013-03-12 2016-10-04 Lighting Science Group Corporation Edge lit lighting device
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
WO2014190304A1 (en) 2013-05-24 2014-11-27 Anderson Deloren E Led light bulb
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
US9429294B2 (en) 2013-11-11 2016-08-30 Lighting Science Group Corporation System for directional control of light and associated methods
JP2014038872A (ja) * 2013-11-26 2014-02-27 Future Light Limited Liability Company 照明装置
EP3097748A1 (en) 2014-01-22 2016-11-30 iLumisys, Inc. Led-based light with addressed leds
US9648688B2 (en) 2014-03-26 2017-05-09 Mind Head Llc Security lighting systems for perimeter security including infrared and LED lights and light intensity controllers
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US9677754B2 (en) 2014-11-07 2017-06-13 Chm Industries, Inc. Rotating light emitting diode driver mount
US20160178181A1 (en) * 2014-11-14 2016-06-23 Bridgelux, Inc. Ism architecture adapted for variable optical configurations
JP2015073131A (ja) * 2015-01-05 2015-04-16 ローム株式会社 Ｌｅｄ発光体およびｌｅｄ電球
US10352541B2 (en) * 2015-01-30 2019-07-16 Signify Holding B.V. Integrated smart module architecture
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
US10415895B2 (en) * 2016-11-21 2019-09-17 Abl Ip Holding Llc Heatsink
US10746387B2 (en) 2017-03-31 2020-08-18 Mind Head Llc Low voltage security lighting systems for perimeter fences having tactical glare capabilities
WO2019012506A1 (en) * 2017-07-14 2019-01-17 A La Carte Media, Inc. LOW COST APPARATUS AND DECENTRALIZED AND REMOTE RECOVERY METHOD OF ELECTRONIC DEVICES HAVING ONEROUS TITLES
DE102019126021A1 (de) * 2019-09-26 2021-04-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements
CN114966864B (zh) * 2022-06-24 2024-03-08 山东省地质矿产勘查开发局第三地质大队(山东省第三地质矿产勘查院、山东省海洋地质勘查院) 一种变质岩区晶质石墨矿找矿系统

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3275874A (en) * 1962-05-11 1966-09-27 Jennings Radio Mfg Corp Electrically energized heat radiator
US4106231A (en) * 1976-12-06 1978-08-15 Master Specialties Company Low level light indicator
US4784258A (en) * 1984-08-13 1988-11-15 Figari Alberto A Contact lens carrying case with magnifying aid apparatus
DE3480294D1 (en) * 1984-11-15 1989-11-30 Japan Traffic Manage Tech Ass Signal light unit having heat dissipating function
US4733335A (en) * 1984-12-28 1988-03-22 Koito Manufacturing Co., Ltd. Vehicular lamp
US4875057A (en) * 1988-09-01 1989-10-17 Eastman Kodak Company Modular optical printhead for hard copy printers
US5029335A (en) * 1989-02-21 1991-07-02 Amoco Corporation Heat dissipating device for laser diodes
US5036248A (en) * 1989-03-31 1991-07-30 Ledstar Inc. Light emitting diode clusters for display signs
US5168537A (en) * 1991-06-28 1992-12-01 Digital Equipment Corporation Method and apparatus for coupling light between an optoelectronic device and a waveguide
JPH05218510A (ja) 1992-02-04 1993-08-27 Iwasaki Electric Co Ltd 発光ダイオードランプ
US5528474A (en) * 1994-07-18 1996-06-18 Grote Industries, Inc. Led array vehicle lamp
US5612821A (en) * 1995-06-15 1997-03-18 United Technologies Corporation Micro lens system for controlling an optical beam pattern
DE19528459C2 (de) 1995-08-03 2001-08-23 Garufo Gmbh Kühlung für ein mit LED's bestücktes Leuchtaggregat
US5852339A (en) * 1997-06-18 1998-12-22 Northrop Grumman Corporation Affordable electrodeless lighting
US6211626B1 (en) 1997-08-26 2001-04-03 Color Kinetics, Incorporated Illumination components
JP2000031546A (ja) * 1998-07-08 2000-01-28 Mitsubishi Electric Corp Ｌｅｄ集合体モジュール
US6429581B1 (en) * 1998-09-10 2002-08-06 Corning Incorporated TIR lens for uniform brightness
US6254262B1 (en) 1998-11-27 2001-07-03 Crunk Paul D Signaling lamp having led light array with removable plastic lens
US6367949B1 (en) * 1999-08-04 2002-04-09 911 Emergency Products, Inc. Par 36 LED utility lamp
US6161910A (en) * 1999-12-14 2000-12-19 Aerospace Lighting Corporation LED reading light
US6160596A (en) * 1999-12-20 2000-12-12 Delphi Technologies, Inc. Backlighting system for a liquid crystal display unit
DE20004105U1 (de) * 2000-03-04 2000-05-31 Zweibrueder Stahlwarenkontor G Taschenlampe
US6472823B2 (en) * 2001-03-07 2002-10-29 Star Reach Corporation LED tubular lighting device and control device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE195 28 459A1 1997.02.13

Also Published As

Publication number Publication date
US20020176250A1 (en) 2002-11-28
US6799864B2 (en) 2004-10-05
CN1518768A (zh) 2004-08-04
EP2241803A2 (en) 2010-10-20
JP4452495B2 (ja) 2010-04-21
EP2241803B1 (en) 2018-11-07
WO2002097884A1 (en) 2002-12-05
JP2004528698A (ja) 2004-09-16
EP1393374B1 (en) 2016-08-24
EP2241803A3 (en) 2016-03-23
EP1393374A1 (en) 2004-03-03

Similar Documents

Publication Publication Date Title
CN100524746C (zh) 用于局部照明的高功率led模块
US9657924B2 (en) LED 3D curved lead frame of illumination device
CN1605790B (zh) Led灯设备及方法
US20140211477A1 (en) Led fixture with interchangeable components
US7993032B2 (en) LED light pod with modular optics and heat dissipation structure
US7736019B2 (en) Lighting system
EP3051586B1 (en) Integrated led-based luminaire for general lighting
CN203099372U (zh) 照明装置
US7234842B2 (en) Replaceable LED socket torch and lighting head assembly
CN102301181A (zh) 用于空间照明的led灯泡
CN102822590A (zh) 半导体灯
JP4488183B2 (ja) 照明装置
CN102003647B (zh) 全方位led球泡灯
JP5835815B2 (ja) モジュール式発光ダイオード回路組立体のための装置、方法、及びシステム
CN203131476U (zh) 自散热led灯具
CN202769315U (zh) 灯泡
JP2013524420A (ja) 白熱電球の代替としてのｌｅｄ灯
CN105570733B (zh) 一种led模块及led点光源灯具
CN215569819U (zh) 一种具有多种发光效果的led灯泡
CN108071952A (zh) 照明设备
CN109899761A (zh) 一种聚光与泛光组合、可见光与红外光双模式机外灯具
CN102374480A (zh) 灯具及其灯罩
CN208058501U (zh) 一种便于拆解的灯串
CN106764609B (zh) 一种多功能便捷安装线型灯
KR101669212B1 (ko) 색온도 조절이 가능한 led 및 그 제조 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20090805

CX01 Expiry of patent term