CN100524804C - 平板显示装置及其制备方法 - Google Patents
平板显示装置及其制备方法 Download PDFInfo
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- CN100524804C CN100524804C CNB2007100077107A CN200710007710A CN100524804C CN 100524804 C CN100524804 C CN 100524804C CN B2007100077107 A CNB2007100077107 A CN B2007100077107A CN 200710007710 A CN200710007710 A CN 200710007710A CN 100524804 C CN100524804 C CN 100524804C
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- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 1
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- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
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- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- QUBMWJKTLKIJNN-UHFFFAOYSA-B tin(4+);tetraphosphate Chemical compound [Sn+4].[Sn+4].[Sn+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QUBMWJKTLKIJNN-UHFFFAOYSA-B 0.000 description 1
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Abstract
Description
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR8809/06 | 2006-01-27 | ||
KR1020060008809A KR100759667B1 (ko) | 2006-01-27 | 2006-01-27 | 평판 표시장치 및 그의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101009314A CN101009314A (zh) | 2007-08-01 |
CN100524804C true CN100524804C (zh) | 2009-08-05 |
Family
ID=38037464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007100077107A Active CN100524804C (zh) | 2006-01-27 | 2007-01-29 | 平板显示装置及其制备方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7586259B2 (zh) |
EP (1) | EP1814159B1 (zh) |
JP (1) | JP4405990B2 (zh) |
KR (1) | KR100759667B1 (zh) |
CN (1) | CN100524804C (zh) |
DE (1) | DE602007000325D1 (zh) |
ES (1) | ES2319338T3 (zh) |
TW (1) | TWI357283B (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100688792B1 (ko) | 2006-01-27 | 2007-03-02 | 삼성에스디아이 주식회사 | 평판 표시장치 및 그의 제조방법 |
KR100759666B1 (ko) * | 2006-01-27 | 2007-09-17 | 삼성에스디아이 주식회사 | 평판 표시장치 및 그의 제조방법 |
WO2007113935A1 (ja) * | 2006-04-05 | 2007-10-11 | Sharp Kabushiki Kaisha | 有機エレクトロルミネッセンス表示装置及びその製造方法 |
CN101884246B (zh) * | 2007-10-05 | 2012-02-08 | 康宁股份有限公司 | 用于密封玻璃封装的方法和设备 |
US20100095705A1 (en) | 2008-10-20 | 2010-04-22 | Burkhalter Robert S | Method for forming a dry glass-based frit |
KR100959106B1 (ko) | 2008-11-05 | 2010-05-25 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
PL2526346T3 (pl) * | 2010-01-19 | 2021-04-06 | Guardian Glass, LLC | Ulepszony wtórny panel odblaskowy (srp) z powłoką umożliwiającą obróbkę cieplną, stosowany w aplikacjach skoncentrowanej energetyki słonecznej i/lub sposoby jego wytwarzania |
WO2012019909A1 (de) * | 2010-08-13 | 2012-02-16 | Tesa Se | Verfahren zur kapselung einer elektronischen anordnung |
CN102237496A (zh) * | 2011-06-30 | 2011-11-09 | 彩虹(佛山)平板显示有限公司 | 一种有机电致发光二极管显示器件的封装方法 |
KR20140000064A (ko) * | 2012-06-22 | 2014-01-02 | 삼성디스플레이 주식회사 | 광학 시트의 제조 방법 및 광학 시트를 구비하는 유기 발광 표시 장치의 제조 방법 |
JP6098984B2 (ja) | 2012-08-30 | 2017-03-22 | コーニング インコーポレイテッド | アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ |
CN104576744A (zh) * | 2013-10-24 | 2015-04-29 | 中国科学院苏州纳米技术与纳米仿生研究所 | 碳纳米管薄膜晶体管、amoled像素柔性驱动电路及制作方法 |
KR102240894B1 (ko) * | 2014-02-26 | 2021-04-16 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
US9431244B2 (en) * | 2014-09-24 | 2016-08-30 | Qualcomm Mems Technologies, Inc. | Laser annealing technique for metal oxide TFT |
CN104810484B (zh) * | 2015-05-07 | 2017-01-04 | 合肥鑫晟光电科技有限公司 | 封装胶、封装方法、显示面板及显示装置 |
CN107316612B (zh) * | 2017-07-11 | 2019-08-30 | 深圳市华星光电半导体显示技术有限公司 | 一种oled显示面板及oled显示器 |
US10522607B2 (en) * | 2017-07-11 | 2019-12-31 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd | OLED display panel and OLED display apparatus |
CN109390352A (zh) * | 2017-08-09 | 2019-02-26 | 昆山国显光电有限公司 | 阵列基板及其制造方法、显示面板及其制造方法 |
CN109860207B (zh) * | 2019-02-27 | 2022-07-19 | 合肥鑫晟光电科技有限公司 | 一种阵列基板、其制作方法、显示面板及显示装置 |
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US5953094A (en) * | 1997-04-04 | 1999-09-14 | Sanyo Electric Co., Ltd. | Liquid crystal display device |
JP3907804B2 (ja) * | 1997-10-06 | 2007-04-18 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
US6113450A (en) * | 1998-05-14 | 2000-09-05 | Candescent Technologies Corporation | Seal material frit frame for flat panel displays |
WO2000048218A1 (fr) * | 1999-02-12 | 2000-08-17 | Toppan Printing Co., Ltd. | Ecran a plasma, procede et dispositif de production correspondants |
US6555025B1 (en) * | 2000-01-31 | 2003-04-29 | Candescent Technologies Corporation | Tuned sealing material for sealing of a flat panel display |
US6747724B2 (en) | 2000-07-26 | 2004-06-08 | Casio Computer Co., Ltd. | Liquid crystal display device having non-display area with reduced width |
KR20040002956A (ko) * | 2001-05-24 | 2004-01-07 | 오리온전기 주식회사 | 유기전계발광소자의 인캡슐레이션 용기 및 그 제조방법 |
KR20030080895A (ko) * | 2002-04-11 | 2003-10-17 | 엘지전자 주식회사 | 유기 el 소자의 실링 방법 |
JP4299021B2 (ja) * | 2003-02-19 | 2009-07-22 | ヤマト電子株式会社 | 封着加工材及び封着加工用ペースト |
US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
US7538488B2 (en) * | 2004-02-14 | 2009-05-26 | Samsung Mobile Display Co., Ltd. | Flat panel display |
JP2005242099A (ja) * | 2004-02-27 | 2005-09-08 | Nec Lcd Technologies Ltd | 液晶表示装置 |
US20050248270A1 (en) * | 2004-05-05 | 2005-11-10 | Eastman Kodak Company | Encapsulating OLED devices |
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CN101009314A (zh) | 2007-08-01 |
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TWI357283B (en) | 2012-01-21 |
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EP1814159B1 (en) | 2008-12-10 |
EP1814159A3 (en) | 2007-10-24 |
US20070176551A1 (en) | 2007-08-02 |
KR100759667B1 (ko) | 2007-09-17 |
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