CN100531519C

CN100531519C - Method for deep drilling print circuit board

Info

Publication number: CN100531519C
Application number: CNB2007100973468A
Authority: CN
Inventors: 徐国成; 符政新
Original assignee: HUSHI ELECTRONICS CO Ltd
Current assignee: HUSHI ELECTRONICS CO Ltd
Priority date: 2007-05-11
Filing date: 2007-05-11
Publication date: 2009-08-19
Anticipated expiration: 2027-05-11
Also published as: CN101094562A

Abstract

The method comprises: setting the plane contacting with the PCB as a standard plane; recording the actual location height Hn of each point on PCB, and saving it into the storage software of the machine; selecting a target layer, setting a standard drilling depth D1 and standard plate thickness H1; the drilling depths of other points are Dn=D1*Hn/H1+ compensation value; according to the drilling depth Dn of each points, re-setting the parameters in the drilling program, and renewing each parameter in the storage software in machine; finally, according to Dn value, modifying the program-controlled instruction.

Description

Method for deep drilling print circuit board

Technical field

The present invention relates to the manufacturing technology field of printed circuit board (PCB) (pcb board), concretely, relate to a kind of on printed circuit board (PCB) the method for deep drilling.

Background technology

Deep drilling print circuit board is to utilize the mode of machine drilling a perforation to be drilled to the hole of being made up of a part of perforation and a part of not perforation, the degree of depth of perforation is not controlled between certain two internal layer and depth accuracy is controlled at ± 1mil (mil) usually. and (L1...Ln as shown in Figure 1: represent the 1st) to the n layer

Existing method for deep drilling print circuit board is to adopt chuck conduction feedback system, as shown in Figure 2, utilize existing deep drilling board, producing the Aluminum cover 1 that the plate surface adds a conduction, drill point 2 tail ends are by conductive switch 3, conductive chuck 4 joins with the production plate, connect conductive switch 3, form control loop in board inside during drill point 2 contact Aluminum covers 1, begin to calculate from Aluminum cover 1 upper surface and down be drilled with the fixed degree of depth, when drill point 2 touched Aluminum cover 1, the board control device can be noted the Z axle of SPINDLE this moment.Then, the board control device is the internal command of the following drilling depth of basis again, by drilling depth under the control of optics chi.

The shortcoming of prior art:

(1) thereby, board can only control the precision of the following drilling depth that begins to calculate from the metal surface contact point and the degree of depth control precision of needed ± 1mil can not change each following drilling depth along with the variation of thickness of slab and reach desired operation volume production plate the time.

(2), because use Aluminum cover to have the difference that combines between Aluminum cover and the production plate, this also can influence drilling accuracy.

Owing to there is an above-mentioned defective, therefore the depth accuracy of the not perforation that obtains of deep drilling print circuit board operation at present generally can only be controlled at ± more than the 2.5mil.

Summary of the invention

The purpose of this invention is to provide a kind of new method for deep drilling print circuit board, this method is by allowing board set drilling depth down according to printed circuit thickness of slab uniformity automatically, thereby promote the control precision of boring, effectively control the influence that the thickness of slab variation brings the deep drilling precision.

In order to reach above-mentioned technique effect, the invention provides following technical proposals:

Deep drilling print circuit board adopts following steps:

(1), determine that printed circuit board (PCB) and the contacted plane of board are standard flat, note the physical location height H n of corresponding each point of printed circuit board (PCB) on the standard flat by board, and be stored in the board storing software;

(2), selected target layer, drilling depth D1 and standard thickness of slab H1 deposit in the storing software under the established standards point, the following drilling depth of all the other each points is the Dn=D1*Hn/H1+ offset, reset drilling parameter in the drilling program according to the following drilling depth Dn of each point, upgrade each parameter in the board storing software;

(3), the program control instruction in the board Control Software is done corresponding change and carried out drilling program according to the Dn value.

It is not drilled disconnected and guarantee that the length of Lm+1 layer residual hole copper on the Ln layer direction will remain on same length as far as possible that offset in the described step (2) should satisfy the Lm+1 layer.

Effect of the present invention is:

(1) thereby, can reduce the control precision that influence that the thickness of slab uniformity produces precision promotes boring;

(2), can effectively control the influence that the thickness of slab variation brings to the deep drilling precision.

Description of drawings

Fig. 1 is the schematic diagram of deep drilling print circuit board.

Fig. 2 is the schematic diagram of existing method for deep drilling.

Fig. 3 is the schematic diagram of method for deep drilling of the present invention.

Fig. 4 finishes the flow chart of deep drilling of the present invention.

Embodiment

The present invention will be further described for existing accompanying drawings and embodiment:

Embodiment: as shown in Figure 3, the printed circuit plank thickness after the pressing is uneven, but it has certain rules, and thickness of slab can present thick middle and the thin situation in both sides under the general situation, and changes more even.

We are controlled at Lm+1 between the Lm+2 layer with the degree of depth to suppose customer requirement, then we to name the Lm+1 layer be destination layer, the Lm+2 layer is the destination layer last layer, the Lm layer is one deck under the destination layer. as shown in Figure 3, still use old method during our deep drilling if the thickness of slab uniformity of the printed circuit plank of producing is relatively poor, promptly use to bore under the same kind of degree of depth just easily destination layer to be bored to break and cause scrapping, perhaps make the Lm+1 layer different in size toward the length of the residual pores copper of Ln layer direction calculating. therefore, need allow board Auto-Sensing plank surface, calculate the plank height of this moment, according to drilling depth under the thickness of slab automatic setting of diverse location.

Details are as follows referring to Fig. 4 for concrete steps:

At first, calculate the following drilling depth value of printed circuit thickness of slab and customer requirement, drill point is installed then, (drill point uses fixedly drill point T98 here, its parameter is also fixing as can be known), secondly determine that printed circuit board (PCB) and the contacted plane of board are standard flat, note physical location height H 1, H2, the H3...Hn of corresponding each point of printed circuit board (PCB) on the standard flat by board control device (comprising board Control Software MAPDAT and board storing software BHGT), and be stored among the board storing software MAPDAT; The program command of the physical location height H n of each point of printed circuit board (PCB) is on the board control device record standard plane:

M48

C#.##

％

T01C00037

X#.##Y#.##

.

X#.##Y#.##

M30

Once more, the selected target layer, according to drilling depth D1 and standard thickness of slab H1 under the following drilling depth value established standards of customer requirement, this moment, thickness of slab was the thickest position, and this moment is if still bore (D2 position in as Fig. 3) with the degree of depth of D1 under edges of boards, then can cause down the dark situation of boring, the degree of depth has got into below the destination layer; Therefore then must use different following drilling depths at the edges of boards deep drilling, as D3 value among Fig. 3 (D3＜D2=D1). D3=D1*H3/H1+ offset wherein, offset is less data that are used to finely tune), purpose is not drilled disconnected and guarantee that the length of Lm+1 layer residual hole copper on the Ln layer direction will remain on same length as far as possible in order to guarantee the Lm+1 layer.Drilling depth D3 resets the drilling parameter in the drilling program under the board control device basis, upgrades each parameter in the board storing software MAPDAT; The program control instruction that resets the drilling parameter in the drilling program according to the following drilling depth Dn of each point is:

TOTO：#.##；SUOTO+：#.##；SUTO-：#.##；LODI：#.##；

ZOB：#.##；ZZ：#.##；HH：#.##.

At last, the board control device is done the program control instruction among the Control Software BHGT corresponding change and is carried out drilling program according to the Dn value.The program control instruction of change is;

T##C#.##

M47，\P：Z112H4.05

M18Z#.#

X#.##Y#.##

.

M30

By above program control realization and execution, board can be realized accurately measuring the function of thickness of slab and can calculate down drilling depth simultaneously and do deep drilling control accurately on PCB.

Test case: after using the method operation, degree of depth control precision is improved significantly. and the result is as follows:

From above test data as can be seen, after using new bore mode, degree of depth control precision is significantly improved, the RANGE (excursion) of the degree of depth of new approach control obviously reduces (dropping to 2.76MIL by original 5.30MIL), CP value (accuracy) also have clear improvement (rising to 2.0429 by 1.2119).

Claims

1, a kind of method for deep drilling print circuit board is carried out drilling program by the board control device, it is characterized in that: comprise the steps:

(1), determine that printed circuit board (PCB) and the contacted plane of board are standard flat, note the physical location height H n of corresponding each point of printed circuit board (PCB) on the standard flat by the board control device, and be stored in the storing software in the board control device;

(2), selected target layer, drilling depth D1 and standard thickness of slab H1 deposit in the storing software under the established standards point, the following drilling depth that the board control device calculates all the other each points is the Dn=D1*Hn/H1+ offset, and reset drilling parameter in the drilling program according to the following drilling depth Dn of each point, upgrade each parameter in the board storing software;

(3), the program control instruction in the Control Software in the board control device is done corresponding change and carried out drilling program according to the Dn value.

2, method for deep drilling print circuit board according to claim 1 is characterized in that: it is not drilled disconnected and guarantee that the length of Lm+1 layer residual hole copper on the Ln layer direction will remain on same length as far as possible that the offset in the described step (2) should satisfy the Lm+1 layer.