CN100544043C - Light-emitting device - Google Patents
Light-emitting device Download PDFInfo
- Publication number
- CN100544043C CN100544043C CN 200610084471 CN200610084471A CN100544043C CN 100544043 C CN100544043 C CN 100544043C CN 200610084471 CN200610084471 CN 200610084471 CN 200610084471 A CN200610084471 A CN 200610084471A CN 100544043 C CN100544043 C CN 100544043C
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- Prior art keywords
- light
- emitting device
- insulating barrier
- emitting component
- emitting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
A kind of light-emitting device comprises a substrate, a first metal layer, at least one light-emitting component and a protective layer.Wherein, substrate surface has a structure that is lifted out optical efficiency, this the first metal layer is arranged at this substrate and this is lifted out on the structure of optical efficiency, and this light-emitting component places the predetermined position on this substrate, the light that this light-emitting component is sent can make the luminous efficiency that promotes light-emitting device by structure reflection and concentrated ejaculation that is lifted out optical efficiency.
Description
Technical field
The present invention relates to a kind of light-emitting device, the good light-emitting device of particularly a kind of heat dissipation.
Background technology
Along with the development of opto-electronics, light-emitting component for example light-emitting diode (LED) has been applied on the display application of various electronic products widely.
Please refer to shown in Figure 1; a kind of LED light-emitting device 1 of routine is provided with an insulating barrier 11 on a substrate 10; 12 of a plurality of LED light-emitting components are arranged on the insulating barrier 11; form with wire-bonded (wirebonding) mode and a metal level 13 on being arranged at insulating barrier 11 again and be electrically connected; coat these LED light-emitting components 12 with an encapsulated layer 14 at last, to protect light-emitting component 12 not to be subjected to machinery, heat, aqueous vapor or other factors influence and to destroy.
Conventional LED light-emitting device 1 only provides a luminous effect, some is leaked LED light-emitting component 12 emitted lights by side, be not applied to fully on the exiting surface of concentrating, its luminous efficient can't effectively promote always, simultaneously, along with the high efficiency of light-emitting device 1 and high brightness development, light-emitting component 12 can distribute heat when work, and the heat of accumulation will make temperature raise and to the luminous efficiency of light-emitting component 12 and cause bad influence useful life.Yet conventional light-emitting component 12 is arranged on the not good insulating barrier of thermal diffusivity 11, adds that the heat energy that the enclosed package of encapsulated layer 14 makes light-emitting component 12 distribute is difficult to dissipate, and is more obvious with the difficult problem of dispelling the heat.
In view of this, how to provide a kind of having concurrently to promote luminous efficiency and radiating effect, the light-emitting device of simplifying technology simultaneously and reducing cost, real is one of important topic.
Summary of the invention
Because above-mentioned problem, purpose of the present invention is for providing a kind of light-emitting device that promotes luminous efficiency and heat dissipation that has concurrently, simplifies technology simultaneously and reduces cost.
Edge is for reaching above-mentioned purpose, to comprise a substrate, a first metal layer, at least one light-emitting component and a protective layer according to a kind of light-emitting device of the present invention.Wherein, substrate surface has a structure that is lifted out optical efficiency; this the first metal layer is arranged at this substrate and this is lifted out on the structure of optical efficiency, and this light-emitting component is arranged at the predetermined position on this first metal layer, and this protective layer coats this light-emitting component.
From the above, because of light-emitting component being arranged at predetermined position on this first metal layer according to a kind of light-emitting device of the present invention, material behavior by this first metal layer, can be directly by making an insulating barrier after the potteryization, in order to thereon with this light-emitting component setting, because the structure that is lifted out optical efficiency on this first metal layer has light reflection that this light-emitting component is sent and the effect of concentrating, make the efficient that promotes bright dipping, simultaneously, by the good and large-area substrate of thermal conductance (thermal conductivity) (can constitute) by the good material of thermal conductances such as metal or alloy, the heat energy that guiding and the work of dissipation light-emitting component are produced, and reach preferable radiating effect, and then the useful life of raising light-emitting device.Compare with routine techniques, the present invention exempts the setting and the attaching of fin, produces cost and time so can reduce, and simplifies processing step, more avoids sticking together thermal resistance and the problem of aging that fin causes, and can improve heat dissipation and production reliability.
Description of drawings
Fig. 1 is a kind of schematic diagram of LED light-emitting device of routine;
Fig. 2 to Fig. 5 is the schematic diagram according to the light-emitting device of various embodiment of the present invention.
The main element symbol description
1 light-emitting component
10 substrates
11 insulating barriers
12 light-emitting components
13 metal levels
14 encapsulated layers
2 light-emitting devices
20 substrates
201 are lifted out the structure of optical efficiency
21 first insulating barriers
21 ' second insulating barrier
22 light-emitting components
23 the first metal layers
23 ' second metal level
23 " the 3rd metal level
24 leads
24 ' conductive layer
25 pads
26 articulamentums
27 lead frames
271 first electrode pins
272 second electrode pins
28 reflector
29 protective layers
Embodiment
Hereinafter with reference to relevant drawings, a kind of light-emitting device according to the preferred embodiment of the present invention is described, wherein components identical will be illustrated with identical reference marks.
Please refer to shown in Figure 2ly, comprise a substrate 20, a first metal layer 23, one first insulating barrier 21, an articulamentum 26, one second metal level 23 ', at least one light-emitting component 22 and a protective layer 29 according to a kind of light-emitting device 2 of the preferred embodiment of the present invention.
In the present embodiment, the material of this substrate 20 is based on the material of high-termal conductivity, mainly in order to offer the preferable heat radiation function of this light-emitting device 2, preferably, can be made of copper, copper alloy or high conductivity material.
This first metal layer 23 of this light-emitting device 2 is positioned on this substrate 20, wherein, the material of this first metal layer 23 be selected from aluminium, magnesium, titanium and alloy thereof at least one of them, because the relation of its material, can form one first insulating barrier 21 by the mode on these the first metal layer 23 surfaces of oxidation, nitrogenize or carbonization, the material of the one the first insulating barriers 21 can be selected from aluminium, magnesium and titanium one of them oxide, nitride or carbide at least, wherein has a structure 201 that is lifted out optical efficiency on this first metal layer 23.
22 of this light-emitting components are arranged on this predetermined position of this substrate 20, in the present embodiment, this light-emitting component 22 comprises one first electrode, one second electrode and a luminescent layer (figure does not show), and this light-emitting component 22 can be a light-emitting diode (LED), a laser diode (LD) or an Organic Light Emitting Diode (OLED) specifically.
Can comprise also in this light-emitting device 2 of present embodiment that one second metal level 23 ' is arranged on this first insulating barrier 21, this second metal level 23 ' directly is electrically connected with this light-emitting component 22, preferably, this light-emitting component 22 is electrically connected with mode and this second metal level 23 ' of direct lead-in wire, wherein the material of this second metal level 23 ' can be silver, gold, copper, aluminium and alloy thereof at least one of them.
For this second metal level 23 ' can be arranged on this first insulating barrier 21, between this second metal level 23 ' and this first insulating barrier 21, also can comprise an articulamentum 26, this articulamentum 26 has tackness, or has the characteristic that can make this second metal level 23 ' formed thereon, needed initial layers when forming this second metal level 23 ' with plating mode for example, its material can be selected from chromium, titanium, nickel and alloy thereof at least one of them.
In the present embodiment; protective layer 29 is arranged on this light-emitting component 22; usefulness as protection light-emitting component 22; the surface of protective layer 29 can form the shape as lens simultaneously; the design of these protective layer 29 surface configurations of mat meets different demonstration demands to disperse or to assemble the light that this light-emitting component 22 is sent.
In the present embodiment, the structure 201 that this of the surface of this first metal layer 23 is lifted out optical efficiency is a groove, its shape can be spheroidal, the oval sphere or the parabolic bodily form, preferably, when this light-emitting component 22 is positioned at this predetermined position, can design on the focus that makes this light-emitting component 22 be positioned at this groove, when so the side direction light that is sent when this light-emitting component 22 is radiated at the structure 201 that is lifted out optical efficiency, the shape of structure 201 that can be by being lifted out optical efficiency, reflection and assemble the lateral light that this light-emitting component 22 produced after penetrate, so can directly be lifted out optical efficiency, in addition, light-emitting device 2 can comprise that also a reflector 28 is arranged on this structure that is lifted out optical efficiency 201, as shown in Figure 4, and in order to side direction reflection of light and the gathering of strengthening this light-emitting component 22.Wherein the material in this reflector 28 can comprise silver, gold or nickel.
In addition, the invention provides another kind of execution mode as shown in Figure 3, comprise one second insulating barrier 21 ' in the light-emitting device 2, since the material of this first metal layer 23 be can potteryization aluminium, magnesium, titanium or its alloy at least one of them, so can be directly the mode on surface by this first metal layer 23 of oxidation, nitrogenize or carbonization form this second insulating barrier 21 '.
One the 3rd metal level 23 can be set on second insulating barrier 21 ' "; be electrically connected with light-emitting component 22 by a lead 24; for the 3rd metal level 23 " can be arranged on this second insulating barrier 21 ', in the 3rd metal level 23 " and this second insulating barrier 21 ' between also can comprise an articulamentum 26; this articulamentum 26 has tackness; or have can make the 3rd metal level 23 " characteristic formed thereon, for example when form the 3rd metal level 23 with plating mode " time needed initial layers, its material can be selected from chromium; titanium; nickel and alloy thereof at least one of them.
Among this embodiment, because light-emitting component 22 is by a lead 24 and the 3rd metal level 23 " is electrically connected; the light-emitting component 22 of dying can directly be arranged at the predetermined position of this first metal layer 23; and predetermined position no longer needs to be provided with earlier insulating barrier and promptly can implement; certain; that this does not need as limit only for enumerating.
The embodiment that the invention provides another kind of light-emitting device 2 as shown in Figure 4, the mode that this light-emitting component 22 is electrically connected with external circuit is electrically connected with this light-emitting component 22 by a lead frame 27 (lead frame) that is arranged on this second insulating barrier 21 ', wherein this lead frame 27 has one first electrode pin 271 and one second electrode pin 272, and can this first electrode pin 271 and this second electrode pin 272 be connected to this first electrode and this second electrode of this light-emitting component 22 by this lead 24.
As shown in Figure 5, this of yet another embodiment of the invention second insulating barrier 21 ' also can coat the outer surface of this substrate 20 relatively, and this substrate can be provided with a plurality of pads 25 for 20 times, be positioned at the 3rd metal level 23 of this second insulating barrier, 21 ' upside " be electrically connected with this second electrode with this first electrode of this light-emitting component 22 respectively; 25 of these pads can by lead or conductive layer 24 ' respectively with these second metal level, 23 ' mutual conduction; but not as limit; if be held on a side of this light-emitting device 2 with a U-shaped metal (not shown); to form second metal level and pad simultaneously; also can have effect same as described above, be to be electrically connected with external circuit with these pads 25 that can utilize downside, for example (surface mount technology SMT) reaches with surface mounting technology.
In sum, because of have the structure of the optical efficiency of being lifted out according to the first metal layer in a kind of light-emitting device of the present invention, and light-emitting component is arranged at a predetermined position, can by the structure that is lifted out optical efficiency the light that light-emitting component produced be reflected and concentrate, promote luminous efficient, simultaneously by the good and large-area substrate of thermal conductance, the heat energy that guiding and the work of dissipation light-emitting component are produced, and reach preferable radiating effect, and then the useful life of raising light-emitting device.Compare with routine techniques, the present invention exempts the setting and the attaching of fin, produces cost and time so also can reduce, and simplifies processing step, more avoids sticking together thermal resistance and the problem of aging that fin causes, and can improve heat dissipation and production reliability.
The above only is an illustrative, but not is restricted.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the claim scope its equivalent modifications of carrying out or change.
Claims (21)
1, a kind of light-emitting device comprises:
One substrate has a structure that is lifted out optical efficiency on it;
One the first metal layer is arranged at this substrate and this is lifted out on the structure of optical efficiency;
At least one light-emitting component is arranged at the predetermined position on this first metal layer; And
One protective layer coats this light-emitting component.
2, light-emitting device as claimed in claim 1, wherein the material of this substrate is selected from copper, copper alloy or high conductivity material.
3, light-emitting device as claimed in claim 1, wherein the material of this first metal layer be selected from aluminium, magnesium, titanium and alloy thereof at least one of them.
4, light-emitting device as claimed in claim 1, it also comprises one first insulating barrier, between this first metal layer and this light-emitting component, wherein the material of this first insulating barrier is selected from aluminium, magnesium and titanium one of them oxide, nitride or carbide at least.
5, light-emitting device as claimed in claim 4, it also comprises one second metal level, be arranged on this first insulating barrier, wherein the material of this second metal level be silver, gold, copper, aluminium and alloy thereof at least one of them.
6, light-emitting device as claimed in claim 5, wherein this light-emitting component is electrically connected with this second metal level by direct lead-in wire mode or directly is electrically connected with this second metal level.
7, light-emitting device as claimed in claim 5, it also comprises an articulamentum, be arranged between this second metal level and this first insulating barrier, with so that this second metal level can be arranged on this first insulating barrier, wherein the material of this articulamentum be selected from chromium, titanium, nickel and alloy thereof at least one of them.
8, as any described light-emitting device in the claim 1,4 to 7, it comprises one second insulating barrier, be positioned at the part outside the structure that on this first metal layer this be lifted out optical efficiency, wherein the material of this second insulating barrier is selected from aluminium, magnesium and titanium one of them oxide, nitride or carbide at least.
9, light-emitting device as claimed in claim 8, it also comprises one the 3rd metal level, is arranged on this second insulating barrier, this light-emitting component directly is electrically connected by at least one lead with the 3rd metal level.
10, light-emitting device as claimed in claim 9, it also comprises another articulamentum, be arranged between the 3rd metal level and this second insulating barrier, with so that the 3rd metal level can be arranged on this second insulating barrier, wherein the material of this another articulamentum be selected from chromium, titanium, nickel and alloy thereof at least one of them.
11, light-emitting device as claimed in claim 10, wherein this articulamentum and this another articulamentum have tackness.
12, light-emitting device as claimed in claim 11, it also comprises at least one pad, wherein this pad is electrically connected by at least one lead with the 3rd metal level.
13, light-emitting device as claimed in claim 8, wherein this first or second insulating barrier forms by this first metal layer surface of oxidation, nitrogenize or carbonization.
14, light-emitting device as claimed in claim 1, wherein this structure that is lifted out optical efficiency is a groove.
15, light-emitting device as claimed in claim 14, wherein the shape of this groove is selected from following group: spheroidal, the oval spherical and parabolic bodily form.
16, light-emitting device as claimed in claim 15, wherein this groove has a focus, when this light-emitting component is positioned at this predetermined position, this light-emitting component is positioned on this focus of this groove.
17, light-emitting device as claimed in claim 1, it also comprises a reflector, is arranged on this structure that is lifted out optical efficiency, wherein the material in this reflector comprises silver, gold or nickel.
18, light-emitting device as claimed in claim 8, it also comprises a lead frame, it has one first electrode pin and one second electrode pin is arranged on this second insulating barrier, and is electrically connected with this light-emitting component respectively.
19, light-emitting device as claimed in claim 1, wherein this light-emitting component is a light-emitting diode, a laser diode or an Organic Light Emitting Diode, this light-emitting component comprises one first electrode, one second electrode and a luminescent layer.
20, light-emitting device as claimed in claim 1, wherein the surface configuration of this protective layer is lens, in order to disperse or to assemble the light that this light-emitting component produces.
21, light-emitting device as claimed in claim 8, wherein this second insulating barrier coats the outer surface of this substrate relatively, under this substrate a plurality of pads can be set, and is electrically connected with this light-emitting component respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610084471 CN100544043C (en) | 2006-05-23 | 2006-05-23 | Light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610084471 CN100544043C (en) | 2006-05-23 | 2006-05-23 | Light-emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101079458A CN101079458A (en) | 2007-11-28 |
| CN100544043C true CN100544043C (en) | 2009-09-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610084471 Expired - Fee Related CN100544043C (en) | 2006-05-23 | 2006-05-23 | Light-emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100544043C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109273577A (en) * | 2018-09-28 | 2019-01-25 | 深圳市鼎业欣电子有限公司 | A kind of package substrate and production method of LED light |
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2006
- 2006-05-23 CN CN 200610084471 patent/CN100544043C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN101079458A (en) | 2007-11-28 |
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Granted publication date: 20090923 Termination date: 20130523 |