CN100547488C - The manufacture method of immersion optical projection system and integrated circuit (IC) wafer - Google Patents
The manufacture method of immersion optical projection system and integrated circuit (IC) wafer Download PDFInfo
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- CN100547488C CN100547488C CNB2005100793413A CN200510079341A CN100547488C CN 100547488 C CN100547488 C CN 100547488C CN B2005100793413 A CNB2005100793413 A CN B2005100793413A CN 200510079341 A CN200510079341 A CN 200510079341A CN 100547488 C CN100547488 C CN 100547488C
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Abstract
The manufacture method of a kind of immersion optical projection system and integrated circuit (IC) wafer.This immersion optical projection system comprises: an end mirror piece element; One wafer susceptor is used to grip a wafer; One transparent panel is located between this end mirror piece element and this wafer when this immersion optical projection system uses.This transparent panel has an eyeglass side surface and a wafer side surface, and this immersion optical projection system has an eyeglass side liquid layer, between this eyeglass side surface of this end mirror piece element and this transparent panel; And this immersion optical projection system has a wafer side liquid layer, between this wafer side surface and this wafer of this transparent panel.There is no circulation between this wafer side liquid layer and this eyeglass side liquid layer, and this eyeglass side liquid layer can be identical or different with this wafer side liquid layer.The present invention is than the of low pollution eyeglass, and still possesses the advantage and the function of general immersion system.
Description
Technical field
The invention relates to and be used for the immersion optical projection system (immersion optical projection system) that semiconductor is made micro-photographing process.
Background technology
In the semiconductor fabrication process, by micro-photographing process with the pattern transfer on the mask to the surface of substrate or wafer.In known micro-photographing process, need to form blocking layer (be generally can at the macromolecular material that changes its characteristic after the irradiate light) on an intermediate structure.Via passing a series of eyeglasses in the optical projection system and mask and desired pattern is projected on the blocking layer.These eyeglasses have dwindled the size of projection image.The image reduction that is caused by eyeglass then changes according to design criteria, and for instance, general image reduction is about 4～5 times.When the blocking layer and produce when exposure to wafer of the graphic pattern projection on the mask, just change through the acidity of the blocking layer of exposure area.And when the resistance agent is developed, remove part resistance agent and formed the blocking layer of a patterning.
Projection forms the wavelength that the clear and accurate patterns with minimum dimension often is subject to the light source that uses on wafer.For instance, adopted deep UV (ultraviolet light) to have wavelength at present and be about in the microlithography system of 248 nanometer to 193 nanometers, can form the pattern of characteristic dimension usually between 130～90 nanometers.In order to prolong formed characteristic dimension to 0.45 nanometer of the little shadow technology of 193 nanometers or following, just derived fluid and immersed the shadow technology that declines.So can obtain the optical characteristics of digital aperture (numerical apertures) greater than 1.
Fig. 1 is a rough schematic view, has illustrated a known immersion optical projection system (immersion optical projection system) 10 that is used for micro-photographing process.Immersion optical projection system 10 shown in Figure 1 is also referred to as spray-type structure (shower configuration) sometimes.In this system, circulating fluid (fluid) 12 continuously is to eliminate the caused damage of heat energy.Shown in the immersion optical projection system among Fig. 1 10, in micro-photographing process, round-robin fluid 12 is between end mirror piece element 22 and wafer 24.At the immersion camera lens 26 of the immersion optical projection system 10 that is used for Fig. 1, fluid intake 14 makes fluid 12 flow through to be positioned at the space of 24 of end mirror piece element 22 and wafers, and is received by fluid egress point 16.In general wafer susceptor shown in Figure 1 (wafer chuck) 28, it utilizes the vacuum power of being supplied by vacuum passage 30 and vacuum pipeline 32 and grips wafer 24.12 of fluids are limited to by capillarity, and then keep the fluid thickness of about 1～2 millimeter (mm).In addition, can use other vacuum passages and/or air pressure mode (not shown) in the perimeter of immersion camera lens 26, more to limit this fluid.The fluid that is used for immersion optical projection system 10 is generally the deionized water of ultrapurity, its have be higher than general between between eyeglass and crystal column surface one refractive index of the refractive index (refractive index) of bubble.In addition, also can in water, add other additive or admixture, to improve its refractive index.
In fluid immersion system so, preferably use usually to have high reflectance and the low fluid that absorbs performance, do not expect that absorption of fluids is from the micronic dust on the wafer (particles).Yet when using system 10 shown in Figure 1, the micronic dust on the blocking layer is taken away the mobile institute that tendency is recycled fluid 12.So micronic dust will be brought to the surface of end mirror piece element 22.So will cause the pollution of wafer, and ultimate demand is carried out the eyeglass replacing, thereby cause very expensive cost.Therefore, just need to be applicable to a kind of immersion optical projection system in the micro-photographing process, it has less eyeglass pollution, and still can possess the advantage and the function of immersion system.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide a kind of manufacture method that is applicable to the immersion optical projection system in the micro-photographing process and a kind of integrated circuit (IC) wafer, it can have less eyeglass contamination, and still possesses the advantage and the function of general immersion system.
To achieve these goals, according to one embodiment of the invention, the invention provides a kind of immersion optical projection system, it is applicable to micro-photographing process, comprising: an end mirror piece element; One wafer susceptor is used to grip a wafer; One transparent panel is located between this end mirror piece element and this wafer when this immersion optical projection system uses.This transparent panel has an eyeglass side surface and a wafer side surface, and this immersion optical projection system can have an eyeglass side liquid layer, between this eyeglass side surface of this end mirror piece element and this transparent panel; And this immersion optical projection system can have a wafer side liquid layer, and between this wafer side surface and this wafer of this transparent panel, wherein this eyeglass side liquid layer and this wafer side liquid interlayer have the different wetting characteristic.In an embodiment, this wafer side liquid layer and this eyeglass side liquid interlayer there is no circulation.In an embodiment, this eyeglass side liquid layer is different from this wafer side liquid layer.In an embodiment, the fluid rate of this wafer side liquid layer is different from the flow rate of this eyeglass side liquid layer.
Immersion optical projection system of the present invention, this transparent panel are adhered to this end mirror piece element, and this eyeglass side liquid layer is located between this end mirror piece element and this transparent panel, and is static.
Immersion optical projection system of the present invention, more comprise: eyeglass side liquid inlet, when using, this immersion optical projection system is adjacent to this end mirror piece element, this eyeglass side liquid inlet can make an eyeglass side liquid flow through between transparent panel and this end mirror piece element, to be formed up to this eyeglass side flow fluid layer of small part; An and eyeglass side liquid outlet, when using, this immersion optical projection system is adjacent to this end mirror piece element, this eyeglass side liquid outlet can receive the segment fluid flow that flows between this transparent panel and this end mirror piece element and flow, to be formed up to the eyeglass side flow fluid layer of small part.
Immersion optical projection system of the present invention comprises: wafer side liquid inlet, be positioned at this wafer susceptor, and this wafer side liquid inlet can make a wafer side liquid flow through between this transparent panel and this wafer, to form this wafer side flow fluid layer; And a wafer side liquid outlet, being positioned at this wafer susceptor, this wafer side liquid outlet can receive from this streaming flow between this transparent panel and this wafer, to form the streaming flow layer of this wafer side.
Immersion optical projection system of the present invention more comprises a carrier, is used for moving this transparent panel, and wherein this carrier comprises two or three arms of mutual axle pivot ground coupling.
According to another object of the present invention, the invention provides a kind of immersion optical projection system, it is applicable to micro-photographing process, comprising: an end mirror piece element; One transparent panel is adhered to this end mirror piece element; The stationary fluid layer of one eyeglass side is between this end mirror piece element and this transparent panel; One wafer susceptor is used to grip a wafer; And the streaming flow layer of a wafer side, between this transparent panel and this wafer, wherein the streaming flow interlayer of the stationary fluid layer of this eyeglass side and this wafer side has the different wetting characteristic.
Immersion optical projection system of the present invention, more comprise: fluid inlet, when using, this immersion optical projection system is adjacent to this end mirror piece element, this fluid intake can make a fluid flow through between transparent panel and the wafer, with the streaming flow layer of this wafer side of being formed up to small part; And a fluid outlet, when using, this immersion optical projection system is adjacent to this end mirror piece element, and this fluid egress point can receive this segment fluid flow that flows between this transparent panel and this wafer, with the streaming flow layer of this wafer side of being formed up to small part.
According to another object of the present invention, the invention provides a kind of manufacture method of integrated circuit (IC) wafer, comprise the following steps: to be provided with an end mirror piece element on a wafer, wherein be provided with a transparent panel between this end mirror piece element and this wafer, this transparent panel has an eyeglass side surface and a wafer side surface; This wafer is implemented a micro-photographing process; When implementing this micro-photographing process, form an eyeglass side liquid between this eyeglass side surface of this end mirror piece element and this transparent panel; And when implementing this micro-photographing process, form a wafer side liquid between this wafer side surface and this wafer of this transparent panel, wherein have the different wetting characteristic between this eyeglass side liquid and this wafer side liquid.
The manufacture method of integrated circuit (IC) wafer of the present invention, this eyeglass side liquid is static when implementing this micro-photographing process, and this wafer side liquid flows.
The manufacture method of integrated circuit (IC) wafer of the present invention, this eyeglass side liquid flows when implementing this micro-photographing process, and this wafer side liquid is static.
The manufacture method of integrated circuit (IC) wafer of the present invention, when implementing this micro-photographing process, this eyeglass side liquid has an eyeglass side liquid speed, and this wafer side liquid has a wafer side liquid speed, and this eyeglass side liquid speed is different from this wafer side liquid speed.
Description of drawings
Fig. 1 is a rough schematic view, in order to the known immersion optical projection system that is used for micro-photographing process to be described;
Fig. 2 is a rough schematic view, in order to the immersion optical projection system that be used for micro-photographing process of explanation according to first embodiment of the invention;
Fig. 3 is a rough schematic view, in order to the immersion optical projection system that be used for micro-photographing process of explanation according to second embodiment of the invention;
Fig. 4 is a rough schematic view, in order to the immersion optical projection system that be used for micro-photographing process of explanation according to third embodiment of the invention;
Fig. 5 is a rough schematic view, is used to place in the system among the 3rd embodiment and the structure that moves the protection transparent panel in order to illustrate; And
Fig. 6 A～6C is a series of vertical views, in order to show the carrier of the protection transparent panel that several are different.
Embodiment
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended diagram, be described in detail below.
Embodiments of the invention will cooperate and following graphicly be described in detail as followsly, and wherein employed same reference numerals has been represented the same or similar element in the different embodiments of the invention in difference is graphic.Below graphicly do not draw according to physical size, and for illustration purpose, with the graphic representation of simplifying among some embodiment.Those skilled in the art should know, the present invention can be based on the spirit of following examples and possessed different application and variation.
Embodiments of the invention provide a kind of immersion optical projection system that semiconductor device is made processing procedure that is used for.Fig. 2 has shown that of the present invention first explains orally embodiment.Fig. 3 has shown that then of the present invention second explains orally embodiment.Fig. 4～6C has then shown according to the 3rd explanation embodiment of the present invention.Above-mentioned three explain orally embodiment will according to be used for semiconductor make the little shadow program of implementing as theme, to explain orally different characteristic of the present invention and advantage.It should be noted that among each embodiment of the following stated that use can be mixed or merge to different characteristic in other embodiment of the present invention.In addition, also it should be noted that in an embodiment institute scope and the feature narrate or discuss not necessarily to be applied in the another embodiment of the present invention, yet in most of situation, those skilled in the art ought can benefit from technology disclosed in this invention.
Fig. 2 is a rough schematic view, has shown the immersion optical projection system 20 according to first embodiment of the invention, and it is applicable to micro-photographing process.In the immersion optical projection system 20 of Fig. 2, immersion camera lens 26 comprises an end mirror piece element 22 and a protection transparent panel 34.In Fig. 2, when micro-photographing process, immersion camera lens 26 is located on the wafer 24, and protection transparent panel 34 is located between end mirror piece element 22 and the wafer 24.Protection transparent panel 34 has an eyeglass side surface 36 and a wafer side surface 38.When micro-photographing process, then be formed with an eyeglass side liquid layer 40 between the eyeglass side surface 36 of lens element 22 and protection transparent panel 34 endways, as shown in Figure 2.Eyeglass side liquid layer 40 has and equals 0 or greater than 0 an eyeglass side liquid speed.In addition; in first embodiment; wafer side surface 38 and 24 of wafers in protection transparent panel 34 are formed with a wafer side liquid layer 42, and it has a wafer side liquid speed that is same or different from eyeglass side liquid speed, and this wafer side liquid speed can be 0 or greater than 0.
In first embodiment, fluid intake 44,46 and fluid egress point 48,50 are located in adjacent end lens element 22 places.The fluid intake 44 of eyeglass side provides the fluid that forms eyeglass side liquid layer 40; end mirror piece element 22 and 34 of transparent panels of protection so that the fluid of eyeglass side liquid layer 40 is flowed through, and received to the fluid of the eyeglass side liquid layer 40 of the small part fluid egress point 48 by the eyeglass side.The fluid intake 46 of wafer side provides the fluid that forms wafer side liquid layer 42, and transparent panel 34 and wafer are 24 so that the fluid of wafer side liquid layer 42 is flowed through.In first embodiment, the fluid of eyeglass side liquid layer is preferable to be not the fluid that fluidly is linked to wafer side liquid layer 42, is transmitted to end mirror piece element 22 places with the dust pollution of avoiding coming from (as coming from the resistance agent material of wafer 24) in the wafer side liquid 42.When being polluted by particulate, can replace protection transparent panel 34, but not replacement end mirror piece element 22.So, one of advantage of the present invention is, replaces protection transparent panel 34 and replaces the economy of end mirror piece element 22 with simple.In a preferred embodiment, because the use of protection transparent panel, so can relatively easily remove and replace.Yet in some embodiment, protection transparent panel 34 can for good and all be adhered on other parts, and may or can not easy removal it.
In other embodiment, eyeglass side liquid layer 40 can be linked to circulation wafer side liquid layer 42 via some place in the system.In such circumstances, before being incorporated in eyeglass side liquid stream 40, wafer side liquid layer 42 preferably filters for process.Yet,, will still use neither homogeneous turbulence body 40,42 based on some reason.For instance, the surface of the resistance agent on the wafer 24 may difference with the character of surface (as angle of wetting, wetting angle) in lens surface.Therefore, may in the fluid of each fluid layer 40,42, add different adjuvants respectively, to meet the wet characteristic of eyeglass and crystal column surface.Therefore, the fluid of eyeglass side liquid layer 40 may have different wet characteristics with the fluid of wafer side liquid layer 42.The fluid of eyeglass side liquid layer 40 may comprise one or more additive, so that the eyeglass side liquid wet characteristic of eyeglass side liquid layer 40 comparatively meets the wet characteristic of end mirror piece element 22, but not meets the wet characteristic of wafer 24.Same, wafer side liquid layer 42 also can comprise one or more additive, makes the wafer side liquid wet characteristic of wafer side liquid layer 42 comparatively meet the wet characteristic of wafer, but not meets the wet characteristic of end mirror piece element 22.
Another reason then is, owing to use two kinds of different fluids in the system 20 in two fluid layers 40,42, thereby preferable obtains different refractive indexes.For instance, the fluid 40 of eyeglass side liquid layer can have the refractive index near end mirror piece element 22, but not than the refractive index near wafer 24 and/or protection transparent panel 34.Therefore, the fluid of wafer side liquid layer 42 preferably has different refractive indexes.Moreover, when the fluid of eyeglass side liquid layer 40 is not when fluidly being linked to the fluid of wafer side liquid layer 42, fluid compared to wafer side liquid layer 42, because the fluid 40 of eyeglass side liquid layer can't contact wafer 24, thus the fluid 40 of eyeglass side liquid layer just non-limiting be one to hang down the absorbability fluid.
In the immersion optical projection system 20 with protection transparent panel 34 of the present invention, between end mirror piece element 22, protection transparent panel 34 and wafer 24 (at least along the graphic pattern projection paths) have living space and preferably filled up by fluid (for example intermediate of high index of refraction).In preferred embodiment of the present invention, protection transparent panel 34 is immersed in the fluid layer 40,42 with its dual-side.When in any space of projected path, existing gapped or during bubble, the high spatial frequency from reticle pattern to eyeglass may not meet resistance agent characteristic.Also reduced dependence at the fluid layer 40,42 of protection transparent panel 34 each side for the high optical quality of extreme of protection transparent panel 34.Because protection transparent panel 34 also is an optical element that is provided with along projection path; and be low deviation system extremely, therefore protect transparent panel 34 to need accurately to consider its surface flatness (surface flatness), smoothness (smoothness), the depth of parallelism (parallelism), displacement (placement) and location situations such as (orientation) at the component of wavelength of light.Yet, in one embodiment of the invention, when eyeglass side liquid layer 40 very conforms to the refractive index of end mirror piece element 22, just do not need to keep aforesaid optical characteristics.In a practical application, even refractive index eyeglass side liquid layer 40 can conform to the refractive index of end mirror piece element 22, the refractive index when having air owing to it comparatively conforms to, and therefore aforementioned optical quality just has the tolerance of a cardinal principle.For instance, in 193 nano wave lengths were set, when the eyeglass side liquid was water when protecting transparent panel 34 to can be quartzy material, the difference of refractive index was about 1.55-1.44=0.11.Through comparing, the refractive index difference of (air gap) is about 1.55-1.00=0.55 in drying system.Therefore, has five times tolerance approximately.
Preferably, the material of protection transparent panel 34 is transparent for photochemical light (actiniclight), and it has and is about 80% or higher penetrance (transmission).Therefore, for institute's wavelength of light of using in the immersion optical projection system 20, protecting transparent panel preferably is transparent (＞80% penetrance).For instance, system 20 in an embodiment can adopt wavelength to be about 436 nanometers, is about 365 nanometers, is about 248 nanometers, is about 193 nanometers or light still less.For instance, protection transparent panel 34 can comprise arbitrary suitable material, for example comprises (but not as limit): quartz, molten silicon (fused silica), calcium fluoride (CaF
2), lithium fluoride (LiF
2), magnesium fluoride (MgF
2) with and composition.The refractive index of protection transparent panel 34 is preferably identical or be higher than the refractive index of fluid layer 40,42.For instance, fluid layer 40,42 preferably has and is about 1.3 or higher refractive index.In an embodiment, water (for example ultrapure water, deionized water) is preferable fluid, because its refractive index is greater than the refractive index (promptly greater than 1) of air.In an embodiment, but Yu Shuizhong adds impurity and/or additive, so as to changing the particular characteristics of fluid layer 40,42.Yet in other embodiment, these factors and standard will change to some extent.
For instance, protection transparent panel 34 can be substantially smooth, part is crooked, the combination of crooked or above-mentioned shape.Another advantage of the embodiment of the invention may be different from its wafer side surface 38 for the eyeglass side surface 36 of protection transparent panel 34.Because the lens surface characteristic of end mirror piece element 22 has an eyeglass wet characteristic, the crystal column surface characteristic of wafer 24 then has a wafer wet characteristic.Therefore, in an embodiment, the eyeglass side surface 36 of protection transparent panel 34 has an eyeglass side surface characteristic, and it differs from the wafer side surface characteristic of the wafer side surface 38 of protection transparent panel 34.The eyeglass side surface characteristic of eyeglass side surface 36 has an eyeglass side surface wet characteristic, and it is similar to the eyeglass wet characteristic that the lens surface characteristic is provided than wafer side surface characteristic.Same, the wafer side surface characteristic of wafer side surface 38 has a wafer side surface wet characteristic, and it is similar to the eyeglass wet characteristic that the crystal column surface characteristic is provided than eyeglass side surface characteristic.Therefore, the surface 36,38 of protection transparent panel 34 is revised discriminably or is tailor-made, to meet the surface wettability characteristic of (or approaching before not having to revise) resistance agent and eyeglass.
In embodiments of the invention, the eyeglass side liquid layer 40 that is positioned at 34 of end mirror piece element 22 and protection transparent panels can be mobile, static or other states.Same, the wafer side liquid layer 42 that is positioned at 24 of protection transparent panel 34 and wafers can be static, mobile or other states.In aforementioned first embodiment, when micro-photographing process, eyeglass side liquid layer 40 preferably be a flow state with wafer side liquid layer 42, though it also can be static or between other static with mobile states.
Fig. 3 is a rough schematic view, in order to the immersion optical projection system that be used for micro-photographing process 20 of explanation according to second embodiment of the invention.In second embodiment, eyeglass side liquid 40 is a stationary state, and wafer side liquid 42 is a flow state.Eyeglass side liquid 40 can conceal and thickly be sealed between protection transparent panel 34 and the end mirror piece element 22.At this moment, protection transparent panel 34 is adhered on the end mirror piece element 22.In other words, when usual immersion optical projection system 20 used, with respect to end mirror piece element 22, protection transparent panel 34 was static.Though the protection transparent panel is adhered to end mirror piece element 22; because it is all and is adhered on the immersion camera lens 26, thereby it also can be adhered on the end mirror piece element 22 (for example protect transparent panel via other members adhesions of immersion camera lens 26 in end mirror piece element 22) indirectly.
In one embodiment of this invention; when immersion optical projection system 20 uses; when end mirror piece element 22 when wafer 24 moves, for immersion camera lens 26, end mirror piece element 22, wafer 24, wafer susceptor 28 or its combination, the protection transparent panel 34 be static.For instance, (please refer to Fig. 2,3) among aforesaid first and second embodiment, when end mirror piece element 22 corresponding wafers 24 and when mobile, with respect to immersion camera lens 26 and end mirror piece element 22, protection transparent panel 34 is still kept static.
Fig. 4 is a rough schematic view, in order to the immersion optical projection system that be used for micro-photographing process 20 of explanation according to third embodiment of the invention.In the 3rd embodiment, when end mirror piece element 22 when wafer 24 moves, for wafer 24 and wafer susceptor 28, the protection transparent panel 34 be static.Protection transparent panel 34 is adhered on the wafer susceptor 28 removedly, to allow moving and shifting out of wafer 24.In wafer susceptor 28, be provided with wafer side liquid inlet 46 and outlet 50, so that the fluid of wafer side liquid layer 42 is flowed through between protection hyaline layer 34 and the wafer 24.End mirror piece element 22 places that are adjacent in the immersion camera lens then are provided with eyeglass side liquid inlet 44 and outlet 48, so as to the fluid of supply eyeglass side liquid layer 40.
Fig. 5 has then shown the flat carrier 54 on the located protection transparent panel 34.The protection transparent panel 34 can lie low on carrier 54, thereby on the eleutheromorph physa seat 28 for this reason carrier 54 reclaim.For instance, in preferred embodiment, protection transparent panel 34 can lift and take in by the vacuum power in the carrier 54.In addition, in micro-photographing process, the vacuum power that transparent protection plate 34 also can be in the wafer susceptor 28 grips
After gripping transparent protection plate 34, carrier 54 can suspend the simple and easy position in exposure system 20.In such circumstances, micro-photographing process preferably needs to minimize the position that is used to park carrier 54.In order to reduce the space of stand, carrier 54 may have any shape.Fig. 6 A～6C has shown the vertical view of the possible example of multiple different carrier 54.In Fig. 6 A, carrier 54 is ring-type (ring) external form, and it comprises vacuum tank (vacuum groove) and/or a plurality of vacuum holes (vacuum hole) that distribute along the annulus 56 of carrier 54.In Fig. 6 B, carrier 54 has crosswise (cross) external form.58 pivot ground of vertical arm in Fig. 6 B (pivotably) are coupled to horizontal arm 60, so that laterally arm 60 can be folded to vertical arm 58 when not using.Fig. 6 C has then shown the another one example.In Fig. 6 C, carrier 54 has forked (fork) external form, and it has the side arm 62 that diaxon pivot ground (pivotably) couples.These side arms 62 can be towards central arm 64 foldings to provide comparatively compact folding structure, to save the space.It will be appreciated by those skilled in the art that carrier 54 can be other external forms, and be not limited to scope of the present invention.
Though the present invention by the preferred embodiment explanation as above, this preferred embodiment is not in order to limit the present invention.Those skilled in the art without departing from the spirit and scope of the present invention, should have the ability this preferred embodiment is made various changes and replenished, so protection scope of the present invention is as the criterion with the scope of claims.
Being simply described as follows of symbol in the accompanying drawing:
10,20: immersion optical projection system 40: eyeglass side liquid layer
12: circulation of fluid 42: wafer side liquid layer
14: fluid intake 44: eyeglass side liquid entrance
16: fluid issuing 46: wafer side liquid entrance
22: end mirror piece element 48: the outlet of eyeglass side liquid
24: wafer 50: the outlet of wafer side liquid
28: wafer susceptor 54: carrier
30: vacuum passage 56: the annulus of carrier
32: vacuum line 58: vertical arm
34: transparent protection plate 60: horizontal arm
36: the eyeglass side surface 62 of transparent protection plate: side arm
38: the wafer side surface 64 of transparent protection plate: central arm
Claims (11)
1, a kind of immersion optical projection system is applicable to micro-photographing process, comprising:
One end mirror piece element;
One wafer susceptor is used to grip a wafer;
One transparent panel is located between this end mirror piece element and this wafer when this immersion optical projection system uses, and wherein this transparent panel has an eyeglass side surface and a wafer side surface;
This immersion optical projection system has an eyeglass side liquid layer, between this eyeglass side surface of this end mirror piece element and this transparent panel; And
This immersion optical projection system has a wafer side liquid layer, and between this wafer side surface and this wafer of this transparent panel, wherein this eyeglass side liquid layer and this wafer side liquid interlayer have the different wetting characteristic.
2, immersion optical projection system according to claim 1 is characterized in that: this transparent panel is adhered to this end mirror piece element, and this eyeglass side liquid layer is located between this end mirror piece element and this transparent panel, and is static.
3, immersion optical projection system according to claim 1 is characterized in that, more comprises:
One eyeglass side liquid inlet, when using, this immersion optical projection system is adjacent to this end mirror piece element, this eyeglass side liquid inlet can make an eyeglass side liquid flow through between transparent panel and this end mirror piece element, to be formed up to this eyeglass side flow fluid layer of small part; And
The outlet of one eyeglass side liquid, when using, this immersion optical projection system is adjacent to this end mirror piece element, this eyeglass side liquid outlet can receive the segment fluid flow that flows between this transparent panel and this end mirror piece element and flow, to be formed up to the eyeglass side flow fluid layer of small part.
4, immersion optical projection system according to claim 1 is characterized in that, comprising:
One wafer side liquid inlet is positioned at this wafer susceptor, and this wafer side liquid inlet can make a wafer side liquid flow through between this transparent panel and this wafer, to form this wafer side flow fluid layer; And
The outlet of one wafer side liquid is positioned at this wafer susceptor, and this wafer side liquid outlet can receive from this streaming flow between this transparent panel and this wafer, to form the streaming flow layer of this wafer side.
5, immersion optical projection system according to claim 1 is characterized in that: more comprise a carrier, be used for moving this transparent panel, wherein this carrier comprises two or three arms of mutual axle pivot ground coupling.
6, a kind of immersion optical projection system is applicable to micro-photographing process, comprising:
One end mirror piece element;
One transparent panel is adhered to this end mirror piece element;
The stationary fluid layer of one eyeglass side is between this end mirror piece element and this transparent panel;
One wafer susceptor is used to grip a wafer; And
The streaming flow layer of one wafer side, between this transparent panel and this wafer, wherein the streaming flow interlayer of the stationary fluid layer of this eyeglass side and this wafer side has the different wetting characteristic.
7, immersion optical projection system according to claim 6 is characterized in that, more comprises:
One fluid inlet is adjacent to this end mirror piece element when this immersion optical projection system uses, this fluid intake can make a fluid flow through between transparent panel and the wafer, with the streaming flow layer of this wafer side of being formed up to small part; And
One fluid outlet is adjacent to this end mirror piece element when this immersion optical projection system uses, this fluid egress point can receive this segment fluid flow that flows between this transparent panel and this wafer, with the streaming flow layer of this wafer side of being formed up to small part.
8, a kind of manufacture method of integrated circuit (IC) wafer comprises the following steps:
One end mirror piece element is set on a wafer, wherein is provided with a transparent panel between this end mirror piece element and this wafer, this transparent panel has an eyeglass side surface and a wafer side surface;
This wafer is implemented a micro-photographing process;
When implementing this micro-photographing process, form an eyeglass side liquid between this eyeglass side surface of this end mirror piece element and this transparent panel; And
When implementing this micro-photographing process, form a wafer side liquid between this wafer side surface and this wafer of this transparent panel, wherein have the different wetting characteristic between this eyeglass side liquid and this wafer side liquid.
9, the manufacture method of integrated circuit (IC) wafer according to claim 8 is characterized in that: this eyeglass side liquid is static when implementing this micro-photographing process, and this wafer side liquid flows.
10, the manufacture method of integrated circuit (IC) wafer according to claim 8 is characterized in that: this eyeglass side liquid flows when implementing this micro-photographing process, and this wafer side liquid is static.
11, the manufacture method of integrated circuit (IC) wafer according to claim 8, it is characterized in that: when implementing this micro-photographing process, this eyeglass side liquid has an eyeglass side liquid speed, this wafer side liquid has a wafer side liquid speed, and this eyeglass side liquid speed is different from this wafer side liquid speed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58220304P | 2004-06-23 | 2004-06-23 | |
| US60/582,203 | 2004-06-23 | ||
| US11/009,505 | 2004-12-10 |
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| CN1790165A CN1790165A (en) | 2006-06-21 |
| CN100547488C true CN100547488C (en) | 2009-10-07 |
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| CNB2005100793413A Active CN100547488C (en) | 2004-06-23 | 2005-06-23 | The manufacture method of immersion optical projection system and integrated circuit (IC) wafer |
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| US8208116B2 (en) * | 2006-11-03 | 2012-06-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion lithography system using a sealed wafer bath |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4480910A (en) * | 1981-03-18 | 1984-11-06 | Hitachi, Ltd. | Pattern forming apparatus |
| US4509852A (en) * | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
| CN1501170A (en) * | 2002-11-18 | 2004-06-02 | Asml | Lithographic apparatus and device manufacturing method |
-
2005
- 2005-06-23 CN CNB2005100793413A patent/CN100547488C/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4509852A (en) * | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
| US4480910A (en) * | 1981-03-18 | 1984-11-06 | Hitachi, Ltd. | Pattern forming apparatus |
| CN1501170A (en) * | 2002-11-18 | 2004-06-02 | Asml | Lithographic apparatus and device manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1790165A (en) | 2006-06-21 |
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