CN100576520C - 碳毫微管热界面结构 - Google Patents

碳毫微管热界面结构 Download PDF

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CN100576520C
CN100576520C CN02828255A CN02828255A CN100576520C CN 100576520 C CN100576520 C CN 100576520C CN 02828255 A CN02828255 A CN 02828255A CN 02828255 A CN02828255 A CN 02828255A CN 100576520 C CN100576520 C CN 100576520C
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S·蒙特戈梅里
V·霍拉克雷
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Abstract

本发明涉及一种形成热界面的方法，该热界面采用碳毫微管以降低电子装置与冷却装置之间的热阻。对准的毫微管束接收注入的聚合物材料，以便形成聚合物/碳复合物，其随后设置在电子装置与散热装置或其它冷却装置之间。

Description

碳毫微管热界面结构
技术领域
本发明总体上涉及向电子电路提供冷却的技术方案，尤其涉及使用碳毫微管的热界面结构的制造，以便改进包含电子电路的电路芯片的热性能。
发明内容
具体地，本发明提出一种热界面结构，其包括：多个碳毫微管束，其定向成大致平行于该热界面的所需传热轴线；和所述毫微管束嵌入其中的填隙材料；其特征在于：该填隙材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
也提出一种热界面，其包括：多个毫微管束，该管束定向成大致彼此平行并且大致平行于该热界面的传热路径；和在该毫微管束之间的填隙材料；其特征在于：该填隙材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
还提出一种与半导体电路芯片一起使用的传热结构，其包括：具有联接到该电路芯片上的表面的散热装置；和导热元件，其包括联接到该散热装置上的第一表面和联接到该电路芯片上的第二表面，该导热元件包括多个碳毫微管，所述碳毫微管定向成其轴线大致垂直于该第一和第二表面；其特征在于：该导热元件还包括在碳毫微管束之间加入的填隙粘结材料；该填隙粘结材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
也提出一种包括至少一个集成的电路插件的电子组件，其包括：至少一个集成的电路芯片；具有联接到该电路芯片上的表面的散热装置；和导热元件，其包括联接到该散热装置上的第一表面和联接到该电路芯片上的第二表面，该导热元件包括多个碳毫微管束，所述碳毫微管束定向成其轴线大致垂直于该第一和第二表面；其特征在于：该导热元件还包括在碳毫微管束之间嵌入的填隙材料；该填隙材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
也提出一种数据处理系统，其包括：将部件联接到该数据处理系统上的总线；与该总线联接的显示装置；与该总线联接的外部存储器；和与该总线联接的处理器，该处理器包括电子组件，该电子组件包括至少一个电路插件，其包括：至少一个集成的电路芯片；具有联接到该电路芯片上的表面的散热装置；和导热元件，其包括联接到该散热装置上的第一表面和联接到该电路芯片上的第二表面，该导热元件包括多个碳毫微管束，所述碳毫微管束定向成其轴线大致垂直于该第一和第二表面；其特征在于：该导热元件还包括在碳毫微管束之间嵌入的填隙材料；该填隙材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
附图说明
按照获得本发明的实施例的顺序来详细描述本发明的结合附图示出的实施例。本发明的附图没有按比例绘制并且不能认为是对本发明的限制，在附图中：
图1是使用依据本发明的实施例的热界面将倒装晶片联接道冷却板上的侧视图；
图2是图1所示的热界面的一部分的立体图，其中具有聚合物加成剂并且示出了碳毫微管束阵列；
图3是热界面的立体示意图，其中以夸大的比例示出了分布在热界面的表面上的碳毫微管束；
图4是图3所示的热界面结构的侧视截面图；
图5是制造依据本发明的一实施例的热界面结构的过程的流程图；和
图6是制造依据本发明的一实施例的在两个器件之间提供热通路的过程的流程图。
具体实施方式
本发明涉及热界面结构和由从衬底突伸的定向的毫微管的矩阵形成热界面的方法。
本领域的普通技术人员应当理解，在不脱离由权利要求限定的本发明的原理和范围的情况下，可描述和示出在部件和方法阶段的细节、材料、结构方面中的各种其它的改变，以便更好地理解本发明。
在图1中，例如计算机10的电子装置的一部分在侧视图中示出。在装置10中，在该实施例中所示的硅电路芯片12以倒装晶片格栅阵列的形式安装在有机衬底14上，该衬底又安装在另一衬底16上并由焊料球18固定。例如散热板20的冷却装置(cooling solution)由在该实施例中所示的热界面结构22联接到电路芯片12的表面上。
过去已经使用了各种热界面材料，以便降低电路芯片和冷却装置之间的热阻。在一些应用场合中，热油脂用做热界面材料，这是因为这种材料具有高度的导热性，并且便于符合在散热装置和该装置中的不规则形状。然而，使用热油脂具有以下缺点，即，当电路芯片被热加热并由于电路芯片12和有机衬底14之间的热膨胀系数不同而引起热翘曲时，热油脂可能出现汲出和相分离。在其它的应用场合中，例如环氧树脂的粘接剂用做热界面材料，但该粘接剂在其施加之后具有需要固化过程的缺点。例如硅酮和某些烯烃的热凝胶也可用做热界面材料，但是它们在施加之后也需要固化并且具有比热油脂更低的导热性。例如聚氨酯橡胶的某些弹性体具有高度的导热性，但是其不利之处在于其接触热阻较高并且需要至少100psi的高压力施加在热接点处以提供足够的热耦合。最后，例如低分子量的聚酯的某些相变材料已经被使用了，但是其不利之处在于它们的导热性低于热油脂。通常使用的热界面材料的导热性的导热率数值是大约10W/m-°K。
在本发明的一个实施例中，热界面结构由在聚合物填隙材料中的对准的碳毫微管阵列形成。因为碳毫微管的导热率为3000W/m-°K的数量级，因此在热界面结构中使用这种碳毫微管将明显地增加其导热性。
在图2中，在聚合物加成剂注入之前的衬底28的具有从其表面突伸的碳毫微管26的间隔管束24的阵列的部分以高倍放大形式示出。这种阵列可从Nano-Lab，Inc.公司获得，该公司在化学气相淀积过程中按Dr.Z.F.Ren在Science，282，1105(1998年)的文章制造该阵列。碳毫微管26的间隔管束24的阵列依据该过程来制造，该阵列在包括玻璃和硅的各种衬底28上生长。在衬底28上生长的毫微管26对准，以便绝大多数的毫微管彼此大致平行地定向并且垂直于它们从其上突伸的衬底28。毫微管的高度通常是基本上相同的。
本发明的热界面结构22由衬底28形成，毫微管束26支承在该衬底上。聚合物填隙材料30围绕毫微管束26注入，以便支承该毫微管。适当的聚合物材料包括聚碳酸酯、聚丙烯、乙缩醛。在聚合物材料30加成之后，除去了毫微管起初形成在其上的衬底28。用于除去衬底28的适当过程是机械磨削或化学蚀刻。
如图2所示，热界面结构22的长度L和宽度W如此选择，以便提供足够的热交换表面，同时使其落在电路芯片12的暴露表面的轮廓之内。在一个实施例中，长度和宽度是2厘米和1厘米。
热界面结构的最大厚度由碳毫微管的长度来限制，而且落在大约5-20微米的范围内。当然，增加热界面结构22的厚度将增加电路芯片与散热装置之间的热阻。如图4所示，碳毫微管定向成彼此大致平行和垂直该结构22的顶表面和底表面，这是因为它们沿其纵向轴线提供了其最大的导热性，并且所希望的是使得传导的热量在电路芯片12与散热装置20之间沿最短的路径传递。
图5是示出了形成热界面结构的方法的实施例的流程图。在操作52中，碳毫微管26的阵列24包括其上有毫微管26突伸的衬底28。该阵列使用填隙材料30嵌入，该填隙材料是从一组包括聚碳酸酯、聚丙烯、聚乙缩醛、聚氧甲烯、聚甲醛中选择的聚合物材料。填隙材料30是热塑性的并且以熔融形式注入以便使其嵌入到阵列中以形成半成品结构。
在操作54中，任何多余的填隙材料30从半成品和衬底28上除去，该衬底是毫微管束起初在其上生长的衬底。该除去可通过化学机械抛光过程或机械磨削过程来实施。在操作54结束时，制成了半成品的热界面结构。碳毫微管在该结构的形成过程中保持彼此对准，并且在多余的填隙材料和初始的衬底被除去之后，碳毫微管的端部在半成品的热界面结构的表面上以及冷却装置的表面上，该热界面结构的表面与被冷却的器件接合，并且热界面结构联接到该表面上。
如果半成品的热界面结构在两个器件的表面之间提供了热耦合并且半成品的热界面结构处于压力下，则填隙材料的屈服确保了碳毫微管与将其夹在其中的器件表面形成稳固的热接触，尽管该本发明的平面度中存在不规则的形状。
图6示出了在两个器件之间提供热耦合的过程。在操作62中，毫微管阵列联接到其中的一个器件上。在一个实施例中，毫微管阵列实际上在器件的表面上生长，而不是在独立的衬底上生长。在该实施例中，毫微管形成时的温度和其它条件必需处于其上生长碳毫微管阵列的器件所允许的温度范围和暴露次数的范围内。在该实施例中，在操作64中使用填隙材料的注入和多余材料的除去以与图5所示的操作大致相似的方式来实施。
在另一实施例中，在毫微管形成在独立的衬底上之后并且在操作64中施加填隙材料和在操作66中去除多余材料之后，实施操作62。
在以上所述的图6所示的过程的实施例中，操作68涉及将阵列的另一表面联接到两个器件的另一器件上。在一个实施例中，其中的一个器件可以是冷却装置，例如散热装置，另一器件可以是半导体电路芯片。在一个实施例中，任一器件可接收在操作62中生长的碳毫微管。使用该过程，可获得与所述器件的特别强的热粘结的优点。
不脱离权利要求限定的本发明的范围和构思，本领域普通技术人员可以对上述的技术方案作出各种改变和改型。因此，所述的各种特征和配置以及等效物可用于各种组合和变更中。因而，本发明不由上述的说明限定，而是由下面的权利要求限定。
应当理解，本文所使用的措辞和术语仅仅是示意性的而不是限定性的。因此，本发明旨在包括落在后附权利要求限定的精神和范围内的所有替换、变型、等同形式和改变。
部件表
10  装置                  22  热界面结构
12  硅电路芯片            24  阵列
14  有机衬底              26  毫微管束
16  另一衬底              28  (用于毫微管束)的衬底
18  焊料球                30  聚合物填隙材料
20  散热板

Claims (10)

1.一种热界面结构，其包括：
多个碳毫微管束，其定向成大致平行于该热界面的所需传热轴线；和
所述毫微管束嵌入其中的填隙材料；其特征在于：该填隙材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
2.如权利要求1所述的结构，其特征在于：该结构具有：第一表面，以便与电路芯片的表面接触，和第二表面，以便与冷却装置的表面接触，该第一和第二表面彼此大致平行。
3.如权利要求2所述的结构，其特征在于：该结构从第一表面到第二表面的厚度大约是5-20微米。
4.一种热界面，其包括：
多个毫微管束，该管束定向成大致彼此平行并且大致平行于该热界面的传热路径；和
在该毫微管束之间的填隙材料；其特征在于：该填隙材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
5.如权利要求4所述的热界面，其特征在于：该热界面具有第一和第二大致为平面的表面，所述表面均大致垂直于该传热路径。
6.一种与半导体电路芯片一起使用的传热结构，其包括：
具有联接到该电路芯片上的表面的散热装置；和
导热元件，其包括联接到该散热装置上的第一表面和联接到该电路芯片上的第二表面，该导热元件包括多个碳毫微管，所述碳毫微管定向成其轴线大致垂直于该第一和第二表面；
其特征在于：该导热元件还包括在碳毫微管束之间加入的填隙粘结材料；该填隙粘结材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
7.如权利要求6所述的散热结构，其特征在于：该导热元件的表面面积与该电路芯片的表面面积大致相同。
8.如权利要求7所述的散热结构，其特征在于：该导热元件的厚度是10-50微米。
9.一种包括至少一个集成的电路插件的电子组件，其包括：
至少一个集成的电路芯片；
具有联接到该电路芯片上的表面的散热装置；和
导热元件，其包括联接到该散热装置上的第一表面和联接到该电路芯片上的第二表面，该导热元件包括多个碳毫微管束，所述碳毫微管束定向成其轴线大致垂直于该第一和第二表面；
其特征在于：该导热元件还包括在碳毫微管束之间嵌入的填隙材料；该填隙材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
10.一种数据处理系统，其包括：
将部件联接到该数据处理系统上的总线；
与该总线联接的显示装置；
与该总线联接的外部存储器；和
与该总线联接的处理器，该处理器包括电子组件，该电子组件包括至少一个电路插件，其包括：
至少一个集成的电路芯片；
具有联接到该电路芯片上的表面的散热装置；和
导热元件，其包括联接到该散热装置上的第一表面和联接到该电路芯片上的第二表面，该导热元件包括多个碳毫微管束，所述碳毫微管束定向成其轴线大致垂直于该第一和第二表面；
其特征在于：该导热元件还包括在碳毫微管束之间嵌入的填隙材料；
该填隙材料是从一组包括聚碳酸酯、聚乙缩醛、聚氧甲烯、和聚甲醛中选择的聚合物材料。
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