CN100581480C - Ultrasonic probe - Google Patents
Ultrasonic probe Download PDFInfo
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- CN100581480C CN100581480C CN 200710139781 CN200710139781A CN100581480C CN 100581480 C CN100581480 C CN 100581480C CN 200710139781 CN200710139781 CN 200710139781 CN 200710139781 A CN200710139781 A CN 200710139781A CN 100581480 C CN100581480 C CN 100581480C
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Abstract
An ultrasonic probe for use in an ultrasonic diagnosis apparatus for a living body comprises an array transducer made up of a plurality of layered transducer elements. A specified structure (face-to-face structure) is created across two adjacent transducer elements. In each transducer element, a first vertical electrode layer for ground is connected with a top electrode layer and an inner electrode layer, and a second vertical electrode layer for signal is connected with a bottom electrode layer and an inner electrode layer. When creating the specified structure, steps including formation of slits in a layered assembly and filling of the slits or the like are repeated. By finally forming a plurality of separating slits, the layered assembly is divided into a plurality of transducer elements. On the other hand, each transducer element is compounded in the horizontal direction. The compounding is performed at any stage of before, during or after formation of the specified structure.
Description
The application is that application number is 03150184.2, and the applying date is on July 18th, 2003, and denomination of invention is divided an application for the Chinese patent application of " ultrasound probe and manufacture method thereof ".
Technical field
The present invention relates to ultrasound probe and manufacture method thereof, The present invention be more particularly directed to be used for the structure and the manufacture method thereof of stack-up type layered transducer elements of the ultrasonic diagnosis of organism.
Background technology
As the layered transducer elements that is arranged with a plurality of vibrating elementss, the known 2D of having layered transducer elements (comprising sparse type 2D layered transducer elements), 1.5D layered transducer elements.In such layered transducer elements, the size of each vibrating elements that constitutes this layered transducer elements is very little.Therefore, the electrical impedance of each vibrating elements is high, between each vibrating elements and cable (or apparatus main body), can't obtain the electrical impedance coupling.The problem that consequently causes significant loss of sensitivity.
So people propose to make each vibrating elements to form the technology of stack-up type.If adopt this technology, then each vibrating elements constitutes with the laminate of regulation order with a plurality of piezoelectric layers and a plurality of electrode layer laminations.Specifically,, be provided with the bottom-side electrodes layer,, be provided with the end face electrode layer, between two piezoelectric layers of adjacency, then be provided with interior electrode layer at the end face of this laminate in the bottom surface of this laminate.Therefore, the odd number electrode layer in these a plurality of electrode layers is as such as, signal electrode layer, and the even number of electrodes layer is as such as, ground electrode layer.Between a plurality of signal electrode layers and a plurality of ground electrode layer, apply voltage signal.According to this scheme, can reduce the electrical impedance of vibrating elements.
Aforesaid stack-up type vibrating elements can go wrong aspect the electrical connection of a plurality of electrode layers.Particularly, problem is how lead or electrode layer are connected with a plurality of interior electrode layers.As 1 existing example, can enumerate the method that adopts passage (via) (for example, vertically by the intermediary thin wire of vibrating elements).But, because of the area of vibrating elements is very little, therefore, if after this it is added man-hour, will occur because of being difficult to making, and unpractical problem.
, open in the 2001-29346 communique for this reason, disclosed a kind of layered transducer elements that constitutes by a plurality of stack-up type vibrating elementss the spy.First side at each stack-up type vibrating elements, the ground connection side electrode layer that formation links to each other with the ground connection interior electrode layer, and, form the signal side electrode layer that links to each other with the signal interior electrode layer in second side (side relative) of each vibrating elements with first side.So just can eliminate, reduce the problems referred to above.If note between two vibrating elementss of adjacency in this layered transducer elements, will find, the ground connection side electrode layer of the signal side electrode layer of the vibrating elements of one side and the vibrating elements of opposite side is approaching mutually, and their formation scope vertically staggers.
Summary of the invention
In order to improve the characteristic of layered transducer elements, be preferably and improve electrical insulating property further.In addition, also be preferably, when making layered transducer elements, positioning accuracy can be improved, and be easy to make (such as, can form opposed a pair of side electrode layer simultaneously).In addition, be preferably the electric field that can form well in each vibrating elements.
The invention has the advantages that to provide ultrasound probe and the manufacture method thereof with well behaved stack-up type layered transducer elements.
Another advantage of the present invention is to provide the ultrasound probe with stack-up type layered transducer elements that is easy to make.
(1) ultrasound probe of the present invention contains and has the first that adjoins each other and the stack-up type ultrasonic oscillator of second portion, and set above-mentioned first and second portion have respectively: a plurality of first horizontal electrode layers that vertically are crisscross arranged and a plurality of second horizontal electrode layer; The first vertical electrode layer that is electrically connected with above-mentioned a plurality of first horizontal electrode layers; And the second vertical electrode layer that is electrically connected with above-mentioned a plurality of second horizontal electrode layers, the first vertical electrode layer that the first vertical electrode layer and the above-mentioned second portion that above-mentioned first had had in abutting connection with and have identical polarity, have first gap area between them, above-mentioned ultrasonic oscillator has the first vertical electrode layer and first gap area that first vertical electrode layer, the second portion that had by first had and is constituted first ad hoc structure.
In said structure, ultrasonic oscillator is 1D layered transducer elements, 1.5D layered transducer elements, 2D layered transducer elements etc.First and second portion lamination respectively form, and adjacency in the horizontal direction.That is, first and second portion are equivalent to the stack-up type vibrating elements of two adjacency, or are equivalent to interconnective two zones of along continuous straight runs or parts (block) in certain stack-up type vibrating elements.Mode (or between them) according to striding across first and second portion forms first ad hoc structure.First ad hoc structure has the function that ground wire or holding wire and first are connected with a plurality of first horizontal electrode layers that second portion is had.First ad hoc structure have from and the opposed a pair of first vertical electrode layer (first vertical electrode layer of first and the first vertical electrode layer of second portion).Because a pair of first vertical electrode layer has identical polar (earthing pole or pickup electrode), so have the advantage that improves electrical properties such as insulating properties.Also can in first gap area, enhancement layer, insulating barrier, laminating resin layer, element separating tank etc. be set.Each vertical electrode layer can be used as side electrode, internal electrode etc.Each vertical electrode layer is preferably formed to planar, but also can adopt other form in addition.Layered transducer elements also can be lobed shape.In the case, the vertical direction of each vibrating elements is defined as the ultrasonic propagation direction.
Above-mentioned ultrasonic oscillator is preferably the third part that also comprises with above-mentioned second portion adjacency, this third part comprises a plurality of first horizontal electrode layers and a plurality of second horizontal electrode layer that is crisscross arranged along above-mentioned vertical direction, the first vertical electrode layer that is electrically connected with above-mentioned a plurality of first horizontal electrode layers, with the second vertical electrode layer that is electrically connected with above-mentioned a plurality of second horizontal electrode layers, the second vertical electrode layer that second vertical electrode layer that above-mentioned second portion had and above-mentioned third part are had in abutting connection with and have an identical polar, have second gap area between them, above-mentioned ultrasonic oscillator also has the second vertical electrode layer that is had by above-mentioned second portion, the second vertical electrode layer that above-mentioned third part had, second ad hoc structure with above-mentioned second gap area formation.
In said structure, arranged side by side in the horizontal direction first, second portion and third part.Mode (or between them) according to striding across first and second portion forms first ad hoc structure, according to the mode that strides across second portion and third part, forms second ad hoc structure.First ad hoc structure and second ad hoc structure have mutually different polarity.In second ad hoc structure, identical with first ad hoc structure, a pair of second vertical electrode layer that is had also is opposed across second gap area, and has identical polarity.
It is respectively that along continuous straight runs keeps symmetrical structure that above-mentioned first ad hoc structure and second ad hoc structure are preferably.Above-mentioned first ad hoc structure and second ad hoc structure are preferably vertically the relation of counter-rotating each other.
Above-mentioned ad hoc structure (first ad hoc structure and second ad hoc structure) has a pair of vertical electrode layer adjacency, opposed, that polarity is identical.Put from this, also ad hoc structure can be called " to interposed structure " or " abutment structure ".It is asymmetrical structure that ad hoc structure also can form along continuous straight runs, still, for the ease of making, is preferably and forms structure or the mirror-image structure that along continuous straight runs keeps symmetry (in the face of claiming).Each ad hoc structure be easy to by carry out repeatedly such as, the formation of groove, the filling of material etc. is made.
In a preferred embodiment, above-mentioned first, second portion and third part also comprise the piezoelectric part with above-mentioned a plurality of first horizontal electrode layer, above-mentioned a plurality of second horizontal electrode layers and a plurality of piezoelectric layers respectively; Be formed at above-mentioned piezoelectric part one side, make above-mentioned first vertical electrode with respect to insulating first insulating mechanism of above-mentioned a plurality of second horizontal electrode layers; With the opposite side that is formed at above-mentioned piezoelectric part, make the above-mentioned second vertical electrode layer with respect to insulating second insulating mechanism of above-mentioned a plurality of first horizontal electrode layers.
According to such scheme, can pass through first insulating mechanism and second insulating mechanism, the polarity of pickup electrode and earthing pole is carried out necessary insulation processing, and can prevent or alleviate the disorderly or distortion of electric field that might be caused by a pair of vertical electrode layer, piezoelectric part (or rather, being meant the piezoelectric part main body that is made of a plurality of piezoelectric layers and a plurality of horizontal electrode layer) is interior.So, can make the electromechanical transducing efficient of piezoelectric part good.
By Combined Processing, can obtain to adjust (be preferably and can reduce) each vibrating elements acoustic impedance, can adjust one or more advantages of (be preferably and can enlarge) frequency band etc.
(2) ultrasound probe of the present invention comprises the layered transducer elements with a plurality of vibrating elementss, and above-mentioned each vibrating elements comprises a plurality of first horizontal electrode layers and a plurality of second horizontal electrode layer that is crisscross arranged along the Z direction; The first vertical electrode layer that is electrically connected with above-mentioned a plurality of first horizontal electrode layers; The second vertical electrode layer that is electrically connected with above-mentioned a plurality of second horizontal electrode layers, above-mentioned layered transducer elements has a plurality of first ad hoc structures and a plurality of second ad hoc structure that is crisscross arranged along directions X, in above-mentioned each first ad hoc structure, two two first vertical electrode adjacency that vibrating elements had of adjacency, and it is middle across first gap area, and in above-mentioned each second ad hoc structure, two two second vertical electrode adjacency that vibrating elements had of adjacency, and middle across second gap area.
According to such scheme, according to forming a plurality of first ad hoc structures and second ad hoc structure along the staggered mode of directions X.With regard to two vibrating elementss along the directions X adjacency, the vertical electrode layer of a side vibrating elements and the vertical electrode layer of opposite side vibrating elements adjacency and opposed, and middle across gap area, but they have identical polarity.So,, have advantage from insulating properties or proof voltage aspect.
Be preferably above-mentioned each vibrating elements and also comprise first insulating mechanism that makes realization electric insulation between the above-mentioned first vertical electrode layer and the above-mentioned a plurality of second horizontal electrode layer; Make second insulating mechanism of realizing electric insulation between the above-mentioned second vertical electrode layer and the above-mentioned a plurality of first horizontal electrode layer.At this, be preferably, above-mentioned first insulating mechanism has the first vertically insulated layer, and above-mentioned second insulating mechanism has the second vertically insulated layer.
According to such scheme, by first insulating mechanism, make and realize insulation between the first vertical electrode layer and a plurality of second horizontal electrode layer, by second insulating mechanism, make and realize insulation between the second vertical electrode layer and a plurality of first horizontal electrode layer.By first insulating mechanism and second insulating mechanism, just can prevent or alleviate the electric field disorder of the element internal that might cause because of the existence of each vertical electrode layer.
In the manufacture method of layered transducer elements, might the Yin Wendu rising wait the split pole that causes piezoelectric to reduce or disappearance.At this moment, can append and carry out split pole operation again.Carrying out this again during the split pole operation, owing to have above-mentioned first insulating mechanism and second insulating mechanism, split pole is difficult for distortion.The dielectric constant of first insulating mechanism and the material of second insulating mechanism is compared more little with the dielectric constant of the material of vibrating elements, above-mentioned effect is big more.Such as, above-mentioned permittivity ratio is preferably 1/1000.
(3) ultrasound probe of the present invention comprises the layered transducer elements with a plurality of vibrating elementss, above-mentioned each vibrating elements has at least 1 piezoelectric part and at least 1 resin portion that along continuous straight runs connects, above-mentioned at least 1 piezoelectric part has vertically a plurality of piezoelectric parts and a plurality of horizontal electrode layer of sequential lamination according to the rules, and a pair of vertical electrode layer that is electrically connected with above-mentioned a plurality of horizontal electrode layers realization with the annexation of regulation, above-mentioned at least 1 resin portion formation vertically has successional packed layer, above-mentioned each vibrating elements is lamination vertically, and along continuous straight runs is compound.
According to such scheme, because each vibrating elements comprises at least 1 stack-up type piezoelectric part and at least 1 resin portion.This resin portion is not to disconnect layer by layer in vertical direction, vertically has successional packed layer but constitute, and therefore, can not produce the position error of horizontal direction basically.In addition, because resin portion constitutes packed layer, therefore, such as, can form easily by formation groove and packing material on established laminate.Like this, even for the piezoelectric part of stack-up type, can not constitute its a plurality of layers horizontal direction position error problem basically yet.
(4) manufacture method of ultrasound probe of the present invention comprises following operation: on the laminate with the first internal electrode parts and second internal electrode parts, form a plurality of first grooves by its top surface side, and by its bottom surface side form parallel with above-mentioned a plurality of first grooves and have an operation of a plurality of second grooves of interlaced with it position relation; On each side in above-mentioned each first groove, form be electrically connected with the first internal electrode parts and with the insulating first vertical electrode layer of the second internal electrode parts, thus, above-mentioned a plurality of first grooves of correspondence form the operation of a plurality of first ad hoc structures; On each side in above-mentioned each second groove, form be electrically connected with the above-mentioned second internal electrode parts and with the insulating second vertical electrode layer of the first internal electrode parts, thus, above-mentioned a plurality of second grooves of correspondence form the operation of a plurality of second ad hoc structures; After forming a plurality of first ad hoc structures and a plurality of second ad hoc structure, on above-mentioned laminate, form a plurality of separating tanks, thus, above-mentioned laminate is divided into the operation of a plurality of vibrating elementss.
According to such scheme, by the operation of carrying out on laminate, forming groove by stages repeatedly and filling this groove, can make along continuous straight runs staggered a plurality of first ad hoc structures and a plurality of second ad hoc structure, so can make the manufacture method easy operating maybe can simplify manufacture method, in addition, can prevent the position error of horizontal direction between the lamination parts.
Compound ultrasonic oscillator generally has the advantage that enlarges bandwidth, but relative therewith, also has the problem that electrical impedance increases, sensitivity reduces.By said method, ultrasonic oscillator is carried out Combined Processing, simultaneously with its lamination, thus, can enlarge the bandwidth of ultrasonic oscillator, reduce electrical impedance simultaneously.Thus, can improve sensitivity.In addition since behind lamination, carry out compound, so can eliminate or alleviate the problem of the position error of horizontal direction between the parts of lamination.Consequently, can improve the performance of ultrasound probe.
(5) manufacture method of ultrasound probe of the present invention comprises following operation: on the laminate with the first internal electrode parts and second internal electrode parts, form the operation of a plurality of first grooves with first degree of depth from its top surface side; On above-mentioned laminate, form with second degree of depth from its bottom surface side and to parallel with above-mentioned a plurality of first grooves and the operation of interlaced with it a plurality of second grooves; Fill insulant in above-mentioned a plurality of first grooves and a plurality of second groove, and make its solidified operation; With above-mentioned curable dielectric material in each side in above-mentioned each first groove residual groove width, and, the insulant in above-mentioned a plurality of first grooves is cut with the 3rd degree of depth greater than above-mentioned first degree of depth, form the operation of a plurality of three-flutes; With above-mentioned curable dielectric material in each side in above-mentioned each second groove residual groove width, and, the insulant in above-mentioned a plurality of second grooves is cut with the 4th degree of depth greater than above-mentioned second degree of depth, form the operation of a plurality of the 4th grooves; On each side in above-mentioned each three-flute, form the first vertical electrode layer that is electrically connected with the above-mentioned first internal electrode parts, thus, on above-mentioned laminate, form the operation of a plurality of first ad hoc structures; On each side in above-mentioned each the 4th groove, form the second vertical electrode layer that is electrically connected with the above-mentioned second internal electrode parts, thus, on above-mentioned laminate, form the operation of a plurality of second ad hoc structures; After forming above-mentioned a plurality of first ad hoc structures and above-mentioned a plurality of second ad hoc structure, on the end face of above-mentioned laminate, form the end face electrod assembly, and on the bottom surface of above-mentioned laminate, form the operation of bottom-side electrodes parts; Operation with liner and above-mentioned bottom-side electrodes part bonding; After above-mentioned liner engages, above-mentioned laminate is divided into the operation of a plurality of vibrating elementss.
Description of drawings
Fig. 1 is the flow chart that is used to illustrate the manufacture method embodiment one of ultrasound probe of the present invention;
Fig. 2 is the generalized section of laminate;
Fig. 3 is the generalized section that is formed with the laminate of foundation trench;
Fig. 4 is the generalized section that is filled with the laminate of insulant;
Fig. 5 is the generalized section that is formed with the laminate of cutting slot;
Fig. 6 is the generalized section that is formed with the laminate of conducting film;
Fig. 7 is the generalized section that is filled with the laminate of reinforcing member;
Fig. 8 is the generalized section that is provided with the laminate of end face electrod assembly and bottom-side electrodes parts;
Fig. 9 is the generalized section of the X-Z section of layered transducer elements;
Figure 10 is the generalized section of the Y-Z section of layered transducer elements;
Figure 11 is the generalized section along the section of B-B ' line shown in Figure 9;
Figure 12 is the sketch map that is used to illustrate the electrical connection of each vibrating elements;
Figure 13 is the flow chart that is used to illustrate the manufacture method embodiment two of ultrasound probe of the present invention;
Figure 14 is the generalized section of laminate;
Figure 15 has the generalized section of the laminate of matrix part for temporary joint;
Figure 16 is formed with a plurality of compound generalized sections of using the laminate of groove;
Figure 17 is the generalized section of the laminate behind the potting resin material;
Figure 18 is the schematic perspective view along the compound laminate of Y direction;
Figure 19 is the axonometric chart along the compound stack-up type 1D of Y direction layered transducer elements;
Figure 20 is the axonometric chart along the compound stack-up type 2D of Y direction layered transducer elements;
Figure 21 is the flow chart that is used to illustrate the manufacture method embodiment three of ultrasound probe of the present invention;
Figure 22 is for after being provided with end face electrod assembly and bottom-side electrodes parts, and is compound and make the schematic perspective view of stack-up type 1D layered transducer elements along Y direction and laminate;
Figure 23 is for after being provided with end face electrod assembly and bottom-side electrodes parts, and is compound and make the schematic perspective view of stack-up type 2D layered transducer elements along Y direction and laminate;
Figure 24 is the flow chart that is used to illustrate the manufacture method embodiment four of ultrasound probe of the present invention;
Figure 25 is the generalized section of laminate;
Figure 26 is the generalized section that is formed with the laminate of foundation trench, insulant and conducting film;
Figure 27 has the generalized section of the laminate of matrix part for temporary joint;
Figure 28 is the generalized section that is filled with the laminate of laminating resin material;
Figure 29 is a generalized section of pulling down the laminate behind the matrix part;
Figure 30 is the generalized section that is provided with the laminate of end face electrod assembly and bottom-side electrodes parts;
Figure 31 is compound along directions X, along the sketch map of the isolating stack-up type 1D of directions X layered transducer elements;
Figure 32 is compound along directions X, along the sketch map of the isolating stack-up type 2D of directions X layered transducer elements;
Figure 33 is the flow chart that is used to illustrate manufacture method embodiment five of the present invention;
Figure 34 is the schematic perspective view along an example of directions X and the compound stack-up type 2D of Y direction layered transducer elements;
Figure 35 is the schematic perspective view along another example of directions X and the compound stack-up type 2D of Y direction layered transducer elements;
The specific embodiment
Below with reference to the accompanying drawings, the specific embodiment of the present invention is described.
Fig. 1 represents the flow chart of the embodiment 1 of ultrasound probe manufacture method.This ultrasound probe links to each other with the diagnostic ultrasound equipment that organism is carried out ultrasonic diagnosis by probe cable, carries out hyperacoustic transmission and receives, and obtains echo data thus.In addition, this ultrasound probe both can be used for contacting with the surface of organism, also can be used for inserting in the body cavity of organism.Manufacture method to this ultrasound probe describes below, simultaneously, the architectural feature of this ultrasound probe (particularly layered transducer elements) is described.
Before the operation of carrying out S101 shown in Figure 1, prepare the laminate of finishing split pole shown in Figure 2 (lamination assembly) 10.The a plurality of parts that constitute laminate 10 are bonding mutually in advance.Specifically, as shown in Figure 2, laminate 10 integral body are tabular, specifically, have a plurality of piezoelectric parts (piezoelectrics) 12,14,16.In these piezoelectric parts, between two piezoelectric parts 12,14 (14,16) of adjacency, be provided with internal electrode parts 18,20 as the horizontal electrode parts.This laminate 10 is of a size of such as 20mm along directions X, is of a size of such as 20mm along the Y direction, is of a size of such as 0.51mm along the Z direction.In addition, as the material of piezoelectric part 12,14,16, can enumerate piezoelectrics such as well-known PZT.Certainly, also can adopt in addition other material (such as, composite) to form each piezoelectric part 12,14,16.In addition, in Fig. 2～Fig. 9, the left and right directions among the figure is directions X (first horizontal direction), and the above-below direction among the figure is Z direction (vertical direction).The Z direction is equivalent to hyperacoustic transmission, receive direction.
In operation S101 shown in Figure 1, as shown in Figure 3, be formed with a plurality of foundation trench 22,24.Specifically, from end face 10A one side of laminate 10, along directions X at certain intervals 2XT form a plurality of foundation trench (first groove) 22.In the case, the spacing of a plurality of foundation trench 22 is the twice of a plurality of vibrating elements spacings.Same as above, from bottom surface 10B one side of laminate 10, along directions X at certain intervals 2XT form a plurality of foundation trench (second groove) 24.The spacing of these a plurality of foundation trench 24 also is 2 times of a plurality of vibrating elements spacing T.But these a plurality of foundation trench 22 and a plurality of foundation trench 24 are according to forming along the interlaced mode of directions X.These a plurality of foundation trench 22 and a plurality of foundation trench 24 are respectively the rectangular channel that extends along the Y direction.That is, these foundation trench 22,24 are parallel to each other.At this, for forming the ad hoc structure (to interposed structure, abutment structure) (with reference to label 200U, the 200D among Fig. 9 of back) that the back will illustrate as much as possible, the width W 1 of these foundation trench 22,24 is set to suitable size, is 0.08mm such as this W1.In addition, laminate 10 generally is made of n piezoelectric part of lamination, and at this, n is preferably odd number, is preferably 3 especially.
In addition, the degree of depth L1 of each foundation trench 22 is meant by end face 10A and sees to the degree of depth of sight line one side of second internal electrode parts 20, such as, this L1 is 0.3mm.Equally, the degree of depth L1 for foundation trench 24 also is that so degree of depth L1 is for to be seen to the degree of depth of sight line one side of second internal electrode body 18 by bottom surface 10B.By formation foundation trench 22,24 like this, internal electrode body 18 can be divided into a plurality of parts 18A, identical therewith, internal electrode body 20 also is split into a plurality of parts 20A.In addition, forming foundation trench 22,24 o'clock, can adopt such as machining instruments such as cast-cutting saws.This is suitable equally for the various grooves that the formation back will illustrate.
Among the operation S102 in Fig. 1, as shown in Figure 4, fill insulant 26,28 in a plurality of foundation trench 22,24 that form by operation S101.Even this insulant 26,28 is preferably the sort of material that still has higher proof voltage grade under the thin situation of finished product, such as, thermosetting resins such as polyimide resin, epoxy resin etc. can be adopted.In Fig. 4, the insulant that is filled in the foundation trench 22 is represented that by label 26 on the other hand, the insulant that is filled in the foundation trench 24 is represented by label 28.
In the operation S103 of Fig. 1, as shown in Figure 5,, form cutting slot (three-flute 30, the four grooves 32) respectively corresponding to each foundation trench 22,24.Specifically, in Fig. 5,, form the cutting slot 30 of break-through intermediate portion to being filled in insulant 26 machining in each foundation trench 22.Equally, the insulant 28 that is filled in each foundation trench 24 is carried out machining, form the cutting slot (connectivity slot, the 4th groove) 32 of break-through intermediate portion.At this, the width W 2 of each cutting slot 30,32 is less than the width W 1 of above-mentioned foundation trench 22,24, such as being 0.04mm.In addition, the degree of depth L2 of cutting slot 30 be set to greater than foundation trench 22 degree of depth L1's and the degree of depth that will cut off by second internal electrode parts 20 of end face number, such as, L2 is 0.36mm.Cutting slot 32 also is that so its degree of depth L2 is set to the degree of depth that can run through from second internal electrode parts 18 of bottom surface side.By forming these cutting slots 30,32, in the inside of each foundation trench 22,24, there are side insulation layer 26A, 26B, 28A, a 28B in each side in this groove so that certain thickness is residual.In addition,, above-mentioned each several part 18A, 20A (with reference to Fig. 5) are further divided into two parts, specifically, form a plurality of interior electrode layer 18B, 20B exactly to be used as the horizontal electrode layer by forming these cutting slots 30,32.The also replaceable operation of operation S102～S103 for formation dielectric films such as employing CVD methods.
In addition, in operation shown in Figure 5, if the degree of depth of each cutting slot 30,32 is excessive, then laminate 10 is cut off itself, and therefore, the degree of depth L2 that is preferably each cutting slot 30,32 is set at the degree that does not produce this cut-out.
In operation S104 shown in Figure 1, as shown in Figure 6, on each side of the inside of each cutting slot 30,32, form planar conducting film 34,36.This conducting film 34,36 can be by such as, formation such as non-electrolytic plating method, vapour deposition method.Each conducting film 34,36 final a pair of vertical electrode layer (side electrode layer etc.) that form.In operation shown in Figure 6, conducting film 34 forms with interior electrode layer 20B by contact site 100 and is electrically connected, and on the other hand, conducting film 34 is by vertically insulated layer 26A, 26B and interior electrode layer 18B insulation.Conducting film 36 is so same, and this conducting film 36 is realized being electrically connected with interior electrode layer 18B by contact site 102.In addition, in operation shown in Figure 6, by at the inside of cutting slot 30,32 filled conductive parts, and carry out necessary machining, also can form conducting film 34,36.
In operation S105 shown in Figure 1, as shown in Figure 7,, specifically, be the interior volume that surrounds by conducting film 34,36 in the inside of each cutting slot 30,32, fill reinforcing material 38,40.This reinforcing member the 38, the 40th plays the parts that cover and protect conducting film 34,36 effects.Reinforcing material 38,40 is made of the material with insulating properties.This reinforcing material 38,40 is preferably by having heat cured macromolecular material, polymeric material, resin material etc. and constitutes.In addition, reinforcing material 38,40 also can be used as the compound material of using, and about this point, will be specifically described in the back.
In operation S106 shown in Figure 1, as shown in Figure 8, at first, the end face 10A and the bottom surface 10B of laminate 10 carried out attrition process, make it be the plane.By such processing, the end face of conducting film 34,36 exposes suitable degree up or down.Then, adopt sputtering method, vapour deposition method etc., on end face 10A and bottom surface 10B, form end face electrode 42 and the bottom-side electrodes parts 44 that are used as the horizontal electrode parts with certain thickness.In the case, the end face of each conducting film 34 forms with end face electrod assembly 42 by contact site 104 and is electrically connected, and is identical therewith, and the end face of each conducting film 36 also forms with bottom-side electrodes parts 44 by contact site 106 and is electrically connected.
In the S107 of Fig. 1 operation, liner 51 is bonded on bottom surface one side of laminate 10.As described later, this liner 51 is built-in with many holding wires, and this liner 51 can adopt such as conductive adhesive etc. with engaging of laminate 10.
In addition, in operation S108, the molectron (laminate 10 of belt material pad 51) to being formed by operation S107 as Fig. 9 and shown in Figure 10, forms a plurality of separating tanks by machining.At this, Figure 10 is the generalized section along A-A ' shown in Figure 9, and the left and right directions among Figure 10 is the Y direction, and its above-below direction is the Z direction.
Specifically, from top surface side, along directions X with a determining deviation form a plurality of central authorities of running through above-mentioned reinforcing material 38, width is the separating tank 46,48 of W3.At this, each separating tank (the 5th groove) 46,48 extends along the Y direction.Each separating tank 46 is formed on each first ad hoc structure (first pair of interposed structure) 200U that top surface side is subjected to displacement, and each separating tank 48 (the 6th groove) is formed on each second ad hoc structure (second pair of interposed structure) 200D that bottom surface side is subjected to displacement.For each ad hoc structure 200U, 200D, will be elaborated in the back, each ad hoc structure 200U, 200D keep symmetrical structure with respect to separating tank 46,48.At this, the width W 3 of these separating tanks 46,48 is less than the width of above-mentioned reinforcing material 38, and for example, this W3 is 0.03mm.In addition, the degree of depth L3 of these separating tanks 46,48 is set at the degree of depth of the electrod assembly 60 that can run through in the liner 51 at least, such as, its L3 is 0.6mm.
As shown in figure 10, on laminate 10, also form along Y direction a plurality of separating tanks 50 side by side.Each separating tank 50 extends along directions X.The width of each separating tank 50 is identical with degree of depth L3 with the width W 3 of separating tank 46,48 with the degree of depth.In addition, a plurality of separating tanks 50 can form before or after a plurality of separating tanks 46,48 form.Also can form a plurality of separating tanks 50 according to the size different with a plurality of separating tank 46,48.But, even when forming a plurality of separating tank 50, also must cut, until the degree of depth of cutting off to laminate 10 and electrod assembly 60.Also can be in each separating tank 46,48,50, fill insulant, deadener, reinforcing material etc.
Below the liner among Fig. 9 51 is described.This liner 51 mainly by gasket material 52, electrod assembly 60 thereon is set and is the rectangular a plurality of holding wires 58 that are arranged on these gasket material 52 inside and constitute.A plurality of holding wires 58 are arranged in and the corresponding form of the two-dimensional arrangements of a plurality of vibrating elementss.Each holding wire 58 is by constituting as the core 56 of its internal signal lead-in wire and cover layer 54 round each holding wire.
As mentioned above, on laminate 10, form, and on this laminate 10, form, like this, just laminate 10 is divided into a plurality of vibrating elementss along Y direction a plurality of separating tanks 50 side by side along directions X a plurality of separating tanks 46,48 side by side.Under this state, piezoelectric part 12 shown in Figure 2 is divided into a plurality of piezoelectric layer 12A, and is identical therewith, and piezoelectric part 14,16 also is divided into a plurality of piezoelectric layer 14A, 16A respectively.And internal electrode parts 18,20 as shown in Figure 2 also are divided into a plurality of interior electrode layer 18B, 20B.In addition, as mentioned above, the electrod assembly 60 of liner 51 is not divided into a plurality of yet, thus, forms a plurality of electronic pads 60A.For electrical connection, will describe with Figure 12 in the back.
Figure 11 is the generalized section along the B-B ' line among Fig. 9.As mentioned above, by forming a plurality of separating tanks 46 (or 48), every pair of vibrating elements along directions X (being left and right directions among the figure) adjacency is right, strides across to constitute two right a period of time ends of this vibrating elements, forms ad hoc structure 200 thus.As ad hoc structure 200, comprise the earthy first ad hoc structure 200U, and signal is with the second ad hoc structure 200D (with reference to Fig. 9).These ad hoc structures 200U, 200D are symmetrical up and down relation.In addition, these ad hoc structures 200U, 200D have relatively that its median plane (specifically, being the imaginary vertical that is positioned at the center of separating tank 46,48) is the face symmetrical structure.
As shown in figure 11, ad hoc structure 200 comprises vertical electrode layer (side electrode layer) 34A that is formed on the side vibrating elements and vertical electrode layer (side electrode layer) 34B that is formed on the opposite side vibrating elements and the gap area between this vertical electrode layer 34A, 34B.More particularly, ad hoc structure 200 is by vertically insulated layer 26A, the vertical electrode layer 34A and the side enhancement layer 38A and vertically insulated layer 26B, the vertical electrode layer 34B and the side enhancement layer 38B that are formed on the opposite side vibrating elements that are formed on the side vibrating elements, and the separating tank between side enhancement layer 38A, 38B 46 constitutes.In this embodiment, gap area is meant the involutory zone of side enhancement layer 38A, 38B and separating tank 46,48.Among another embodiment that will illustrate in the back, gap area is meant and comprises compound zone with packed layer and separating tank 46.
In the operation S109 of Fig. 1, as mentioned above, after forming layered transducer elements,, the ground electrode parts that constitute by such as Copper Foil etc. are set in the top surface side of this layered transducer elements by a plurality of vibrating elementss.In addition, also be provided with a plurality of adjustment layers of two-dimensional arrangements thereon.The probing shell inside that do not indicate in the drawings of the assembly setting of Xing Chenging like this.
Figure 12 is the sketch map of the electrical connection of layered transducer elements.At this, be example with vibrating elements 202,204.It is that the boundary keeps symmetrical structure that vibrating elements 202,204 has with the space between them.In vibrating elements 202, vertical electrode layer 34B realizes being electrically connected with being positioned at from last number formulary odd number end face electrode layer 42A and interior electrode layer 20B.And vertical electrode layer 36A with realize being electrically connected from the interior electrode layer 18B of last number formulary even number and bottom-side electrodes layer 44A.Like this,, the ground electrode parts are linked to each other with end face electrode layer 42A, vibrating elements 202 is played a role as so-called stack-up type vibrating elements if holding wire is linked to each other with bottom-side electrodes layer 44A.For vibrating elements 204 also is same, and vertical electrode layer 34A realizes being electrically connected with the end face electrode layer 42A and the interior electrode layer 20B that are positioned at from last number formulary odd number.And vertical electrode layer 36B realizes being electrically connected with being positioned at from last number formulary even number interior electrode layer 18B and bottom electrode layer 44A.
Because vertical electrode layer 36A in the vibrating elements 202 and the vertical electrode layer 36B in the vibrating elements 204 are in symmetrical relations, so be easy to make.In addition, vertical electrode layer 36A in the vibrating elements 202 and the vertical electrode layer 36B in the vibrating elements 204 are approaching and opposed, and have identical polarity, therefore, help realizing insulation.
Because the ultrasound probe of above-mentioned embodiment can adopt the stack-up type vibrating elements, thus electrical impedance can be reduced, and, that is, can improve sensitivity because of utilizing the vertical electrode layer can alleviate or eliminate the loss of the vibration area in the vibrating elements or the reduction of vibration efficiency.In addition, according to above-mentioned manufacture method, two kinds of ad hoc structures are set to interlaced mode, can realize really and being electrically connected of each stack-up type vibrating elements.In addition, because the polarity of opposed two vertical electrode layers is identical, so can improve the proof voltage grade between holding wire and the earth lead.
Other several embodiment to the manufacture method of ultrasound probe describe below.Following each manufacture method is identical with above-mentioned manufacture method, all has the operation that constitutes a plurality of ad hoc structures, and on the other hand, different with above-mentioned manufacture method is to have the compound operation of laminate.In addition, in each embodiment, adopt same label for identical structure.
At first, by Figure 13～Figure 20 second embodiment of the manufacture method of ultrasound probe is described.This example is characterised in that, carries out the Combined Processing of this laminate in advance.
Figure 13 represents the flow chart of this manufacture method.Operation S201 is the operation of laminate being carried out Combined Processing.Below it is specifically described.Among Figure 14,10 expression laminates.This laminate 10 is identical with laminate 10 shown in Figure 2, but the profile direction of Figure 14 and Fig. 2 is different.As shown in figure 15, at the bottom surface side of laminate 10, adopt adhesives 302 that matrix part 300 is engaged.Then, as shown in figure 16, on laminate 10,, form a plurality of compound at certain intervals along the Y direction with groove 304 from its top surface side.The degree of depth of this groove 304 is for greater than the degree of depth integral body of laminate 10, that matrix part 300 had some degree cuttings.By forming a plurality of grooves 304, piezoelectric part 12,14,16 is divided into a plurality of part 12B, 14B, 16B, simultaneously, a plurality of internal electrode parts 18,20 also are divided into a plurality of part 18B, 20B.In this stage, form a plurality of piezoelectric parts 305.Each piezoelectric layer is by vertically part 12B, 14B, 16B, 18B, the 20B of lamination constitute.Therefore can prevent to make a plurality of piezoelectric parts 305 by isolating problem messyly by matrix part 300.Then, the potting resin material heats so that this resin material solidifies laminate 10 with as packing material in a plurality of grooves 304.Thus, form a plurality of resin beds (resin portion) 306.Resin material is such as being the compound material of using of main constituent with epoxy resin, silicones etc.After forming a plurality of resin beds 306, pull down matrix part 300 from laminate 10.This state is represented with the profile among Figure 17.In Figure 17, represent with label 310 through the laminate of Combined Processing.Figure 18 is the axonometric chart of laminate 310.In Figure 18, a plurality of foundation trench 22,24 of Xing Chenging are represented by dotted lines subsequently.
In operation S202 shown in Figure 13, carry out the operation of operation S101 shown in Figure 1～S107.Then, adopting laminate 310 to make under the situation of 1D layered transducer elements, carry out operation S203～S204.On the other hand, adopting laminate 310 to make under the situation of 2D layered transducer elements, carry out operation S203～S205.
In operation S204, as shown in figure 19, on laminate 310, form along directions X a plurality of separating tanks 46,48 side by side.Each separating tank 46,48 is the groove that extends along the Y direction.Each separating tank 46 is formed at the center of each ad hoc structure (earthy ad hoc structure) 200U.Each separating tank 48 is formed at the center of each ad hoc structure (signal ad hoc structure) 200D.In the laminate 310 of Figure 19, a plurality of piezoelectric parts 305 and a plurality of resin portion 306 are cross-linked along the Y direction.Along directions X side by side with a plurality of vibrating elements 310A.In addition, at the vibrating elements of per two adjacency,, form ad hoc structure 200U or 200D according to the mode that strides across them.By with upper type, forming with the directions X is array direction, and along the compound 1D layered transducer elements of Y direction.
On the other hand, in operation S205, as shown in figure 20, on laminate 310, be formed with along directions X side by side a plurality of separating tanks 46,48 and along Y direction a plurality of separating tanks 50 side by side.Each separating tank 46,48 is the groove that extends along the Y direction.Each separating tank 50 is the groove that extends along directions X.By the formation of these separating tanks 46,48,50, form a plurality of vibrating elements 310B of two-dimensional arrangements.More particularly, the center of each each ad hoc structure (earthy ad hoc structure) 200U is formed with each separating tank 46.The center of each each ad hoc structure (signal ad hoc structure) 200D is formed with each separating tank 48.Formed each separating tank 50 is divided into two parts with in piezoelectric part 305 or the resin portion 306 any one, or is formed at the intersection of piezoelectric part 305 and lamination portion 306.In the embodiment shown in Figure 20, by each separating tank 50, piezoelectric part (integral body) 305 is divided into two parts, thus, the piezoelectric part 305B (half part of opposite side) that is comprised in the opposite side vibrating elements of piezoelectric part 305A (half part of a side) that is comprised in the formation Y direction one side vibrating elements and Y direction.By the way, form along the compound 2D layered transducer elements of Y direction.
In the S206 of Figure 13, identical with the operation S109 of Fig. 1, on laminate 310, also be provided with other parts.In addition, the number of the piezoelectric part of Y direction and resin portion, size and spacing can be set arbitrarily.Such as, piezoelectric part and resin portion that also can relative 1 more a plurality of number of oscillator setting.In Figure 19 and Figure 20, omitted the diagram of the electrod assembly 60 shown in Fig. 9 waits, many holding wires 58 etc.In Figure 22,23,31,32,34,35 subsequently, also be like this.
Below by Figure 21～Figure 23, the 3rd embodiment of the manufacture method of ultrasound probe is described.This example is characterised in that, laminate is being carried out Combined Processing afterwards.
Figure 21 represents the flow chart of manufacture method.In operation S301, carry out operation S101 shown in Figure 1～S107.In operation S302, form the end face electrod assembly and the bottom-side electrodes parts of a plurality of ad hoc structures, and, have at joint on the laminate of liner, form along the Y direction a plurality of compound groove of using side by side.At this, the groove of these a plurality of compound usefulness is the groove that extends along directions X respectively.In operation S303, a plurality of compound with filling the laminating resin material in the groove, this resin material solidifies by heating.
Behind operation S303, form the occasion of 1D layered transducer elements, carry out operation S304～S305.In operation S305, as shown in figure 22, form along directions X a plurality of separating tanks 46,48 side by side.Each separating tank 46,48 is the groove that extends along the Y direction.Thus, form along directions X a plurality of vibrating elements 320A side by side.Each vibrating elements 320A is by constituting along Y direction alternately parallel a plurality of piezoelectric parts 326 and a plurality of resin portion 324.Each resin portion 324 forms by potting resin material in compound usefulness groove 322 as mentioned above.After forming end face electrod assembly 42 and bottom-side electrodes parts 44, in order to form a plurality of grooves 322, end face electrode layer 42 and bottom-side electrodes layer 44 also are cut to a plurality of electrode layers (Figure 22 represents a plurality of end face electrode layer 42B) by a plurality of grooves 322.So, on the end face 325A and bottom surface 325B of each resin bed (resin portion) 324, end face electrode layer and bottom-side electrodes layer are not set.
On the other hand, behind operation S303, form the occasion of 2D layered transducer elements, carry out operation S304～S306.In operation S306, as shown in figure 23, form along directions X side by side a plurality of separating tanks 46,48 and along Y direction a plurality of separating tanks 50 side by side.Each separating tank 46,48 is the groove that extends along the Y direction.Each separating tank 50 is the groove that extends along directions X.Thus, constitute along a plurality of vibrating elements 320B of the two-dimensional arrangements of directions X and Y direction.Each vibrating elements 320B is by constituting along Y direction alternately parallel at least 1 piezoelectric part 326 and at least 1 resin portion 324.Each resin portion 324 as mentioned above, by compound with groove 322 in the potting resin material form.Each separating tank 50 is formed at any piezoelectric part or resin portion is divided into the position of two parts, or is formed at the position, boundary of any piezoelectric part and resin portion.In the embodiment of Figure 23, each piezoelectric part is divided into two parts by each separating tank 50, thus, forms two piezoelectric part 326A.After forming end face electrod assembly 42 and bottom-side electrodes parts 44, form a plurality of grooves 322, this is identical with embodiment shown in Figure 22.In the operation S307 of Figure 21, other parts and Figure 22 and a plurality of vibrating elementss 320 shown in Figure 23 are engaged.
Below by Figure 24～Figure 32 the 4th embodiment of the manufacture method of ultrasound probe is described.This embodiment is characterised in that, when forming a plurality of ad hoc structures, laminate carried out Combined Processing along directions X.
Figure 24 represents the flow chart of manufacture method.In operation S401, identical with S101 shown in Figure 1, on laminate, form a plurality of foundation trench.Specifically, on laminate shown in Figure 25 10 (identical) with laminate 10 shown in Figure 2, form the bigger foundation trench of a plurality of width along directions X from its end face with certain spacing, form the bigger foundation trench of a plurality of width from its bottom surface with certain spacing along directions X.The width setup of these foundation trench is compared with common occasion shown in Figure 3 for carrying out the necessary size of Combined Processing, and the value that sets is bigger.
Then, in operation S402, S102 is identical with operation, at the inside of each foundation trench fill insulant, this insulant is solidified.In operation S403, S103 is identical with operation, forms a plurality of cutting slots.Thus, at a pair of vertically insulated layer of the inner formation of each foundation trench.In operation S404, S104 is identical with operation, forms conducting film on the inner face of each foundation trench.This state as shown in figure 26.Conducting film 34,36 is formed at the inner surface of vertically insulated layer 26A, 26B.
In the S405 of Figure 24, as shown in figure 27, at first, adopt adhesives 302 that the bottom surface of matrix part 300 with laminate 10 engaged, then, in the entire scope of laminate 10, each cutting slot 30,32 is processed into through slot.That is, to carrying out whole machining, form each cutting slot 30, to carrying out whole machining, form each cutting slot 32 from first piezoelectric part 12 of last number formulary along the Z direction from the 3rd piezoelectric part 16 of last number formulary along the Z direction.Thus, as shown in figure 28, on laminate 10, form a plurality of compound with groove 329.In addition, compound at these in operation S405 with filling laminating resin material 330 in the groove 329, by heating resin material 330 is solidified.Resin material 330 constitutes resin bed, i.e. resin portion.
In the operation S406 of Figure 24, as shown in figure 29, matrix part 300 is pulled down from laminate 10.Thus, obtain compound laminate 332.Then, as shown in figure 30, on laminate 332, form end face electrod assembly 42 and bottom-side electrodes parts 44.In addition, liner is adhered on the bottom-side electrodes parts 44.
In the occasion that forms 1D layered transducer elements (A type), carry out operation S407～S408.In operation S408,, form along directions X a plurality of separating tanks 46,48 side by side corresponding to the center of a plurality of ad hoc structures.Thus, as shown in figure 31, constitute a plurality of vibrating elements 332A along directions X 1D layered transducer elements side by side.1 vibrating elements 332A of label 334 expressions among Figure 31, label 336 expression piezoelectric parts.Label 338 expressions are formed at a pair of resin portion of the both sides of piezoelectric part 336.Like this, make each vibrating elements 332A compound along directions X.
On the other hand, in the occasion that forms 1D layered transducer elements (Type B), carry out operation S407～S409.In operation S409, form along Y direction a plurality of separating tanks 50 side by side.Each separating tank 50 is the groove that extends along directions X.Thus, shown in figure 32, constitute a plurality of vibrating elements 332B along Y direction 1D layered transducer elements side by side.Each vibrating elements 332B is a directions X and compound in the direction with its length direction.In Figure 32, if from first viewpoint, then each vibrating elements 332B is for connecting the parts of a plurality of parts (being equivalent to section) 340,341.According to the mode of two parts 340,341 that stride across adjacency, form ad hoc structure 200U ' or 200D ', at the mid portion of this ad hoc structure 200U ' or 200D ', have resin bed (resin portion) 344.In this embodiment shown in Figure 32, resin bed 344 does not have separating tank, but from conceptive, resin bed 344 is divided into the part 343A and the part 343B that belongs to the part 341 of opposite side of the part 340 that belongs to a side.If from second viewpoint, each vibrating elements 332B is for connecting a plurality of piezoelectric parts 342 that are crisscross arranged along directions X and the parts of a plurality of resin portion 344.
On the other hand, in the occasion that forms the 2D layered transducer elements, carry out operation S407～S410.In operation S410, the center of corresponding a plurality of ad hoc structures forms along directions X a plurality of separating tanks side by side, in addition, forms along Y direction a plurality of separating tanks side by side.Thus, be split into along a plurality of vibrating elementss of directions X and the arrangement of Y direction along the compound piezoelectrics of directions X.That is, on piezoelectrics shown in Figure 31 332, form a plurality of separating tanks (being equivalent to a plurality of separating tanks 50 shown in Figure 10) that become permutation along the Y direction in addition, thus, form a plurality of vibrating elementss.In the operation S411 of Figure 24, adjust other processing of the formation etc. of layer.
Below by Figure 33～Figure 35, the 5th embodiment of the manufacture method of ultrasound probe is described.This embodiment is characterised in that, laminate is carried out Combined Processing along directions X and Y direction.
Figure 33 represents the flow chart of manufacture method.Laminate being carried out the occasion of prior Combined Processing along the Y direction, carry out operation S501～S502, carry out operation S503 then.Specifically, in operation S502, by carrying out operation S201 shown in Figure 13, piezoelectrics are carried out Compound Machining (with reference to Figure 17 and Figure 18) along the Y direction.Then, in operation S503, carry out the operation of S401～S406 shown in Figure 24, form, simultaneously, form along directions X a plurality of resin beds side by side along directions X a plurality of ad hoc structures side by side.Thus, form along directions X and the two-way compound piezoelectrics of Y direction.
On the other hand,, carry out operation S501～S504, carry out operation S505 then carry out the occasion of Combined Processing afterwards along the Y direction.Specifically, in operation S504, carry out the operation (with reference to Figure 30) of operation S401 shown in Figure 24～S406, then, in operation S505, identical with operation S302 and the S303 of Figure 21, form a plurality of compound grooves of using along the Y direction, in each groove, fill the laminating resin material.Thus, formation is along the two-way composite piezoelectric body of directions X and Y direction.
In the occasion that after above-mentioned two-dimentional Combined Processing, forms 1D layered transducer elements (A type),, carry out operation S508 again through operation S506, S507.In this operation S508, form along directions X a plurality of separating tanks side by side.At this, each separating tank parts is the groove that extends along the Y direction.Form thus along directions X a plurality of vibrating elementss side by side.These a plurality of vibrating elementss are equivalent to remove the structure behind a plurality of separating tanks 50 from aftermentioned structure shown in Figure 34.
In the occasion that after above-mentioned two-dimentional Combined Processing, forms 1D layered transducer elements (Type B),, carry out operation S509 again through operation S506, S507.In this operation S509, form along Y direction a plurality of separating tanks side by side.At this, each separating tank parts is the groove that extends along directions X.Form thus along Y direction a plurality of vibrating elementss side by side.These a plurality of vibrating elementss are equivalent to remove the structure behind a plurality of separating tanks 46,48 from aftermentioned structure shown in Figure 34.
After above-mentioned two-dimentional Combined Processing, form the occasion of 2D layered transducer elements (A type),, carry out operation S511 again through operation S506, S510.In this operation S511, form along directions X a plurality of separating tanks side by side, and form along Y direction a plurality of separating tanks side by side.Thus, form two-dimentional layered transducer elements shown in Figure 34.Specifically, carry out on the compound laminate 350, form a plurality of separating tanks 46,48 along directions X in the edge two dimension.Each separating tank 46,48 is the groove that extends along the Y direction, forms at each ad hoc structure 200U, 200D.In the occasion that is conceived to certain vibrating elements 350A, this vibrating elements 350A is by along between the piezoelectric regions of directions X 336 and be formed between two resin region of its both sides 337,338 and constitute.The whole width of the vibrating elements 350A of label 334 expression directions Xs.This vibrating elements 350A along the Y direction by 352 constituting between 351 and resin region between two piezoelectric regions.So from the top, vibrating elements 350A is made of the resin portion with H shape and orthogonal two piezoelectric parts.Structure shown in Figure 34 is an example, such as, also can be provided with between the piezoelectric regions of requirement and between resin region along the Y direction.
After above-mentioned two-dimentional Combined Processing, form the occasion of 2D layered transducer elements (Type B),, carry out operation S512 again through operation S506, S510.In this operation S512, form along directions X a plurality of separating tanks side by side spaced apartly, in addition, form along Y direction a plurality of separating tanks side by side spaced apartly.Specifically, on the laminate 350 of having implemented two-dimentional Combined Processing, form a plurality of separating tanks 48 along directions X.Each separating tank 48 is the groove that extends along the Y direction, and it forms at each ad hoc structure 200D.That is, in embodiment shown in Figure 35, in each ad hoc structure 200U (with reference to Figure 34), do not form separating tank 46.Obviously, also can be in a plurality of ad hoc structures side by side, or not on 1 ad hoc structure, do not forming separating tank, and on the individual ad hoc structure of m (m is greater than 2), forming separating tank as shown in Figure 35.On the other hand, also can be according at interval forming a plurality of separating tanks 50 arbitrarily, along the Y direction, at each oscillator, can be provided with between more a plurality of piezoelectric regions 351 and resin region between 352.
In embodiment shown in Figure 35, in the occasion that is conceived to certain vibrating elements 350B, this vibrating elements 350B on directions X, by between two piezoelectric regions 420, be clipped between these piezoelectric regions between the resin region in 420 406, be arranged between two resin region of two both sides between piezoelectric regions 404 and constitute.The whole width of the vibrating elements 350B of label 400 expression directions Xs.This vibrating elements 350B is in the Y direction, by 352 constituting between 351, two resin region between three piezoelectric regions.So from the top, vibrating elements 350B is made of the resin portion of individual piezoelectric part in 6 (=2 * 3) and the lattice shape between these piezoelectric parts.Structure shown in Figure 35 is an embodiment, such as, also can be along between directions X and the more a plurality of piezoelectric regions of Y direction setting and between resin region.
In example shown in Figure 35, along directions X, between two vibrating elementss of adjacency, form ad hoc structure 200D, in addition, at the central part formation ad hoc structure 200U ' of vibrating elements 350B.In the occasion that ad hoc structure 200D (ad hoc structures between the parts) and ad hoc structure 200U ' (ad hoc structure of components interior) are compared, both differences are, ad hoc structure 200D between the parts has separating tank 46, relative therewith, the ad hoc structure 200U ' of components interior does not have separating tank.But, the ad hoc structure 200D between the parts and the ad hoc structure 200U ' of components interior have the symmetric a pair of vertical electrode layer of the face that is identical polar aspect be common.Particularly, both can obtain good insulation performance, structure and form easily that these aspects are common.
According to above-mentioned second～the 5th embodiment, can realize lamination and compound layered transducer elements.Particularly, after handling, lamination carries out Combined Processing again, so can get rid of vertically the horizontal direction position error between side by side each parts.In addition, Combined Processing is undertaken by forming the filling of groove and material, so can realize easily.
Claims (4)
1. a ultrasound probe is characterized in that, comprises the layered transducer elements with a plurality of vibrating elementss,
Described each vibrating elements has:
At least 1 piezoelectric part and at least 1 resin portion that along continuous straight runs connects;
Described at least 1 piezoelectric part has vertically a plurality of piezoelectric layers and a plurality of horizontal electrode layer of sequential lamination according to the rules, and a pair of vertical electrode layer that is electrically connected with described a plurality of horizontal electrode layers realization with the annexation of regulation;
Described a plurality of horizontal electrode layer comprises the end face electrode layer, two interior electrode layers and bottom-side electrodes layer;
Described at least 1 resin portion is arranged on the layer between end face electrode layer and the bottom-side electrodes layer, and described at least 1 resin portion formation vertically has successional packed layer;
Described each vibrating elements is lamination vertically, and along continuous straight runs is compound.
2. ultrasound probe as claimed in claim 1 is characterized in that,
Described at least 1 piezoelectric part also comprises a pair of vertically insulated layer, and described vertically insulated layer is arranged at the two sides of the piezoelectric part main body that is made of a plurality of piezoelectric layers and a plurality of horizontal electrode layer, and between the described a pair of vertical electrode layer.
3. ultrasound probe as claimed in claim 1 is characterized in that, described each vibrating elements is compound along a direction in first horizontal direction and second horizontal direction.
4. ultrasound probe as claimed in claim 1 is characterized in that, described each vibrating elements is compound along first horizontal direction and this both direction of second horizontal direction.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002210891 | 2002-07-19 | ||
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| JP2003169658 | 2003-06-13 | ||
| JP2003169659 | 2003-06-13 |
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| CNB031501842A Division CN100403990C (en) | 2002-07-19 | 2003-07-18 | Supersonic probe and its mfg. method |
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| CN101099682A CN101099682A (en) | 2008-01-09 |
| CN100581480C true CN100581480C (en) | 2010-01-20 |
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