CN101019205B - 用于将粘接在柔软薄膜上的部件分开的方法和装置 - Google Patents
用于将粘接在柔软薄膜上的部件分开的方法和装置 Download PDFInfo
- Publication number
- CN101019205B CN101019205B CN2004800430659A CN200480043065A CN101019205B CN 101019205 B CN101019205 B CN 101019205B CN 2004800430659 A CN2004800430659 A CN 2004800430659A CN 200480043065 A CN200480043065 A CN 200480043065A CN 101019205 B CN101019205 B CN 101019205B
- Authority
- CN
- China
- Prior art keywords
- film
- plane
- parts
- surface portion
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1132—Using vacuum directly against work during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
Abstract
Description
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH869/04 | 2004-05-19 | ||
CH00869/04A CH697213A5 (de) | 2004-05-19 | 2004-05-19 | Verfahren und Vorrichtung zum Ablösen eines auf eine flexible Folie geklebten Bauteils. |
PCT/EP2004/053593 WO2005117072A1 (de) | 2004-05-19 | 2004-12-17 | Verfahren und vorrichung zum ablösen eines auf eine flexible folie geklebten bauteils |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101019205A CN101019205A (zh) | 2007-08-15 |
CN101019205B true CN101019205B (zh) | 2010-06-16 |
Family
ID=34959940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800430659A Active CN101019205B (zh) | 2004-05-19 | 2004-12-17 | 用于将粘接在柔软薄膜上的部件分开的方法和装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7981246B2 (zh) |
EP (2) | EP1754249A1 (zh) |
KR (1) | KR101097500B1 (zh) |
CN (1) | CN101019205B (zh) |
CH (1) | CH697213A5 (zh) |
HK (1) | HK1111263A1 (zh) |
WO (1) | WO2005117072A1 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8221583B2 (en) * | 2007-01-20 | 2012-07-17 | Stats Chippac Ltd. | System for peeling semiconductor chips from tape |
CH699851A1 (de) * | 2008-11-05 | 2010-05-14 | Esec Ag | Chip-Auswerfer und Verfahren zum Ablösen und Entnehmen eines Halbleiterchips von einer Folie. |
MY150953A (en) | 2008-11-05 | 2014-03-31 | Esec Ag | Die-ejector |
JP2012508460A (ja) | 2008-11-12 | 2012-04-05 | エセック アーゲー | フォイルからの半導体チップの剥離及び取外し方法 |
KR101026040B1 (ko) | 2008-11-13 | 2011-03-30 | 삼성전기주식회사 | 박막소자 제조방법 |
KR101046064B1 (ko) | 2008-12-11 | 2011-07-01 | 삼성전기주식회사 | 박막소자 제조방법 |
IT1393913B1 (it) * | 2009-05-05 | 2012-05-17 | Rent Srl | Gruppo e procedimento di alimentazione di bobine di materiale in foglio, in particolare ma non esclusivamente film plastico stampato con riferimenti di posizione per confezionatrici automatiche |
ATE552610T1 (de) | 2009-08-11 | 2012-04-15 | Kulicke & Soffa Die Bonding Gmbh | Verfahren und vorrichtung zur prüfung eines chips vor dem bonden |
JP5107408B2 (ja) * | 2010-08-31 | 2012-12-26 | 東京エレクトロン株式会社 | ピックアップ方法及びピックアップ装置 |
DE102011087388A1 (de) * | 2011-02-17 | 2012-08-23 | Semikron Elektronik Gmbh & Co. Kg Ip-Department | Vorrichtung und Verfahren zur Abnahme mindestens eines chipförmigen Halbleiterbauelements von einer Folie |
CH706280B1 (de) * | 2012-03-30 | 2016-03-15 | Esec Ag | Verfahren zum Ablösen eines Halbleiterchips von einer Folie. |
JP6021904B2 (ja) * | 2012-05-17 | 2016-11-09 | 富士機械製造株式会社 | ダイ剥離装置 |
KR20140107982A (ko) * | 2013-02-28 | 2014-09-05 | 삼성전자주식회사 | 다이 이젝터 및 다이 분리 방법 |
US9111984B2 (en) * | 2013-10-28 | 2015-08-18 | Freescale Semiconductor Inc. | Devices and methods of operation for separating semiconductor die from adhesive tape |
CN103659813A (zh) * | 2013-12-25 | 2014-03-26 | 大连佳峰电子有限公司 | 一种用于半导体晶片吸取的机构运动控制方法 |
JP2017005222A (ja) * | 2015-06-16 | 2017-01-05 | パイオニア株式会社 | ピックアップ装置 |
WO2017129171A1 (de) * | 2016-01-29 | 2017-08-03 | Jenoptik Optical Systems Gmbh | Verfahren und vorrichtung zum herauslösen eines mikro-chips aus einem wafer und aufbringen des mikro-chips auf ein substrat |
TWI567011B (zh) * | 2016-06-15 | 2017-01-21 | All Ring Tech Co Ltd | Method and device for conveying the components of the bonding process |
CN107160822B (zh) * | 2017-04-26 | 2018-11-27 | 湖州蓝澳无纬布有限公司 | 一种节能型无纬布生产前期加工处理设备 |
JP6519761B2 (ja) * | 2017-08-25 | 2019-05-29 | 上野精機株式会社 | 電子部品受渡し装置 |
CN114188264B (zh) * | 2022-02-15 | 2022-05-03 | 合肥矽迈微电子科技有限公司 | 一种芯片剥离机构、剥离机及剥离方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6202292B1 (en) * | 1998-08-26 | 2001-03-20 | Micron Technology, Inc. | Apparatus for removing carrier film from a semiconductor die |
CN1414602A (zh) * | 2001-10-23 | 2003-04-30 | 富士通株式会社 | 用环形接触部件剥离半导体器件的方法和装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4778326A (en) | 1983-05-24 | 1988-10-18 | Vichem Corporation | Method and means for handling semiconductor and similar electronic devices |
US4556362A (en) * | 1983-12-21 | 1985-12-03 | At&T Technologies, Inc. | Methods of and apparatus for handling semiconductor devices |
JPS63228638A (ja) * | 1987-03-17 | 1988-09-22 | Sony Corp | チツプ取出し装置 |
JPH0376139A (ja) * | 1989-08-18 | 1991-04-02 | Nec Corp | 半導体素子突上げ方法 |
US6352073B1 (en) * | 1998-11-12 | 2002-03-05 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing equipment |
JP2000353710A (ja) * | 1999-06-14 | 2000-12-19 | Toshiba Corp | ペレットピックアップ装置および半導体装置の製造方法 |
JP3209736B2 (ja) | 1999-11-09 | 2001-09-17 | エヌイーシーマシナリー株式会社 | ペレットピックアップ装置 |
JP2001196443A (ja) * | 2000-01-14 | 2001-07-19 | Sharp Corp | 半導体チップのピックアップ装置およびピックアップ方法 |
US7306695B2 (en) * | 2003-04-10 | 2007-12-11 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for picking up semiconductor chip |
US7757742B2 (en) * | 2007-07-31 | 2010-07-20 | Asm Assembly Automation Ltd | Vibration-induced die detachment system |
-
2004
- 2004-05-19 CH CH00869/04A patent/CH697213A5/de unknown
- 2004-12-17 EP EP04804931A patent/EP1754249A1/de not_active Withdrawn
- 2004-12-17 CN CN2004800430659A patent/CN101019205B/zh active Active
- 2004-12-17 EP EP10186245A patent/EP2306496A3/de not_active Withdrawn
- 2004-12-17 KR KR1020067025586A patent/KR101097500B1/ko active IP Right Grant
- 2004-12-17 US US11/596,645 patent/US7981246B2/en active Active
- 2004-12-17 WO PCT/EP2004/053593 patent/WO2005117072A1/de active Application Filing
-
2008
- 2008-02-05 HK HK08101408.6A patent/HK1111263A1/xx unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6202292B1 (en) * | 1998-08-26 | 2001-03-20 | Micron Technology, Inc. | Apparatus for removing carrier film from a semiconductor die |
CN1414602A (zh) * | 2001-10-23 | 2003-04-30 | 富士通株式会社 | 用环形接触部件剥离半导体器件的方法和装置 |
Non-Patent Citations (5)
Title |
---|
JP平3-76139A 1991.04.02 |
JP昭63-228638A 1988.09.22 |
JP特开2001-196443A 2001.07.19 |
JP特开平11-297793A 1999.10.29 |
同上. |
Also Published As
Publication number | Publication date |
---|---|
EP2306496A3 (de) | 2012-10-10 |
HK1111263A1 (en) | 2008-08-01 |
KR101097500B1 (ko) | 2011-12-22 |
EP2306496A2 (de) | 2011-04-06 |
CH697213A5 (de) | 2008-06-25 |
US20070277929A1 (en) | 2007-12-06 |
KR20070085112A (ko) | 2007-08-27 |
EP1754249A1 (de) | 2007-02-21 |
CN101019205A (zh) | 2007-08-15 |
WO2005117072A1 (de) | 2005-12-08 |
US7981246B2 (en) | 2011-07-19 |
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Address after: Swiss Berg Patentee after: Kulicke and Soffa Die Bonding GmbH Address before: Swiss Berg Patentee before: Alphasem AG |