CN101084608A - 电连接器 - Google Patents

电连接器 Download PDF

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CN101084608A
CN101084608A CNA200580044147XA CN200580044147A CN101084608A CN 101084608 A CN101084608 A CN 101084608A CN A200580044147X A CNA200580044147X A CN A200580044147XA CN 200580044147 A CN200580044147 A CN 200580044147A CN 101084608 A CN101084608 A CN 101084608A
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electric connector
electrical contact
heat
contact
connector
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CN101084608B (zh
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C·戴利
C·克里沃斯基
W·斯温
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FCI SA
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7088—Arrangements for power supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/533—Bases, cases made for use in extreme conditions, e.g. high temperature, radiation, vibration, corrosive environment, pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/947—PCB mounted connector with ground terminal

Abstract

电连接器在靠近放置在其中的触头附近的区域中能包括导热材料以将热从触头中散走。导热材料能提供于连接器的壳体结构中。导热材料也能提供为不同于壳体的导热元件。

Description

电连接器
技术领域
本发明涉及包括电触头和导热结构元件的电连接器，所述导热结构元件非常靠近电触头用于从触头散热。
背景技术
电连接器由于其功能性质而产生热。大多现有连接器壳体设计通常所用的材料是绝热的，并且因而保留热，从而使得热在连接器内聚集。一种改进散热的方法是尽可能地将壳体去芯从而允许壳体内触头周围的间隙以希望改进对流热传递。然而，滞留空气是热的不良导体，并且局部的强迫通风取决于用户的应用场合。
发明内容
本发明包括插塞和插座电连接器。在一些实施例中，插塞和插座连接器中至少一个的壳体在靠近放置在其中的触头附近的区域中包括导热材料，以将热从触头中散走。配合的连接器都能在其壳体结构中采用导热材料。连接器壳体也可包括导热材料之外的材料。而且，导热材料可存在于大致整个壳体结构中。可选地，导热材料可选择性地放置在比如靠近产热触头的位置处。
在电触头附近提供导热材料的一种方式是通过用这种材料形成壳体结构；例如，包括使固化聚合物具有导热性的添加物或填料的可注射成型的热塑塑料。另一种方式包括使用分开地形成的散热元件，其能结合至电触头周围的壳体结构或者触头本身。例如，由导热材料制成的夹持件能添加至电触头，并且触头插入壳体。夹持件的至少一部分优选地暴露于连接器壳体的外面，以使得从触头导热地传递的热随后能通过对流从整个连接器中传递走。在其中分离地形成的散热元件结合至壳体结构或电触头的实施例中，连接器壳体可由绝热或导热材料制成。
在本发明的优选实施例中，采用了包括板状本体元件的电触头。这些触头相对大的表面积有助于热传递到周围的导热性壳体材料中。同样能不受限制地采用其它电触头设计。而且，本发明的原理能应用于单触头和多触头连接器。
附图说明
图1是根据本发明的一种示例性插塞连接器的正面透视图。
图2是图1所示插塞连接器的后面透视图。
图3是本发明提供的一个示例性插座连接器的透视图。
图4是与一个优选插座连接器相配合的一个优选插塞连接器的局部透视图。
图5是本发明提供的另一示例性电连接器的正面透视图。
图6是优选的电触头和散热元件组合件的后面透视图。
图7是另一优选的电触头和散热元件组合件的正面透视图。
图8是包括散热元件和多个传热通道的示例性电连接器的后视图。
图9是本发明提供的一个电连接器的后面透视图。
图10是第三种优选的电触头和散热元件组合件的正面透视图。
具体实施方式
参照图1-3，其中同样的部件用同样的附图标记标识。图1和2中示出了一种示例性的插塞电连接器10，其包括壳体20、触头槽21、以及基本上布置在槽21内的插塞触头30。插塞触头30由一对板状本体元件32和34所限定。如所示，板状本体元件32和34彼此不连接；然而，可选实施例可包括连接元件。多个梁40从每个本体元件32和34的前边缘延伸用于啮合插座触头。梁40具有球形远端42，其限定了插塞触头与相应插座触头的主要啮合区域。多个终端44从每个板状本体元件32和34的底部边缘延伸，用于啮合印刷电路板。根据本发明也能使用与所示不同构造的触头。
板状本体元件32和34的各个内表面定位为与优选包括导热材料的槽21的壁22平齐，以使得热能从触头本身传递出去。在优选实施例中，导热材料包括导热性热塑塑料。这种热塑塑料目前可从PolyOne Corp.、Cool Polymers、LNP Engineering Plastics、TRP Co.和Ticona Corp.购得。尽管大多热塑塑料(尤其是通常用于电子工业的那些)是良好的绝缘体，但是还是将填料或添加物与现有的基体聚合物(例如尼龙、液晶聚合物和聚酯)相组合以赋予其导热性。在最常使用的之中，导热添加物是石墨碳纤维、碳粉、比如铜粉、钢、铝粉和铝片之类的金属填料、以及比如氮化铝和氮化硼之类的陶瓷填料。导热性聚合物能以导电或不导电的等级生产，任何一种都能用于本发明的连接器应用中。
导热材料能具有大约1.2W/m K至大约2.4W/m K的导热率、以及大约1.1 J/g K至大约1.3J/g K的热容。导热率和热容的这些具体范围仅为了示例的目的而公开。在可选方案中也能使用导热率和热容在这些范围之外的导热材料。
板状本体元件32和34的各个外表面暴露于壳体沟槽24和26。这些沟槽能改进插塞触头30通过对流的散热。因而，触头30所产生的热能经由导热壁22传导地和经由流过沟槽24和26的空气对流地从触头传递离开。除了壁22之外，插塞连接器壳体20的其它部分能采用导热材料。例如，插塞连接器壳体20能由导热聚合物注射成型而成以使得整个结构可用作散热器。在这种情况下，从板状本体元件32和34的外表面至相对的槽壁28(不可见)和29也出现辐射性热传递。
现在参照图3，其中示出了一种示例性的插座连接器50，其包括壳体60、触头槽61、和布置在槽61中的插座触头70。插座触头70具有一对间隔开的板状本体元件80和82(不可见)。如所示，板状本体元件80和82彼此不连接；然而，可选实施例也可包括连接元件。插塞触头接收空间72介于本体元件80和82之间，并且多个终端84从每个本体元件80和82延伸。连接器壳体60优选地由导热聚合物制成以便于从触头70至周围壳体结构的热传递；例如，触头槽壁62和64。插塞触头接收空间72也便于通过穿过壳体60的对流性气流所进行的热传递。
现在参照图4，一种示例性的插塞连接器110示出为与一种示例性的插座连接器150相配合。连接器110和150的部件中与连接器10和50相似的部件用相应的附图标记标识，不过是百位数系列。当连接器110和150配合时，梁140的球形远端142弹性地向内弯曲，形成法向力。这种法向力有助于确保触头板状本体元件和优选地包括导热材料的相邻壳体材料之间的紧密接触。这种紧密接触改善了触头的热传递。法向力迫使本体元件132和134的内表面紧靠壁122，并且本体元件180和182的外表面紧靠壁162和164。大多热量在梁的远端142与板状本体元件180和182的内表面区域之间的配合界面处局部地产生。通过紧邻在界面后面采用导热材料，就能改善散热。
在本发明可选的连接器实施例中，额外的导热材料能布置在触头部件和也包括导热材料的连接器壳体部件之间。例如，导热垫或化合物能布置在触头本体元件和周围壳体结构的缝隙之间。在一些情况下，这种额外的导热材料包括在内以填充从相邻触头和/或壳体结构上的高点出现的任何小气隙(这会导致绝缘)。这里，触头本体元件将有一些部分紧密接触周围的壳体结构并且将有一些部分经由额外的导热材料(导热地)结合。在其它情况下，触头的任何部分都不与周围的壳体结构直接接触，并且缝隙将至少部分地填充有例如加入的导热垫或化合物。
现在参照图5，其中示出了另一示例性的连接器200，其包括壳体202、多个电触头204以及散热元件206。壳体202可由绝热或导热材料制成。电触头204和散热元件206的组合件210在图6中示出。电触头204包括第一和第二板状本体元件207和208，本体元件207和208示出为相对彼此叠置从而其内表面的至少一部分优选地可接触(注意到，相对内表面的一些部分由于有目的的设计考虑和/或制造能力原因而可间隔开)。本体元件207和208每个包括以交替方式布置的一系列倾斜悬臂梁220和一系列直线悬臂梁222。相对的倾斜梁220限定了“夹紧”或“接收”梁，其能啮合与配合电连接器相关的触头的一个或多个直线梁。本发明同样可以预期具有不同数目梁和/或不同梁几何形状的触头。本体元件207和208每个还包括用于啮合印刷电路结构的多个终端225。终端225能构造为压配合或焊接啮合，或者熟练技术人员易于得知的任何其它啮合。
散热元件206能具有很多不同形式，包括夹持件230，如图6和7所示。夹持件230由导热材料构成，比如举例来说金属或上述变化的热塑塑料，以将热通过传导从电触头204中散走。夹持件230包括顶部232以及一对从顶部232向下延伸的面板234和236。如所示，触头本体元件207和208相对彼此叠置，因此面板234啮合本体元件207的外部分而面板236啮合本体元件208的外部分。导热垫或化合物能可选地应用于面板和触头本体元件之间以确保良好的导热性。顶部232能可选地采用热传递增强部件，比如举例来说多个柱或翅片250(图7中示出)。尽管未示出，触头本体元件207和208也能间隔开，其中一个或多个夹板布置在限定于本体元件之间的中间空间以啮合本体元件的各个内部分。另外的夹板可进一步啮合间隔开的本体元件的各个外部分。
词语“夹持件”的使用在任何方面都不是要限制散热元件206的设计。而是，散热元件的重要方面在于，其以如此的方式设计和定位以使得将热从电触头散走。在优选实施例中，散热元件的至少一部分暴露于外部环境以便形成从连接器内部至连接器外部的热传递通道。如同从仅示出一个优选构造的图5中能看出的，散热元件206开放地暴露于外部环境的区域垂直于插入连接器的部分(向下延伸的面板)，从而增大暴露于外部环境的表面积，并且因而增大了通过较冷外部环境的热对流的量。散热元件处于连接器壳体内的部分(面板234、236)平行地朝向，并且与电触头的本体元件紧密地接触。面板通过传导将热传递到暴露于外部环境的垂直部分，而垂直部分然后借助于对流将所述热传递到环境。注意到，尽管优选地导热的散热元件的至少一部分暴露于外部环境，但是在可选实施例中散热元件也可以完全包含在连接器壳体内。
图8中示出了与连接器200类似的电连接器260的后部。连接器260包括壳体268、电触头270和散热元件280。电触头270和散热元件280的部件与图6和7所示类似。壳体268具有四个沟槽282、283、284和285，它们便于热通过对流从电触头280传递走。热量能通过空气流过沟槽284和285而以对流方式直接从电触头270传递走。也能通过使热首先以对流方式从电触头270传递到散热元件280而以对流方式间接地从电触头270传递走热量。壳体268可由绝热或导热的材料制成。在采用导热材料时，散热元件280的一部分能与周围的壳体结构紧密接触。
根据应用场合，从穿过本发明电连接器的电能传递中能产生更多或更少的热。在高热量的情形下，导热的散热元件可包括既与电触头相接触又暴露于连接器外部(即外部环境)的相当大的表面积。举例来说，并且如图9所示，连接器300示出为包括壳体310、多个电触头320和等同数目的散热元件330。
电触头320和散热元件330的组合件350在图10中示出。电触头320包括第一和第二板状本体元件323、324，并且每个都具有从本体元件前边缘延伸的交替的倾斜悬臂梁325和直线悬臂梁326，以及多个从本体元件底部边缘延伸的终端327。散热元件330包括一对与本体元件323、324的各个外部相接触的面板332和334、以及沿着面板的顶部和后部延伸的多个翅片340。如同从图9中能看到的，连接器壳体310构造为允许翅片340相当程度的暴露以进行有效的对流热传递。
在图5-10中，各个散热元件啮合一个电触头。然而，也可以采用更少数目的散热元件，因此不是每个电触头都与散热元件相啮合。而且，散热元件可设计为啮合多个电触头以使得制造和装配更加高效。
本发明的电触头由适合的材料制成，比如举例来说铜合金。触头可镀有比如金、金和镍组合之类的材料，或者很多工业中公知的其它材料。触头的数目及其在连接器壳体中的布置并不限于附图所示。本发明的优选电触头包括板状本体元件。本领域的普通技术人员将易于理解到，板状本体元件的形式可以是平面状的或非平面状的。电触头可包含孔隙或其它热传递部件。类似地，连接器壳体可包含附图中未示出的热传递部件，比如举例来说从连接器外部延伸到壳体内部的热沟槽，与保留电触头的一些部分相邻的空隙或缝隙以组合传导式和对流式热传递。注意到，虽然上述插塞和插座连接器都采用了导热材料，但是可选实施例包括其中仅是插塞连接器和插座连接器中的一个采用导热材料的配合连接器。
描述聚焦于示例性的电触头和附图所示的连接器实施例。这种实施例的变化也包括在本发明的精神内，本发明的部分精神通过所附的各个权利要求包括在内。

Claims (20)

1.一种电连接器，包括：
壳体；
定位在壳体中的电触头；和
位于电触头附近的导热材料，以使得导热元件从电触头传递热。
2.根据权利要求1的电连接器，其中导热材料包括暴露于电连接器周围环境的第一部分、以及临近第一部分且定位为靠近电触头第一主要表面的第一面板。
3.根据权利要求2的电连接器，其中导热材料还包括临近第一部分的第二面板，该第二面板定位为靠近电触头的第二主要表面。
4.根据权利要求2的电连接器，其中电连接器包括两个电触头并且第一面板定位在电触头之间。
5.根据权利要求2的电连接器，其中第一面板和壳体限定了与电连接器周围环境流体相通的沟槽，其中热可通过传导或对流从电触头传递到电连接器周围的环境。
6.根据权利要求2的电连接器，其中第一部分包括翅片或柱。
7.根据权利要求1的电连接器，其中电触头包括至少两对间隔开的梁。
8.根据权利要求1的电连接器，还包括布置在电触头和导热材料之间的、导热垫和导热化合物中的至少一个。
9.根据权利要求1的电连接器，其中导热材料选自于包括金属材料和导热性热塑塑料的组。
10.根据权利要求1的电连接器，其中电触头包括两个板，这两个板一起限定了凹形配合触头和凸形配合触头。
11.根据权利要求9的电连接器，其中导热性热塑塑料包括：选自于由尼龙、液晶聚合物以及聚酯构成的组的聚合物；以及选自于由石墨碳纤维、碳粉、金属填料和陶瓷填料构成的组的第二材料。
12.根据权利要求2的电连接器，其中电连接器包括两个电触头；导热材料还包括临近第一部分的第二面板；第一面板接触第一个电触头；并且第二面板接触第二个电触头。
13.根据权利要求2的电连接器，其中第一面板通过传导热传递来将热从电触头传递到第一部分，并且第一部分通过对流热传递将热传递到电连接器周围的环境。
14.根据权利要求1的电连接器，其中导热材料是壳体的一部分。
15.根据权利要求14的电连接器，其中电触头的一个主要表面接触壳体。
16.根据权利要求14的电连接器，其中电触头的第一主要表面面对壳体，并且电触头的第二主要表面和壳体的内表面限定了与电连接器周围的环境流体相通的沟槽，其中热可通过对流从电触头传递到电连接器周围的环境。
17.根据权利要求14的电连接器，其中导热材料是导热性热塑塑料。
18.根据权利要求17的电连接器，其中导热性热塑塑料包括：选自于由尼龙、液晶聚合物以及聚酯构成的组的聚合物；以及选自于由石墨碳纤维、碳粉、金属填料和陶瓷填料构成的组的第二材料。
19.根据权利要求1的电连接器，
其中壳体限定了包括在其中的插塞连接器；和
电触头限定了插塞部分和插座部分。
20.一种制造电连接器的方法，包括
提供电触头；
将电触头放置在模具内；和
将导热性的热塑塑料注射入该模具以在电触头周围形成壳体。
CN200580044147XA 2004-12-22 2005-12-01 电连接器 Expired - Fee Related CN101084608B (zh)

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CN102723637B (zh) * 2008-02-04 2014-10-22 凡甲电子(苏州)有限公司 电源连接器组件
CN102845142A (zh) * 2010-04-23 2012-12-26 通用电气智能平台嵌入系统公司 供单板计算机使用的楔锁、单板计算机以及装配计算机系统的方法
WO2013120312A1 (zh) * 2012-02-13 2013-08-22 中兴通讯股份有限公司 散热结构、电子设备及散热方法
CN104810661A (zh) * 2014-01-24 2015-07-29 富士康(昆山)电脑接插件有限公司 电连接器
CN104810661B (zh) * 2014-01-24 2018-01-05 富士康(昆山)电脑接插件有限公司 电连接器

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CN101084608B (zh) 2010-06-09
US20060228948A1 (en) 2006-10-12
EP1831963B1 (en) 2013-07-17
US7476108B2 (en) 2009-01-13
EP1831963A4 (en) 2010-02-17
WO2006068803A2 (en) 2006-06-29
TWI289955B (en) 2007-11-11

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