CN101163376B - Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same - Google Patents

Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same Download PDF

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Publication number
CN101163376B
CN101163376B CN2007101011249A CN200710101124A CN101163376B CN 101163376 B CN101163376 B CN 101163376B CN 2007101011249 A CN2007101011249 A CN 2007101011249A CN 200710101124 A CN200710101124 A CN 200710101124A CN 101163376 B CN101163376 B CN 101163376B
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CN
China
Prior art keywords
movable plate
edge
pcb
equipment
matrix
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Application number
CN2007101011249A
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Chinese (zh)
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CN101163376A (en
Inventor
曹旼铉
南元佑
金周汉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phoenix Digital Technology Co ltd
Hanwha Aerospace Co Ltd
Hanwha Vision Co Ltd
Original Assignee
Samsung Techwin Co Ltd
Phoenix Digital Tech Co Ltd
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Publication of CN101163376A publication Critical patent/CN101163376A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0165Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/51Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136Separate tool stations for selective or successive operation on work
    • Y10T29/5137Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y10T29/5138Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to machine work part to fit cooperating work part
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178Chip component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183Multilead component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53187Multiple station assembly apparatus
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53191Means to apply vacuum directly to position or hold work part

Abstract

An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.

Description

Be used to support the equipment of printed circuit board substrate and utilize this equipment to form the method for printed circuit board (PCB)
The reference of related application
It is on October 13rd, 2006 that the application requires to enjoy the applying date, in the priority of the korean patent application No.10-2006-0100013 of Korea S Department of Intellectual Property application, the content that the document disclosed can be used in full as a reference in this application.
Technical field
The present invention relates generally to printed circuit board (PCB) (PCB).More particularly, the present invention relates to a kind of equipment that is used at printing equipment flux application time supporting PCB matrix on matrix surface, and the application relates to a kind of method of utilizing this equipment to form PCB.
Background technology
Various electronic components are installed on the surface of printed circuit board (PCB) (PCB).Usually, PCB is through comprising the various technologies of silk-screen printing technique, element mounting process and reflux technique etc., and is mass-produced by automation equipment.
In the mass-produced silk-screen printing technique of PCB, on matrix surface, use the solder flux that is molten condition with predetermined pattern, so that the various electronic components with different shape can be installed on the surface of PCB, thereby they are communicated with each other.Solder flux is to utilize the equipment of so-called screen process press to use.Screen process press utilizes rubber to roll to push and is supplied to mask with predetermined pattern or the solder flux on the silk screen and on PCB, uses pressurized solder flux.
When being applied to solder flux on the matrix, the operation of PCB support apparatus is with fixing (promptly keeping fixing, clamping or fastening) PCB, so that PCB can not moved.The PCB support apparatus comprises cylinder, and the side surface that this cylinder is pushed PCB is with fixing PCB, so that during printing operation, make the motion of PCB reduce to minimum.
Fig. 1 is for showing the plane graph of traditional P CB support apparatus; Fig. 2 is the end view of the PCB support apparatus of displayed map 1.
Side or the edge that traditional P CB support apparatus is pushed PCB10 is with fixing PCB10.
The preform of printing operation can comprise: before flux application on the PCB, and adjustment PCB.
The preform of printing operation also comprises: through after the adjustment of PCB, provide vacuum to support PCB to the bottom pressure face of PCB.
In said method; First fixed cell can comprise: first movable plate that engages first edge of PCB matrix; First actuator; This actuator can make first movable plate move with first inward direction towards first edge and can make first movable plate to leave first outward direction motion at first edge, is used to limit first retainer that first movable plate is moved along first outward direction; And; Second fixed cell can comprise: second movable plate that engages second edge of PCB matrix; Second actuator; This actuator can make second movable plate move with second inward direction towards second edge and second movable plate is moved with second outward direction that leaves second edge, and is used to limit second retainer that second movable plate is moved along second outward direction, and; The actuating force that utilization is applied by first and second actuators can be carried out the fixing of first fixed cell and second fixed cell.
Fig. 1 is for showing the plane graph of traditional printed circuit board (PCB) (PCB) support apparatus;
Summary of the invention
Fig. 2 is for showing the end view of traditional PCB support apparatus shown in Figure 1;
Fig. 3 is for showing a kind of perspective view of the printing equipment as example, and this printing equipment comprises the PCB support apparatus of one embodiment of the invention;
Fig. 4 is for showing the fragmentary, perspective view of PCB support apparatus shown in Figure 3;
Fig. 5 is the enlarged perspective of the part " A " of demonstration PCB support apparatus shown in Figure 4;
Fig. 6 is an end view, and it has shown the PCB support apparatus that has the PCB of conveying shown in Figure 3;
Fig. 7 is the end view of the PCB support apparatus in the displayed map 3, and this equipment can be carried out printing operation along the past backward directions of invention;
Fig. 8 is a plane graph, and it has schematically shown the mode of operation of PCB support apparatus shown in Figure 7;
Fig. 9 is the end view of the PCB support apparatus in the displayed map 3, and this equipment can be carried out printing operation along the direction extremely preceding from the back;
Figure 10 is a plane graph, and it has schematically shown PCB support apparatus shown in Figure 9
Draw unit 111 suitable segment length part, extend along the x-axis direction.
Description of drawings
Though can use first movable plate 112 that different modes or device make first fixed cell 110 on first guide unit 111, move along the y-axis direction; But in the illustrated embodiment, used linear motion guide member 115 with guiding block 116 so that first movable plate 112 on first guide unit 111, along inwardly and outward direction move.Linear motion guide member 115 is installed on first guide unit 111, and making slidably, guiding block 116 combines with linear motion guide member 115 and it is installed on first movable plate 112.Therefore, first movable plate 112 can be moved along inside and outside direction with linear motion guide member 115.
First actuator 113 of first fixed cell 110 is installed on first guide unit 111 and with first movable plate 112 and links to each other, so that to first movable plate 112 actuating force is provided.In one embodiment, first actuator 113 of first fixed cell 110 comprises gas (that is, pneumatic) cylinder, and the piston rod 117 of cylinder links to each other with first movable plate 112 through contiguous block 118.Therefore, when the piston rod 117 of cylinder extends through the manipulation of first actuator 113 or shrinks, transfer a driving force to first movable plate 112, thereby first movable plate 112 is moved on first guide unit 111.In other embodiment, first actuator 113 can adopt other proper device, like electric actuator, hydraulic actuator etc.
First retainer 114 of first fixed cell 110 is installed on the outside of linear motion guide member 115.First retainer 114 has limited the outside motion that first movable plate 112 is left first edge 91 of PCB90.First edge 91 of PCB90 outwards moves and when arriving first retainer 114, first movable plate 112 stops because the effect of first actuator 113 is left when first movable plate 112.Therefore, because the effect of first retainer 114, at this moment, first movable plate 112 can not outwards be moved and left first edge 91 of PCB90.Under this halted state, the structure of first movable plate 112 preferably can support first edge 91 of PCB90.
Embodiment
Second fixed cell 120 of PCB support apparatus constitutes and is roughly parallel to first fixed cell 110 and separates with this unit, so that second edge 92 of supporting PCB90.Second fixed cell 120 comprises second movable plate 122, second actuator 123 and second retainer 124 (referring to Fig. 7 and 9).As intelligible, second fixed cell 120 of PCB support apparatus is similar with first fixed cell 110 basically or be the substantial mirror images setting with it.
Second movable plate 122 of second fixed cell 120 is installed in also can be along the horizontal movement of y-axis direction on second guide unit 121, and this second guide unit is installed on the pedestal 100.Second movable plate 122 can be along inwardly (that is direction motion and can moving along outside (that is, the backward) direction at second edge 92 that leaves PCB90 forward), towards second edge 92 of PCB90.As clearly illustrating in Fig. 3 and 4, second movable plate 122 is along the suitable segment length part of second guide unit 121, extend along the x-axis direction.
Second movable plate 122 is through 123 motions of second actuator, and, its combine with linear motion guide member (not shown) in being installed in second guide unit 121 in case can with towards and leave PCB90 second edge 92 inwardly or outward direction move.Second retainer 124 is installed on the linear motion guide member, leaves the outside motion at second edge 92 of PCB90 to limit second movable plate 122.
In one embodiment, first and second fixed cells 110,120 can move relative to each other on pedestal 100, so that can regulate the distance between first and second guide units 111,121.As being clear that in Fig. 3 and 4; In one embodiment; Second guide unit 121 can slide through the guide member 191 along pedestal 100; And, can drive second guide unit 121 so that it leaves first guide unit 111 towards 111 motions of first guide unit or motion through motor 192.
PCB conveying equipment 130 can be installed between first and second fixed cells 110 and 120.In one embodiment, PCB conveying equipment 130 can comprise and is installed in first conveyer belt 131 on first guide unit 111 and is installed in second conveyer belt 132 (referring to Fig. 6) on second guide unit 121.The bottom surface of a side of most approaching edge 91 among first conveyer belt, the 131 supporting PCB90, the bottom surface of the opposite side of most approaching edge 92 among second conveyer belt, the 132 supporting PCB90.Therefore, when first and second conveyer belts 131 and 132 rotate, can between first and second fixed cells 110 and 120, carry, locate, arrange or otherwise transmit PCB90.
The PCB support apparatus can also comprise downside bearing unit 140 (referring to Fig. 6), and this unit has the structure of supporting PCB90 bottom surface.Downside bearing unit 140 moves through the direction that makes progress in the PCB90 lower edge and supports the bottom surface of PCB90; Therefore; Can the height of PCB90 be adjusted to roughly corresponding with the height of first and second movable plate 112 and 122 so that PCB90 for example roughly is in same plane with plate 112,122.That is, when between first and second fixed cells 110 and 120, carrying PCB90, downside bearing unit 140 raises with supporting PCB90 and regulates the height of PCB90.
Downside bearing unit 140 comprises vertical movable plate 141, and this movable plate can be from pedestal 100 upwards to move with downward direction.Downside bearing unit 140 also comprises from vertical movable plate 141 upwardly extending supporting wing plate 142 and fulcrum posts 143.The both sides of the bottom surface of supporting wing plate 142 supporting PCB90, and, the middle body of the bottom surface of fulcrum post 143 supporting PCB90.
The PCB support apparatus can also comprise vacuum nozzle 150, and this nozzle applies vacuum fixing PCB90 vertically through the bottom surface to PCB90.Vacuum nozzle 150 can move with downside bearing unit 140, edge direction up or down; So that after supporting wing plate 142 and fulcrum post 143 contacts the bottom surface of PCB90, vacuum nozzle 150 applies vacuum pressure through the bottom surface to PCB90 and fixes PCB90.
Below, will the operation of equipment that is used to support PCB with said structure be described.
PCB90 is installed on the PCB conveying equipment 130 of PCB support apparatus, and, between first and second fixed cells 110 and 120, it is carried.Before installing PCB90 additional; For example; In one embodiment; Through making second guide unit 121, thereby can first and second guide units 111, spacing between 121 be adjusted to roughly the width (that is the spacing between the edge 91 and 92) corresponding to PCB90 toward or away from the motion of first guide unit 111.
The front and back end of the bottom surface of PCB90 is by first and second conveyer belts 131 and 132 supportings of PCB conveying equipment 130.Therefore, when first and second conveyer belts 131 and 132 of PCB conveying equipment 130 rotate, between first and second fixed cells 110 and 120, carry PCB90.
First and second conveyer belts 131 and 132 of PCB conveying equipment 130 are lower than first and second fixed heads 112 and 122 and constitute; So that PCB90 is when being carried by first and second conveyer belts 131 and 132; Not can with other parts, interfere like first and second fixed heads 112 and 122.Downside bearing unit 140 is regulated the height of the PCB90 that is carried so that roughly be in same plane with the plate 112,122 of first and second fixed cells 110 and 120.When side bearing unit 140 moves under PCB90 in the upward direction instantly, through supporting PCB90 from vertical movable plate 141 upwardly extending supporting wing plates 142 and fulcrum post 143.First and second sides and first and second movable plate 112 and 122 that downside bearing unit 140 rises until PCB90 roughly are in same plane.
Fig. 7 is the end view of the PCB support apparatus in the displayed map 3, and this equipment can be carried out printing operation along the past print direction backward; Fig. 8 is a plane graph, and it has schematically shown the mode of operation of PCB support apparatus shown in Figure 7.
When PCB90 and first and second movable plate 112 and 122 roughly are in same plane,, PCB90 is bearing between them according to print direction.In printing operation, solder flux is applied on the surface of PCB90.When rolling through rubber solder flux is pressed in PCB90 when going up, the print direction of solder flux can be for from the place ahead of PCB90 backwards or from the rear of PCB90 forward.Roll through rubber, PCB90 is exerted pressure, thereby cause PCB90 to move along print direction along print direction.In order to prevent the motion of PCB90, confirm the direction of motion of PCB90 according to print direction, and, operate first and second fixed cells 110 and 120 to avoid the motion of PCB90.
When print direction be from first edge 91 of PCB90 when second edge 92 of PCB90 (that is, in the past backward), because from the pressure of printing equipment, PCB90 is motion backward often.In this case, second movable plate 122 at second edge 92 of supporting PCB90 and 124 operations of second retainer are not so that PCB90 can move along print direction.
In this case, the work of second actuator 123 so that second movable plate 122 move along outward direction so that back surface contact second retainer 124 of second movable plate 122.When the back surface of second movable plate 122 contacted second retainer 124, because second retainer can limit the outside motion of second movable plate 122, therefore, second movable plate 122 this moments can not be with outside direction motion.
When second movable plate 122 and second actuator 123 have quit work, 113 work of first actuator so that first movable plate 112 move along inside direction, thereby PCB90 is pressed in or is clamped between the plate 112,122.Shown in Fig. 7 and 8, PCB90 is supported by the supporting wing plate 142 and the fulcrum post 143 of downside bearing unit 140, but fixing.Therefore, when first movable plate 112 was pushed first edge 91 of PCB90, PCB90 was towards 122 motions of second movable plate, and therefore, second edge 92 contacts second movable plate 122.
In this state, because second edge, 92 contact second movable plate 122 and the PCB90 of PCB90 can further not move along direction backward, therefore, the PCB support apparatus can support PCB90 reliably during printing operation.
Fig. 9 is the end view of the PCB support apparatus in the displayed map 3, this equipment can along from after forward print direction carry out printing operation; Figure 10 is a plane graph, and it has schematically shown the mode of operation of PCB support apparatus shown in Figure 9.
When print direction be from second edge 92 of PCB90 when first edge 91 (promptly from after forward), because by the printing equipment applied pressure, PCB90 is often with print direction motion (forward).In this case, first movable plate 112 at first edge 91 of supporting PCB90 and 114 work of first retainer are not so that PCB90 can travel forward.
In this case, shown in Fig. 7 and 8, PCB90 fixes with the mode relative with PCB.That is, the work of first actuator 113 so that first movable plate 112 move along outward direction so that back surface contact first retainer 114 of first movable plate 112.When the back surface of first movable plate 112 contacted first retainer 114, because the outside motion of first retainer, 114 restrictions, first movable plate 112, therefore, first movable plate 112 was fixing, thereby it can not further move along outside direction.
When first movable plate 112 fixing, when therefore first actuator 113 has quit work, 123 work of second actuator so that second movable plate 122 move along inside direction, thereby PCB90 is pressed in or is clamped on first movable plate 112.Shown in Fig. 9 and 10, PCB90 is supported by the supporting wing plate 142 and the fulcrum post 143 of downside bearing unit 140, but fixing.Therefore, when second movable plate 122 was pushed second edge 92, PCB90 was towards 112 motions of first movable plate, and therefore, first edge 91 contacts first movable plate 112.
In this state, because first edge 91 of PCB90 contacts first movable plate 112 and PCB90 can further not move along direction forward.Therefore, the PCB support apparatus can support PCB90 reliably during printing operation.
When according to print direction, when being bearing in PCB90 between first and second fixed cells 110 and 120, vacuum nozzle 150 work are with supporting PCB90, so that provide vacuum pressure to keep it to be vertically oriented through the bottom surface to PCB90.
When setting up the supporting of PCB90, can be to printing operation adjustment PCB90.In one embodiment, can aim at PCB90 so that carry out printing operation through the aligning equipment 160 (referring to Fig. 3) that is installed in pedestal 100 belows.Aligning equipment 160 makes pedestal 100 move or pedestal 100 is rotated regulating the angle of pedestal 100 along x-axis direction and y-axis direction, thereby regulates the position of PCB90 so that carry out printing operation.
When accomplishing the adjustment of PCB90, carry out printing operation so that solder flux is applied on the surface of PCB90 with predetermined pattern.When accomplishing the printing operation of PCB90, from printing equipment, discharge through PCB conveying equipment 130 conveying PCB90 and with it.Immediately, carry another PCB and will repeat aforesaid operations through PCB conveying equipment 130.
Figure 11 is a flow chart, and it has shown the sample method that forms PCB according to a further aspect in the invention.
The sample method of the formation PCB of an example comprises according to the present invention: PCB is installed in the printing equipment, and this printing equipment comprises the foregoing support apparatus (S100) with first and second fixed cells; Confirm print direction (S200); With respect to said definite step, fix the second time of (S300) or PCB the first time of carrying out PCB and fix (S400); Aim at PCB (S500) and printing (S600).
In operation S100, the PCB90 that will be used for printing operation is installed at the presumptive area of the printing equipment that comprises foregoing support apparatus (it has first and second fixed cells), and this presumptive area is between first and second fixed cell.For example, can pass through PCB conveying equipment 130, between first fixed cell 110 and second fixed cell 120, carry the PCB90 that is provided to the PCB support apparatus.Immediately, through downside bearing unit 140, can make the PCB90 motion in the upward direction, so that the height of PCB90 is adjusted to roughly corresponding to first and second movable plate 112 of first and second fixed cells 110,120 and 122 height.
In operation S200, confirm solder flux is applied to the direction of the lip-deep printing operation of PCB90.Print direction can be the first direction that second edge 92 from first edge 91 to PCB90 of PCB90 moves, or the second direction that moves from first edge 91 at second edge 92 to PCB90 of PCB90.
Owing to print direction pressure is applied on the PCB90, therefore, can carries out the fixing operation of suitable substance P CB according to the print direction of in operation S200, confirming.
When print direction is second direction, carry out the first fixing operation S300.That is, first movable plate 112 of fixing first fixed cell 110 is with first edge 91 of supporting PCB90, and second fixed cell 120 is pressed to first fixed cell 110 with PCB90.
When print direction is first direction, carry out the second fixing operation S400.That is, second movable plate 122 of fixing second fixed cell 120 is with second edge 92 of supporting PCB90, and first fixed cell 110 is pressed to second fixed cell 120 with PCB90.
When PCB90 being fixed between the plate 112,122, carry out printing operation S600.In operation S600, solder flux is applied on the surface of PCB90, to produce predetermined pattern.Operation S600 can comprise alignment function S500 or carry out through alignment function S500.In operation S500, before flux application, regulate the position of PCB90.Operation S600 can comprise also that vacuum applies the operation (not shown).Apply in the operation in vacuum, the bottom surface of 150 couples of PCB90 of vacuum nozzle provides vacuum to avoid for example vertical motion after alignment function S500 of PCB90.
As stated, support the equipment of PCB and the method that forms PCB,, therefore, can during printing operation, support PCB better because the supporting of PCB changes according to print direction according to being used to.
Though with reference to illustrative example of the present invention the present invention is specified; But; Those of ordinary skills it is to be understood that under the situation of thought of the present invention that does not break away from the accompanying claims qualification and scope, can make various changes in form and details.

Claims (20)

1. one kind is used for during printing the equipment that supporting has the PCB matrix at the first relative edge and second edge, and this equipment comprises:
First fixed cell, this unit comprise first movable plate at first edge that engages the PCB matrix; First actuator that makes first movable plate move and it is moved with first outward direction that leaves first edge with first inward direction towards first edge; And limit first retainer of first movable plate with first outward direction motion; And
Second fixed cell, this unit is parallel with first fixed cell and separate with first fixed cell, and second fixed cell comprises second movable plate at second edge that engages the PCB matrix; Second actuator, this actuator are used to make second movable plate with second inward direction motion towards second edge, and, can make it to leave second outward direction motion at second edge; And limit second retainer of second movable plate with second outward direction motion;
Wherein, From first edge when second edge prints solder flux to the PCB matrix; Second actuator makes second movable plate move to contact second retainer with second outward direction; And first actuator makes first movable plate move so that the PCB matrix is pressed to second movable plate along first inward direction, and
From second edge when first edge prints solder flux to the PCB matrix; First actuator makes first movable plate move to contact first retainer with first outward direction; And second actuator makes second movable plate move so that the PCB matrix is pressed to first movable plate along second inward direction.
2. equipment according to claim 1, it also comprises: the PCB conveying equipment, this equipment can be carried the PCB matrix between first and second fixed cells.
3. equipment according to claim 1, it also comprises: the bearing unit of the bottom surface of supporting PCB matrix.
4. equipment according to claim 3, wherein: bearing unit goes up and down the PCB matrix so that itself and first and second movable plate are in same plane.
5. equipment according to claim 3, wherein: bearing unit also comprises vacuum nozzle, this vacuum nozzle applies vacuum pressure to the bottom surface of PCB.
6. equipment according to claim 1; Wherein: at least one unit in first fixed cell and second fixed cell can be with respect to another motion in first fixed cell and second fixed cell, so that the spacing between first and second edges of adjusting PCB matrix.
7. equipment according to claim 1, wherein: at least one in first and second actuators is linear actuator.
8. method that forms printed circuit board (PCB) (PCB), this method comprises:
The PCB matrix is installed in the printing equipment; This printing equipment comprises support apparatus; This support apparatus has first fixed cell and second fixed cell; First fixed cell comprises first movable plate at first retainer and first edge that engages the PCB matrix, and second fixed cell comprises second movable plate at second retainer and second edge that engages the PCB matrix;
The print direction of confirming printing equipment is the first direction that moves from edge, first edge to the second, the second direction that still moves from edge, second edge to the first;
When print direction is second direction, make first movable plate motion contacting first retainer, and, through second movable plate PCB matrix is pressed to first fixed cell, so that the PCB matrix is clamped between first and second movable plate;
When print direction is first direction, make second movable plate motion contacting second retainer, and, through first movable plate PCB matrix is pressed to second fixed cell, so that the PCB matrix is clamped between first and second movable plate; And
Utilize printing equipment, solder flux is applied on the PCB matrix along print direction.
9. method according to claim 8, wherein: install step additional and comprise and utilize the PCB conveying equipment, between first and second fixed cells, PCB is provided matrix.
10. method according to claim 8, it also comprises: the step of aiming at the PCB matrix at said step of applying before with respect to printing equipment.
11. method according to claim 8, it also comprises: the step that before bottom surface of PCB matrix is provided vacuum pressure at said step of applying.
12. method according to claim 10, it also comprises: the step that after said alignment procedures, the bottom surface of PCB matrix is provided vacuum pressure.
13. an equipment that is used for during printing, supporting the PCB matrix with relative first and second edges, this equipment comprises:
Pedestal;
First guide unit, it is installed on the pedestal and along first axle and extends;
Be installed in second guide unit on the pedestal, said second guide unit is parallel with first axle and leave first guide unit;
Conveying equipment, this equipment move the PCB matrix along first axle between first and second guide units;
Engage first movable plate at first edge of PCB matrix, said first movable plate combines with first guide unit, so that second axial-movement that edge and first axle intersect;
First actuator, this actuator can make first movable plate with first inward direction, edge second axial-movement towards first edge, and, can make first outward direction, edge second axial-movement of first movable plate to leave first edge;
First retainer, it is used to limit first movable plate moving along first outward direction;
Engage second movable plate at second edge of PCB matrix, said second movable plate combines with second guide unit, so that along second axial-movement;
Second actuator, this actuator can make second movable plate with second inward direction, edge second axial-movement towards second edge, and, can make second outward direction, edge second axial-movement of second movable plate to leave second edge; With
Second retainer, it is used to limit second movable plate moving along second outward direction;
Wherein, From first edge to second edge during at PCB matrix printing solder flux; Second actuator makes second movable plate move to contact second retainer along second outward direction; And first actuator makes first movable plate move so that the PCB matrix is pressed to second movable plate along first inward direction; And
From second edge to first edge during at PCB matrix printing solder flux; First actuator makes first movable plate move to contact first retainer along first outward direction; And second actuator makes second movable plate move so that the PCB matrix is pressed to first movable plate along second inward direction.
14. equipment according to claim 13, it also comprises: the bearing unit of supporting PCB matrix bottom surface.
15. equipment according to claim 14, wherein: bearing unit goes up and down the PCB matrix so that itself and first and second movable plate are in same plane.
16. equipment according to claim 14, wherein: bearing unit also comprises vacuum nozzle, and this vacuum nozzle is used for the bottom surface of PCB is applied vacuum pressure.
17. equipment according to claim 13; Wherein: at least one unit in first guide unit and second guide unit can be with respect to another motion in first guide unit and second guide unit, so that the spacing between first and second edges of adjusting PCB matrix.
18. equipment according to claim 13, wherein: at least one in first and second actuators is linear actuator.
19. equipment according to claim 13, it also comprises: aligning equipment, this equipment are used to adjust the orientation of PCB matrix with respect to printing equipment.
20. equipment according to claim 19, wherein: said aligning equipment combines with pedestal so that pedestal is done linear movement or rotation.
CN2007101011249A 2006-10-13 2007-04-29 Apparatus for supporting a printed circuit board substrate and method of forming printed circuit board using the same Active CN101163376B (en)

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KR1020060100013 2006-10-13
KR1020060100013A KR101164593B1 (en) 2006-10-13 2006-10-13 Fixing apparatus for printed circuit board and printing method of PCB
KR10-2006-0100013 2006-10-13

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KR101164593B1 (en) 2012-07-11
US20080087178A1 (en) 2008-04-17
CN101163376A (en) 2008-04-16
KR20080034067A (en) 2008-04-18

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