CN101351088B - Inside imbedded type line structure and technique thereof - Google Patents
Inside imbedded type line structure and technique thereof Download PDFInfo
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- CN101351088B CN101351088B CN2007101368256A CN200710136825A CN101351088B CN 101351088 B CN101351088 B CN 101351088B CN 2007101368256 A CN2007101368256 A CN 2007101368256A CN 200710136825 A CN200710136825 A CN 200710136825A CN 101351088 B CN101351088 B CN 101351088B
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- core board
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- recess patterns
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Abstract
The invention relates to the technology of an embedded line structure. At least one through hole forming on a kernel board penetrates the kernel board. A first depression pattern and a second depression pattern respectively form on the first surface of the kernel board and a second surface relative to the first surface. Conducting materials are electroplated to the through hole, the first depression pattern and the second depression pattern, aiming at forming a conducting channel in the through hole, a first line pattern forms in the first depression pattern part of which is beyond the first depression pattern, and a second line pattern forms in the second depression pattern part of which is beyond the second depression pattern. Part of the first line pattern beyond the first depression pattern is removed to flatten the first line pattern on the first surface of the kernel board, and part of the second line pattern beyond the second depression pattern is removed to flatten the second line pattern on the second surface of the kernel board.
Description
Technical field
The invention relates to a kind of line construction and technology thereof, and particularly relevant for a kind of buried circuit structure and technology thereof.
Background technology
Along with the number of contacts of integrated circuit (IC) chip and the increase of contactor density, being used for the contactor density of line carrier plate of packaged chip and wiring density also must can corresponding matching.Except the line carrier plate that Chip Packaging is used, along with the miniaturization and the slimming of electronic product, the employed line carrier plate of the motherboard of electronic product is also gradually towards the trend development of high wiring density.Therefore, the demand of the line carrier plate of high wiring density rises gradually.
The production method of line carrier plate roughly comprises laminated method (laminating process) and Layer increasing method (build-up process) at present.
Laminated method be earlier with the position after the patterned line layer on the surface of dielectric layer completes, again with required patterned line layer and the stacking layered structure that presses to of dielectric, carry out electroplating ventilating hole (platedthrough hole, i.e. PTH) step afterwards and be positioned at the patterned line layer of two different levels with connection.Layer increasing method is to form patterned line layer on a substrate in regular turn, and makes the conductive hole (conductive via) that connects last layer pattern line layer in the lump in the process of pattern-making line layer in regular turn.
United States Patent (USP) numbering 5,504,992 disclose a kind of " circuit board technique ", it forms a photoresist pattern on a thin metal layer of the one side of a sheet metal, then be that chemical deposit forms a line pattern on the part that not hidden by the photoresist pattern of thin metal layer, remove the photoresist pattern then with the thin metal layer.Then, above-mentioned two line patterns are being imbedded the two sides of same dielectric layer respectively and formed a layered structure, and in this layered structure, forming after the perforation,, connecting above-mentioned two line patterns to form conductive channel with the inwall of plated with conductive material to perforation.At last, remove these sheet metals and these thin metal layers, and stay dielectric layer, these imbed dielectric layer the two sides line pattern and connect the conductive channel of these line patterns.The thin metal layer as chemical deposit that it should be noted that above-mentioned United States Patent (USP) will remove after technology is finished, and can not be retained between line pattern and the dielectric layer.
Summary of the invention
The invention provides a kind of inside imbedded type line structural technique, in order to the accurate positioning degree between these line patterns of relative raising.
The invention provides a kind of buried circuit structure, it can improve the accurate positioning degree between these line patterns relatively in technology.
The present invention proposes a kind of inside imbedded type line structural technique.One core board is provided.Form consistent at least hole on core board, it runs through core board itself.First at core board forms first recess patterns.Second formation second recess patterns at core board with respect to first.With plated with conductive material to perforation, first recess patterns and second recess patterns, in perforation, to form conductive channel, and in first recess patterns, form first line pattern, its part exceeds first recess patterns, and in second recess patterns, form second line pattern, its part exceeds second recess patterns, wherein electroplates to comprise behind the first electroless plating metallide again.Remove first line pattern that the part exceeds first recess patterns,, and remove second line pattern that the part exceeds second recess patterns, with leveling second line pattern second to core board with leveling first line pattern first to core board.
In one embodiment of this invention, the step of formation perforation can comprise machining or laser processing.
In one embodiment of this invention, the step that forms first recess patterns and second recess patterns can comprise laser processing.
In one embodiment of this invention, the step that removes the first local line pattern and local second line pattern can comprise etching or grinding.
In one embodiment of this invention, conductive channel can have a tubular space.
In one embodiment of this invention, this technology more can comprise the consent material is filled in the tubular space of conductive channel.
In one embodiment of this invention, this technology more can comprise and remove local outstanding consent post, with the two ends of consent post respectively leveling to first and second of core board.
The present invention proposes a kind of buried circuit structure, and it comprises core board, first line pattern, second line pattern, conductive channel and a plurality of chemical deposit.Core board has first and second on the other side.First line pattern is imbedded first of core board.Second line pattern is imbedded second of core board.Conductive channel runs through core board, and the two ends of conductive channel connect first line pattern and second line pattern respectively.These chemical deposits lay respectively between the core board and first line pattern, between core board and second line pattern and between core board and the conductive channel.
In one embodiment of this invention, this structure more can comprise a consent post, and it is filled in the tubular space of conductive channel.
The present invention proposes a kind of inside imbedded type line structural technique.Core board is provided, and it has first and second on the other side.Form consistent at least hole on core board, it runs through core board itself.To perforation, to form conductive channel in perforation, wherein conductive channel has a tubular space with plated with conductive material.The consent material is filled in the tubular space of conductive channel, to form the consent post.Remove local outstanding first and second consent post, so that leveling first and second to core board distinguished at the two ends of consent post from core board.First at core board forms first recess patterns.Second at core board forms second recess patterns.With plated with conductive material to the first recess patterns and second recess patterns, in first recess patterns, to form first line pattern, its part exceeds first recess patterns, and in second recess patterns, form second line pattern, its part exceeds second recess patterns, wherein electroplates to comprise behind the first electroless plating metallide again.Remove first line pattern that the part exceeds first recess patterns,, and remove second line pattern that the part exceeds second recess patterns, with leveling second line pattern second to core board with leveling first line pattern first to core board.
In one embodiment of this invention, the step of formation perforation comprises machining or laser processing.
In one embodiment of this invention, the step that forms first recess patterns and second recess patterns comprises laser processing.
In one embodiment of this invention, the step that removes the first local line pattern and local second line pattern comprises etching or grinding.
The present invention proposes a kind of buried circuit structure, and it comprises core board, first line pattern, second line pattern, conductive channel, first chemical deposit, a plurality of second chemical deposit and consent post.Core board has first and second on the other side.First line pattern is imbedded first of core board.Second line pattern is imbedded second of core board.Conductive channel runs through core board, and the two ends of conductive channel connect first line pattern and second line pattern respectively.First chemical deposit is between core board and conductive channel.These second chemical deposits lay respectively between the core board and first line pattern and between the core board and second line pattern.The consent column filling is in a tubular space of conductive channel.
In one embodiment of this invention, first chemical deposit is more between these second chemical deposits and conductive channel.
In the present invention, owing to be positioned at the position that these recess patterns on the two sides of core board can directly define these line patterns, so the accurate positioning degree between these line patterns can improve relatively.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, a plurality of embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A to Fig. 1 D illustrates the inside imbedded type line structural technique of one embodiment of the invention.
Fig. 2 A to Fig. 2 E illustrates the inside imbedded type line structural technique of another embodiment of the present invention.
Fig. 3 A to Fig. 3 H illustrates the inside imbedded type line structural technique of another embodiment of the present invention.
The main element symbol description
100: core board
100a: first
100b: second
102: perforation
104: the first recess patterns
106: the second recess patterns
108: conductive channel
108a: tubular space
110: the first line patterns
112: the second line patterns
114: chemical deposit
116: the consent post
200: core board
200a: first
200b: second
202: perforation
204: conductive channel
204a: tubular space
206: the first chemical deposits
The part of 206 ': the first chemical deposit
207: electrodeposited coating
207 ': the part of electrodeposited coating
208: the consent post
210: the first recess patterns
212: the second recess patterns
214: the first line patterns
216: the second line patterns
218: the second chemical deposits
Embodiment
Figure 1A to Fig. 1 D illustrates the inside imbedded type line structural technique of one embodiment of the invention.
Please refer to Figure 1A, a core board 100 is provided.In the present embodiment, core board 100 is a dielectric sheet.
Please refer to Figure 1B, form consistent at least hole 102 on core board 100, it runs through core board 100 itself, and the step that wherein forms perforation 102 can comprise machining or laser processing.In addition, more one first 100a at core board 100 forms one first recess patterns 104, and the step that wherein forms first recess patterns 104 can comprise laser processing.In addition, also one second 100b with respect to first 100a at core board 100 forms one second recess patterns 106, and the step that wherein forms second recess patterns 106 can comprise laser processing.
Please refer to Fig. 1 C, with plated with conductive material to perforation 102, first recess patterns 104 and second recess patterns 106, in perforation 102, to form a conductive channel 108, in first recess patterns 104, form one first line pattern 110, its part exceeds first recess patterns 104, and in second recess patterns 106, forming one second line pattern 112, its part exceeds second recess patterns 106.
In the present embodiment, electric conducting material will fill up perforation 102 and form solid conductive channel 108.Therefore, conductive channel 108 runs through core board, and the two ends of conductive channel 108 connect first line pattern 110 and second line pattern 112 respectively.In addition, first line pattern 110 is imbedded first 100a of core board 100, and second line pattern 112 is imbedded second 100b of core board 100.
In the present embodiment, plating comprises first electroless plating with formation chemical deposit 114, follows metallide to form conductive channel 108, first line pattern 110 and second line pattern 112 again.Therefore, conductive channel 108 runs through core board 100, and the two ends of conductive channel 108 connect first line pattern 110 and second line pattern 112 respectively.In addition, first line pattern 110 is imbedded first 100a of core board 100, and second line pattern 112 is imbedded second 100b of core board 100.
Please refer to Fig. 1 D, remove first line pattern 110 that the part exceeds first recess patterns 104, with first 100a of leveling first line pattern 110 to core board 100, and remove second line pattern 112 that the part exceeds second recess patterns 106, with second 100b of leveling second line pattern 112 to core board 100.In the present embodiment, the step that removes the first local line pattern 110 and local second line pattern 112 can comprise etching or grinding.
Fig. 2 A to Fig. 2 E illustrates the inside imbedded type line structural technique of another embodiment of the present invention.
Please refer to Fig. 2 A, a core board 100 is provided.In the present embodiment, core board 100 is a dielectric sheet.
Please refer to Fig. 2 B, form consistent at least hole 102 on core board 100, it runs through core board 100 itself, and the step that wherein forms perforation 102 can comprise machining or laser processing.In addition, more one first 100a at core board 100 forms one first recess patterns 104, and the step that wherein forms first recess patterns 104 can comprise laser processing.In addition, also one second 100b with respect to first 100a at core board 100 forms one second recess patterns 106, and the step that wherein forms second recess patterns 106 can comprise laser processing.
Please refer to Fig. 2 C, with plated with conductive material to perforation 102, first recess patterns 104 and second recess patterns 106, in perforation 102, to form a conductive channel 108, in first recess patterns 104, form one first line pattern 110, its part exceeds first recess patterns 104, and in second recess patterns 106, forming one second line pattern 112, its part exceeds second recess patterns 106.In the present embodiment, electric conducting material does not fill up perforation 102.Make conductive channel 108 have a tubular space 108a.
In the present embodiment, plating comprises first electroless plating with formation chemical deposit 114, follows metallide to form conductive channel 108, first line pattern 110 and second line pattern 112 again.Therefore, conductive channel 108 runs through core board 100, and the two ends of conductive channel 108 connect first line pattern 110 and second line pattern 112 respectively.In addition, first line pattern 110 is imbedded first 100a of core board 100, and second line pattern 112 is imbedded second 100b of core board 100.
Please refer to Fig. 2 D, the consent material is filled in the tubular space 108a of conductive channel 108, to form a consent post 116.
Please refer to Fig. 2 E, remove first line pattern 110 that the part exceeds first recess patterns 104, with first 100a of leveling first line pattern 110 to core board 100, and remove second line pattern 112 that the part exceeds second recess patterns 106, with second 100b of leveling second line pattern 112 to core board 100.In the present embodiment, the step that removes the first local line pattern 110 and local second line pattern 112 can comprise etching or grinding.In the present embodiment, more comprise removing local outstanding consent post 116, so that leveling first 100a and second 100b to core board 100 distinguished at the two ends of consent post 116.
Fig. 3 A to Fig. 3 G illustrates the inside imbedded type line structural technique of another embodiment of the present invention.
Please refer to Fig. 3 A, a core board 200 is provided.In the present embodiment, core board 200 is a dielectric sheet.
Please refer to Fig. 3 B, form consistent at least hole 202 on core board 200, it runs through core board 200 itself, and the step that wherein forms perforation 202 can comprise machining or laser processing.
Please refer to Fig. 3 C, to perforation 202, to form a conductive channel 204 in perforation 202, wherein conductive channel 204 has a tubular space 204a with plated with conductive material.In the present embodiment, owing to adopt plating mode to form conductive channel 204, so will form earlier one first chemical deposit 206 between the inwall of perforation 202 and the conductive channel 204, electrodeposited coating 207 also is formed on first 200a and second 200b of core board 200 simultaneously.Therefore, be positioned at the part 206 ' of first chemical deposit 206 of perforation 202 and the part 207 ' that is positioned at the electrodeposited coating 207 of perforation 202 and form conductive channel 204.
Please refer to Fig. 3 D, the consent material is filled in the tubular space 204a of conductive channel 204, to form a consent post 208.
Please refer to Fig. 3 E, remove local giving prominence to, so that leveling first 200a and second 200b to core board 200 distinguished at the two ends of consent post 208 from first 200a of core board 200 and the consent post 208 of second 200b.In the present embodiment, the position that more removes first chemical deposit 206 in the part of first 200a and the position of electrodeposited coating 207 in the part of second 200b.
Please refer to Fig. 3 F, form one first recess patterns 210 at first 200a of core board 200, the step that wherein forms first recess patterns 210 can comprise laser processing.In addition, more second 200b at core board 200 forms one second recess patterns 212, and the step that wherein forms second recess patterns 212 can comprise laser processing.
Please refer to Fig. 3 G, with plated with conductive material to the first recess patterns 210 and second recess patterns 212, in first recess patterns 210, to form one first line pattern 214, its part exceeds first recess patterns 210, and in second recess patterns 212, forming one second line pattern 216, its part exceeds second recess patterns 212.
In the present embodiment, plating comprises first electroless plating electric conducting material to form two second chemical deposits 218, first 100a and second 200b respectively at core board 200, follows the metallide electric conducting material to form first line pattern 214 and second line pattern 216 on second chemical deposit 218 again.Therefore, first line pattern 214 is imbedded first 200a of core board 200, and second line pattern 216 is imbedded second 200b of core board 200, and the two ends of conductive channel 204 connect first line pattern 214 and second line pattern 216 respectively.
Please refer to Fig. 3 H, remove first line pattern 214 that the part exceeds first recess patterns 210, with first 200a of leveling first line pattern 214 to core board 200, and remove second line pattern 216 that the part exceeds second recess patterns 212, with second 200b of leveling second line pattern 214 to core board 200.
In the present embodiment, second chemical deposit 218 that the part exceeds first recess patterns 210 also can be removed, with first 200a of leveling second chemical deposit 218 to core board 200, and local second chemical deposit 218 that exceeds second recess patterns 212 also can be removed, with second 200b of leveling second chemical deposit 218 to core board 200.
In the present embodiment, the step that removes the first local line pattern 214 and local second line pattern 216 can comprise etching or grinding.Similarly, the step that removes these local second chemical deposits 218 also can comprise etching or grinding.
The thin metal layer that United States Patent (USP) numbering 5,504,992 discloses as chemical deposit will remove after technology is finished, and can not be retained between line pattern and the dielectric layer.Yet compared to United States Patent (USP) numbering 5,504,992, produced chemical deposit will be between two line patterns and core board in technology in the present invention.
In sum, the present invention is after two recess patterns are respectively formed at the two sides of core board, insert electric conducting material is imbedded core board with formation to these recess patterns line pattern with plating mode again, thereby produce a buried circuit structure, it can be used as the part of a wiring board or wiring board.In addition, can make the preceding of line pattern or make the conductive channel that one or more connections two are positioned at the line pattern of different levels simultaneously.
It should be noted that the position that can directly define these line patterns owing to these recess patterns that are positioned at the two sides of core board, so the accurate positioning degree between these line patterns can improve relatively.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; have in the technical field under any and know that usually the knowledgeable without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking appended the claim person of defining.
Claims (10)
1. inside imbedded type line structural technique comprises:
Core board is provided;
Form consistent at least hole on this core board, it runs through this core board itself;
First at this core board forms first recess patterns;
Form second recess patterns at this core board with respect to this first second;
With plated with conductive material to this perforation, this first recess patterns and this second recess patterns, in this perforation, to form conductive channel, and in this first recess patterns, form first line pattern, its part exceeds this first recess patterns, and in this second recess patterns, form second line pattern, its part exceeds this second recess patterns, wherein electroplates to comprise behind the first electroless plating metallide again; And
Remove this first line pattern that the part exceeds this first recess patterns, with this first line pattern of leveling this first to this core board, and remove this second line pattern that the part exceeds this second recess patterns, with this second line pattern of leveling this second to this core board.
2. inside imbedded type line structural technique as claimed in claim 1, wherein this conductive channel has tubular space.
3. inside imbedded type line structural technique as claimed in claim 1 more comprises:
The consent material is filled in this tubular space of this conductive channel.
4. inside imbedded type line structural technique as claimed in claim 1 more comprises:
Remove local this outstanding consent post, so that leveling this first and this second to this core board distinguished at the two ends of this consent post.
5. buried circuit structure comprises:
Core board has first and second on the other side;
First line pattern, this first of imbedding this core board;
Second line pattern, this second of imbedding this core board;
Conductive channel runs through this core board, and the two ends of this conductive channel connect this first line pattern and this second line pattern respectively; And
A plurality of chemical deposits lay respectively between this core board and this first line pattern, between this core board and this second line pattern and between this core board and this conductive channel.
6. buried circuit structure as claimed in claim 5 more comprises:
The consent post is filled in the tubular space of this conductive channel.
7. inside imbedded type line structural technique comprises:
Core board is provided, and it has first and second on the other side;
Form consistent at least hole on this core board, it runs through this core board itself;
To this perforation, to form conductive channel in this perforation, wherein this conductive channel has tubular space with plated with conductive material;
The consent material is filled in this tubular space of this conductive channel, to form the consent post;
Remove local outstanding this first and this this consent post of second, so that leveling this first and this second to this core board distinguished at the two ends of this consent post from this core board;
This first at this core board forms first recess patterns;
This second at this core board forms second recess patterns;
With plated with conductive material to this first recess patterns and this second recess patterns, in this first recess patterns, to form first line pattern, its part exceeds this first recess patterns, and in this second recess patterns, form second line pattern, its part exceeds this second recess patterns, wherein electroplates to comprise behind the first electroless plating metallide again; And
Remove this first line pattern that the part exceeds this first recess patterns, with this first line pattern of leveling this first to this core board, and remove this second line pattern that the part exceeds this second recess patterns, with this second line pattern of leveling this second to this core board.
8. inside imbedded type line structural technique as claimed in claim 7, wherein this step that removes this second line pattern of this local first line pattern and part comprises etching or grinding.
9. buried circuit structure comprises:
Core board has first and second on the other side;
First line pattern, this first of imbedding this core board;
Second line pattern, this second of imbedding this core board;
Conductive channel runs through this core board, and the two ends of this conductive channel connect this first line pattern and this second line pattern respectively;
First chemical deposit is between this core board and this conductive channel;
A plurality of second chemical deposits lay respectively between this core board and this first line pattern and between this core board and this second line pattern; And
The consent post is filled in the tubular space of this conductive channel.
10. buried circuit structure as claimed in claim 9, wherein this first chemical deposit is also between those second chemical deposits and this conductive channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101368256A CN101351088B (en) | 2007-07-17 | 2007-07-17 | Inside imbedded type line structure and technique thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101368256A CN101351088B (en) | 2007-07-17 | 2007-07-17 | Inside imbedded type line structure and technique thereof |
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| Publication Number | Publication Date |
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| CN101351088A CN101351088A (en) | 2009-01-21 |
| CN101351088B true CN101351088B (en) | 2010-06-23 |
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| CN2007101368256A Active CN101351088B (en) | 2007-07-17 | 2007-07-17 | Inside imbedded type line structure and technique thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102730619B (en) * | 2011-04-07 | 2015-03-04 | 欣兴电子股份有限公司 | Covering member for micro-electro mechanical device and method for manufacturing covering member |
| CN103458628B (en) * | 2012-05-30 | 2016-06-01 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and making method thereof |
| CN104219892A (en) * | 2013-05-29 | 2014-12-17 | 富葵精密组件(深圳)有限公司 | A method for manufacturing circuit board |
| TWI482541B (en) * | 2013-12-10 | 2015-04-21 | Subtron Technology Co Ltd | Circuit board and manufacturing method thereof |
| CN105161426A (en) * | 2015-09-21 | 2015-12-16 | 业成光电（深圳）有限公司 | Conductive substrate and manufacturing method thereof |
| TWM522540U (en) * | 2015-11-30 | 2016-05-21 | 同泰電子科技股份有限公司 | Circuit board structure |
| CN107666765A (en) * | 2016-07-29 | 2018-02-06 | 同扬光电（江苏）有限公司 | Circuit board structure |
| CN110798970A (en) * | 2018-08-01 | 2020-02-14 | 鹏鼎控股(深圳)股份有限公司 | Display module with flexible circuit board and manufacturing method thereof |
| CN110798987A (en) * | 2018-08-01 | 2020-02-14 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and method for manufacturing the same |
| CN114126224A (en) * | 2020-08-28 | 2022-03-01 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
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|---|---|---|---|---|
| US5509200A (en) * | 1994-11-21 | 1996-04-23 | International Business Machines Corporation | Method of making laminar stackable circuit board structure |
| CN2606997Y (en) * | 2003-04-01 | 2004-03-17 | 欣兴电子股份有限公司 | Inner layer structure of circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5509200A (en) * | 1994-11-21 | 1996-04-23 | International Business Machines Corporation | Method of making laminar stackable circuit board structure |
| CN2606997Y (en) * | 2003-04-01 | 2004-03-17 | 欣兴电子股份有限公司 | Inner layer structure of circuit board |
Non-Patent Citations (1)
| Title |
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| JP特开2000-244130A 2000.09.08 |
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