CN101351885A - 快闪存储器卡上的测试垫 - Google Patents
快闪存储器卡上的测试垫 Download PDFInfo
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- CN101351885A CN101351885A CNA2006800499456A CN200680049945A CN101351885A CN 101351885 A CN101351885 A CN 101351885A CN A2006800499456 A CNA2006800499456 A CN A2006800499456A CN 200680049945 A CN200680049945 A CN 200680049945A CN 101351885 A CN101351885 A CN 101351885A
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
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Abstract
Description
Claims (17)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/321,663 US7259028B2 (en) | 2005-12-29 | 2005-12-29 | Test pads on flash memory cards |
US11/321,663 | 2005-12-29 | ||
PCT/US2006/049380 WO2007079123A2 (en) | 2005-12-29 | 2006-12-27 | Test pads on flash memory cards |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101351885A true CN101351885A (zh) | 2009-01-21 |
CN101351885B CN101351885B (zh) | 2010-06-09 |
Family
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Application Number | Title | Priority Date | Filing Date |
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CN2006800499456A Expired - Fee Related CN101351885B (zh) | 2005-12-29 | 2006-12-27 | 半导体封装及其制造方法 |
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US (2) | US7259028B2 (zh) |
EP (1) | EP1974380A2 (zh) |
KR (1) | KR101041228B1 (zh) |
CN (1) | CN101351885B (zh) |
TW (1) | TWI355721B (zh) |
WO (1) | WO2007079123A2 (zh) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7573276B2 (en) * | 2006-11-03 | 2009-08-11 | Micron Technology, Inc. | Probe card layout |
US7778057B2 (en) * | 2007-02-26 | 2010-08-17 | Sandisk Corporation | PCB circuit modification from multiple to individual chip enable signals |
US7709278B2 (en) * | 2007-02-26 | 2010-05-04 | Sandisk Corporation | Method of making PCB circuit modification from multiple to individual chip enable signals |
EP2073262B1 (de) | 2007-12-18 | 2015-09-30 | Micronas GmbH | Halbleiterbauelement |
US7901987B2 (en) * | 2008-03-19 | 2011-03-08 | Stats Chippac Ltd. | Package-on-package system with internal stacking module interposer |
US20100123243A1 (en) * | 2008-11-17 | 2010-05-20 | Great Team Backend Foundry, Inc. | Flip-chip chip-scale package structure |
US7944029B2 (en) * | 2009-09-16 | 2011-05-17 | Sandisk Corporation | Non-volatile memory with reduced mobile ion diffusion |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4881028A (en) * | 1988-06-13 | 1989-11-14 | Bright James A | Fault detector |
US5334857A (en) * | 1992-04-06 | 1994-08-02 | Motorola, Inc. | Semiconductor device with test-only contacts and method for making the same |
US5250841A (en) * | 1992-04-06 | 1993-10-05 | Motorola, Inc. | Semiconductor device with test-only leads |
US5772451A (en) * | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
US5719449A (en) * | 1996-09-30 | 1998-02-17 | Lucent Technologies Inc. | Flip-chip integrated circuit with improved testability |
US6551844B1 (en) * | 1997-01-15 | 2003-04-22 | Formfactor, Inc. | Test assembly including a test die for testing a semiconductor product die |
US6221682B1 (en) * | 1999-05-28 | 2001-04-24 | Lockheed Martin Corporation | Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects |
JP3768761B2 (ja) * | 2000-01-31 | 2006-04-19 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
US20020013071A1 (en) * | 2000-07-26 | 2002-01-31 | Ong E. C. | Final testing of IC die in wafer form |
US6680213B2 (en) * | 2001-04-02 | 2004-01-20 | Micron Technology, Inc. | Method and system for fabricating contacts on semiconductor components |
KR100437278B1 (ko) * | 2001-07-27 | 2004-06-25 | 주식회사 네패스 | 반도체 플립칩 패키지 제조방법 |
TWI292196B (en) * | 2002-09-30 | 2008-01-01 | Via Tech Inc | Flip chip test structure |
US7170306B2 (en) * | 2003-03-12 | 2007-01-30 | Celerity Research, Inc. | Connecting a probe card and an interposer using a compliant connector |
TWI240082B (en) * | 2003-07-10 | 2005-09-21 | Siliconware Precision Industries Co Ltd | Wafer test method |
KR100585142B1 (ko) * | 2004-05-04 | 2006-05-30 | 삼성전자주식회사 | 범프 테스트를 위한 플립 칩 반도체 패키지 및 그 제조방법 |
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EP1974380A2 (en) | 2008-10-01 |
US7259028B2 (en) | 2007-08-21 |
WO2007079123A2 (en) | 2007-07-12 |
US20070152215A1 (en) | 2007-07-05 |
US7495255B2 (en) | 2009-02-24 |
TWI355721B (en) | 2012-01-01 |
WO2007079123A3 (en) | 2008-04-17 |
TW200741998A (en) | 2007-11-01 |
KR101041228B1 (ko) | 2011-06-14 |
KR20080087146A (ko) | 2008-09-30 |
CN101351885B (zh) | 2010-06-09 |
US20070257352A1 (en) | 2007-11-08 |
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