CN101370355B - Module, circuit board assembly, communication equipment and module assembly method - Google Patents
Module, circuit board assembly, communication equipment and module assembly method Download PDFInfo
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- CN101370355B CN101370355B CN2007101405823A CN200710140582A CN101370355B CN 101370355 B CN101370355 B CN 101370355B CN 2007101405823 A CN2007101405823 A CN 2007101405823A CN 200710140582 A CN200710140582 A CN 200710140582A CN 101370355 B CN101370355 B CN 101370355B
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- scolder
- carrier
- module
- sided
- substrate
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Abstract
The invention discloses a module and circuit assembly and communication device and module assembly method. The module pin structure is composed of prefabricated solder and solder carrier provided with a slot, at least one side of the solder carrier is provided with groove one-to-one corresponding to base board welding disc, the prefabricated solder places in the groove. The base board lower end provided with welding disc is inserted into slot of solder carrier to form a vertical module; the base board and solder carrier constitutes pin structure and goes through reflow soldering with mother board, then prefabricated solder in groove melts to form pin and module and mother board is electrically and mechanically connected. The invention reduces production cost of module, simplifies assembling procedure, welded pin structure is not easy to deform during processing, package and transportation thereby eliminating co-planarity problem.
Description
Technical field
The present invention relates to electronic applications, relate in particular to a kind of module and circuit board assemblies and communication device and modular assembling method.
Background technology
Highly dense miniaturization is the trend of electronic product development, also is that the electronics packaging technology needs the challenge that faces always, and the process layout's density that improves veneer has become electronic product and realized one of necessary condition of highly dense miniaturization.With the partial common circuit on the circuit board, especially repeated circuit unit on a motherboard is integrated on the vertical type module (Module), and then this vertical type module is assembled on the motherboard as a conventional device.By the method, not only made full use of three dimensions, reduce floor space, and promoted packaging efficiency and quality when improving layout density, reduce production costs.
According to the form of module secondary assembling on motherboard, module can be divided into vertical and horizontal two kinds, and vertical module can effectively be utilized the three dimensions of veneer.Vertical type module is many based on single pin configuration in the prior art, is example with the pin configuration of vertical single surface-mount module of the prior art, as shown in Figure 1 vertical single surface-mount module circuit profile and pin configuration thereof:
Once assembling is preceding many to the intercell connector connection of pin by two ends, and to the substrate 1 of module, the technology realization module of Reflow Soldering and being connected of motherboard are adopted in the secondary assembling to the pin 2 that intercell connector connects as an overall package.
In the said method, what described pin configuration adopted is that metal ferrule is realized the electric and mechanical connection between module and the motherboard, and metal ferrule is vulnerable to external force generation distortion in the process of processing, packing and the transportation of pin configuration, makes pin configuration produce the problem of coplane degree; And the cost of metal ferrule is higher, causes the cost of whole module to improve.
In addition, in the said method, when assembling substrates and pin configuration, usually by mode welding pin and substrates such as manual immersed solder, the installation procedure complexity, and be prone to Welding Problems such as bridging.
Summary of the invention
The technical problem that the embodiment of the invention solves provides a kind of module and circuit board assemblies and communication device and modular assembling method, and the technical scheme of using the embodiment of the invention to provide can reduce the cost of module, eliminates the problem of pin configuration coplane degree.
The purpose of the embodiment of the invention is achieved through the following technical solutions:
The embodiment of the invention provides a kind of module, comprise substrate and pin configuration, described substrate lower end is provided with pad, described pin configuration is made up of prefabricated scolder and the scolder carrier that is provided with crack, wherein, described substrate inserts in the crack of pin configuration, and interior at least one side of described scolder carrier is provided with and substrate pads position groove one to one, and described prefabricated scolder is deposited in the described groove.
The embodiment of the invention also provides a kind of circuit board assemblies, comprise module and motherboard, described module comprises substrate and pin configuration, the pin configuration of described module comprises the scolder carrier that is provided with crack, at least one side is provided with and substrate pads position groove one to one in the described scolder carrier, described substrate inserts in the crack of pin configuration, and described substrate is connected by the pin that is provided with in the groove with pin configuration, and described module is electrically connected with motherboard.
The embodiment of the invention also provides a kind of communication device, comprise circuit board assemblies, described circuit board assemblies comprises module and motherboard, described module comprises substrate and pin configuration, the pin configuration of described module comprises the scolder carrier that is provided with crack, at least one side is provided with and substrate pads position groove one to one in the described scolder carrier, described substrate inserts in the crack of pin configuration, described substrate is electrically connected by the pin that is provided with in the groove with pin configuration, and described module is electrically connected with motherboard.
The embodiment of the invention also provides a kind of modular assembling method, comprising:
The side that the substrate lower end is provided with pad is inserted by the scolder carrier and is preset in the crack of the pin configuration that scolder is formed in the described scolder carrier;
The module of described pin configuration and described substrate composition is installed on the motherboard, and this module is crossed the reflow ovens welding with motherboard.
The above technical scheme that provides from the embodiment of the invention as can be seen, the embodiment of the invention has realized a kind of novel vertical module and assemble method and circuit unit thereof by special pin configuration design.Pin configuration is made up of prefabricated scolder and the scolder carrier that is provided with crack, and wherein, the interior at least one side of described scolder carrier is provided with and substrate pads position groove one to one, and described prefabricated scolder is deposited in the described groove.A side that the substrate lower end is provided with pad is inserted in the crack of scolder carrier, forms a vertical type module.The pin configuration that described substrate and scolder carrier constitute is after motherboard is crossed the reflow ovens welding, form pin behind the prefabricated solder fusing in the groove, realize the electric and mechanical connection of module and motherboard, in prior art, utilize metal ferrule to realize comparing being connected between module and the motherboard, the embodiment of the invention is by realizing the electric and mechanical connection between module and the motherboard behind the solder fusing, reduced the manufacturing cost of module, simplified installation procedure, and the pin configuration that welding forms is in processing, not yielding in packing and the transportation, therefore eliminated the problem of coplane degree.
Description of drawings
Fig. 1 is vertical single surface-mount module circuit profile and a pin configuration thereof in the prior art;
The vertical type module figure that comprises pin configuration that Fig. 2 is provided for the embodiment of the invention one;
The one-sided scolder carrier structure figure of the prefabricated scolder of vertical placement that Fig. 3 is provided for the embodiment of the invention one;
The one-sided scolder carrier structure figure of the prefabricated scolder of horizontal positioned that Fig. 4 is provided for the embodiment of the invention one;
The increase that Fig. 5 is provided for the embodiment of the invention one the scolder carrier of stopping means;
The scolder carrier that is provided with boss that Fig. 6 is provided for the embodiment of the invention one;
The substrate schematic diagram that projection is set that Fig. 7 is provided for the embodiment of the invention one;
The overall schematic of the circuit board assemblies that Fig. 8 is provided for the embodiment of the invention two;
The schematic diagram of the circuit board assemblies of the demonstration pin that Fig. 9 is provided for the embodiment of the invention two;
The flow chart of the modular assembling method that Figure 10 is provided for the embodiment of the invention three;
Assembling schematic diagram before the module that Figure 11 is provided for the embodiment of the invention three refluxes;
The schematic diagram of the pin that forms after the module that Figure 12 provides for the embodiment of the invention three refluxes.
Embodiment
For make purpose of the present invention, technical scheme, and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the present invention is described in more detail.
The separate unit body that the building block technique of broad sense can be understood as different components and parts encapsulation integrated, itself needs once assembling, and then it is carried out secondary assembling on the motherboard.
Embodiment one:
The embodiment of the invention provides a kind of module, as shown in Figure 2, this module comprises: substrate 1, pin configuration 2, wherein, the lower end of described substrate 1 is provided with pad 11, described pin configuration 2 is made of scolder carrier 3 and prefabricated scolder 5, in the scolder carrier 3 both sides be provided with substrate 1 on pad 11 positions groove 311 one to one; The first one-sided scolder carrier 31 and the second one-sided scolder carrier 32 are combined to form the scolder carrier 3 of crack 4, and described substrate 1 inserts in the crack 4 of pin configuration;
Wherein, it is corresponding one by one with groove in the pin configuration to insert the pad 11 of the substrate in the pin configuration;
Be placed with prefabricated scolder 5 in the groove 311 shown in Figure 2;
Wherein, for relieve stresses, open wicket 316 in the outside of pin configuration 2; The quantity of wicket can be provided with as required flexibly;
Wherein, can be only in the described scolder carrier in a side setting and substrate pads position groove one to one;
Referring to Fig. 3, but the 311 vertical direction settings of described groove; Referring to Fig. 4, described groove also can the horizontal direction setting; Described groove is used to deposit the prefabricated scolder of welding usefulness;
Wherein, described scolder carrier can be combined by the first one-sided scolder carrier 31 and the second one-sided scolder carrier 32, referring to Fig. 3, the first one-sided scolder carrier 31 is provided with and substrate pads 11 positions groove 311 one to one, has placed prefabricated scolder in the described groove; The first one-sided scolder carrier 31 is provided with jockey, the described first one-sided scolder carrier and the second one-sided scolder carrier cooperatively interact by this jockey, described jockey can be the reference column 312 that is arranged at described scolder carrier 31 1 ends, and the mating holes 313 that is arranged at described scolder carrier 31 other ends;
Wherein, separate between each prefabricated scolder 5; Scolder carrier 3 used materials are insulation, high temperature resistant, antistatic material;
Wherein, the bottom of all prefabricated scolders 5 is positioned at same plane, when guaranteeing that secondary is assembled on the motherboard plate, and the quality of electric and mechanical connection;
Wherein, also jockey can be set in the middle part of the described scolder carrier;
Wherein, the jockey between the first one-sided scolder carrier and the second one-sided scolder carrier is not limited to said structure, can also connect by double-screw bolt, perhaps alternate manner;
Wherein,,, a middle side part of groove can be set, reference column 312 and mating holes 313 are set at the first one-sided scolder carrier referring to Fig. 3 in order to cooperate closely;
Wherein, the structure of the second one-sided scolder carrier and the first one-sided scolder carrier are similar, after the first one-sided scolder carrier and the second one-sided scolder carrier cooperatively interact by jockey, form scolder carrier 3;
Described scolder carrier can also be set to integral type;
Referring to Fig. 5,, can increase a harpoon shape stopping means 314 at scolder carrier two ends for guaranteeing the stability and the assembling quality of module in assembling process; Wherein, also a stopping means can only be set at one end;
Wherein, described stopping means can also be a reference column, or other stopping means;
Referring to Fig. 6, in order to raise the scolder carrier, expose solder joint, so that the detection of solder joint and maintenance, the bottom of scolder carrier 3 is symmetrical set four boss 315;
Wherein, described boss 315 can be symmetrical set a plurality of, also can be symmetrical set two;
For making the motherboard of substrate and lower end have the gap, avoid substrate to contact with the motherboard whole rigidity, referring to Fig. 7, the two ends that are provided with a side of pad 11 at substrate 1 are provided with projection 12 respectively.
Embodiment two:
Referring to Fig. 8, the embodiment of the invention also provides a kind of circuit board assemblies, comprise: substrate 1 and pin configuration 2 and motherboard 6, wherein, substrate 1 inserts composition module in the pin configuration 2, and pin configuration 2 comprises the scolder carrier 3 that is provided with crack 4, at least one sides are provided with and substrate pads position groove 311 one to one in the described scolder carrier 3, described substrate 1 inserts in the crack 4 of pin configuration, and referring to Fig. 9, described substrate is electrically connected by the pin 21 that is provided with in the groove with pin configuration; Substrate is electrically connected with motherboard 6;
Wherein, it can be welding that described substrate is connected by the pin that is provided with in the groove with pin configuration, also can adopt other electric connection mode; Described substrate and motherboard also can be welding, also can adopt other electric connection mode;
Wherein, can only groove be set in the described crack, and in a side groove, pin be set in a side;
Wherein, scolder carrier 3 can be made of symmetrical two one-sided scolder carrier combinations, also can be set to integral type; If the scolder carrier is formed by symmetrical two one-sided scolder carrier combinations, referring to Fig. 9, the first one-sided scolder carrier 31 is provided with jockey, the described first one-sided scolder carrier and the second one-sided scolder carrier cooperatively interact by this jockey, described jockey can be the reference column 312 that is arranged at scolder carrier 31 1 ends, and the mating holes 313 that is arranged at scolder carrier 31 other ends;
Wherein, also jockey can be set in the middle part of the described scolder carrier;
Wherein, the jockey between the first one-sided scolder carrier and the second one-sided scolder carrier is not limited to said structure, can also connect by double-screw bolt, perhaps alternate manner;
Wherein,,, a middle side part of groove can be set, reference column 312 and mating holes 313 are set at the first one-sided scolder carrier referring to Fig. 9 in order to cooperate closely;
Wherein, the structure of the second one-sided scolder carrier and the first one-sided scolder carrier are similar, after the first one-sided scolder carrier and the second one-sided scolder carrier cooperatively interact by jockey, form scolder carrier 3;
Referring to Fig. 8,, open wicket 316 in the outside of pin configuration 2 for relieve stresses; The quantity of wicket can be provided with as required flexibly;
Wherein, for guaranteeing stability and the assembling quality of module in assembling process, can increase a harpoon shape stopping means at scolder carrier 3 two ends; Also a stopping means can only be set at one end; The stopping means that the structure of described stopping means and embodiment one are provided is identical;
Wherein, described stopping means can also be a reference column, or other stopping means;
Wherein, in order to raise the scolder carrier, expose solder joint, so that the detection of solder joint and maintenance, the bottom of scolder carrier 3 is symmetrical set boss; Wherein, described boss can be symmetrical set a plurality of, also can be symmetrical set two; The boss structure that is provided with on the scolder carrier among the structure of described boss and the embodiment one is identical;
For making the motherboard of substrate and lower end have the gap, avoid substrate to contact with the motherboard whole rigidity, the two ends that are provided with a side of pad 11 at substrate 1 can be provided with projection respectively, and the structure of the projection that is provided with on the substrate among the structure of described ledge and the embodiment one is identical.
The present invention is that embodiment also provides a kind of communication device, and this device comprises circuit board assemblies, and the circuit board assemblies that the structure of described circuit board assemblies and the foregoing description two are provided is identical.
Embodiment three:
The embodiment of the invention also provides a kind of modular assembling method, and referring to Figure 10, this method comprises:
Step 101: a side that the substrate lower end is provided with pad is inserted in the crack of pin configuration, forms module;
Wherein, form by the jockey cooperation if described scolder carrier is the first one-sided scolder carrier and the second one-sided scolder carrier, then the mating holes of the reference column of the first one-sided scolder carrier and the second one-sided scolder carrier is connected, the clamping substrate;
Step 102: described module is installed on the motherboard, and this module is crossed the reflow ovens welding with motherboard;
Wherein, during backflow, put into the solder fusing of scolder carrier groove, the pad of substrate side surfaces and the pad on the motherboard are welded together, module refluxes preceding assembling as shown in figure 11, the solder joint situation that the back of refluxing forms, as shown in figure 12.
The above technical scheme that provides from the embodiment of the invention as can be seen, the embodiment of the invention has realized a kind of novel vertical module and assemble method thereof by special pin configuration design.Pin configuration is made up of prefabricated scolder and the scolder carrier that is provided with crack, and wherein, the interior at least one side of described scolder carrier is provided with and substrate pads position groove one to one, and described prefabricated scolder is deposited in the described groove.A side that the substrate lower end is provided with pad is inserted in the crack of scolder carrier, forms a vertical type module.The pin configuration that described substrate and scolder carrier constitute is after motherboard is crossed the reflow ovens welding, form pin behind the prefabricated solder fusing in the groove, realize the electric and mechanical connection of module and motherboard, in prior art, utilize metal ferrule to realize comparing being connected between module and the motherboard, the embodiment of the invention is by realizing the electric and mechanical connection between module and the motherboard behind the solder fusing, reduced the manufacturing cost of module, simplified installation procedure, and the pin configuration that welding forms is in processing, not yielding in packing and the transportation, therefore eliminated the problem of coplane degree.
Further, because separate between the scolder, the used material of described scolder carrier is insulation, high temperature resistant, antistatic material, make the pin of substrate both sides separate, can be used for connecting different I/O (put in/put out, I/O) mouthful, and in the prior art, the metal ferrule both wings of pin are connected as a single entity, pair of pins can only realize the connection of an I/O, therefore, and the scheme that the embodiment of the invention provided, can effectively increase the connection of I/O mouth, improve layout density.
More than a kind of module that the embodiment of the invention provided and circuit board assemblies and communication device and modular assembling method are described in detail, the explanation of above embodiment just is used for helping to understand method of the present invention and thought thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (16)
1. module, comprise substrate and pin configuration, described substrate lower end is provided with pad, it is characterized in that, described pin configuration is made up of prefabricated scolder and the scolder carrier that is provided with crack, and wherein, described substrate inserts in the crack of pin configuration, at least one side is provided with and substrate pads position groove one to one in the described scolder carrier, and described prefabricated scolder is deposited in the described groove.
2. module according to claim 1, it is characterized in that, described scolder carrier is formed by the first one-sided scolder carrier and the second one-sided scolder carrier combinations, on the described first one-sided scolder carrier and the second one-sided scolder carrier jockey is set, the described first one-sided scolder carrier and the second one-sided scolder carrier are realized cooperatively interacting by this jockey.
3. module according to claim 2 is characterized in that, described jockey is arranged at the two ends of the first one-sided scolder carrier and the second one-sided scolder carrier or/and medium position.
4. module according to claim 2 is characterized in that, described jockey comprises the reference column of the first one-sided scolder carrier or the second one-sided scolder carrier one end setting and the mating holes that the other end is provided with.
5. according to the arbitrary described module of claim 1 to 4, it is characterized in that described scolder carrier base is symmetrical set at least two boss.
6. according to the arbitrary described module of claim 1 to 4, it is characterized in that the bottom of described scolder carrier is provided with at least one stopping means.
7. according to the arbitrary described module of claim 1 to 4, it is characterized in that the two ends that described substrate is provided with a side of pad are provided with projection respectively.
8. circuit board assemblies, comprise module and motherboard, described module comprises substrate and pin configuration, it is characterized in that, the pin configuration of described module comprises the scolder carrier that is provided with crack, and at least one side is provided with and substrate pads position groove one to one in the described scolder carrier, and described substrate inserts in the crack of pin configuration, described substrate is electrically connected by the pin that is provided with in the groove with pin configuration, and described module is electrically connected with motherboard.
9. circuit board assemblies according to claim 8, it is characterized in that, described scolder carrier is formed by the first one-sided scolder carrier and the second one-sided scolder carrier combinations, on the described first one-sided scolder carrier and the second one-sided scolder carrier jockey is set, the described first one-sided scolder carrier and the second one-sided scolder carrier are realized cooperatively interacting by this jockey.
10. circuit board assemblies according to claim 9 is characterized in that, described jockey is arranged at the two ends of the first one-sided scolder carrier and the second one-sided scolder carrier or/and medium position.
11. circuit board assemblies according to claim 9 is characterized in that, described jockey comprises the reference column of the first one-sided scolder carrier or the second one-sided scolder carrier one end setting and the mating holes that the other end is provided with.
12. to 11 arbitrary described circuit board assemblies, it is characterized in that according to Claim 8 described scolder carrier base is symmetrical set at least two boss.
13. to 11 arbitrary described circuit board assemblies, it is characterized in that the bottom of described scolder carrier is provided with at least one stopping means according to Claim 8.
14. to 11 arbitrary described circuit board assemblies, it is characterized in that according to Claim 8 the two ends that described substrate is provided with a side of pad are provided with projection respectively.
15. communication device, comprise circuit board assemblies, described circuit board assemblies comprises module and motherboard, described module comprises substrate and pin configuration, it is characterized in that, the pin configuration of described module comprises the scolder carrier that is provided with crack, at least one side is provided with and substrate pads position groove one to one in the described scolder carrier, described substrate inserts in the crack of pin configuration, and described substrate is electrically connected by the pin that is provided with in the groove with pin configuration, and described module is electrically connected with motherboard.
16. a modular assembling method is characterized in that, comprising:
The side that the substrate lower end is provided with pad is inserted by the scolder carrier and is preset in the crack of the pin configuration that scolder is formed in the described scolder carrier;
The module of described pin configuration and described substrate composition is installed on the motherboard, and this module is crossed the reflow ovens welding with motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101405823A CN101370355B (en) | 2007-08-15 | 2007-08-15 | Module, circuit board assembly, communication equipment and module assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101405823A CN101370355B (en) | 2007-08-15 | 2007-08-15 | Module, circuit board assembly, communication equipment and module assembly method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101370355A CN101370355A (en) | 2009-02-18 |
| CN101370355B true CN101370355B (en) | 2010-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007101405823A Expired - Fee Related CN101370355B (en) | 2007-08-15 | 2007-08-15 | Module, circuit board assembly, communication equipment and module assembly method |
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| CN (1) | CN101370355B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103426845B (en) * | 2013-07-30 | 2016-01-13 | 陕西华经微电子股份有限公司 | Two-sided independence many pins band latching circuit terminal |
| WO2016047417A1 (en) * | 2014-09-24 | 2016-03-31 | 京セラ株式会社 | Electronic module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6496384B1 (en) * | 2001-09-21 | 2002-12-17 | Visteon Global Technologies, Inc. | Circuit board assembly and method of fabricating same |
| CN1527657A (en) * | 2003-02-27 | 2004-09-08 | 株式会社山武 | Electric circuit base board assembling body |
| EP1804561A1 (en) * | 2005-12-30 | 2007-07-04 | Omron Europe B.V. | Printed circuit board for perpendicularly connecting electronic components |
-
2007
- 2007-08-15 CN CN2007101405823A patent/CN101370355B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6496384B1 (en) * | 2001-09-21 | 2002-12-17 | Visteon Global Technologies, Inc. | Circuit board assembly and method of fabricating same |
| CN1527657A (en) * | 2003-02-27 | 2004-09-08 | 株式会社山武 | Electric circuit base board assembling body |
| EP1804561A1 (en) * | 2005-12-30 | 2007-07-04 | Omron Europe B.V. | Printed circuit board for perpendicularly connecting electronic components |
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| Publication number | Publication date |
|---|---|
| CN101370355A (en) | 2009-02-18 |
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