Background technology
Energy crisis and environmental pollution are the significant challenge that the mankind are faced with, and tap a new source of energy and renewable and clean energy resource is one of technical field of 21 century tool decision influence.According to the world energy sources committee and International Institute for Applied Systems Analysis's prediction, global fossil fuel shortage was used 100 years, and, because the CO of combustion of fossil fuels discharging
2Increase with the energy consumption index Deng gas, heavy damage the ecological balance.A series of problems such as acid rain have been caused such as greenhouse effect.Seek a kind of renewablely, free of contamination clean energy resource becomes a urgent task.Solar cell grows up just under these circumstances.
Solar cell can be divided into (1) silicon solar cell according to the difference of material therefor; (2) with inorganic salts such as GaAs III one IV compounds of group. cadmium sulfide, the battery that multiple compound such as copper indium diselenide is a material; (3) nano crystal solar cell.In all kinds of batteries, because silicon is the second largest element of reserves on the earth, as semi-conducting material, people are maximum to its research, and its stable performance, nontoxic, pollution-free. so silicon series battery technology comparative maturity, and had commercial value. in silicon series solar cell, monocrystalline silicon transformation efficiency height, but cost height, limited its application, and amorphous silicon has higher absorption coefficient in visible light, can realize large area film deposition cheaply, and making it has more wide application prospect than single crystal silicon solar cell.
For unijunction solar cell, even if with crystalline material preparation, the theoretical limit of its conversion efficiency generally also has only about 25% under the illumination condition of AM1.5.This be because, the Energy distribution broad of solar spectrum, and any semiconductor can only absorb the wherein energy photon higher than own band gap magnitude.Remaining photon is not to pass battery to be changed into heat energy by the back metal absorption, is exactly the atom of energy delivery being given battery material itself, makes the material heating.These energy all can not become electric energy by producing photo-generated carrier.Moreover, the thermal effect of these photons generations also can raise battery operated temperature and battery performance is descended.
The stability problem that single junction cell exists can be raised the efficiency, be solved to lamination a-Si:H solar cell, this be because:
(1) laminated cell has been widened scope of spectral response the combination of materials of different energy gaps together.
(2) the i layer of top battery is thinner, so that the space charge that produces after the illumination is not obvious to the modulation of i layer electric field, and electric-field intensity distribution changes little in the i layer.Be still high field region, this high electric field on the active area obviously is enough to the photo-generated carrier in the i layer is effectively extracted out, thereby stops the generation of photic decline.
(3) photo-generated carrier of end battery generation is about half of single junction cell, and the photic attenuating effect of end battery is less.
Summary of the invention
The object of the present invention is to provide a kind of production method of amorphous silicon laminated solar cell, this method can improve the photoelectric conversion efficiency of solar cell, makes it to help industrialization production.
(1) cleans substrate;
(2) preparation P type amorphous silicon carbide film on substrate; Wherein each gas flow of Tong Ruing is: B
2H
6: 25~35sccm, CH
4: 25~35sccm, SiH
4: 35~45sccm, radio-frequency power are 80~150W, and substrate temperature is 180~240 ℃;
(3) preparation I type amorphous silicon membrane on P type amorphous silicon carbide film, wherein each gas flow of Tong Ruing is: SiH4:25~35sccm, radio-frequency power are 80~150W, substrate temperature is 180~240 ℃;
(4) preparation N type microcrystalline silicon film on I type amorphous silicon membrane, wherein each gas flow of Tong Ruing is: PH
3: 25~35sccm, SiH
4: 15~25sccm, radio-frequency power are 80~150W, and substrate temperature is 180~240 ℃;
(5) preparation P type amorphous silicon carbide film on N type microcrystalline silicon film, wherein each gas flow of Tong Ruing is: B
2H
6: 40~50sccm, CH
4: 20~30sccm, SiH
4: 15~25sccm, radio-frequency power are 80~150W, and substrate temperature is 180~240 ℃;
(6) preparation I type amorphous silicon membrane on P type amorphous silicon carbide film, wherein each gas flow of Tong Ruing is: SiH
4: 25~35sccm, radio-frequency power are 80~150W, and substrate temperature is 180~240 ℃;
(7) preparation N type microcrystalline silicon film on I type amorphous silicon membrane, wherein each gas flow of Tong Ruing is: PH
3: 25~35sccm, SiH
4: 15~25sccm, radio-frequency power are 80~150W, and substrate temperature is 180~240 ℃;
(8) preparation P type amorphous silicon carbide film on N type microcrystalline silicon film, wherein each gas flow of Tong Ruing is: B
2H
6: 40~50sccm, CH
4: 20~30sccm, SiH
4: 15~25sccm, radio-frequency power are 80~150W, and substrate temperature is 180~240 ℃;
(9) preparation I type amorphous silicon membrane on P type amorphous silicon carbide film, wherein each gas flow of Tong Ruing is: SiH
4: 25~35sccm, radio-frequency power are 80~150W, and substrate temperature is 180~240 ℃;
(10) preparation N type microcrystalline silicon film, wherein each gas flow of Tong Ruing is: PH
3: 25~35sccm, SiH
4: 15~25sccm, radio-frequency power are 80~150W, and substrate temperature is 180~240 ℃;
(11) come the AM aluminum metallization hearth electrode with resistance vaporation-type vacuum aluminum-plating equipment, wherein the base vacuum degree is 10
-3Pa~
-4Pa, sputtering time are 2 minutes~4 minutes, and voltage is 150V~175V.
The present invention relates to the amorphous silicon laminated solar cell fabricating technology.The characteristics of this lamination solar cell maximum are the combination of materials of different energy gaps together, have widened scope of spectral response and the effectively generation of the photic decline of prevention.The present invention adopts the solar-electricity pool model of " glass substrate/TCO (transparent conductive film)/top layer PIN amorphous silicon membrane/second layer PIN amorphous silicon membrane/3rd layer PIN amorphous silicon membrane/Al hearth electrode " structure, and uses the transparent conducting ZnO film as preceding electrode.Adopt six Room continuous plasmas to strengthen each layer film that chemical gas-phase deposition system prepares this solar cell.In the process of this battery of preparation, by continuous process optimization, improved the conversion efficiency and the stability of battery, improved cleaning way simultaneously.A kind of preparation technology of the complete amorphous silicon laminated solar cell with industrialization potential is provided.This technology can improve the photoelectric conversion efficiency of solar cell, makes it to help industrialization production.
Embodiment
The present invention adopts the lamination solar cell model of " glass substrate/TCO (transparent conductive film)/top layer PIN amorphous silicon membrane/second layer PIN amorphous silicon membrane/3rd layer PIN amorphous silicon membrane/Al hearth electrode " structure.Related manufacturing process technology is divided into three parts,
Below by describing the present invention more in detail by embodiment.
Example 1:
Example of the present invention utilizes PECVD (plasma-reinforced chemical vapor deposition) technology to prepare each thin layer, specifically comprises the steps:
(1) cleans substrate
(2) preparation P type amorphous silicon carbide film on substrate, wherein each gas flow of Tong Ruing is: B
2H
6: 30sccm, CH
4: 30sccm, SiH
4: 45sccm, radio-frequency power are 120W, and substrate temperature is 230 ℃;
(3) preparation I type amorphous silicon membrane on P type amorphous silicon carbide film, wherein each gas flow of Tong Ruing is: SiH
4: 30sccm, radio-frequency power are 120W, and substrate temperature is 220 ℃;
(4) preparation N type microcrystalline silicon film on I type amorphous silicon membrane, wherein each gas flow of Tong Ruing is: PH
3: 25sccm, SiH
4: 20sccm, radio-frequency power are 120W, and substrate temperature is 220 ℃;
(5) preparation P type amorphous silicon carbide film on N type microcrystalline silicon film, wherein each gas flow of Tong Ruing is: B
2H
6: 45sccm, CH
4: 25sccm, SiH
4: 20sccm, radio-frequency power are 120W, and substrate temperature is 220 ℃;
(6) preparation I type amorphous silicon membrane on P type amorphous silicon carbide film, wherein each gas flow of Tong Ruing is: SiH
4: 35sccm, radio-frequency power are 150W, and substrate temperature is 180 ℃;
(7) preparation N type microcrystalline silicon film on I type amorphous silicon membrane, wherein each gas flow of Tong Ruing is: PH
3: 35sccm, SiH
4: 20sccm, radio-frequency power are 80W, and substrate temperature is 220 ℃;
(8) preparation P type amorphous silicon carbide film on N type microcrystalline silicon film, wherein each gas flow of Tong Ruing is: B
2H
6: 45sccm, CH
4: 25sccm, SiH
4: 20sccm, radio-frequency power are 120W, and substrate temperature is 180 ℃;
(9) preparation I type amorphous silicon membrane on P type amorphous silicon carbide film, wherein each gas flow of Tong Ruing is: SiH
4: 30sccm, radio-frequency power are 100W, and substrate temperature is 220 ℃;
(10) preparation N type microcrystalline silicon film on I type amorphous silicon membrane, wherein each gas flow of Tong Ruing is: PH
3: 35sccm, SiH
4: 20sccm, radio-frequency power are 120W, and substrate temperature is 220 ℃;
(11) preparation aluminium electrode on N type microcrystalline silicon film
Wherein the base vacuum degree 10
-3Pa, sputtering time: 2 minutes, voltage was 200V.
Example 2:
(1) cleans substrate
(2) preparation P type amorphous silicon carbide film on substrate, wherein each gas flow of Tong Ruing is: B
2H
6: 25sccm, CH
4: 35sccm, SiH
4: 40sccm, radio-frequency power are 100W, and substrate temperature is 210 ℃;
(3) preparation I type amorphous silicon membrane on P type amorphous silicon carbide film, wherein each gas flow of Tong Ruing is: SiH
4: 25sccm, radio-frequency power are 100W, and substrate temperature is 200 ℃;
(4) preparation N type microcrystalline silicon film on I type amorphous silicon membrane, wherein each gas flow of Tong Ruing is: PH
3: 30sccm, SiH
4: 15sccm, radio-frequency power are 100W, and substrate temperature is 200 ℃;
(5) preparation P type amorphous silicon carbide film on N type microcrystalline silicon film, wherein each gas flow of Tong Ruing is: B
2H
6: 50sccm, CH
4: 20sccm, SiH
4: 15sccm, radio-frequency power are 100W, and substrate temperature is 210 ℃;
(6) preparation I type amorphous silicon membrane on P type amorphous silicon carbide film, wherein each gas flow of Tong Ruing is: SiH
4: 30sccm, radio-frequency power are 100W, and substrate temperature is 210 ℃;
(7) preparation N type microcrystalline silicon film on I type amorphous silicon membrane, wherein each gas flow of Tong Ruing is: PH
3: 30sccm, SiH
4: 15sccm, radio-frequency power are 100W, and substrate temperature is 200 ℃;
(8) preparation P type amorphous silicon carbide film on N type microcrystalline silicon film, wherein each gas flow of Tong Ruing is: B
2H
6: 50sccm, CH
4: 20sccm, SiH
4: 15sccm, radio-frequency power are 100W, and substrate temperature is 210 ℃;
(9) preparation I type amorphous silicon membrane on P type amorphous silicon carbide film, wherein each gas flow of Tong Ruing is: SiH
4: 25sccm, radio-frequency power are 80W, and substrate temperature is 200 ℃;
(10) preparation N type microcrystalline silicon film on I type amorphous silicon membrane, wherein each gas flow of Tong Ruing is: PH
3: 30sccm, SiH
4: 15sccm, radio-frequency power are 100W, and substrate temperature is 200 ℃;
(11) preparation aluminium electrode on N type microcrystalline silicon film
Wherein the base vacuum degree 10
-3Pa, sputtering time: 2 minutes, voltage was 175V.
The above is preferred embodiment of the present invention, but the present invention should not be confined to the disclosed content of this embodiment.So everyly do not break away from the equivalence of finishing under the spirit disclosed in this invention or revise, all fall into the scope of protection of the invention.