CN101483418B - Filter wire laying and design method thereof - Google Patents
Filter wire laying and design method thereof Download PDFInfo
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- CN101483418B CN101483418B CN2008100257176A CN200810025717A CN101483418B CN 101483418 B CN101483418 B CN 101483418B CN 2008100257176 A CN2008100257176 A CN 2008100257176A CN 200810025717 A CN200810025717 A CN 200810025717A CN 101483418 B CN101483418 B CN 101483418B
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- electric capacity
- filter
- inductance
- earth terminal
- chip
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Abstract
The present invention discloses a filter wiring, which comprises a substrate plate provided with a first capacitance, electric inductance and a second capacitance, wherein, the first capacitance is provided with a first grounding end, while the electric inductance coupled to one end of the first capacitance; furthermore, the second capacitance is coupled to one end of the electric inductance and is provided with the second grounding end. When design Pi type filter wiring, set an interval between the first grounding end and the second grounding end with a distance of Lambada/n (Lambada as signal wavelength and n as signless integral smaller than 20). Thus, problem of noise coming back because of hypotelorism of Pi type filter grounding end can be avoided, so as to have the Pi type filter work normally.
Description
[technical field]
The invention relates to a kind of wiring and method for designing thereof, and particularly relevant for a kind of filter wire laying and method for designing thereof.
[background technology]
In the middle of the process of circuit transmissioning signal (Signal); usually can be (for example: digital and electronic, wireless radio transmission, motor, switch, relay because of some artificial noise sources ... Deng), the noise source of natural interference (for example: sunspot and lightning), pure matter (for example: the relevant random perturbation that produces from real system; such as thermal noise and protruding ripple noise) or electromagnetic interference (Electromagnetic Interference; be called for short EMI) etc. factor, and cause circuit when operation, to have generation of false action.
Wherein, the source of EMI comprises microprocessor, switching circuit, static discharge, reflector, instantaneous power supply module, power supply and lightning.For instance, in a circuit board based on microprocessor, digital timing circuit is the product survivor of EMI maximum normally, and along with the frequency variation more and more high and the signal edge noise of circuit running is more and more fast, make the interior circuit of circuit board may produce the Harmonic Interference up to 300MHz, wherein these high-frequency noises be should give the worn-out or filtering of screen.
In a good circuit design, if will prevent above-mentioned each noise factor for influence that circuit caused, must be via suitable ground connection, screen is worn-out or add various filters (for example: low pass filter, high pass filter, pi type filter, band pass filter etc.), could reduce the noise jamming in the circuit effectively.In addition, more can when the wiring of planning and designing circuit board, promptly begin to carry out the work of Noise Prevention and Treatment, can guarantee that so circuit keeps normal action when execution work, with construction high-reliability low noise electronic system.
Fig. 1 illustrates the pi type filter circuit diagram of eliminating high-frequency noise into prior art.Please refer to Fig. 1, in pi type filter 100, it utilizes the combination of first electric capacity 101, inductance 103 and second electric capacity 105, comes in order to the high-frequency noise filtering with signal si.Wherein, first end of first electric capacity 101 is in order to received signal si, and second end then couples the first earth terminal gnd1.First end of inductance 103 is coupled to first end of first electric capacity 101, and second end is then exported signal so of filter away high frequency noise.First end of second electric capacity 105 couples second end of inductance 103, and second end then couples the second earth terminal gnd2.
Fig. 2 illustrates the wiring schematic diagram into the prior art pi type filter.Please refer to Fig. 1 and Fig. 2, wiring (Layout) 200 o'clock at the circuit board of design pi type filter 100, first electric capacity 203 on the substrate plate 201 and second electric capacity 207 can be fitted together, will get the high-frequency noise filtering among the signal si and see through first electric capacity 203, inductance 205 and second electric capacity 207.Yet, because the distance D between the second earth terminal gnd2 that the first earth terminal gnd1 that first electric capacity 203 is coupled and second electric capacity 207 are coupled is too near, to cause noise (Noise) easily from the second earth terminal gnd2 via second electric capacity 207 scurry write in reply number online, and then cause the inefficacy of pi type filter 100, and the high-frequency noise of filtered signal si normally.
[summary of the invention]
In view of this, the invention provides a kind of filter wire laying, the spacing distance that is disposed on the substrate plate by the earth terminal with pi type filter two electric capacity elongates, and to solve in the prior art, causes the shortcoming of pi type filter inefficacy easily because noise scurries back holding wire.
Therefore the invention provides a kind of Wiring design method, be disposed at respectively in the different chips, be disposed at again in the filter circuit of filter, can avoid noise to return scurrying and cause pi type filter to lose efficacy by two electric capacity with pi type filter.
Filter wire laying provided by the present invention comprises a substrate plate, and disposes first electric capacity, inductance and second electric capacity on this substrate plate.Wherein, first electric capacity has first earth terminal, inductance is coupled to an end of first electric capacity and second electric capacity is coupled to an end of inductance, and has second earth terminal.In addition, first earth terminal and second earth terminal distance at interval be λ/n, and wherein, λ is a signal wavelength and n is the positive integer less than 20.
In one embodiment of this invention, first end of first electric capacity is in order to received signal, and its second end then couples first earth terminal.First end of inductance is coupled to first end of first electric capacity, and its second end is then in order to export this signal.First end of second electric capacity couples second end of inductance, and its second end then couples second earth terminal.
In one embodiment of this invention, n can be 20, and spacing distance can be 20~30 mils (mil).
From another viewpoint, the invention provides a kind of Wiring design method, it is applicable to a filter.The present invention includes configuration first electric capacity in first chip, first end of this first electric capacity is in order to receive a signal, and second end then couples first earth terminal.The configuration inductance is in second chip, and first end of this inductance is coupled to first end of first electric capacity, and its second end is then exported this signal.In addition, also dispose second electric capacity in second chip, first end of this second electric capacity couples second end of inductance, and its second end then couples second earth terminal.At last, dispose the first above-mentioned chip and second chip respectively in the filter circuit of filter.In one embodiment of this invention, filter can be a pi type filter, and the spacing distance of first chip and second chip can be 20~30 mils (mil).
In one embodiment of this invention, above-mentioned inductance can be a magnetic bead.
In sum, in filter wire laying of the present invention and method for designing thereof, by with the earth terminal of pi type filter first electric capacity and second electric capacity distance more than one λ/n (λ be signal wavelength and n for less than 20 positive integer) at interval, make its pi type filter when execution work, high-frequency noise in the erasure signal normally, and unlikely because noise is scurried back holding wire, and pi type filter was lost efficacy.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment of the present invention cited below particularly, and cooperate appended graphicly, be described in detail below.
[description of drawings]
Fig. 1 illustrates the pi type filter circuit diagram of eliminating high-frequency noise into prior art.
Fig. 2 illustrates the wiring schematic diagram into the prior art pi type filter.
The filter wire laying schematic diagram of Fig. 3 for being illustrated according to a preferred embodiment of the present invention.
The Wiring design method flow chart of Fig. 4 for being illustrated according to a preferred embodiment of the present invention.
[embodiment]
The present invention is in order to solve in the prior art, when designing the circuit board wiring of pi type filter, because the distance of capacitance arrangement on circuit board is too near, and to cause the problem of pi type filter inefficacy.In following embodiment, a kind of filter wire laying has been proposed and a kind of Wiring design method solves above-mentioned problem.The filter wire laying schematic diagram of Fig. 3 for being illustrated according to a preferred embodiment of the present invention.Please merge with reference to Fig. 1 and Fig. 3, in filter wire laying 300, comprise a substrate plate 301, and dispose first electric capacity 303, inductance 305 (for example being a magnetic bead (Bead)) and second electric capacity 307 on this substrate plate 301.Wherein, first electric capacity 303 has the first earth terminal gnd1, and inductance 305 is coupled to an end of first electric capacity 303, and second electric capacity 307 is coupled to an end of inductance 305, and has the second earth terminal gnd2.In addition, the distance of one λ/n at interval then between the first earth terminal gnd1 and the second earth terminal gnd2, wherein λ is the wavelength of signal si and n for less than 20 positive integer.
In the present embodiment, first end of first electric capacity 303 is in order to received signal si, and second end then couples the first earth terminal gnd1.First end of inductance 305 is coupled to first end of first electric capacity 303, and second end is then exported signal so of filter away high frequency noise.First end of second electric capacity 307 couples second end of inductance 305, and second end then couples the second earth terminal gnd2.
Above-mentioned when 100 wirings of design pi type filter, spacing distance between the first earth terminal gnd1 and the second earth terminal gnd2 for example is 20~30 mils (mil), but be familiar with this operator as can be known, the present invention does not limit this distance, the user can be according to the demand of circuit design, with this spacer from being set at more than 20 mils.So, except the high-frequency noise filtering of signal si can also being avoided scurrying back holding wire because of noise, and is made the problem of pi type filter inefficacy.
In order to reach the effect that above-mentioned filter wire laying can provide, below enumerate a kind of Wiring design method again, wherein when the designing filter circuit, by two groups of electric capacity in the pi type filter are separated, and can effectively avoid noise to scurry back holding wire, and make filter execution work normally.
The Wiring design method flow chart of Fig. 4 for being illustrated according to a preferred embodiment of the present invention.At first, in step S401, dispose one first electric capacity in first chip.Wherein, first end of this first electric capacity is connected to a signal end, and in order to receive a signal, its second end then couples first earth terminal, in order to get rid of the high-frequency noise in the received signal.
In addition, in step S403, then dispose an inductance in second chip, first end of this inductance is coupled to first end of above-mentioned first electric capacity, and its second end then is coupled to the output of filter, in order to export the signal of filtering noise.Wherein, this inductance can be a magnetic bead (Bead), does not limit its scope.In addition, in step S405, more dispose one second electric capacity in second chip, first end of this second electric capacity is coupled to second end of above-mentioned inductance, and its second end then couples second earth terminal, in order to get rid of the high-frequency noise in the received signal.
At last, in step S407, then respectively with the first above-mentioned chip and second chip configuration in the filter circuit of filter.Wherein, the distance that one 20~30 mils of can being separated by between this first chip and second chip or 30 mils are above does not limit its scope.According to above-mentioned, because first chip and second chip are disposed respectively, therefore the earth terminal of first electric capacity in the filter with second electric capacity can be separated, and effectively avoid in the prior art earth terminal near excessively, and cause noise to scurry back the problem of holding wire.
In addition, the personnel that are familiar with the common technology in this area as can be known, above-mentioned steps S401~S407 is only as one embodiment of the invention, it is not configuration sequence in order to each assembly in the limiting filtering device, visual its of user needs, and do not breaking away under the spirit of the present invention each assembly of configuration filter.
In sum, the invention provides a kind of filter wire laying and a kind of Wiring design method.And according to the above embodiments, the present invention comprises following advantage at least:
1. save because of hardware and electromagnetic interference, and need be to the modification of wiring route.
2. save the electromagnetic interference debug time.
3. make pi type filter performance function.
Claims (8)
1. a filter wire laying is characterized in that, comprising:
One substrate plate, configuration comprises on this substrate plate:
One first electric capacity has one first end and one second end, and second end of this first electric capacity is coupled to one first earth terminal;
One inductance has one first end and one second end, and first end of this inductance is coupled to first end of this first electric capacity; And
One second electric capacity has one first end and one second end, and first end of this second electric capacity has one second earth terminal, and second end of second electric capacity is coupled to second end of this inductance,
Wherein, this first earth terminal and this second earth terminal a distance at interval be λ/n, and λ is a signal wavelength and n is the positive integer less than 20.
2. filter wire laying as claimed in claim 1 is characterized in that, wherein first end of this first electric capacity is in order to receive this signal.
3. filter wire laying as claimed in claim 1 is characterized in that, this second end is then in order to export this signal.
4. filter wire laying as claimed in claim 1 is characterized in that, wherein this inductance is a magnetic bead.
5. filter wire laying as claimed in claim 1 is characterized in that, wherein this distance is 20~30 mils.
6. a Wiring design method is applicable to a filter, it is characterized in that, this method for designing comprises the following steps:
Dispose one first electric capacity in one first chip, first end of this first electric capacity is in order to receive a signal, and its second end then couples one first earth terminal;
Dispose an inductance in one second chip, first end of this inductance is coupled to first end of this first electric capacity, and its second end is then exported this signal;
Dispose one second electric capacity in this second chip, first end of this second electric capacity couples second end of this inductance, and its second end then couples one second earth terminal;
First chip and second chip are disposed respectively, separate with the earth terminal with first electric capacity in the filter and second electric capacity, the spacing distance of this first chip and second chip is the 20-30 mil.
7. Wiring design method as claimed in claim 6 is characterized in that, wherein this inductance is a magnetic bead.
8. Wiring design method as claimed in claim 6 is characterized in that, wherein this filter is a pi type filter.
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CN2008100257176A CN101483418B (en) | 2008-01-10 | 2008-01-10 | Filter wire laying and design method thereof |
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CN2008100257176A CN101483418B (en) | 2008-01-10 | 2008-01-10 | Filter wire laying and design method thereof |
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CN101483418A CN101483418A (en) | 2009-07-15 |
CN101483418B true CN101483418B (en) | 2011-08-17 |
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CN2008100257176A Expired - Fee Related CN101483418B (en) | 2008-01-10 | 2008-01-10 | Filter wire laying and design method thereof |
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TWI722946B (en) * | 2019-09-11 | 2021-03-21 | 瑞昱半導體股份有限公司 | Semiconductor device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5834994A (en) * | 1997-01-17 | 1998-11-10 | Motorola Inc. | Multilayer lowpass filter with improved ground plane configuration |
US5864092A (en) * | 1996-05-16 | 1999-01-26 | Sawtek Inc. | Leadless ceramic chip carrier crosstalk suppression apparatus |
CN1798473A (en) * | 2004-12-30 | 2006-07-05 | 三星电机株式会社 | High frequency signal transmission line having reduced noise |
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2008
- 2008-01-10 CN CN2008100257176A patent/CN101483418B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5864092A (en) * | 1996-05-16 | 1999-01-26 | Sawtek Inc. | Leadless ceramic chip carrier crosstalk suppression apparatus |
US5834994A (en) * | 1997-01-17 | 1998-11-10 | Motorola Inc. | Multilayer lowpass filter with improved ground plane configuration |
CN1798473A (en) * | 2004-12-30 | 2006-07-05 | 三星电机株式会社 | High frequency signal transmission line having reduced noise |
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