CN101496456A - 卡连接器减震组件 - Google Patents

卡连接器减震组件 Download PDF

Info

Publication number
CN101496456A
CN101496456A CNA2007800277347A CN200780027734A CN101496456A CN 101496456 A CN101496456 A CN 101496456A CN A2007800277347 A CNA2007800277347 A CN A2007800277347A CN 200780027734 A CN200780027734 A CN 200780027734A CN 101496456 A CN101496456 A CN 101496456A
Authority
CN
China
Prior art keywords
circuit board
printed circuit
pcb
electronic cards
cushioning members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2007800277347A
Other languages
English (en)
Other versions
CN101496456B (zh
Inventor
M·S·特雷西
E·W·穆尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of CN101496456A publication Critical patent/CN101496456A/zh
Application granted granted Critical
Publication of CN101496456B publication Critical patent/CN101496456B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/83—Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations

Abstract

一种卡连接器减震组件(12)，包括连接器(32)，其被耦合到印刷电路板(30)并被配置以容纳与其连接的电子卡(34)；和减震构件(40)，其被至少部分地布置在该印刷电路板(30)和该电子卡(34)之间。

Description

卡连接器减震组件
背景技术
[0001]印刷电路板组件常常包括基本电路板(例如母版)，该基本电路板包括固定地与其耦合或者连接(例如，焊接到母版)的各种部件和使用连接器或者插座可拆卸地与其耦合或者连接的其它部件。例如，单列直插式存储器模块(SIMM)、双列直插式存储器模块(DIMM)、外围部件互连总线(PCIe)迷你卡和其它类型的电子卡一般包括连接器边缘，该连接器边缘具有导电导线或接触，该导电导线或接触与导电地耦合到母版的插座或连接器紧密配合和/或以其它方式与该插座或连接器接合。但是震动和/或其他类型的移动引起该边缘连接器接触的磨损，特别是如果包含母版/电子卡的电子装置被布置在移动装置中(例如笔记本计算机或者手持游戏机)，从而导致磨蚀(例如当边缘连接器接触上的保护氧化层磨损时)，这样的磨蚀会使电子卡和连接器/母版之间的电接触的质量退化。
附图说明
[0002]图1是示出一电子装置的示意图，其中根据本发明的卡连接器减震组件的实施例被使用以获得有益效果；
[0003]图2是示出图1所示的卡连接器减震组件的放大视图；
[0004]图3是示出图2的卡连接器减震组件沿图2的线3-3所截取的截面视图；
[0005]图4示出据本发明的卡连接器减震组件的另一个实施例的截面视图。
具体实施方式
[0006]参考图1-4，可以最好地理解本发明的优选实施例及其有益效果，相似的标记代表各附图中的相似的和对应的各个部分。
[0007]图1示出电子装置10，其中卡连接器减震组件12的实施例被使用以获得有益效果。在图1所示的实施例中，电子装置10包括笔记本计算机14。但是，应当理解根据本发明的组件12的实施例可以在各种不同类型的电子装置10中使用以获得有益效果，诸如，但不限于，蜂窝电话、平板计算机、可折叠(convertible)便携式计算机、游戏机、或任何其它类型的便携式或非便携式装置，在这些装置中震动或者其它类型的移动是令人关注的。在图1所示的实施例中，接入面板已经从计算机14的基座构件的底部表面20移除以示出组件12可以被使用的示例性位置。但是，应当理解组件12可以在相对于电子装置10的任何位置使用。
[0008]图2示出图1所示的卡连接器减震组件12的放大视图。在图2所示的实施例中，组件12包括具有与其耦合的插座或者连接器32的印刷电路板30。印刷电路板30可以包括母版或者任何其它类型的布置在装置10内的电子电路板。在图2所示实施例中，组件12还包括电子卡34，该电子卡34可连接到和/或以其它方式可耦合到连接器32以方便电子卡34通信地耦合到印刷电路板30。电子卡34可以包括任何类型的电子卡(例如，另一印刷电路板)，例如，但不限于，单列直插式存储器模块(SIMM)、双列直插式存储器模块(DIMM)，外围组件互连总线(PCIe)迷你卡、视频卡、图形卡、或者
[0009]
[0010]无线通信卡。在图2所示的实施例中，连接器32包括使得电子卡34能被安放和/或定向为平行于印刷电路板30的平面的九十度连接器32(当在此处使用时，平行应意味着平行或者基本平行)，从而在电子装置10内提供有限空间的可用性。
[0011]在图2所示的实施例中，组件12还包括布置在电子卡34和印刷电路板30之间的减震构件40。在图2中，减震构件40被设置在电子卡34和印刷电路板30之间与电子卡34和印刷电路板30平行的方向上，以基本防止或者消除可能因为电子装置10的震动或者移动而造成的有害影响(例如，以减震或者防止震动)。优选地，减震构件40被设计成合适的大小，在由箭头44和46所指示的方向上的长和宽分别与电子卡34的长和宽基本对应。但是，应当理解减震构件40的设计大小可以被另外配置。另外，在图2所示的实施例中，示出的是单个减震构件40被布置在电子卡34和印刷电路板30之间。但是，应当理解减震构件40可以包括布置在电子卡34和印刷电路板30之间的多个分立的和/或分开的单元(在足够的数量方面取决于电子卡34的大小)，这些单元彼此间隔、彼此邻接、或者以其它方式被安置。
[0012]优选地，减震构件40由可压缩材料形成以方便减震构件40随着将电子卡34安装在连接器32中而被略微压紧。例如，在本发明的一些实施例中，减震构件40由基于泡沫的材料成形，例如从E-A-R专业复合材料(即印第安纳波利斯的箭有限公司(Arrow Corporation ofIndianapolis)，印第安纳)得到的件号为CF-47012EG的1/8英寸厚的泡沫板。但是，应当理解其它类型的可压缩材料可以被用来形成减震构件40。
[0013]工作中，印刷电路板30优选地被制造和/或以其它方式被提供与其耦合的连接器32，以容纳与连接器32连接的电子卡34。电子卡34插入和/或以其他方式布置在连接器32内(例如，
[0014]
[0015]以大约三十度的角度插入连接器32)以将电子卡34的端部50与连接器32的部分52接合在一起。电子卡34的端部54接着朝着印刷电路板30向下移动直到电子卡34被布置在与印刷电路板30平行的位置和/或直到电子卡34处于使用连接器夹子60和62将其相对于连接器32固定的位置。随着将电子卡34定位在连接器32中，由电子卡34对减震构件40施加压紧的力，由此导致减震构件40的轻微压紧，这由此显著防止或者消除了电子卡34相对于印刷电路板30的移动。例如，将电子卡34安装在连接器32内显著防止了电子卡34在如图2中所示的参考轴70所指示的X，Y和+Z方向上相对于印刷电路板30的移动。减震构件40显著防止或者消除了电子卡34在参考轴70所指示的-Z方向上相对于印刷电路板70的移动。减震构件40可以在将电子卡34插入连接器32之前定位在印刷电路板30上、在将电子卡34插入连接器32和/或被夹在合适的位置(例如，使用夹子60和62)之后插入在电子卡34和印刷电路板30之间、或者减震构件40被附着到、粘附到印刷电路板30或者电子卡34或者以其他方式构成印刷电路板30或者电子卡34的一部分。
[0016]图3是示出图2所示的组件12沿图2的线3-3所截取的截面视图。如图3中所示，减震构件40至少部分布置在电子卡34和印刷电路板30之间以显著防止或者消除电子卡34在参考轴70所指示的-Z方位上相对于印刷电路板30的移动。因此，本发明的实施例显著防止或者消除了连接器32的接触80和与其接合的对应的和/或相配的电子卡34的边缘连接器迹线82之间的磨损和/或磨蚀。例如，若没有减震构件40，电子装置10的震动和/或移动本来可能造成电子卡34在-Z方向上相对于印刷电路板30的移动，该移动可以造成边缘连接器迹线82和接触80之间的磨损和/或磨蚀，由此不利地影响电子卡34和连接器
[0017]
[0018]32/印刷电路板30之间的电导性。因此，减震构件40显著防止或者消除了电子卡34在-Z方向上相对于印刷电路板30的移动，由此显著防止或者消除了边缘连接器迹线82和接触80之间的磨损和/或磨蚀。
[0019]图4其示出据本发明的组件12的另一个实施例视图。在图4所示的实施例中，减震构件40被配置为具有间隙腔(relief cavity)86和88。在图4中，所示的两个间隙腔86和88形成在减震构件40内。但是，应当理解更多或者更少数量的间隙腔可以被提供在减震构件40中。间隙腔86和88优选地配置为布置和/或以其他方式形成在减震构件40内的腔部分，该腔部分位于对应印刷电路板30的部件(例如印刷电路板30的部件90和92)的所选定的和/或特定的位置以防止压紧的力随着将电子卡34安装在连接器32内而被施加到部件90和92(图3)。在图4中，所示的间隙腔86和88被设置以为印刷电路板30的组件90和92提供位置。但是，应当理解，额外地或者可替换地，间隙腔可以为电子卡34的部件提供。
[0020]应当理解，减震构件40可以以各种方式布置在电子卡34和印刷电路板30之间以将减震构件40固定在电子卡34和印刷电路板30之间的相对固定的位置。例如，优选地，由电子卡34施加到减震构件40的压紧的力足以将减震构件40保持在电子卡34和印刷电路板30之间的固定的位置。但是，在本发明的一些实施例中，通过将减震构件40粘附到电子卡34或者印刷电路板30和/或以其它方式粘附性地将减震构件40固定到电子卡34或者印刷电路板30，减震构件40可以被固定到电子卡34或者印刷电路板30。应当理解，其它的类型的装置或者方法也可以被用来将减震构件40固定在电子卡34和印刷电路板30之间的固定位置。
[0021]因此，本发明的实施例显著减少或者消除了电子卡相对于印刷电路板和/或与其接合的连接器的移动。
[0022]
[0023]因此，本发明的实施例显著减少或者消除了连接器的接触和与其接合的电子卡的边缘连接器导线之间的磨损，由此提供电子卡与连接器和对应的印刷电路板的更可靠的导电耦合。

Claims (10)

1.一种卡连接器减震组件(12)，包括：
连接器(32)，其被耦合到印刷电路板(30)并被配置为容纳与其连接的电子卡(34)；和
减震构件(40)，其被至少部分地布置在该印刷电路板(30)和该电子卡(34)之间。
2.权利要求1所述的组件(12)，其中该减震构件(40)包括可压缩的减震构件(40)。
3.权利要求1所述的组件(12)，其中该减震构件(40)包括基于泡沫的减震构件(40)。
4.权利要求1所述的组件(12)，其中该减震构件(40)包括用于该印刷电路板(30)的部件(90、92)的至少一个间隙腔(86、88)。
5.权利要求1所述的组件(12)，其中该连接器(32)包括九十度连接器(32)。
6.权利要求1所述的组件(12)，其中该减震构件(40)粘附到该印刷电路板(30)。
7.一种用于制造卡连接器减震组件(12)的方法，包括：
提供印刷电路板(30)，该印刷电路板(30)具有与其连接的电子卡(34)；和
将减震构件(40)至少部分地布置在该印刷电路板(30)和该电子卡(34)之间。
8.权利要求7所述的方法，进一步包括将可压缩的减震构件(40)布置在该印刷电路板(30)和该电子卡(34)之间。
9.权利要求7所述的方法，进一步包括将基于泡沫的减震构件(40)布置在该印刷电路板(30)和该电子卡(34)之间。
10.权利要求7所述的方法，进一步包括提供该减震构件(40)，该减震构件(40)具有用于该印刷电路板(30)的至少一个部件(90、92)的至少一个间隙腔(86、88)。
CN2007800277347A 2006-07-21 2007-07-19 卡连接器减震组件及其制造方法 Expired - Fee Related CN101496456B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/490,928 US7566238B2 (en) 2006-07-21 2006-07-21 Card connector dampening assembly
US11/490,928 2006-07-21
PCT/US2007/016413 WO2008011124A2 (en) 2006-07-21 2007-07-19 Card connector dampening assembly

Publications (2)

Publication Number Publication Date
CN101496456A true CN101496456A (zh) 2009-07-29
CN101496456B CN101496456B (zh) 2012-07-04

Family

ID=38792054

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800277347A Expired - Fee Related CN101496456B (zh) 2006-07-21 2007-07-19 卡连接器减震组件及其制造方法

Country Status (5)

Country Link
US (1) US7566238B2 (zh)
EP (1) EP2047722B1 (zh)
KR (1) KR101381521B1 (zh)
CN (1) CN101496456B (zh)
WO (1) WO2008011124A2 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4906312B2 (ja) * 2005-10-24 2012-03-28 モレックス インコーポレイテド カード用コネクタ
JP5209750B2 (ja) * 2011-03-07 2013-06-12 ファナック株式会社 エンコーダ
US10673165B1 (en) * 2019-07-05 2020-06-02 Wbstudio Technology Media Co., Ltd. Power connector for building blocks
CN111642057B (zh) * 2020-04-30 2021-10-01 航天材料及工艺研究所 一种具备阻尼减振功能的电路板锁紧装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5161981A (en) * 1992-03-10 1992-11-10 Amp Incorporated Foldable stacking connector
US5317308A (en) 1992-05-04 1994-05-31 Motorola, Inc. Circuit supporting mechanical shock isolator for radio receiver
EP0603739B1 (de) * 1992-12-23 1995-10-25 Rheinmetall Industrie Aktiengesellschaft Spannungsfeste Elektronik-Baugruppe
US5833471A (en) * 1996-06-11 1998-11-10 Sun Microsystems, Inc. Hold-down collar for attachment of IC substrates and elastomeric material to PCBS
US5757580A (en) * 1996-11-27 1998-05-26 Seagate Technology, Inc. Constrain layer damping of a disc drive printed wiring assembly
US5958556A (en) * 1996-12-19 1999-09-28 Minnesota Mining And Manufacturing Company Vibration damped and stiffened circuit articles
US5914864A (en) 1997-12-22 1999-06-22 Ericsson Inc. Shock and vibration attenuating structure for an electronic assembly
US6735043B2 (en) * 1999-05-07 2004-05-11 Seagate Technology Llc Disc drive protective cover to improve shock robustness
JP2001035613A (ja) * 1999-07-26 2001-02-09 Fci Japan Kk プリント基板用ソケット
JP2002124328A (ja) 2000-10-18 2002-04-26 Tokyo Eletec Kk メモリカード用コネクタ
US6835071B2 (en) * 2001-07-18 2004-12-28 Tyco Electronics Corporation Elastomeric connector interconnecting flexible circuits and circuit board and method of manufacturing the same
US20040084208A1 (en) * 2002-10-30 2004-05-06 Ives Thomas W. Article and method for reducing external excitation of MEMS devices
US7300298B2 (en) 2002-12-27 2007-11-27 Fci Board securing device
US7359210B2 (en) * 2005-03-29 2008-04-15 Intel Corporation Shock absorbing system for circuit boards

Also Published As

Publication number Publication date
US20080020625A1 (en) 2008-01-24
EP2047722B1 (en) 2016-04-06
WO2008011124A2 (en) 2008-01-24
CN101496456B (zh) 2012-07-04
WO2008011124A3 (en) 2008-03-06
KR101381521B1 (ko) 2014-04-04
EP2047722A2 (en) 2009-04-15
US7566238B2 (en) 2009-07-28
KR20090040300A (ko) 2009-04-23

Similar Documents

Publication Publication Date Title
US7220152B2 (en) Contact for a portable electronic device
US7402048B2 (en) Technique for blind-mating daughtercard to mainboard
CN100373702C (zh) 柔性板连接器及电路板和柔性板之间的连接结构
CN201060951Y (zh) 天线与pcb板间的接触连接结构及采用该结构的设备
TW200731882A (en) Display module and electronic device using the same
US20120026710A1 (en) Riser card for power supply
US20130335276A1 (en) Electronic communication device with antenna structure
CN101496456B (zh) 卡连接器减震组件及其制造方法
CN206271858U (zh) 终端设备
US20090111295A1 (en) Computer system with riser card
US20090137136A1 (en) Housing, Terminal and Connector Using Housing and Terminal
KR101770823B1 (ko) 휴대 단말기용 대용량 메모리 모듈 실장 장치
EP1536672A4 (en) PRINTED CIRCUIT BOARD DEVICES AND CONNECTION METHOD BETWEEN CARDS
PL1728414T3 (pl) Układ z silnikiem elektrycznym i główną płytką drukowaną oraz sposób montażu
US7559777B2 (en) Electrical connector for connecting electrically an antenna module to a grounding plate
US20070009788A1 (en) Battery interface for mobile device
MXPA06000751A (es) Modulo de conexion conductor para tableros de circuito impreso.
CN107086383A (zh) 连接器组件、电源组件和终端设备
CN105655507A (zh) 电子设备及其电池连接装置
US8625291B2 (en) Electronic device for miniaturizing size thereof
CN102740186A (zh) 音频界面结构与使用该结构的电子装置
CN201022099Y (zh) 天线与pcb板间的接触连接结构及采用该结构的设备
CN113727566B (zh) 电路板组件及电子设备
CN215344952U (zh) 一种手机光感防摔结构
CN218514592U (zh) 电路组件及电子设备

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120704

Termination date: 20190719