CN101587883B - Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof - Google Patents
Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof Download PDFInfo
- Publication number
- CN101587883B CN101587883B CN2008101091445A CN200810109144A CN101587883B CN 101587883 B CN101587883 B CN 101587883B CN 2008101091445 A CN2008101091445 A CN 2008101091445A CN 200810109144 A CN200810109144 A CN 200810109144A CN 101587883 B CN101587883 B CN 101587883B
- Authority
- CN
- China
- Prior art keywords
- lampshade
- substrate
- conductive traces
- led encapsulation
- encapsulation construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 101
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 59
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229920001342 Bakelite® Polymers 0.000 claims abstract description 17
- 239000004637 bakelite Substances 0.000 claims abstract description 17
- 238000010276 construction Methods 0.000 claims description 88
- 238000005538 encapsulation Methods 0.000 claims description 88
- 230000000994 depressogenic effect Effects 0.000 claims description 43
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 238000004020 luminiscence type Methods 0.000 claims description 5
- 230000000191 radiation effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 1
Images
Abstract
The invention provides a chip packaging structure of a light emitting diode using a substrate as a lamp cover and a manufacturing method thereof. The chip packaging structure of the light emitting diode comprises a substrate unit and a light emitting unit, wherein the substrate unit is provided with a substrate body in a shape of lamp cover; and the light emitting unit is provided with a pluralityof light emitting elements electrically arranged on the inner surface of the substrate body. Thus, the part of the light beams generated by the light emitting elements is reflected outside by the inn er surface of the substrate body in the lamp cover shape. The method avoids manufacturing the prior lamp cover and improves the radiation effect of the light emitting elements by using the high heat conductivity of the substrate body (consisting of a metal layer and a bakelite layer).
Description
Technical field
The present invention relates to a kind of LED encapsulation construction and preparation method thereof, relating in particular to a kind of is the LED encapsulation construction and preparation method thereof of lampshade with the substrate.
Background technology
See also shown in Figure 1ly, this figure is arranged at schematic side view in the lampshade for the prior art package structure for LED.By among the figure as can be known, the package structure for LED of prior art includes: substrate body S and at least one are arranged at the light-emitting component L on this substrate body S electrically, and wherein this substrate body S has heat-conducting layer (heat conducting layer) S1, is formed on insulating barrier (insulative layer) S2 of the upper surface of this heat-conducting layer S1 and is formed on conductive layer (conductive layer) S3 of the upper surface of this insulating barrier S2.Therefore, this light-emitting component L by this conductive layer S3 conducting electricity in power supply (figure do not show), and this light-emitting component L in regular turn by this insulating barrier S2 and this heat-conducting layer S1 to dispel the heat.
Can reach the effect of optically focused for the segment beam B that can make this light-emitting component L be produced, the package structure for LED of prior art is arranged in the lampshade U that is the lampshade shape by adhesion coating A, so the segment beam B that this light-emitting component L is produced can be by the inner surface U10 of this lampshade U, to produce spotlight effect.
Yet, prior art is arranged at package structure for LED the mode of this lampshade U, not only manufacturing process is more complicated, and because after the heat that produced of this light-emitting component L must pass through this substrate body S (passing through this insulating barrier S2 and this heat-conducting layer S1 in regular turn) and this adhesion coating A, could arrive this lampshade U, therefore greatly reduce radiating rate and the efficient of this light-emitting component L.
So as from the foregoing, the package structure for LED of prior art obviously exists inconvenience and defective at present, therefore remains to be improved.
Summary of the invention
Therefore, the inventor thinks that above-mentioned defective improves, and according to the correlation experience of being engaged in for many years in this respect, observes and research through careful, and cooperate the scientific and technological principle of utilization, and proposes reasonable in design and effectively improve the present invention of above-mentioned defective.
Technical problem to be solved by this invention, being to provide a kind of is the LED encapsulation construction and preparation method thereof of lampshade with the substrate.The present invention directly bends the lampshade body of LED encapsulation construction, with the lampshade of the light-emitting component that becomes LED encapsulation construction.Therefore, the present invention not only can save the making of traditional lampshade, and (being made up of metal level and bakelite layer (Bakelite layer)) itself the high-termal conductivity of also can passing through the lampshade body, increases the radiating effect of this light-emitting component.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, providing a kind of is the LED encapsulation construction of lampshade with the substrate, and it comprises: lampshade unit and luminescence unit.Wherein, this lampshade unit has the lampshade body that is the lampshade shape, and the described inner surface that is the lampshade body of lampshade shape has positive conductive traces and negative pole conductive traces.That this luminescence unit has a plurality of inner surfaces that are arranged at this lampshade body and be electrically connected at light-emitting component between this positive conductive traces and this negative pole conductive traces respectively, and each light-emitting component is a light-emitting diode chip for backlight unit.Whereby, the segment beam that above-mentioned a plurality of light-emitting diode chip for backlight unit produced reflects away by the inner surface that this is the lampshade body of lampshade shape.
Above-mentioned is in the LED encapsulation construction of lampshade with the substrate, and this lampshade body can be printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base, and this lampshade is shaped as the U font.
Above-mentioned is in the LED encapsulation construction of lampshade with the substrate, this lampshade body can have planar portions and two respectively from the upwardly extending extension in the two ends of this planar portions, and this lampshade body comprises metal level and is formed on bakelite layer on this metal level.
Above-mentioned is in the LED encapsulation construction of lampshade with the substrate, and this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions.
Above-mentioned is in the LED encapsulation construction of lampshade with the substrate, and this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions and the inner surface of above-mentioned two extensions.
Above-mentioned is in the LED encapsulation construction of lampshade with the substrate, and this lampshade body can have two depressed parts, and each depressed part is formed between this planar portions and each extension.
Above-mentioned is that each depressed part can be continuous recess in the LED encapsulation construction of lampshade with the substrate.
Above-mentioned is in the LED encapsulation construction of lampshade with the substrate, and each depressed part can be made up of a plurality of grooves that are separated from each other.
Above-mentioned is in the LED encapsulation construction of lampshade with the substrate, and this positive conductive traces and this negative pole conductive traces are aluminum steel road or silver-colored circuit.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, providing a kind of is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it comprises: at first, provide the lampshade that is flat shape body, and the described inner surface that is the lampshade body of flat shape have positive conductive traces and negative pole conductive traces; Then, a plurality of light-emitting components are arranged on the inner surface of this lampshade body and are electrically connected at respectively between this positive conductive traces and this negative pole conductive traces, wherein each light-emitting component is a light-emitting diode chip for backlight unit; Then, bend this lampshade body, so that the profile of this lampshade body is bent into the lampshade shape from flat shape, the segment beam that therefore above-mentioned a plurality of light-emitting diode chip for backlight unit produced reflects away by the inner surface that this is the lampshade body of lampshade shape.
Above-mentioned is that this lampshade body can be printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base, and this lampshade is shaped as the U font in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is in the manufacture method of LED encapsulation construction of lampshade with the substrate, this lampshade body that is the lampshade shape can have planar portions and two respectively from the upwardly extending extension in the two ends of this planar portions, and this lampshade body comprises metal level and is formed on bakelite layer on this metal level.
Above-mentioned is that this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is in the manufacture method of LED encapsulation construction of lampshade with the substrate, and this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions and the inner surface of above-mentioned two extensions.
Above-mentioned is that this lampshade body can have two depressed parts, and each depressed part is formed between this planar portions and each extension in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is that the manufacture method of the LED encapsulation construction of lampshade can further comprise with the substrate: prolonging above-mentioned two depressed parts to bend this lampshade body.
Above-mentioned is that each depressed part can be continuous recess in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is that each depressed part can be made up of a plurality of grooves that are separated from each other in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is that this positive conductive traces and this negative pole conductive traces are aluminum steel road or silver-colored circuit in the manufacture method of LED encapsulation construction of lampshade with the substrate.
In order to solve the problems of the technologies described above, according to wherein a kind of scheme of the present invention, providing a kind of is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it comprises: at first, provide the lampshade that is flat shape body, and the described inner surface that is the lampshade body of flat shape have positive conductive traces and negative pole conductive traces; Then, bend this lampshade body, so that the shape of this lampshade body is bent into the lampshade shape from this flat shape; Then, a plurality of light-emitting components are arranged on the inner surface of this lampshade body and are electrically connected at respectively between this positive conductive traces and this negative pole conductive traces, wherein each light-emitting component is a light-emitting diode chip for backlight unit, and the segment beam that therefore above-mentioned a plurality of light-emitting diode chip for backlight unit produced reflects away by the inner surface that this is the lampshade body of lampshade shape.
Above-mentioned is that this lampshade body can be printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base, and this lampshade is shaped as the U font in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is in the manufacture method of LED encapsulation construction of lampshade with the substrate, this lampshade body that is the lampshade shape can have planar portions and two respectively from the upwardly extending extension in the two ends of this planar portions, and this lampshade body comprises metal level and is formed on bakelite layer on this metal level.
Above-mentioned is that this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is in the manufacture method of LED encapsulation construction of lampshade with the substrate, and this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions and the inner surface of above-mentioned two extensions.
Above-mentioned is that this lampshade body can have two depressed parts, and each depressed part is formed between this planar portions and each extension in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is that the manufacture method of the LED encapsulation construction of lampshade can further comprise with the substrate: prolonging above-mentioned two depressed parts to bend this lampshade body.
Above-mentioned is that each depressed part can be continuous recess in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is that each depressed part can be made up of a plurality of grooves that are separated from each other in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Above-mentioned is that this positive conductive traces and this negative pole conductive traces are aluminum steel road or silver-colored circuit in the manufacture method of LED encapsulation construction of lampshade with the substrate.
Therefore, the present invention is by directly bending the lampshade body of LED encapsulation construction, with the lampshade of the light-emitting component that becomes LED encapsulation construction.So the present invention not only can save the making of traditional lampshade, and also can pass through the high-termal conductivity of lampshade body (forming) itself, increase the radiating effect of this light-emitting component by metal level and bakelite layer.
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, when obtaining thus deeply and concrete understanding, yet accompanying drawing is only for reference and explanation, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 is arranged at the interior schematic side view of lampshade for the prior art package structure for LED;
Fig. 2 is the flow chart of first embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention;
Fig. 2 A to Fig. 2 C2 is the making schematic flow sheet of first embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention;
Fig. 3 is the flow chart of second embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention;
Fig. 3 A to Fig. 3 C2 is the making schematic flow sheet of second embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention;
Fig. 4 is the flow chart of the 3rd embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention;
Fig. 4 A to Fig. 4 C2 is the making schematic flow sheet of the 3rd embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention;
Fig. 5 is the schematic perspective view of the 4th embodiment of the LED encapsulation construction of lampshade with the substrate for the present invention; And
Fig. 6 is the schematic perspective view of the 5th embodiment of the LED encapsulation construction of lampshade with the substrate for the present invention.
Wherein, description of reference numerals is as follows:
[prior art]
S lampshade body S1 heat-conducting layer
The S2 insulating barrier
The S3 conductive layer
L light-emitting component B segment beam
The A adhesion coating
U lampshade U10 inner surface
[the present invention]
(first embodiment)
The 10a positive conductive traces
11a negative pole conductive traces
The 12a metal level
13a bakelite layer
2a light-emitting component 20a positive terminal
The 21a negative pole end
The La segment beam
1a ' lampshade body 10a ' planar portions
11a ' extension
(second embodiment)
The 10b positive conductive traces
11b negative pole conductive traces
The 12b metal level
13b bakelite layer
2b light-emitting component 20b positive terminal
The 21b negative pole end
The Lb segment beam
1b ' lampshade body 10b ' planar portions
11b ' extension
(the 3rd embodiment)
1c lampshade body 100c inner surface
The 10c positive conductive traces
11c negative pole conductive traces
The 12c metal level
13c bakelite layer
14c, 14c ' depressed part
2c light-emitting component 20c positive terminal
The 21c negative pole end
The Lc segment beam
1c ' lampshade body 10c ' planar portions
11c ' extension
(the 4th embodiment)
1d ' lampshade body
14d ' depressed part 140d ' groove
(the 5th embodiment)
The 10e positive conductive traces
11e negative pole conductive traces
10e ' planar portions
11e ' extension
Embodiment
See also Fig. 2, and Fig. 2 A to Fig. 2 C2 shown in, Fig. 2 is the flow chart of first embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention; Fig. 2 A to Fig. 2 C2 is the making schematic flow sheet of first embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention.
By above-mentioned accompanying drawing as can be known, it is the manufacture method of the LED encapsulation construction of lampshade with the substrate that first embodiment of the invention provides a kind of, and it comprises: at first, please cooperate shown in Fig. 2 and Fig. 2 A, the lampshade body 1a (S100) that is flat shape is provided.Wherein, this lampshade body 1a has positive conductive traces 10a and the negative pole conductive traces 11a of the inner surface 100a that is formed on this lampshade body 1a, and this lampshade body 1a comprises metal level 12a and is formed on bakelite layer 13a on this metal level 12a.According to actual needs, this positive conductive traces 10a and this negative pole conductive traces 11a all can be aluminum steel road or silver-colored circuit.In addition, this lampshade body 1a can be printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base.
Next, please cooperate shown in Fig. 2 and Fig. 2 B, by the mode of surface adhering technology (Surface MountedTechnology), the inner surface 100a that a plurality of light-emitting component 2a is arranged at electrically this lampshade body 1a goes up (S102).Wherein, each light-emitting component 2a has the positive conductive traces 10a that is electrically connected at this lampshade body 1a respectively and positive terminal 20a and the negative pole end 21a of negative pole conductive traces 11a.
And then, please cooperate shown in Fig. 2, Fig. 2 C1 and Fig. 2 C2, bend this lampshade body 1a, so that the shape of this lampshade body 1a is bent into lampshade shape (S104) from this flat shape.In other words, this lampshade body 1a that is flat shape is bent into the lampshade body 1a ' that is the lampshade shape, so the segment beam La that above-mentioned a plurality of light-emitting component 2a are produced reflects away by the inner surface 100a that this is the lampshade body 1a ' of lampshade shape.Wherein, this lampshade is shaped as the U font, and this lampshade body 1a ' that is the lampshade shape has planar portions 10a ' and two respectively from the upwardly extending extension 11a ' in the two ends of this planar portions 10a '.In addition, this positive conductive traces 10a and this negative pole conductive traces 11a all are formed on the inner surface of this planar portions 10a '.
See also Fig. 3, and Fig. 3 A to Fig. 3 C2 shown in, Fig. 3 is the flow chart of second embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention; Fig. 3 A to Fig. 3 C2 is the making schematic flow sheet of second embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention.
By above-mentioned accompanying drawing as can be known, it is the manufacture method of the LED encapsulation construction of lampshade with the substrate that second embodiment of the invention provides a kind of, and it comprises: at first, please cooperate shown in Fig. 3 and Fig. 3 A, the lampshade body 1b (S200) that is flat shape is provided.Wherein, this lampshade body 1b has positive conductive traces 10b and the negative pole conductive traces 11b of the inner surface 100b that is formed on this lampshade body 1b, and this lampshade body 1b comprises metal level 12b and is formed on bakelite layer 13b on this metal level 12b.According to actual needs, this positive conductive traces 10b and this negative pole conductive traces 11b all can be aluminum steel road or silver-colored circuit.In addition, this lampshade body 1b can be printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base.
Next, please cooperate shown in Fig. 3 and Fig. 3 B, bend this lampshade body 1b, so that the shape of this lampshade body 1b is bent into lampshade shape (S202) from this flat shape.In other words, this lampshade body 1b that is flat shape is bent into the lampshade body 1b ' that is the lampshade shape.Wherein, this lampshade is shaped as the U font, and this lampshade body 1b ' that is the lampshade shape has planar portions 10b ' and two respectively from the upwardly extending extension 11b ' in the two ends of this planar portions 10b '.In addition, this positive conductive traces 10b and this negative pole conductive traces 11b all are formed on the inner surface of this planar portions 10b '.
And then, please cooperate shown in Fig. 3, Fig. 3 C1 and Fig. 3 C2, mode by the surface adhering technology, the inner surface 100b that a plurality of light-emitting component 2b is arranged at electrically this lampshade body 1b goes up (S204), so the segment beam Lb that above-mentioned a plurality of light-emitting component 2b are produced reflects away by the inner surface 100b that this is the lampshade body 1b ' of lampshade shape.Wherein, each light-emitting component 2b has the positive conductive traces 10b that is electrically connected at this lampshade body 1b ' respectively and positive terminal 20b and the negative pole end 21b of negative pole conductive traces 11b.
Therefore, by above-mentioned step as can be known, second embodiment of the invention is with first the different of embodiment maximum: in first embodiment, be earlier above-mentioned a plurality of light-emitting component 2a to be arranged on this lampshade body 1a that is flat shape electrically, and then this lampshade body 1a that is flat shape is bent into the lampshade body 1a ' that is the lampshade shape; And in a second embodiment, be that the lampshade body 1b that earlier this is flat shape is bent into the lampshade body 1b ' that is the lampshade shape, and then above-mentioned a plurality of light-emitting component 2b are arranged on this lampshade body 1b ' that is the lampshade shape electrically.
So " is the LED encapsulation construction of lampshade with the substrate " that the first embodiment of the invention and second embodiment are provided comprising: lampshade unit and luminescence unit.Wherein, this lampshade unit has the lampshade body that is the lampshade shape (1a ', 1b ').This luminescence unit has a plurality of light-emitting components (2a, 2b) that are arranged at the inner surface (100a, 100b) of this lampshade body (1a ', 1b ') electrically.Whereby, the segment beam that produced of above-mentioned a plurality of light-emitting component (2a, 2b) reflects away by the inner surface (100a, 100b) that this is the lampshade body (1a ', 1b ') of lampshade shape.
See also Fig. 4, and Fig. 4 A to Fig. 4 C2 shown in, Fig. 4 is the flow chart of the 3rd embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention; Fig. 4 A to Fig. 4 C2 is the making schematic flow sheet of the 3rd embodiment of manufacture method of the LED encapsulation construction of lampshade with the substrate for the present invention.
By above-mentioned accompanying drawing as can be known, it is the manufacture method of the LED encapsulation construction of lampshade with the substrate that third embodiment of the invention provides a kind of, it comprises: at first, please cooperate shown in Fig. 3 and Fig. 3 A, provide the lampshade body that is flat shape 1c, and this lampshade body 1c have two depressed part 14c (S300).Wherein, this lampshade body 1c has positive conductive traces 10c and the negative pole conductive traces 11c of the inner surface 100c that is formed on this lampshade body 1c, and this lampshade body 1c comprises metal level 12c and is formed on bakelite layer 13c on this metal level 12c.In addition, each depressed part 14c is a continuous recess.
Next, please cooperate shown in Fig. 4 and Fig. 4 B, prolong above-mentioned two depressed part 14c and bending this lampshade body 1c, so that the shape of this lampshade body 1c is bent into lampshade shape (S302) from this flat shape.In other words, this lampshade body 1c that is flat shape is bent into the lampshade body 1c ' that is the lampshade shape, and above-mentioned two depressed part 14c are bent into the depressed part 14c ' after the bending.Wherein, this lampshade is shaped as the U font, and this lampshade body 1c ' that is the lampshade shape has planar portions 10c ' and reaches two respectively from the upwardly extending extension 11c ' in the two ends of this planar portions 10c ', so the depressed part 14c ' after each bending is formed between this planar portions 10c ' and each the extension 11c '.In addition, this positive conductive traces 10c and this negative pole conductive traces 11c all are formed on the inner surface of this planar portions 10c '.
And then, please cooperate shown in Fig. 4, Fig. 4 C1 and Fig. 4 C2, mode by the surface adhering technology, the inner surface 100c that a plurality of light-emitting component 2c is arranged at electrically this lampshade body 1c ' goes up (S304), so the segment beam Lc that above-mentioned a plurality of light-emitting component 2c are produced reflects away by the inner surface 100c that this is the lampshade body 1c ' of lampshade shape.Wherein, each light-emitting component 2c has the positive conductive traces 10c that is electrically connected at this lampshade body 1c ' respectively and positive terminal 20c and the negative pole end 21c of negative pole conductive traces 11c.
Therefore, by above-mentioned step as can be known, third embodiment of the invention is with second the different of embodiment maximum: in a second embodiment, be earlier two depressed part 14c to be formed on this lampshade body 1c, so that in above-mentioned steps S302, can carry out the step of " prolonging above-mentioned two depressed part 14c " to bend this lampshade body 1c.Therefore, by the setting of above-mentioned two depressed part 14c, just increased and formed easness and the convenience that this is the lampshade body 1c ' of lampshade shape.
Please refer to shown in Figure 5ly, it is the schematic perspective view of the 4th embodiment of the LED encapsulation construction of lampshade with the substrate for the present invention.By among the figure as can be known, fourth embodiment of the invention is with second the different of embodiment maximum: each the bending after depressed part 14d ' form by a plurality of groove 140d ' that are separated from each other.Its advantage also is: earlier the depressed part before two bendings (figure does not show) is formed on this lampshade body 1d ' that is the lampshade shape, to carry out the step of " prolonging above-mentioned two depressed parts (figure does not show) to bend this lampshade body (figure does not show) ".Therefore, by the setting of (figure does not show) of above-mentioned two depressed parts, increased and formed easness and the convenience that this is the lampshade body 1d ' of lampshade shape.
Please refer to shown in Figure 6ly, it is the schematic perspective view of the 5th embodiment of the LED encapsulation construction of lampshade with the substrate for the present invention.By among the figure as can be known, fifth embodiment of the invention is with second the different of embodiment maximum: positive conductive traces 10e and negative pole conductive traces 11e all are formed on the inner surface of planar portions 10e ' and the inner surface of two extension 11e '.
In sum, the present invention directly bends the lampshade body of LED encapsulation construction, with the lampshade of the light-emitting component that becomes LED encapsulation construction.Therefore, the present invention not only can save the making of traditional lampshade, and also can pass through the high-termal conductivity of lampshade body (being made up of metal level and bakelite layer) itself, increases the radiating effect of this light-emitting component.
Yet note, the above only is the detailed description and the accompanying drawing of the specific embodiment of one of the best of the present invention, but feature of the present invention is not limited thereto, therefore above explanation and accompanying drawing are not in order to restriction the present invention, scope of the present invention should be as the criterion with the claim scope, all embodiment that meets the spirit variation similar of claim scope of the present invention with it, all should be contained in the category of the present invention, any those skilled in the art in the field of the invention, can think easily and variation or revise all can be encompassed in following the application's the claim.
Claims (29)
1. one kind is the LED encapsulation construction of lampshade with the substrate, it is characterized in that, comprising:
The lampshade unit, it has the lampshade body that is the lampshade shape, and the inner surface of this lampshade body has positive conductive traces and negative pole conductive traces; And
Luminescence unit, its have a plurality of be arranged at the inner surface of this lampshade body and be electrically connected at this positive conductive traces respectively and this negative pole conductive traces between light-emitting component, and each light-emitting component is a light-emitting diode chip for backlight unit;
Whereby, the segment beam that described a plurality of light-emitting diode chip for backlight unit produced reflects away by the inner surface that this is the lampshade body of lampshade shape.
2. as claimed in claim 1 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body is printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base, and this lampshade is shaped as the U font.
3. as claimed in claim 1 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body has planar portions and two respectively from the upwardly extending extension in the two ends of this planar portions, and this lampshade body comprises metal level and is formed on bakelite layer on this metal level.
4. as claimed in claim 3 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions.
5. as claimed in claim 3 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions and the inner surface of above-mentioned two extensions.
6. as claimed in claim 3 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body has two depressed parts, and each depressed part is formed between this planar portions and each extension.
7. as claimed in claim 6 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is a continuous recess.
8. as claimed in claim 6 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is made up of a plurality of grooves that are separated from each other.
9. as claimed in claim 1 is the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces are aluminum steel road or silver-colored circuit.
10. one kind is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that, may further comprise the steps:
Provide the lampshade that is flat shape body, and the described inner surface that is the lampshade body of flat shape have positive conductive traces and negative pole conductive traces;
A plurality of light-emitting components are arranged on the inner surface of this lampshade body and are electrically connected at respectively between this positive conductive traces and this negative pole conductive traces, wherein each light-emitting component is a light-emitting diode chip for backlight unit; And
Bend this lampshade body, so that the profile of this lampshade body is bent into the lampshade shape from flat shape, the segment beam that therefore described a plurality of light-emitting diode chip for backlight unit produced reflects away by the inner surface that this is the lampshade body of lampshade shape.
11. as claimed in claim 10 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body is printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base, and this lampshade is shaped as the U font.
12. as claimed in claim 10 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body that is the lampshade shape has planar portions and two respectively from the upwardly extending extension in the two ends of this planar portions, and this lampshade body comprises metal level and is formed on bakelite layer on this metal level.
13. as claimed in claim 12 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions.
14. as claimed in claim 12 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions and the inner surface of above-mentioned two extensions.
15. as claimed in claim 12 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body has two depressed parts, and each depressed part is formed between this planar portions and each extension.
16. as claimed in claim 15 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that, further comprises: prolonging above-mentioned two depressed parts to bend this lampshade body.
17. as claimed in claim 15 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is a continuous recess.
18. as claimed in claim 15 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is made up of a plurality of grooves that are separated from each other.
19. as claimed in claim 12 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces are aluminum steel road or silver-colored circuit.
20. one kind is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that, may further comprise the steps:
Provide the lampshade that is flat shape body, and the described inner surface that is the lampshade body of flat shape have positive conductive traces and negative pole conductive traces;
Bend this lampshade body, so that the shape of this lampshade body is bent into the lampshade shape from this flat shape; And
A plurality of light-emitting components are arranged on the inner surface of this lampshade body and are electrically connected at respectively between this positive conductive traces and this negative pole conductive traces, wherein each light-emitting component is a light-emitting diode chip for backlight unit, and the segment beam that therefore described a plurality of light-emitting diode chip for backlight unit produced reflects away by the inner surface that this is the lampshade body of lampshade shape.
21. as claimed in claim 20 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body is printed circuit board (PCB), soft base plate, aluminium base, ceramic substrate or copper base, and this lampshade is shaped as the U font.
22. as claimed in claim 20 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body that is the lampshade shape has planar portions and two respectively from the upwardly extending extension in the two ends of this planar portions, and this lampshade body comprises metal level and is formed on bakelite layer on this metal level.
23. as claimed in claim 22 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions.
24. as claimed in claim 22 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces all are formed on the inner surface of this planar portions and the inner surface of above-mentioned two extensions.
25. as claimed in claim 22 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this lampshade body has two depressed parts, and each depressed part is formed between this planar portions and each extension.
26. as claimed in claim 25 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that, further comprises: prolonging above-mentioned two depressed parts to bend this lampshade body.
27. as claimed in claim 25 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is a continuous recess.
28. as claimed in claim 25 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: each depressed part is made up of a plurality of grooves that are separated from each other.
29. as claimed in claim 20 is the manufacture method of the LED encapsulation construction of lampshade with the substrate, it is characterized in that: this positive conductive traces and this negative pole conductive traces are aluminum steel road or silver-colored circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101091445A CN101587883B (en) | 2008-05-23 | 2008-05-23 | Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101091445A CN101587883B (en) | 2008-05-23 | 2008-05-23 | Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101587883A CN101587883A (en) | 2009-11-25 |
| CN101587883B true CN101587883B (en) | 2011-09-28 |
Family
ID=41372036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101091445A Expired - Fee Related CN101587883B (en) | 2008-05-23 | 2008-05-23 | Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101587883B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103032847B (en) * | 2012-12-13 | 2014-09-10 | 林培林 | LED (light emitting diode) illumination device with non-isolated type power supply and LED lamp |
| CN103148442A (en) * | 2013-03-07 | 2013-06-12 | 上海尚宜灯饰有限公司 | Edgefold structure for star-like lamp |
| US11125399B1 (en) | 2020-06-01 | 2021-09-21 | Apogee Lighting Holdings, Llc | Connection for scalable LED luminaire tape |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6592238B2 (en) * | 2001-01-31 | 2003-07-15 | Light Technologies, Inc. | Illumination device for simulation of neon lighting |
| CN1624915A (en) * | 2003-12-03 | 2005-06-08 | 政齐科技股份有限公司 | LED luminous module |
| US7008097B1 (en) * | 2003-02-25 | 2006-03-07 | Ilight Technologies, Inc. | Illumination device for simulating neon or fluorescent lighting including a waveguide and a scattering cap |
| CN101075609A (en) * | 2006-05-15 | 2007-11-21 | 宏齐科技股份有限公司 | Structure and method for packing LED chip |
-
2008
- 2008-05-23 CN CN2008101091445A patent/CN101587883B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6592238B2 (en) * | 2001-01-31 | 2003-07-15 | Light Technologies, Inc. | Illumination device for simulation of neon lighting |
| US7008097B1 (en) * | 2003-02-25 | 2006-03-07 | Ilight Technologies, Inc. | Illumination device for simulating neon or fluorescent lighting including a waveguide and a scattering cap |
| CN1624915A (en) * | 2003-12-03 | 2005-06-08 | 政齐科技股份有限公司 | LED luminous module |
| CN101075609A (en) * | 2006-05-15 | 2007-11-21 | 宏齐科技股份有限公司 | Structure and method for packing LED chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101587883A (en) | 2009-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203932097U (en) | Light-emitting device, illumination light source and lighting device | |
| CN101886759B (en) | Light emitting device using alternating current and manufacturing method thereof | |
| CN102176504B (en) | Light emitting device package and method of manufacturing same | |
| US20100096642A1 (en) | Packaging struture for high power light emitting diode(led) chip | |
| CN202084524U (en) | Packaging plate | |
| CN102185091A (en) | Light-emitting diode device and manufacturing method thereof | |
| CN102709439A (en) | LED (Light emitting diode) ceramic support and manufacturing method thereof | |
| CN101587883B (en) | Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof | |
| CN202195315U (en) | LED (light-emitting diode) surface light source device | |
| CN204922861U (en) | Illumination is with light source and lighting device | |
| CN102683546B (en) | Semiconductor package structure and manufacturing method thereof | |
| CN101159300B (en) | Copper base high power LED packaging | |
| KR101066471B1 (en) | Variable led package and led lamp using its | |
| CN101982883A (en) | Luminescent device formed by inverted luminous cell array and manufacture method thereof | |
| CN101562139B (en) | Luminescence chip encapsulating structure for avoiding reducing luminous efficiency and manufacture method thereof | |
| CN103579450A (en) | Light-emitting diode lamp bar | |
| CN201238052Y (en) | LED chip packaging structure with substrate as lampshade | |
| CN202205814U (en) | Light emitting diode device | |
| CN201680214U (en) | Light-emitting device using alternating current | |
| CN201611667U (en) | LED lighting unit | |
| CN102214782A (en) | LED (light-emitting diode) metallic support and manufacturing method thereof as well as LED and LED lamp | |
| CN203757407U (en) | LED (Light-Emitting Diode) light-emitting module for LED bulb lamp | |
| CN203757406U (en) | LED (Light Emitting Diode) bulb lamp convenient for assembly | |
| CN202094119U (en) | Packaging structure for LED light-source module with convex cup structures | |
| CN201804867U (en) | Light-emitting device consisting of inverted light-emitting unit array |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110928 Termination date: 20120523 |