CN101634662A - Micro-accelerometer and preparation method thereof - Google Patents
Micro-accelerometer and preparation method thereof Download PDFInfo
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- CN101634662A CN101634662A CN200910090736A CN200910090736A CN101634662A CN 101634662 A CN101634662 A CN 101634662A CN 200910090736 A CN200910090736 A CN 200910090736A CN 200910090736 A CN200910090736 A CN 200910090736A CN 101634662 A CN101634662 A CN 101634662A
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Abstract
The invention discloses a micro-accelerometer and a preparation method thereof, belonging to the technical field of processing micro inertia devices. The micro-accelerometer is arranged on a package substrate which is formed by stacking an upper surface plate, a lower surface plate and a plurality of middle substrates, wherein a signal detection circuit of the micro-accelerometer is attached on the upper surface plate; a sensitive element of the micro-accelerometer is embedded in the middle substrates, i.e. the middle substrates with cavities form a frame of the sensitive element; a flexible hanger and a sensitive mass block of the sensitive element are arranged in the cavities, and one end of the flexible hanger is connected with the sensitive element, while the other end is fixed on the frame; metal electrodes are respectively sputtered on the sensitive mass block and the surface of the frame corresponding to the sensitive mass block so as to form a flat plate sensitive capacitor, or a metal piezoresistive thick-film pattern is deposited at a connecting part of the flexible hanger and the inner side surface of the frame so as to form a metal piezoresistive strain gauge. The micro-accelerometer has high sensitivity and high-temperature resistance and can be fused into a whole with a system level package substrate, thus the micro-accelerometer has low processing difficulty and cost.
Description
Technical field
The invention relates to the process technology of little inertia device, be specifically related to a kind of micro-acceleration gauge and preparation method thereof.
Background technology
Little inertia device mainly comprises micro-acceleration gauge and little gyro, owing to have outstanding advantages such as volume is little, in light weight, measuring accuracy is higher, single-piece is cheap, the manufacturing of being convenient to walk abreast, be subjected to the great attention of national governments, the military and military scientific and technological research institution or company.Little inertia device has been widely used in occasions such as tactical missile/intelligent projectile midcourse guidance, agile bomb guidance and attitude control, unmanned plane guidance.At civil area, in, the micro-acceleration gauge of low precision also obtained commercial applications in the stable field of consumer electronics such as intelligent toy that reaches of automobile attitude and the control of travelling, commercial unit motion monitoring, health monitoring, camera.
Present micro-acceleration gauge is the microminiaturized acceleration analysis device that processes on SIC (semiconductor integrated circuit) backing materials such as silicon with the silicon-base micro-mechanical processing technology.This slightly inertia device generally comprise sensitive element (sensing element) and signal deteching circuit (detection circuit) two parts.
The critical component of existing micro-acceleration gauge is its sensitive element, is the primary structure material with silicon, so that utilize the good at normal temperatures micromechanics characteristic of silicon materials.Sensitive element structure mainly comprises a responsive mass by the flexible suspension strut of low rigidity, one section of flexible suspension links to each other with responsive mass, the other end links to each other with the side that a planar graph is the framework of closed figure, and flexible suspension, responsive mass are positioned at framework inside.The micro fabrication of sensitive element derives from semiconductor integrated circuit technique, can be divided into build micromachined and surface micromachined two big classes.The former generally is after by anisotropic wet corrosion or dry etching the individual layer silicon chip being carried out micromachined, produces responsive mass and flexible structure, be fixed on the specific substrate by anode linkage or fusion bonding, as glass sheet or another layer silicon chip; The latter utilizes semiconductor integrated circuit technique, in conjunction with sacrifice layer deposit and burn into release process, forms unsettled polysilicon membrane at silicon chip surface, and makes its planar graph form responsive mass and flexible suspended structure.The signal deteching circuit aspect, technology is full-fledged, no matter be the responsive principle of pressure drag or condenser type, had the universal circuit product of bare chip form to sell, the signal deteching circuit that has has been realized with the singualtion of sensitive element on silicon chip of surface micromechanical process processing integrated.
At present, there are various deficiencies in existing micro-acceleration gauge device and preparation method thereof, these deficiencies make the precision of device be difficult to further raising, perhaps its cost further reduces, limited it and need carry out the occasion that high precision, great dynamic range measure and the application of the abominable occasion of environmental baseline to acceleration, and had influence on it and need popularizing of in enormous quantities, low cost acceleration or angular rate measurement device at consumer electronics product etc. at those.These deficiencies comprise:
1) in the sensitive element structure, the thickness of responsive mass is restricted.The thickness of the responsive mass of surface micromechanical process processing is no more than 5 μ m, and poor-performings such as corresponding micro-acceleration gauge Measurement Resolution, signal to noise ratio (S/N ratio) can't satisfy military or high-end consumer application; The thick responsive mass that military micro-acceleration gauge is required, the general build micro-processing methods such as deep erosion of dry method or long wet etching that adopt are made, its thickness generally also can't surpass the individual layer silicon chip, this moment, common method was that silicon chip is corroded or etching for a long time, to run through whole silicon wafer, form required responsive mass geometric configuration, corresponding technology cost is higher; For fields such as microgravity surveies, often need 2～4 layers of silicon wafer layer to be gathered into folds by the fusion bonding, to obtain the responsive mass that thickness surpasses the individual layer silicon chip, the electrode or the electrical interconnection between the piezoresistive strain sheet that are distributed in this moment on the different layers silicon chip are very difficult, if adopt TSV (Through-Si-Via, wear the silicon via hole) realize this electrical interconnection, then need increase corresponding dry etching (running through whole layer silicon chip), the side wall insulating layer deposit, semiconductor technologies such as plating, this can greatly increase the technology cost, the technology difficulty of fusion bonding is very big in addition, comprise the disk alignment difficulties, process time is long, technological temperature height, yield rate are difficult to assurance etc., so cost is very high.
2) because the silicon-base micro-mechanical processing technology limits, the thickness of flexible suspension generally can not be less than 5 μ m; So the thickness of responsive mass and the thickness of flexible suspension ratio are difficult to freely select, this has just limited the flexibility ratio of structural design of accelerometer and the final resolution of device, make it to be difficult to be applied to the application that microgravity survey etc. needs high sensitivity or resolution, perhaps attitude of carrier measurement etc. needs the application of wide dynamic range.
3) with silicon be the operating ambient temperature of the very difficult tolerance of accelerometer sensitive element more than 300 ℃ of structured material.
4) silicon-base micro-mechanical processing derives from the semiconductor integrated technique, generally must finish in ultra-clean chamber, compares the investment of process equipment and processing/operating cost height with other micro fabrications; If the silicon chip design changes, often necessary corresponding modify lithography mask version and technological parameter, the further rising that brings cost.
5) the accelerometer sensitive element and the signal deteching circuit that process of existing silica-based micro fabrication generally need be fixed on certain base plate for packaging surface, finishes the encapsulation of entire device again by special packaging technology; When accelerometer also need with base plate for packaging on other chips (as gyro, Inertial Measurement Unit circuit, digital signal processing circuit) be integrated into the relative complete SiP (System-in-Package of function together, system in package) time, accelerometer sensitive element and circuit all will take substrate surface area (its area is often suitable with circuit chips such as DSP), have influence on the raising of the function and the device integrated level of whole encapsulation;
6) the accelerometer sensitive element pastes the technological process that is put into package substrate, be difficult to guarantee that the sensitive axes of sensitive element is to keeping aiming at the mainly axial of base plate for packaging of other devices or whole SiP, and this can have influence on the measuring accuracy of encapsulation post-acceleration meter, so needing to adopt further calibration steps realizes aiming at, this calibration length consuming time, and cost is higher.
Summary of the invention
The present invention has overcome deficiency of the prior art, and a kind of micro-acceleration gauge in micro-system or the microelectronics Packaging substrate and preparation method thereof that is embedded in is provided.
Technical scheme of the present invention is:
A kind of micro-acceleration gauge, comprise sensitive element and signal deteching circuit, exist between described sensitive element and the signal deteching circuit to be electrically connected, it is characterized in that, described micro-mechanical accelerometer is arranged on the base plate for packaging, and base plate for packaging is piled up by upper and lower surface plate and several Intermediate substrates and forms; Described signal deteching circuit is attached on the upper surface panel; The cavity of running through substrate is set, with other Intermediate substrates or the common cavity of forming of upper and lower surface plate respectively on the multilayer Intermediate substrate; The Intermediate substrate that has the cavity constitutes the framework of sensitive element, the flexible suspension of sensitive element and responsive mass are arranged in the described cavity, one end of described flexible suspension connects responsive mass, the other end is fixed on the framework, and splash-proofing sputtering metal electrode respectively on responsive mass and the framework surface corresponding with responsive mass, form flat sensitization capacitance, or, constitute the metal piezoresistive strain gauge at the position of flexible suspension and framework medial surface junction depositing metal pressure drag thick film figure.
Described base plate for packaging is LTCC (english abbreviation LTCC) substrate.
The responsive mass of described micro-acceleration gauge sensitive element is shaped as the solid construction of square or rectangular parallelepiped, this sensitivity mass have three mutually vertical and intersect at the mirror symmetry planes of barycenter, two planes of symmetry are perpendicular to Intermediate substrate, and another plane of symmetry then is parallel to Intermediate substrate.
Framework is gone up the corresponding substrate number of plies (p) at the thickness direction direction of Intermediate substrate (promptly perpendicular to) should satisfy p 〉=n+2 with the relation of responsive mass between the number of plies corresponding on the thickness direction (n).
Described flexible suspension is made up of several laminated spring structures.
If sensitivity is axially perpendicular to Intermediate substrate, then at depositing metal electrode on the responsive mass upper surface and on the lower surface of upper surface panel on the other side, sensitization capacitance in the formation, simultaneously at depositing metal electrode on the responsive mass lower surface and on the upper surface of lower cover on the other side or following table panel, form sensitization capacitance down, if sensitive axes is to being parallel to Intermediate substrate, depositing metal respectively on two sides of responsive mass and framework medial surface on the other side respectively then forms the sensitization capacitance of parallel plate type.
When adopting the pressure resistance type principle, if sensitivity is axially perpendicular to Intermediate substrate, then the position depositing metal pressure drag thick film figure of approaching flexible suspension and framework medial surface junction on the upper surface of flexible suspension constitutes the metal piezoresistive strain gauge, and its direction of measurement parallels with the long limit of flexible suspension; When adopting the pressure resistance type principle, if sensitive axes is to being parallel to Intermediate substrate, then go up position depositing metal pressure drag thick film figure near flexible suspension and framework medial surface junction in the side of flexible suspension (perpendicular to orientation substrate), constitute the metal piezoresistive strain gauge, its direction of measurement parallels with the long limit of flexible suspension.
A kind of preparation method of micro-acceleration gauge, its step comprise,
1) on multilayer LTCC green plate, produces level and vertical electrical interconnection respectively, horizontal electrical interconnection is to form by print the thick film figure with metal paste on the upper and lower surface of LTCC green plate, and vertical electrical interconnection is to form by the via hole that runs through LTCC green plate, filling metal paste;
2), and laminate in advance with above-mentioned LTCC green plate stacked in parallel;
3) the above-mentioned LTCC green plate of cutting makes it to occur cavity, the responsive mass of corresponding formation, flexible suspension and framed structure;
4) splash-proofing sputtering metal electrode respectively on responsive mass and the framework surface corresponding with responsive mass forms flat sensitization capacitance, or at the position of flexible suspension and framework medial surface junction depositing metal pressure drag thick film figure, formation metal piezoresistive strain gauge;
5) in framed structure, fill expendable material, be superimposed with, lower surface LTCC green plate, and level and vertical electrical interconnection are set;
6) laminate all LTCC green plates;
7) the LTCC green plate after sintering laminates allows expendable material volatilization or discharge, and forms the sensitive element structure that is embedded in the base plate for packaging, and finishes and being electrically connected attached to the signal deteching circuit of upper surface panel.
Described sintering temperature is 750-950 ℃.
Described laminating in advance takes to wait the static pressure mode, and used pressure limit is 8～15atm (atmospheric pressure), and the ltcc substrate that is lower than present routine laminates technology, and temperature is 40～50 ℃.
Described laminating takes to wait the static pressure mode, and used pressure limit is 15～35atm (atmospheric pressure), and to laminate the used pressure of technology suitable with the ltcc substrate of present routine, and temperature is 50～80 ℃.
Described metal paste is the organic ink that includes Au, Ag or Cu particle.
Compared with prior art, the invention has the beneficial effects as follows:
1) sensitive structure is that the 2.5 dimension structures of processing on multilayer ltcc substrate green band respectively (are that planar structure is versatile and flexible, and the single structure of the shape of thickness direction) aim at, pile up the three dimensional stress structure that the back forms with large ratio of height to width, therefore can make thickness and weight and be far longer than silica-based micro-acceleration gauge, 3 dimensional coil geometry can satisfy the responsive mass (as the square-section) of particular requirement, and the thickness of flexible suspended structure and rigidity can be in a big way flexible, so its sensitive structure is expected to have lower acceleration analysis response limit (being high resolving power), bigger measurement dynamic range, less zero-bit random drift;
2) processing technology and existing can in to bury the ltcc substrate processing process compatibility of passive electric circuit element good, by exploitation LTCC build micromachined technology, special processes such as cavity expendable material technology, just can form corresponding set technique, performance based on serigraphy/slurry metallization/multilayer laminate/the technology cost of sintering ltcc substrate is far below the silicon-base micro-mechanical technology based on conventional semiconductors processing, and the outstanding advantage that processing/model machine proving period is short, but adapting to industries such as military project well to fast steering (short turnaround), in the time of the demand of the productive capacity of short run/many kinds, take into account the demand of production in enormous quantities;
3) that job operation also can be produced other three dimensional stresses that are embedded in the substrate easily is little/receive functional structure, as little gyro, microchannel, microtemperature sensor etc.;
4) LTCC acceleration sensitive structure is embedded in the multilayer ltcc substrate of system-oriented level encapsulation, and combine together by sintering and substrate, can be when circuit chip and lamination thereof are reserved valuable base plate for packaging space surface, allow substrate itself have locus and the responsive ability of carrier delivery state, thereby improve its degree of intelligence, and realize the Highgrade integration of system in package; In addition, can in substrate, process the different sensitive structure of thickness direction structural mechanics parameter simultaneously more conveniently, constitute the range accelerometer array different, thereby satisfy the acceleration analysis demand of military flight carrier at different inflight phases with the individual devices encapsulation with frequency response range;
5) LTCC acceleration or angular velocity sensitive structure can be embedded in the multilayer ltcc substrate of system-oriented level encapsulation, and combine together by sintering and substrate; So, because sintering process can form better seal for sensitive element inside, the atmosphere of its sensitive element inside can not be subjected to the influence of working environment atmosphere, and can laminate by change, atmosphere and method of temperature during sintering, adjust the pressure and the air damping of sensitive element inside, thereby improve the measuring accuracy and the functional reliability of corresponding little inertia device greatly, and the technology cost is low; And present LTCC micro-acceleration gauge technology must bond on the other package substrate, goes to carry out level Hermetic Package again, and its cost and difficult quality reach the level of this process program.
6) in recent years, the researchist who comprises the applicant finds, the LTCC material has that mechanical property is good, physical/chemical good stability, advantage such as high temperature resistant, if combine with refractory metals such as W, can be made into the accelerometer that can tolerate high temperature (〉=300 ℃) rugged surroundings, serve military fields such as the monitoring of Aeronautics and Astronautics engine operating condition, flutter of aerofoil monitoring, and industrial application such as oil-gas exploration.
7) can guarantee at little inertia device with carrier accelerated motion or when vibration, responsive mass has enough mobile spaces to realize the measurement of acceleration or angular velocity, simultaneously perpendicular to the acceleration on the orientation substrate when excessive, can utilize Intermediate substrate or upper and lower surface plate above or below the sensitive element to stop mass that bigger displacement takes place, thereby prevent flexible suspension from excessive deformation taking place and rupture.
Description of drawings
The side view of the basic sensitive structure of the micro-acceleration gauge that the little inertia device preparation method of Fig. 1 the present invention is processed.
A kind of enforcement structural representation of sensitive axes sensitive element when being parallel to substrate of the micro-acceleration gauge that the little inertia device preparation method of Fig. 2 the present invention is processed, wherein flexible suspension is single " one " letter stencil spring, (a) being vertical view, (b) is that A-A is to cut-open view.
A kind of enforcement structural representation of sensitive axes sensitive element when being parallel to substrate of the micro-acceleration gauge that the little inertia device preparation method of Fig. 3 the present invention is processed, wherein flexible suspension is single " bow " letter stencil spring, (a) being vertical view, (b) is that A-A is to cut-open view.
A kind of enforcement structural representation of sensitive axes sensitive element when being parallel to substrate of the micro-acceleration gauge that the little inertia device preparation method of Fig. 4 the present invention is processed, wherein flexible suspension is two " bow " letter stencil springs, the vertical mirror plane of symmetry with respect to responsive mass is the mirror image symmetric relation, (a) being vertical view, (b) is that A-A is to cut-open view.
When the sensitivity of the micro-acceleration gauge that the little inertia device preparation method of Fig. 5 the present invention is processed was axially perpendicular to substrate, the enforcement synoptic diagram of sensitive structure (a) was STRUCTURE DECOMPOSITION figure, the longitudinal sectional view of structure after (b) the technology preparation is finished.
The sensitive axes of the micro-acceleration gauge that the little inertia device preparation method of Fig. 6 the present invention is processed is when being parallel to substrate, and the enforcement synoptic diagram of sensitive structure (a) is STRUCTURE DECOMPOSITION figure, the longitudinal sectional view of structure after (b) the technology preparation is finished.
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is described in further detail:
Fig. 1 shows the sensitive element basic structure cut-open view of the micro-acceleration gauge that the little inertia device preparation method of the present invention processed.Layer multilayer packaging substrate among the figure is piled up by Intermediate substrates such as flat upper surface panel 1a, following table panel 1b and 2a～g and forms, and material is LTCC, at the layer multilayer packaging substrate through becoming one behind the sintering process.Signal deteching circuit 4 can adopt commercial, universal accelerometer signal testing circuit chip, also can adopt custom-designed signal deteching circuit chip, can mount on the metal pad of groove 3 bottoms of leaving on the upper surface panel 1a, chip is realized electrical interconnection by these pads of bottom portion of groove and the vertical vias 5 of these pads below with sensitive element.Have the cavity of running through substrate on Intermediate substrate 2b～2f, empty sidewall is perpendicular to substrate, and is being parallel to the closed figures that is hollow on the direction of substrate, i.e. cavity (can referring to Fig. 2), and these substrates pile up and have constituted sensitive element.Sensitive element comprises framework 6, flexible suspension 7 and responsive mass 8.Framework 6 is Intermediate substrates such as 2b～2f, flexible suspension 7 is made up of Intermediate substrate 2c, 2d, responsive mass 8 is formed by Intermediate substrate 2c, 2d, 2e cutting, wherein 2b and 2f layer Intermediate substrate only have the framework figure, the space that is used to responsive mass to provide to move up and down and form the air gap with suitable damping characteristic in responsive quality above and below.Flexible suspension 7 is very little perpendicular to the rigidity on the orientation substrate, when along the sensitive axes of described micro-acceleration gauge when the acceleration input is arranged, responsive mass is parallel to the displacement of orientation substrate with respect to framework, detect this displacement just can measure acceleration and direction and size; Flexible suspension 7 is very high in the rigidity that is parallel on the direction of substrate, if in acceleration when input, arranged along these directions, the displacement that responsive mass takes place is very little, and the output of micro-acceleration gauge is also very little, thereby has guaranteed that described micro-acceleration gauge has very low intersecting axle susceptibility.Upper cover plate 2a can also be piled up in the sensitive element top, and lower cover 2g is piled up in the below, thereby the empty formed inner chamber of each laminar substrate of 2b～2f is closed; In concrete enforcement, when the number of plies of the used substrate of layer multilayer packaging substrate more after a little while, also can save upper and lower cover plate, and directly realize sealing by upper surface panel and following table panel.On each laminar substrate of the inside of described layer multilayer packaging substrate, can process plane electrical interconnection and vertical vias 5 by existing substrate electrical interconnection processing technology, thereby form electrical interconnection network highdensity, three-dimensional with arbitrary shape; Therefore the input chip can be realized being electrically connected with sensitive electrode or piezoresistive strain thick film figure on being distributed in responsive quality, flexible suspension by this electrical interconnection network like a cork, the micro-acceleration gauge sensitive element of the multiple stratification that its difficulty of processing and realization cost will be processed well below existing silica-based micromachined technology.
The sensitive axes that Fig. 2 has provided micro-acceleration gauge of the present invention is a kind of enforcement structural representation during sensitive element when being parallel to substrate, and wherein (a) is vertical view, (b) is that A-A is to cut-open view.Dot-and- dash line 9 and 10 among the figure (a) is represented the vertical mirror plane of symmetry of responsive mass respectively; The sensitive axes that double-head arrow 11 shows accelerometer to.Flexible suspension 7 is adopted has the laminated spring structure of square-section, and the width that its upper and lower surface that is parallel to Intermediate substrate is " one " font, side (perpendicular to the Intermediate substrate direction) then is 2 times of thickness of substrate; A mirror symmetry planes 9 of the neutral surface of flexible suspension 7 and responsive mass coincides.
The sensitive axes that Fig. 3 shows micro-acceleration gauge of the present invention is a kind of enforcement structural representation during sensitive element when being parallel to substrate, and wherein (a) is vertical view, (b) is that A-A is to cut-open view.Dot-and- dash line 9 and 10 among the figure (a) is represented the vertical mirror plane of symmetry of responsive mass respectively; The sensitive axes that double-head arrow 11 shows accelerometer to.Flexible suspension 7 is adopted has the laminated spring structure of square-section, the width that its upper and lower surface that is parallel to Intermediate substrate is " bow " font, side (perpendicular to the Intermediate substrate direction) then is 2 times of thickness of substrate, and it is crooked platy structure on perpendicular to the Intermediate substrate direction.
The sensitive axes that Fig. 4 shows micro-acceleration gauge of the present invention is a kind of enforcement structural representation during sensitive element when being parallel to substrate, and wherein (a) is vertical view, (b) is that A-A is to cut-open view.Dot-and- dash line 9 and 10 among the figure (a) is represented the vertical mirror plane of symmetry of responsive mass respectively; The sensitive axes that double-head arrow 11 shows accelerometer to. Flexible suspension 7a, 7b adopt has the laminated spring structure of square-section, the width that its upper and lower surface that is parallel to Intermediate substrate is " bow " font, side (perpendicular to the Intermediate substrate direction) then is 2 times of thickness of substrate, and it is crooked platy structure on perpendicular to the Intermediate substrate direction; Two flexible suspensions are measure-alike, and with respect to 9 one-tenth mirror image symmetric relations of the vertical mirror plane of symmetry of responsive mass.
The specific embodiments synoptic diagram of a kind of acceleration sensitive structure the when sensitivity that Fig. 5 has provided micro-acceleration gauge of the present invention is axially perpendicular to substrate during sensitive element and preparation method thereof.The part of figure middle frame is removed, to clearly illustrate responsive mass and flexible suspension.Micro-acceleration gauge shown in the figure has adopted the responsive principle of condenser type; At depositing metal electrode 12a and 12b on responsive mass 8 upper surfaces and on the lower surface of upper cover plate on the other side or upper surface panel, sensitization capacitance in the formation, simultaneously at depositing metal electrode 12c and 12d on the responsive mass lower surface and on the upper surface of lower cover on the other side or following table panel, form sensitization capacitance down, like this, when the acceleration input is arranged, upper and lower moving takes place in responsive mass, make upper and lower sensitization capacitance generation inverse variation, utilize signal deteching circuit that this measure of the change is come out, just can obtain required acceleration analysis signal.
The processing process of device shown in Figure 5 is mainly:
1) utilize conventional cutting method, on a kind of ceramic chips (generally being made as banded structure), cut out 9 layers of identical individual layer LTCC base plate for packaging green plate of planar dimension, i.e. 1a, 1b, 2a～2g, its thickness are 100 μ m.
2) the ltcc substrate interconnection processing technology with routine is produced level and vertical electrical interconnection respectively on above-mentioned green plate, the former prints the thick film figure that forms with metal paste on the substrate upper and lower surface, the latter is run through via hole substrate, that fill metal paste; Then substrate 2c～2e stacked in parallel is got up, and laminate (pre-laminate) in advance;
3) utilize build micro-machinings such as wet etching, deep reaction ion etching, precision optical machinery cutting, laser accurate cutting, remove the part material on green plate 2c～2e, formation runs through the cavity of multilayer, make the green plate 2c～2e after laminating in advance form the responsive mass that surrounded by framework and the planar graph of flexible suspension being parallel on the orientation substrate, thereby obtain the three-dimensional structure of responsive mass 8, flexible suspension 7, framework 6;
4) on the upper and lower green plate 2b of green plate 2c～2e and 2f, remove the part material, form the framework figure, produce the ccf layer ceramic chips with the build micro-machining;
5) to above-mentioned technology 2), the upper surface of the responsive mass 8 that forms 3) and the lower surface of upper cover plate 2a are printed metal paste figure 12a and 12b respectively, print metal paste figure 12c and 12d respectively at the lower surface of responsive mass 8 and the upper surface of lower cover 2g, 12a, 12b combination and 12c, the 12d combination is formed for the last sensitization capacitance structure and the following sensitization capacitance structure of measuring vertical axial acceleration respectively, constitute differential relation in the middle of these two electric capacity, when promptly the capacitance of an electric capacity increases, another corresponding reducing so just can be improved the precision and the sensitivity of measurement; These electrodes 12a～12d laminates the back by vertically linking to each other with signal deteching circuit 4 with horizontal interconnect of making in advance on the green plate at all green plates;
6) below through green plate 2c～2e of laminating in advance, pile up ccf layer ceramic chips 2f, guarantee the pattern alignment of two-layer ceramic chips when piling up; Below ccf layer, pile up following table panel 2g then; Above the sensitive element structural sheet, pile up another ceramic chips ccf layer ceramic chips 2b, in the cavity of layers of material, fill expendable material (be generally paraffin, graphite or based on the organic filler material of paraffin, graphite), and above ccf layer, pile up upper surface panel 2a; The planar graph of each layer ceramic chips is aimed at;
7) do not comprise at other and utilize conventional LTCC layer multilayer packaging substrate technology to make the electrical interconnection of three-dimensional on Intermediate substrate green band of sensitive element structure, comprise horizontal interconnect and vertical vias;
8) will constitute all individual layers of sensitive element and three-dimensional systematic base plate for packaging and the multilager base plate that laminates in advance and laminate (laminate), technology 6 under the hydrostatic pressure condition waiting) in the expendable material of filling can prevent to laminate the time substrate subside; The stacked multilager base plate inside that goes out will form the electrical interconnection of unsettled responsive quality of large ratio of height to width and three-dimensional;
9) to substrate sintering in addition, and allow expendable material volatilization or discharge after, just can finally form the sensitive element structure of the little inertia device that is embedded in the layer multilayer packaging substrate, and finish being electrically connected of sensitization capacitance substrate or voltage dependent resistor (VDR) and signal deteching circuit part.
The specific implementation method synoptic diagram of the sensitive axes that Fig. 6 shows micro-acceleration gauge of the present invention a kind of acceleration sensitive structure during sensitive element when being parallel to substrate.Difference depositing metal electrode 13a, 13b on the side of responsive mass 8 and the framework medial surface on the other side, form the sensitization capacitance of parallel plate type, like this, when the acceleration input is arranged, responsive mass take place along sensitive axes to move, make sensitization capacitance generation inverse variation, utilize signal deteching circuit that this measure of the change is come out, just can obtain required acceleration analysis signal.
The processing process of device shown in Figure 6 is mainly:
1) utilize conventional cutting method, on a kind of ceramic chips (generally being made as banded structure), cut out 9 layers of identical individual layer LTCC base plate for packaging green plate of planar dimension, i.e. 1a, 1b, 2a～2g, its thickness are 100 μ m.
2) the ltcc substrate interconnection processing technology with routine is produced level and vertical electrical interconnection respectively on above-mentioned green plate, the former prints the thick film figure that forms with metal paste on the substrate upper and lower surface, the latter is run through via hole substrate, that fill metal paste;
3) on green plate 2b and 2f, remove the part material, form the cavity of rectangle, produce the ccf layer ceramic chips with the build micro-machining; Then substrate 2b～2f stacked in parallel is got up, and laminate (pre-laminate) in advance;
4) utilize build micro-machinings such as wet etching, deep reaction ion etching, precision optical machinery cutting, laser accurate cutting, remove the part material on green plate 2c～2e, formation runs through the cavity of multilayer, make the green plate 2c～2e after laminating in advance form the responsive mass that surrounded by framework and the planar graph of flexible suspension being parallel on the orientation substrate, thereby obtain the three-dimensional structure of responsive mass 8, flexible suspension 7, framework 6;
5) to above-mentioned technology 2), 3) in pass through magnetically controlled sputter method on the vertical side wall of the side surface of the responsive mass 8 that forms and framework on the other side, form metal electrode figure 13a and 13b, be formed for measuring the sensitization capacitance structure of horizontal axis acceleration, this electrode laminates the back by vertically linking to each other with signal deteching circuit 4 with horizontal interconnect of making in advance on the green plate at all green plates;
6) below through green plate 2b～2f of laminating in advance, pile up lower cover 2g, guarantee the pattern alignment of two-layer ceramic chips when piling up; In the cavity of layers of material, fill expendable material (be generally paraffin, graphite or based on the organic filler material of paraffin, graphite), and above ccf layer, pile up upper cover plate 2a; The planar graph of each layer ceramic chips is aimed at;
7) do not comprise at other and utilize conventional LTCC layer multilayer packaging substrate technology to make the electrical interconnection of three-dimensional on Intermediate substrate green band of sensitive element structure, comprise horizontal interconnect and vertical vias;
8) will constitute all individual layers of sensitive element and three-dimensional systematic base plate for packaging and the multilager base plate that laminates in advance and laminate (laminate), technology 6 under the hydrostatic pressure condition waiting) in the expendable material of filling can prevent to laminate the time substrate subside; The stacked multilager base plate inside that goes out will form the electrical interconnection of unsettled responsive quality of large ratio of height to width and three-dimensional;
9) to substrate sintering in addition, and allow expendable material volatilization or discharge after, just can finally form the sensitive element structure of the little inertia device that is embedded in the layer multilayer packaging substrate, and finish being electrically connected of sensitization capacitance substrate or voltage dependent resistor (VDR) and signal deteching circuit part.
More than by specific embodiment micro-acceleration gauge provided by the present invention has been described, it will be understood by those of skill in the art that in the scope that does not break away from essence of the present invention, can make certain deformation or modification to the present invention; Its preparation method also is not limited to disclosed content among the embodiment.
Claims (10)
1, a kind of micro-acceleration gauge, comprise sensitive element and signal deteching circuit, exist between described sensitive element and the signal deteching circuit and be electrically connected, it is characterized in that, described micro-mechanical accelerometer is arranged on the base plate for packaging, base plate for packaging is piled up by upper and lower surface plate and several Intermediate substrates and forms, and described signal deteching circuit is attached on the upper surface panel; The cavity of running through substrate is set, with other Intermediate substrates or the common cavity of forming of upper and lower surface plate respectively on the multilayer Intermediate substrate; The Intermediate substrate that has the cavity constitutes the framework of sensitive element, the flexible suspension of sensitive element and responsive mass are arranged in the described cavity, one end of described flexible suspension connects responsive mass, the other end is fixed on the framework, and splash-proofing sputtering metal electrode respectively on responsive mass and the framework surface corresponding with responsive mass, form flat sensitization capacitance, or, constitute the metal piezoresistive strain gauge at the position of flexible suspension and framework medial surface junction depositing metal pressure drag thick film figure.
2, micro-acceleration gauge as claimed in claim 1 is characterized in that, described base plate for packaging is a low-temperature co-fired ceramic substrate.
3, micro-acceleration gauge as claimed in claim 1 or 2, it is characterized in that, described responsive mass is shaped as the solid construction of square or rectangular parallelepiped, this sensitivity mass have three mutually vertical and intersect at the mirror symmetry planes of barycenter, two planes of symmetry are perpendicular to Intermediate substrate, and another plane of symmetry then is parallel to Intermediate substrate.
4, micro-acceleration gauge as claimed in claim 1 is characterized in that, corresponding substrate number of plies p on perpendicular to the Intermediate substrate direction is satisfied with the relation of responsive mass between substrate number of plies n corresponding on the thickness direction for described framework: p 〉=n+2.
As claim 1 or 4 described micro-acceleration gauges, it is characterized in that 5, described flexible suspension is made up of several laminated spring structures.
6, micro-acceleration gauge as claimed in claim 1, it is characterized in that, if sensitivity is axially perpendicular to Intermediate substrate, then at splash-proofing sputtering metal electrode on the responsive mass upper surface and on the lower surface of upper surface panel on the other side, sensitization capacitance in the formation, simultaneously at splash-proofing sputtering metal electrode on the responsive mass lower surface and on the upper surface of lower cover on the other side or following table panel, form sensitization capacitance down, if sensitive axes is to being parallel to Intermediate substrate, splash-proofing sputtering metal respectively on two sides of responsive mass and framework medial surface on the other side respectively then forms the sensitization capacitance of parallel plate type.
7, micro-acceleration gauge as claimed in claim 1, it is characterized in that, if sensitivity is axially perpendicular to Intermediate substrate, then on the upper surface of flexible suspension near the position depositing metal pressure drag thick film figure of flexible suspension and framework medial surface junction, constitute the metal piezoresistive strain gauge, if sensitive axes is to being parallel to Intermediate substrate, then flexible suspension perpendicular to the side of substrate near the position depositing metal pressure drag thick film figure of flexible suspension with framework medial surface junction, formation metal piezoresistive strain gauge.
8, a kind of preparation method of micro-acceleration gauge, its step comprise,
1) on multilayer LTCC green plate, produces level and vertical electrical interconnection respectively, horizontal electrical interconnection is to form by print the thick film figure with metal paste on the upper and lower surface of LTCC green plate, and vertical electrical interconnection is to form by the via hole that runs through LTCC green plate, filling metal paste;
2), and laminate in advance with above-mentioned LTCC green plate stacked in parallel;
3) the above-mentioned LTCC green plate of cutting makes it to occur cavity, the responsive mass of corresponding formation, flexible suspension and framed structure;
4) splash-proofing sputtering metal electrode respectively on responsive mass and the framework surface corresponding with responsive mass forms flat sensitization capacitance, or at the position of flexible suspension and framework medial surface junction depositing metal pressure drag thick film figure, formation metal piezoresistive strain gauge;
5) in framed structure, fill expendable material, be superimposed with, lower surface LTCC green plate, and level and vertical electrical interconnection are set;
6) laminate all LTCC green plates;
7) the LTCC green plate after sintering laminates allows expendable material volatilization or discharge, and forms the sensitive element structure that is embedded in the base plate for packaging, and finishes and being electrically connected attached to the signal deteching circuit of upper surface panel.
9, method as claimed in claim 8 is characterized in that, described sintering temperature is 750-950 ℃.
10, method as claimed in claim 8 or 9 is characterized in that, described laminating in advance takes to wait the static pressure mode, and used pressure limit is 8～15atm, and temperature range is 40～50 ℃.
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