CN101685476B - 在集成电路设计期间快速模拟制造影响的设备、方法和系统 - Google Patents
在集成电路设计期间快速模拟制造影响的设备、方法和系统 Download PDFInfo
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- CN101685476B CN101685476B CN2009101755296A CN200910175529A CN101685476B CN 101685476 B CN101685476 B CN 101685476B CN 2009101755296 A CN2009101755296 A CN 2009101755296A CN 200910175529 A CN200910175529 A CN 200910175529A CN 101685476 B CN101685476 B CN 101685476B
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- integrated circuit
- design
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- physical characteristics
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/40—Data acquisition and logging
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
Description
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/237,727 | 2008-09-25 | ||
US12/237,727 US8117568B2 (en) | 2008-09-25 | 2008-09-25 | Apparatus, method and computer program product for fast simulation of manufacturing effects during integrated circuit design |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101685476A CN101685476A (zh) | 2010-03-31 |
CN101685476B true CN101685476B (zh) | 2013-01-16 |
Family
ID=42038905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101755296A Expired - Fee Related CN101685476B (zh) | 2008-09-25 | 2009-09-22 | 在集成电路设计期间快速模拟制造影响的设备、方法和系统 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8117568B2 (zh) |
JP (1) | JP5306122B2 (zh) |
KR (1) | KR20100035093A (zh) |
CN (1) | CN101685476B (zh) |
SG (1) | SG160271A1 (zh) |
Families Citing this family (22)
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US8073667B2 (en) * | 2003-09-30 | 2011-12-06 | Tokyo Electron Limited | System and method for using first-principles simulation to control a semiconductor manufacturing process |
US8014991B2 (en) * | 2003-09-30 | 2011-09-06 | Tokyo Electron Limited | System and method for using first-principles simulation to characterize a semiconductor manufacturing process |
US8136068B2 (en) * | 2008-09-30 | 2012-03-13 | Cadence Design Systems, Inc. | Methods, systems, and computer program products for implementing compact manufacturing models in electronic design automation |
US8255855B2 (en) * | 2009-06-23 | 2012-08-28 | Oracle America, Inc. | Routing nets over circuit blocks in a hierarchical circuit design |
CN102254786B (zh) * | 2010-05-20 | 2013-02-13 | 上海华虹Nec电子有限公司 | 芯片的局部图形密度的分析和检查方法 |
US8464194B1 (en) * | 2011-12-16 | 2013-06-11 | International Business Machines Corporation | Machine learning approach to correct lithographic hot-spots |
US8434030B1 (en) * | 2012-01-05 | 2013-04-30 | United Microelectronics Corporation | Integrated circuit design and fabrication method by way of detecting and scoring hotspots |
US8793638B2 (en) * | 2012-07-26 | 2014-07-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of optimizing design for manufacturing (DFM) |
CN103020384B (zh) * | 2012-12-27 | 2015-03-04 | 中国科学院微电子研究所 | 铝栅cmp化学反应动力学仿真及版图设计优化方法 |
CN104978448B (zh) * | 2014-04-14 | 2018-10-26 | 复旦大学 | 基于伯努利分布的贝叶斯模型混合预测电路成品率方法 |
CN104077460B (zh) * | 2014-07-18 | 2017-02-15 | 中国科学院微电子研究所 | 化学机械抛光方法及芯片版图等效特征参数提取方法 |
US9641399B1 (en) * | 2014-10-14 | 2017-05-02 | Jpmorgan Chase Bank, N.A. | Application and infrastructure performance analysis and forecasting system and method |
US20160365253A1 (en) * | 2015-06-09 | 2016-12-15 | Macronix International Co., Ltd. | System and method for chemical mechanical planarization process prediction and optimization |
CN107195561B (zh) * | 2016-03-14 | 2019-09-10 | 中国科学院微电子研究所 | 一种化学机械研磨缺陷检测方法 |
CN106334993A (zh) * | 2016-10-24 | 2017-01-18 | 上海华力微电子有限公司 | 一种化学机械研磨工艺的模拟装置 |
US10678973B2 (en) | 2017-03-15 | 2020-06-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Machine-learning design enablement platform |
KR102402673B1 (ko) * | 2017-04-28 | 2022-05-26 | 삼성전자주식회사 | Beol의 공정 변이를 고려하여 집적 회로를 설계하기 위한 컴퓨터 구현 방법 및 컴퓨팅 시스템 |
CN117272924A (zh) * | 2017-04-28 | 2023-12-22 | 三星电子株式会社 | 设计集成电路的方法 |
US10803218B1 (en) * | 2017-12-21 | 2020-10-13 | Ansys, Inc | Processor-implemented systems using neural networks for simulating high quantile behaviors in physical systems |
US10817634B2 (en) | 2018-01-19 | 2020-10-27 | Synopsys, Inc. | Machine-learning circuit optimization using quantized prediction functions |
KR102513707B1 (ko) * | 2018-09-03 | 2023-03-23 | 가부시키가이샤 프리퍼드 네트웍스 | 학습 장치, 추론 장치, 학습 모델 생성 방법 및 추론 방법 |
EP4028928A1 (en) * | 2019-09-10 | 2022-07-20 | Synopsys, Inc. | Machine-learning driven prediction in integrated circuit design |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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US5467291A (en) * | 1991-09-09 | 1995-11-14 | Hewlett-Packard Company | Measurement-based system for modeling and simulation of active semiconductor devices over an extended operating frequency range |
KR20010032223A (ko) | 1997-11-18 | 2001-04-16 | 카리 홀란드 | 화학적 기계 연마 공정의 모델링 방법 및 장치 |
KR100297732B1 (ko) | 1999-06-21 | 2001-11-01 | 윤종용 | 반도체 소자의 소정 물질층의 패턴밀도를 구하는 방법 및 이를 이용한 화학기계적 연마의 시뮬레이션 방법 |
JP2001273350A (ja) * | 2000-03-24 | 2001-10-05 | Semiconductor Leading Edge Technologies Inc | 半導体集積回路の特性演算システムおよび半導体集積回路の設計方法 |
US6766283B1 (en) | 2000-10-13 | 2004-07-20 | Insyst Ltd. | System and method for monitoring process quality control |
JP2003224098A (ja) * | 2002-01-30 | 2003-08-08 | Semiconductor Leading Edge Technologies Inc | 配線の設計方法、プログラムおよびそのプログラムを記録した記録媒体 |
US7363099B2 (en) | 2002-06-07 | 2008-04-22 | Cadence Design Systems, Inc. | Integrated circuit metrology |
US7231624B2 (en) | 2002-11-19 | 2007-06-12 | Cadence Design Systems, Inc. | Method, system, and article of manufacture for implementing metal-fill with power or ground connection |
JP2004213510A (ja) * | 2003-01-08 | 2004-07-29 | Matsushita Electric Ind Co Ltd | 集積回路の性能予測方法及び設計方法 |
US7254792B1 (en) | 2003-06-27 | 2007-08-07 | Cypress Semiconductor Corporation | Accounting for the effects of dummy metal patterns in integrated circuits |
US7137080B2 (en) * | 2003-08-22 | 2006-11-14 | International Business Machines Corporation | Method for determining and using leakage current sensitivities to optimize the design of an integrated circuit |
US7251807B2 (en) | 2005-02-24 | 2007-07-31 | Synopsys, Inc. | Method and apparatus for identifying a manufacturing problem area in a layout using a process-sensitivity model |
JP2007103634A (ja) | 2005-10-04 | 2007-04-19 | Renesas Technology Corp | 半導体デバイスの形状シミュレーション方法 |
US7448014B2 (en) | 2006-03-08 | 2008-11-04 | International Business Machines Corporation | Design stage mitigation of interconnect variability |
JP5087864B2 (ja) * | 2006-06-21 | 2012-12-05 | 富士通株式会社 | 膜厚予測プログラム、記録媒体、膜厚予測装置および膜厚予測方法 |
US7721237B2 (en) * | 2006-12-29 | 2010-05-18 | Cadence Design Systems, Inc. | Method, system, and computer program product for timing closure in electronic designs |
US7814447B2 (en) * | 2006-12-29 | 2010-10-12 | Cadence Design Systems, Inc. | Supplant design rules in electronic designs |
JP5217566B2 (ja) * | 2008-03-28 | 2013-06-19 | 富士通株式会社 | 研磨予測評価装置、研磨予測評価方法、研磨予測評価プログラム |
-
2008
- 2008-09-25 US US12/237,727 patent/US8117568B2/en not_active Expired - Fee Related
-
2009
- 2009-07-10 KR KR1020090062906A patent/KR20100035093A/ko active IP Right Grant
- 2009-07-17 SG SG200904844-8A patent/SG160271A1/en unknown
- 2009-09-11 JP JP2009209893A patent/JP5306122B2/ja not_active Expired - Fee Related
- 2009-09-22 CN CN2009101755296A patent/CN101685476B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP5306122B2 (ja) | 2013-10-02 |
CN101685476A (zh) | 2010-03-31 |
KR20100035093A (ko) | 2010-04-02 |
US8117568B2 (en) | 2012-02-14 |
US20100077372A1 (en) | 2010-03-25 |
SG160271A1 (en) | 2010-04-29 |
JP2010079896A (ja) | 2010-04-08 |
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Effective date of registration: 20171113 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171113 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
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