CN101801162A - Wireless communication module - Google Patents
Wireless communication module Download PDFInfo
- Publication number
- CN101801162A CN101801162A CN201010122959A CN201010122959A CN101801162A CN 101801162 A CN101801162 A CN 101801162A CN 201010122959 A CN201010122959 A CN 201010122959A CN 201010122959 A CN201010122959 A CN 201010122959A CN 101801162 A CN101801162 A CN 101801162A
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- CN
- China
- Prior art keywords
- pcb
- radio frequency
- sidepiece
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Abstract
The invention discloses a wireless communication module, comprising a printed circuit board (PCB), wherein functional components are arranged on the first side of the PCB; functional pin pads and earthed radiating pads are arranged on the second side of the PCB; the surfaces of the functional pin pads and the earthed radiating pads are attached to the corresponding pads of a mainboard and are welded and fixed by a surface welding method; the PCB is also provided with radio frequency (RF) access devices which are respectively connected with RF devices and antennas arranged on the mainboard so as to realize RF signal transmission. The size of the module is effectively reduced, surface mount technology is more convenient and the cost is low; in addition, the PCB is also provided with RF connectors so as to transmit the RF signals to the antennas, and the mode is simple and flexible to use; and the PCB can be also provided with antenna pin pads which are connected with the antennas arranged on the mainboard by the PCB wires on the mainboard.
Description
Technical field
The present invention relates to the wireless telecommunications system field, relate in particular to a kind of wireless communication module.
Background technology
Along with the rise of Internet of Things and constantly development, wireless communication module more and more is subjected to people's attention, meanwhile, along with the develop rapidly of mobile communication technology, the wireless communication module volume is little, price is low, easy to carry and use advantage such as simple also constantly to show.
At present, the wireless communication module on the market is pressed the difference of packing forms, mainly is divided into following several:
The nineties is along with the progress of integrated technology, the improvement of equipment and the use of deep sub-micron technique, LSI (large scale integrated circuit), VLSI (very lagre scale integrated circuit (VLSIC)) and ULSI (ultra large scale integrated circuit) occur in succession, silicon single-chip integrated level improves constantly, encapsulation requires strict more to integrated circuit, I/O (I/O) number of pins sharply increases, and power consumption also increases thereupon.Be to satisfy the needs of development, increased new encapsulation kind-BGA Package (Ball Grid Array Package, BGA).This packing forms can adopt the welding of control collapsed chip method, can improve electric heating property, can adopt the coplane welding to assemble, and the reliability height has the minimum advantage of size simultaneously.But because the higher integrated level of BGA encapsulation, its cost generally is used on the chip of high integration also than higher.
The W-SIM general module that can be used for PHS (personal handhold telephone system) that Japan WILLCOM operator releases also can be applicable to notebook computer, mobile phone and palmtop PC simultaneously.The module size of this packing forms is 25.6 (W) x42 (L) x4 (H) mm.Advantages such as interface is unified, supports hot plug, and the while is inner antenna integrated solve but heat dissipation problem is difficult, and simultaneously owing to the influence of antenna, structure is restricted.
The stamp hole encapsulation, this packing forms uses comparatively extensive.The module pin is similar to dentation, protrudes in module edge, and corresponding mainboard pad is a rectangle.This type encapsulation, technology are comparatively ripe, and module size is less, easily overhaul for the welding situation of module simultaneously.But this packaged type causes radiofrequency signal discontinuous because himself, causes simultaneously copper wire easily and cut partially in the hole, residual copper wire is afterwards cut brokenly in the hole in the hole in, causes welding performance decline.
Peripheral components interface (Peripheral Component Interconnection, PCIE) packing forms, the PCIE tissue has defined PCI Express Mini Card consensus standard, two class communications protocol in this standard, have been formulated, wherein a class is the 3.3V port of USB2.0, also has the distinctive difference transmission duplex of PCI Express MiniCard agreement.Any module that meets this agreement can be inserted in the slot that meets this agreement.At present, this technology is widely used on the PC.Unified based on this packing forms interface of the Mini PCIE of PCIE, plug and play, cost is lower, changes easily.But the module of accord with PCI Express Mini Card agreement is because the requirement of himself agreement, and the power supply of 3.3V makes needs level conversion in some occasion without the 3.3V power supply, increases a level transferring chip, has increased cost.Simultaneously, some interfaces of the module of accord with PCI Express Mini Card agreement, for example UART interface etc. can not satisfy the demand in present module market, and interface uses dumb.
Summary of the invention
The technical problem to be solved in the present invention is to realize that a kind of cost is lower, heat dispersion better and realize simple wireless communication module.
For solving the problems of the technologies described above, a kind of wireless communication module of the present invention, comprise: printed circuit board (PCB), first sidepiece of this printed circuit board (PCB) is provided with the function components and parts, second sidepiece of this printed circuit board (PCB) is provided with function pin pad and ground connection heat radiation pad, this function pin pad and ground connection heatsink welding dish cart are attached on the respective pad of mainboard, adopt the welding of surface soldered method fixing, on printed circuit board (PCB), also be provided with the radio frequency access device, this radio frequency access device links to each other with antenna on being arranged on mainboard with radio-frequency devices respectively, to realize the transmission of radiofrequency signal.
Further, the radio frequency access device adopts radio frequency connector and/or day wire pin pad.
Further, radio frequency connector is arranged on first sidepiece of printed circuit board (PCB), is connected with antenna by the radio frequency connecting line.
Further, radio frequency connector is one or more.
Further, day wire pin pad is the function pin pad that is arranged on second sidepiece of printed circuit board (PCB), this day the wire pin pad be connected with antenna by the printed circuit board (PCB) cabling on the mainboard.
Further, when the radio frequency access device adopted radio frequency connector and day wire pin pad, radio frequency connector was arranged on about the position on second sidepiece that position and day wire pin pad on first sidepiece of printed circuit board (PCB) be arranged on printed circuit board (PCB) corresponding.
Further, on first sidepiece of printed circuit board (PCB), also be provided with and reduce the screening arrangement that the function components and parts are interfered, this screening arrangement be provided with the isolation part with the corresponding position of radio frequency connector.
Further, radio frequency connector be arranged on printed circuit board (PCB) first sidepiece the position, angle.
In sum, wireless communication module of the present invention is by being provided with function pin pad around printed circuit board (PCB) (PCB) bottom, the ground connection heat radiation pad that is provided for dispelling the heat at middle section, thereby reduced the size of module effectively, SMT (surface-assembled) is also convenient, and it is with low cost, perfect heat-dissipating, welding performance is easy to control, in addition, also be provided with radio frequency connector on the PCB, by the radio frequency connecting line radio frequency connector is connected with antenna on being arranged on mainboard, so that radiofrequency signal is sent to antenna, antenna can be arranged on any position of mainboard, this mode uses simply, flexibly, a day wire pin pad also can be set, and by the PCB cabling connection day wire pin pad and the antenna that is arranged on the mainboard of mainboard, this mode need be considered the impedance matching of antenna when the PCB cabling of design mainboard.
Description of drawings
Fig. 1 is the longitudinal sectional drawing of wireless communication module of the present invention;
Fig. 2 is the function pin pad of wireless communication module of the present invention and the distribution schematic diagram of ground connection heat radiation pad;
Fig. 3 is the schematic diagram that wireless communication module of the present invention is provided with radio frequency connector;
Fig. 4 is the structure chart of the screening arrangement of wireless communication module employing of the present invention.
Embodiment
Consider that the BGA packaging cost is higher in the wireless communication module that has packing forms now, W-SIM module heat dissipating poor-performing and structure are difficult to design, stamp hole encapsulation radiofrequency signal is discontinuous and reliability of technology is poor, PCIE packaging cost height and interface use inconvenience, therefore, present embodiment provides a kind of cost lower, heat dispersion is better and realize simple wireless communication module, this wireless communication module comprises: PCB, first sidepiece of PCB is provided with function components and parts and radio frequency connector, this radio frequency connector is as the radio frequency access device, is connected with antenna on being arranged on mainboard by the radio frequency connecting line.On first sidepiece, also be provided with the screening arrangement of avoiding electromagnetic interference.Second sidepiece of PCB is provided with function pin pad and ground connection heat radiation pad, function pin pad can distribute by hoop on second sidepiece, ground connection heat radiation pad is distributed in the middle position of second sidepiece, when wireless communication module is installed, function pin pad and ground connection heatsink welding dish cart are attached on the mainboard on the corresponding bonding pad, fix by surface soldered methods such as Reflow Solderings.Can comprise a day wire pin pad in the function pin pad on second sidepiece of PCB, this day the wire pin pad be connected with antenna as the PCB cabling of radio frequency access device by mainboard.
Below in conjunction with accompanying drawing the specific embodiment of the present invention is elaborated.
As shown in Figure 1, this wireless communication module comprises PCB1, and this PCB1 adopts FR4 sheet material, and the BT board cost of comparing common employing reduces a lot.First sidepiece 2 of PCB1 is provided with various function components and parts 21, function components and parts 21 can adopt BGA or QFN modes such as (four sides do not have the pin flat packaging) to be welded on first sidepiece 2, wherein, function components and parts 21 comprise two parts, baseband portion and radio frequency part, baseband portion is mainly baseband chip and FLASH chip etc., radio frequency part is mainly radio frequency conversion chip, radio-frequency (RF) power amplification and LNA (LNA) chip etc., and choosing of chip can be chosen the difference of the difference of platform or standard and different according to module.Second sidepiece 3 of PCB1 is provided with function pin pad 31 and ground connection heat radiation pad 32.
As shown in Figure 2, on second sidepiece 3 of PCB1, function pin pad 31 is the function pin along second sidepiece, 3 annular spread, and ground connection heat radiation pad 32 is distributed in the middle position of second sidepiece 3, is used to improve heat dispersion.Major function pin in the function pin pad 31 comprises: USB (USB) interface pin, PCM (digital speech) interface pin, LINE IN/OUT (analog voice input and output) interface pin, UART (universal asynchronous reception/dispensing device) interface pin, JTAG (joint test working group) interface pin, main antenna pin, diversity antenna pin, energization pins etc., these function pins provide profuse communication interface commonly used.When being installed to wireless communication module on the mainboard, press pinout function pin pad 31 and ground connection are dispelled the heat pad 32 Surface Mounts on the corresponding pad of mainboard, weld fixing by surface soldered methods such as Reflow Solderings.And four function pin pads 31 that are in the function pin pad 31 on the diagonal of second sidepiece 3 dimensionally can be bigger than other function pin pads 31 slightly, increases with this wireless communication module is welded to reliability on the mainboard.
The size of ground connection heat radiation pad 32 is more bigger than function pin pad 31, and ground connection heat radiation pad 32 can be directly transferred to the heat of each function components and parts 21 on the mainboard, reaches the purpose of heat radiation.The shape of ground connection heat radiation pad 32 can adopt rectangle, also can adopt square or angle shape etc.The size and the number of ground connection heat radiation pad 32 can design according to the concrete size of module, but should follow the principle of " increase single bonding pad area, reduce number, reduce the entire heat dissipation bonding pad area ".
Wireless communication module can adopt the radio frequency access device 5 of dual mode in the present embodiment, as shown in Figure 3, wherein a kind of is by one jiao of place's welding radio frequency connector 6 at first sidepiece 2 of PCB1, connect radio frequency connector 6 and the antenna that is arranged on the mainboard by the radio frequency connecting line, radiofrequency signal is sent to antenna, and antenna can be arranged on the optional position of mainboard.Should set up being connected of radio-frequency devices and radio frequency connector on first sidepiece 2 of PCB1 in advance, can design one or more radio frequency connectors 6 as required, can insert by radio frequency connector 6 as diversity reception, GPS (global positioning system) also can insert by radio frequency connector 6.
With reference to figure 2, another kind is by on second sidepiece 3 of PCB1 a day wire pin pad 7 being set, should set up being connected of radio-frequency devices and day wire pin pad 7 on first sidepiece 2 of PCB1 in advance, after module welding is fixed to mainboard, it wire pin pad 7 is connected with antenna on the mainboard by the PCB cabling on the mainboard, the PCB cabling of realization by mainboard causes antenna with the radiofrequency signal of module, antenna can be arranged on the optional position of mainboard, this mode is when the PCB cabling of design mainboard, should consider the impedance matching of antenna, as 50 ohm etc.
During specific design, day wire pin pad 7 and radio frequency connector 6 can be set simultaneously, and freely select to use day wire pin pad 7 and radio frequency connector 6 one of them as required.
Figure 4 shows that the screening arrangement 4 that is arranged on first sidepiece 2, this screening arrangement 4 comprises: shielded rack 41 and radome 42, shielded rack 41 are welded on first sidepiece 2, and radome 42 right-hand threads are on shielded rack 41, and shielded rack 41 plays the support effect to radome 42.When first sidepiece 2 is provided with radio frequency connector 6, shielded rack 41 and radome 42 with radio frequency connector 6 corresponding positions on need to be provided with isolation part 43, radio frequency connector 6 is isolated screening arrangement 4, connect antenna to use the radio frequency connecting line.The right angle mode among Fig. 4 can be adopted in isolation part 43, also can adopt isolation method or any other shape of radian.It is simple that the advantage of this kind screening arrangement 4 is that shielded rack 41 and radome 42 made, remove radome 42 after, can directly the function components and parts 21 on first sidepiece 2 of PCB1 be keeped in repair and check that test and debugging makes things convenient for.
Certainly, for the thickness that reduces module also can directly be welded on radome 42 on first sidepiece 2, this mode does not use shielded rack 41 can reduce module thickness.The advantage of this kind mode is to adopt modes such as plastic cement to carry out the branch chamber in radome 42 inside for the function components and parts 21 on first sidepiece 2, airtight performance and shielding properties are better, simultaneously, directly welding radome 42 has removed the size height of shielded rack 41, so can effectively reduce the thickness of module.But owing to adopt the directly mode of welding, so not too convenient for the maintainability test of function components and parts 21.
On radome 42, can also paste the label that records the module relevant information, information such as the standard of record such as module and numbering.
In the communication and industrial circle that the wireless communication module of present embodiment can be applicable to size and heat radiation are had higher requirements.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.Within the spirit and principles in the present invention all, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. wireless communication module, comprise: printed circuit board (PCB) (1), first sidepiece (2) of this printed circuit board (PCB) (1) is provided with function components and parts (21), second sidepiece (3) of this printed circuit board (PCB) (1) is provided with function pin pad (31) and ground connection heat radiation pad (32), this function pin pad (31) and ground connection heat radiation pad (32) Surface Mount are on the respective pad of mainboard, adopt the welding of surface soldered method fixing, on described printed circuit board (PCB) (1), also be provided with radio frequency access device (5), this radio frequency access device (5) links to each other with antenna on being arranged on described mainboard with radio-frequency devices respectively, to realize the transmission of radiofrequency signal.
2. wireless communication module as claimed in claim 1 is characterized in that: described radio frequency access device (5) adopts radio frequency connector (6) and/or day wire pin pad (7).
3. wireless communication module as claimed in claim 2 is characterized in that: described radio frequency connector (6) is arranged on first sidepiece (2) of described printed circuit board (PCB) (1), is connected with described antenna by the radio frequency connecting line.
4. wireless communication module as claimed in claim 3 is characterized in that: described radio frequency connector (6) is for one or more.
5. wireless communication module as claimed in claim 3, it is characterized in that: described sky wire pin pad (7) is connected with described antenna by the printed circuit board (PCB) cabling on the described mainboard for the function pin pad (31) on second sidepiece (3) that is arranged on described printed circuit board (PCB) (1), this day wire pin pad (7).
6. wireless communication module as claimed in claim 5, it is characterized in that: when described radio frequency access device (5) adopts described radio frequency connector (6) and day wire pin pad (7), described radio frequency connector (6) be arranged on first sidepiece (2) of described printed circuit board (PCB) (1) the position with described day the wire pin pad (7) be arranged on about the position on second sidepiece (3) of described printed circuit board (PCB) (1) corresponding.
7. wireless communication module as claimed in claim 3, it is characterized in that: on first sidepiece (2) of described printed circuit board (PCB) (1), also be provided with and reduce the screening arrangement (4) that described function components and parts (21) are interfered, this screening arrangement (4) be provided with isolation part (43) with the corresponding position of described radio frequency connector (6).
8. wireless communication module as claimed in claim 6 is characterized in that: described radio frequency connector (6) be arranged on described printed circuit board (PCB) (1) first sidepiece (2) the position, angle.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010122959A CN101801162A (en) | 2010-02-25 | 2010-02-25 | Wireless communication module |
| PCT/CN2010/075408 WO2011103736A1 (en) | 2010-02-25 | 2010-07-22 | Wireless communication module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010122959A CN101801162A (en) | 2010-02-25 | 2010-02-25 | Wireless communication module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101801162A true CN101801162A (en) | 2010-08-11 |
Family
ID=42596561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010122959A Pending CN101801162A (en) | 2010-02-25 | 2010-02-25 | Wireless communication module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101801162A (en) |
| WO (1) | WO2011103736A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2354826A1 (en) * | 2010-02-04 | 2011-08-10 | Corning Cable Systems LLC | Communications equipment housings, assemblies, and related alignment features and methods |
| CN102195712A (en) * | 2010-02-04 | 2011-09-21 | 康宁光缆系统有限公司 | Communications equipment housings, assemblies, and related alignment features and methods |
| CN103095329A (en) * | 2011-11-07 | 2013-05-08 | 联想(北京)有限公司 | Frequency division signal transmitter-receiver set and electronic equipment |
| CN106252827A (en) * | 2016-09-19 | 2016-12-21 | 武汉天喻聚联网络有限公司 | A kind of modified form radio-frequency antenna and production technology thereof |
| CN106972268A (en) * | 2017-03-30 | 2017-07-21 | 广东欧珀移动通信有限公司 | Circuit board assemblies and electronic equipment |
| CN107920416A (en) * | 2017-11-07 | 2018-04-17 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board and its welding design |
| CN107948355A (en) * | 2017-11-20 | 2018-04-20 | 广东欧珀移动通信有限公司 | The circuit board and terminal device of antenna radiation performance can be improved |
| CN108323005A (en) * | 2018-02-28 | 2018-07-24 | 深圳市沃特沃德股份有限公司 | Pad structure and circuit board |
| CN116500427A (en) * | 2023-06-27 | 2023-07-28 | 合肥联宝信息技术有限公司 | Power supply connecting device for motherboard test |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108429564B (en) * | 2016-02-25 | 2019-10-25 | Oppo广东移动通信有限公司 | The design method and mobile terminal of impedance matching circuit |
| CN105682360B (en) * | 2016-02-25 | 2018-12-11 | 广东欧珀移动通信有限公司 | High-frequency model and mobile terminal |
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- 2010-07-22 WO PCT/CN2010/075408 patent/WO2011103736A1/en active Application Filing
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| CN2689498Y (en) * | 2004-02-24 | 2005-03-30 | 联想(北京)有限公司 | Connector for module and mother board |
| CN2829092Y (en) * | 2005-07-12 | 2006-10-18 | 华为技术有限公司 | Module circuit assembly |
| US20070148816A1 (en) * | 2005-12-22 | 2007-06-28 | International Business Machines Corporation | Attachment of a QFN to a PCB |
| WO2008005593A2 (en) * | 2006-06-30 | 2008-01-10 | Motorola, Inc. | Apparatus for providing radio frequency shielding and heat dissipation for electronic components |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2354826A1 (en) * | 2010-02-04 | 2011-08-10 | Corning Cable Systems LLC | Communications equipment housings, assemblies, and related alignment features and methods |
| CN102195712A (en) * | 2010-02-04 | 2011-09-21 | 康宁光缆系统有限公司 | Communications equipment housings, assemblies, and related alignment features and methods |
| US8593828B2 (en) | 2010-02-04 | 2013-11-26 | Corning Cable Systems Llc | Communications equipment housings, assemblies, and related alignment features and methods |
| CN102195712B (en) * | 2010-02-04 | 2015-09-30 | 康宁光缆系统有限公司 | Communication equipment outer cover, assembly and relevant aligning parts and method |
| CN103095329A (en) * | 2011-11-07 | 2013-05-08 | 联想(北京)有限公司 | Frequency division signal transmitter-receiver set and electronic equipment |
| CN103095329B (en) * | 2011-11-07 | 2015-07-29 | 联想(北京)有限公司 | A kind of frequency division signal transmitter-receiverset set and electronic equipment |
| CN106252827A (en) * | 2016-09-19 | 2016-12-21 | 武汉天喻聚联网络有限公司 | A kind of modified form radio-frequency antenna and production technology thereof |
| CN106252827B (en) * | 2016-09-19 | 2023-10-27 | 武汉天喻聚联网络有限公司 | Improved radio frequency antenna and production process thereof |
| CN106972268A (en) * | 2017-03-30 | 2017-07-21 | 广东欧珀移动通信有限公司 | Circuit board assemblies and electronic equipment |
| CN107920416A (en) * | 2017-11-07 | 2018-04-17 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board and its welding design |
| CN107948355A (en) * | 2017-11-20 | 2018-04-20 | 广东欧珀移动通信有限公司 | The circuit board and terminal device of antenna radiation performance can be improved |
| CN107948355B (en) * | 2017-11-20 | 2020-03-10 | Oppo广东移动通信有限公司 | Circuit board capable of improving antenna radiation performance and terminal equipment |
| CN108323005A (en) * | 2018-02-28 | 2018-07-24 | 深圳市沃特沃德股份有限公司 | Pad structure and circuit board |
| CN108323005B (en) * | 2018-02-28 | 2024-01-30 | 深圳市沃特沃德信息有限公司 | Bonding pad structure and circuit board |
| CN116500427A (en) * | 2023-06-27 | 2023-07-28 | 合肥联宝信息技术有限公司 | Power supply connecting device for motherboard test |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011103736A1 (en) | 2011-09-01 |
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Application publication date: 20100811 |