CN101804526A - Welding material containing diamond grains and preparation method thereof - Google Patents
Welding material containing diamond grains and preparation method thereof Download PDFInfo
- Publication number
- CN101804526A CN101804526A CN 201010127960 CN201010127960A CN101804526A CN 101804526 A CN101804526 A CN 101804526A CN 201010127960 CN201010127960 CN 201010127960 CN 201010127960 A CN201010127960 A CN 201010127960A CN 101804526 A CN101804526 A CN 101804526A
- Authority
- CN
- China
- Prior art keywords
- diamond grains
- metal
- welding material
- plated film
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a welding material containing diamond grains and a preparation method thereof. The welding material comprises a soldering material and a plurality of coated diamond grains mixed with the soldering material, wherein a metallic carbide coating are formed on the surface of the diamond grain, and at least one metal coating is formed on the metallic carbide coating thereby forming a coated diamond grain. By the aid of the metallic carbide coating on the surface of the diamond gain, the metal coating can be stably bonded with the diamond grain and can not be detached from the diamond grain due to multicycle heating and cooling, so that the coated diamond grains can be uniformly mixed in the soldering material; and by adjusting the size and the ratio of the coated diamond grains, welding materials with different properties can be made, so that the welding material containing the diamond grains can adapt to different purposes.
Description
Technical field
The present invention relates to a kind of welding material and preparation method who contains diamond grains, especially be applied to contain in microelectronics Packaging and the radiator structure welding material of diamond grains.
Background technology
The encapsulation of general electronic building brick or with electronic building brick as (LED, CPU, GPU etc.) be incorporated on the metal heat sink, need utilize solder technology to make welding material as articulamentum usually, the heat that high-power electronic building brick is produced passes to metal heat sink and dispels the heat.Contain tin in the welding material, the thermal conductivity of tin is 66.6W/ (mK), and far below the 401W/ (mK) of copper, therefore in the process that heat passes, the soldering-tin layer of low heat conductivity can cause very big thermal resistance, reduces hot transfer efficiency.
U.S. Pat 6,365,973, disclose a kind of filling soldering tin material, comprise that a soldering tin material contains a plurality of plated film filler particles, wherein this plated film filler particles changes the thermal coefficient of expansion (coefficient of thermal expansion) of filling soldering tin material.The plated film filler particles is by the material coating one deck with low thermal coefficient of expansion can to produce the coating layer of wetting action made with soldering tin material; The material of filler particles such as graphite (graphite), carbon fiber (carbon fiber), diamond (diamond), boron nitride (boron nitride), aluminium nitride (aluminum nitride), carborundum (silicon carbide), silicon nitride (silicon nitride), zinc oxide (zinc oxide), aluminium (alumina), titanium diboride (titanium diboride) and silica (silica) etc.; The material of coating layer such as cobalt, copper, cupric oxide, nickel, iron, tin, tin ash, zinc and its alloy etc.
Though the filling soldering tin material that above-mentioned United States Patent (USP) discloses contains diamond grains, can increase its heat transfer efficiency, but diamond grains if directly be coated with one deck can with the metal material of soldering tin material wetting action, diamond can't produce chemical bonded refractory with metal and combine, this metal material is difficult to firm attachment in the surface of diamond grains, intensification and cooling through repeatedly circulation, because both thermal expansion coefficient differences are too big, being easy to cause metal material and diamond grains to produce breaks away from, reduce weld strength and increase thermal resistance, make and fill the function that soldering tin material loses welding.
Summary of the invention
For improving the known welding material that contains diamond grains, make diamond grains more firm, and, make the welding material that is fit for various uses, and propose the present invention by the size of selecting diamond grains and the ratio that occupies with combining of soldering tin material.
A kind of welding material that contains diamond grains comprises: a soldering tin material; A plurality of plated film diamond grains mix mutually with this soldering tin material; Wherein these a plurality of plated film diamond grains comprise respectively:
One diamond grains, its surface has a metal-carbide coating;
At least one deck coat of metal is incorporated into this metal-carbide coating surface;
Wherein this metal-carbide coating is in order to help this diamond grains and this coat of metal stable bond.
A kind of preparation method who contains the welding material of diamond grains comprises the steps:
Step 2; With above-mentioned program, plate layer of metal coating and form the plated film diamond grains with diamond grains of metallic carbide coating with chemical plating or plating; The metal of this metal-plated rete is including but not limited to following material: gold, silver, copper, iron, aluminium, nickel, cobalt, titanium, tungsten, chromium, tin, zinc or its alloy material.
Step 3; Plated film diamond grains and soldering tin material are uniformly mixed to form the welding material of diamond grains; Wherein the coat of metal of plated film diamond grains can produce wetting action with soldering tin material and mixes in order to even; The material of soldering tin material is including but not limited to following material: tin, silver, copper, bismuth or lead.
A kind of purposes that contains the welding material of diamond grains, the welding material that contains the plated film diamond grains are used to make LED, CPU or GPU electronic building brick to be welded in metal heat sink.
Main purpose of the present invention, a kind of welding material that contains diamond grains is being provided, has a metal-carbide coating between the diamond grains wherein and the coat of metal of wetting action, therefore the coat of metal can combine with diamond grains and brazing metal are firm, and the plated film diamond grains can be mixed in the soldering tin material uniformly.
Another object of the present invention is providing a kind of welding material that contains diamond grains, by the size of adjusting the plated film diamond grains and the volume ratio that occupies, makes welding material of different nature, makes the welding material that contains diamond grains can be fit to different purposes.
Advantage of the present invention is: because the metal-carbide coating on diamond grains surface helps diamond grains and coat of metal stable bond, more can not lose combination, the plated film diamond grains can be blended in the soldering tin material uniformly because of producing to break away from through the intensification of repeatedly circulation and cooling; And, make welding material of different nature by the size of adjusting the plated film diamond grains and the ratio that occupies, make the welding material that contains diamond grains can be fit to different purposes.
Other purpose of the present invention, effect see also figure and embodiment, are described in detail as follows.
Description of drawings
When considered in conjunction with the accompanying drawings, by the reference following detailed, can more completely understand the present invention better and learn wherein many attendant advantages easily, but accompanying drawing described herein is used to provide further understanding of the present invention, constitute a part of the present invention, illustrative examples of the present invention and explanation thereof are used to explain the present invention, do not constitute to improper qualification of the present invention, wherein:
Fig. 1 contains the schematic diagram of the welding material of diamond grains for the present invention.
Fig. 2 is the schematic diagram of plated film diamond grains of the present invention.
Fig. 3 contains the schematic diagram of the welding material application examples of diamond grains for the present invention.
The primary clustering symbol description:
The welding material 1 that contains diamond grains; Soldering tin material 11; Plated film diamond grains 12; Diamond grains 121; Metal-carbide coating 122; The coat of metal 123; Electronic building brick 2; Metal heat sink 3.
The specific embodiment
Referring to figs. 1 through Fig. 3 embodiments of the invention are described.
As shown in Figure 1, 2, 3, the present invention ties up to and adds certain volume ratio and a certain size plated film diamond grains 12 in the soldering tin material 11, because the thermal conductivity of diamond grains 121 is 1200-2000W/ (mK), thermal conductivity much larger than tin is 66.6W/ (mK), therefore can significantly increase the thermal conductivity of welding material 1.But because do not have wetting action between diamond grains 121 and the soldering tin material 11, so when soldering tin material 11 is heated thawing, the diamond grains 121 that proportion is lighter can be taken away by the scaling powder in the soldering tin material 11, float and to use, therefore need plate one deck on the surface of diamond grains 121 and can produce the coat of metal 123 of wetting actions with soldering tin material 11 on the surface of soldering tin material 11.But, the surface of diamond grains 121 can't the Direct Electroplating coat of metal 123, so need utilize little evaporation or vacuum evaporation or sputtering sedimentation earlier, generate layer of metal carbide coating 122 on the surface of diamond grains 121 through methods such as high temperature program reactions then, plate the required coat of metal 123 in carbide coating 122 surfaces again, could produce wetting action with soldering tin material 11.
As shown in Figure 1, 2, 3, the present invention contains the welding material 1 of diamond grains, comprises that a soldering tin material 11 (solder material) reaches and its a plurality of plated film diamond grains 12 that mix mutually; Metal-carbide coating 122 surface that this plated film diamond grains 12 is included in diamond grains 121 surfaces is in conjunction with layer of metal coating 123 at least; Metal-carbide coating 122 by diamond grains 121 surfaces helps diamond grains 121 and the coat of metal 122 stable bond.The thermal coefficient of expansion of metal-carbide coating 122 is between the thermal coefficient of expansion of the thermal coefficient of expansion of diamond grains 121 and the coat of metal 123.
The metal-carbide coating 122 that has buffering between the diamond grains 121 of plated film diamond grains 12 of the present invention and the coat of metal 123, though intensification and cooling through repeatedly circulation, more can be too not big because of both thermal expansion coefficient differences of diamond grains 121 and the coat of metal 123, and cause the coat of metal 123 and diamond grains 121 to produce disengaging and lose combination, make the welding material 1 that contains diamond grains have more firm welding function.
The volume of plated film diamond grains 121 of the present invention be soldering tin material 11 volume 5% to 30%, be the best wherein with 10% to 20%, when surpassing 30%, can reduce weld strength.The size of diamond grains 121 be 0.001mm (millimeter) to 0.2mm, be the best wherein with 0.005 to 0.02mm.The kind of diamond grains 121 can be HTHP (HTHP) rhinestone.
As shown in Figure 1, 2, 3, the present invention contains the method for making of the welding material 1 of diamond grains, comprises the steps:
1. diamond grains 121 can be formed the metal material of carbide with diamond grains 121 with little evaporation or vacuum evaporation or sputtering sedimentation program coating one deck, as contain chromium, molybdenum, tungsten, titanium, vanadium, tantalum, zirconium, silicon (Cr, Mo, W, Ti, V, Ta, Zr Si) waits material, then through after the reaction of high temperature program, the metal material of above-mentioned coating can form metal-carbide coating 122 with the carbon reaction of diamond grains 121, as CrC, and MoC, WC, TiC, VC, TaC, ZrC, SiC etc.
2. with above-mentioned program, plate layer of metal coating 123 and form plated film diamond grains 12 with diamond grains 121 of metallic carbide coating 122 with chemical plating or plating; The metal of this metal-plated rete 123 is including but not limited to following material: materials such as gold, silver, copper, iron, aluminium, nickel, cobalt, titanium, tungsten, chromium, tin, zinc or its alloy.
3. plated film diamond grains 12 and soldering tin material 11 are uniformly mixed to form the welding material 1 of diamond grains; Wherein the coat of metal 123 of plated film diamond grains 12 can mix in order to even with soldering tin material 11 generation wetting actions; The material of soldering tin material 11 is including but not limited to following material: tin, silver, copper, bismuth or lead etc.
As shown in Figure 3, a kind of purposes that contains the welding material of diamond grains, the welding material that contains the plated film diamond grains is used to make LED, CPU or GPU electronic building brick to be welded in metal heat sink.
The present invention contains the welding material 1 of plated film diamond grains, with so that be welded on the metal heat sink 3 as electronic building bricks 2 such as LED, CPU, GPU; The welding material 1 that contains the plated film diamond grains has preferable heat conduction function, the heat that electronic building brick 2 produces can be conducted to metal heat sink 3 fast and carry out thermolysis; And what welding material 1 energy that contains diamond grains was firm is welded in metal heat sink 3 in conjunction with electronic building brick 2.
The present invention contains the welding material of diamond grains, has a metal-carbide coating between the diamond grains of its plated film diamond grains and the coat of metal of wetting action, therefore the coat of metal can combine with diamond grains is firm, more can be because of not breaking away from and lose combination through the intensification of repeatedly circulation and cooling, and the plated film diamond grains can be mixed in the soldering tin material uniformly; And, make welding material of different nature by the size of adjusting the plated film diamond grains and the volume ratio that occupies, make the welding material that contains diamond grains can be fit to different purposes.
As mentioned above, embodiments of the invention are explained, but as long as not breaking away from inventive point of the present invention and effect in fact can have a lot of distortion, this will be readily apparent to persons skilled in the art.Therefore, such variation also all is included within protection scope of the present invention.
Claims (10)
1. a welding material that contains diamond grains is characterized in that comprising: a soldering tin material; A plurality of plated film diamond grains mix mutually with this soldering tin material; Wherein these a plurality of plated film diamond grains comprise respectively:
One diamond grains, its surface has a metal-carbide coating;
At least one deck coat of metal is incorporated into this metal-carbide coating surface;
Wherein this metal-carbide coating is in order to help this diamond grains and this coat of metal stable bond.
2. the welding material that contains diamond grains according to claim 1 is characterized in that wherein the size of this diamond grains is 0.001 millimeter to 0.2 millimeter; Or wherein the volume of these a plurality of plated film diamond grains be this soldering tin material volume 5% to 30%.
3. the welding material that contains diamond grains according to claim 1 is characterized in that wherein the size of this diamond grains is 0.005 millimeter to 0.02 millimeter; The volume of these a plurality of plated film diamond grains be this soldering tin material volume 10% to 20%; Or wherein this diamond grains is the HTHP rhinestone.
According to claim 2 to 3 described in each described welding material that contains diamond grains, it is characterized in that wherein this diamond grains system is with little evaporation or vacuum evaporation or one of them person of sputtering sedimentation program, coating one deck can form the metal material of carbide with this diamond grains, through after the reaction of high temperature program, this metal material and the reaction of this diamond grains form this metal-carbide coating then.
5. the welding material that contains diamond grains according to claim 4 is characterized in that wherein this metal-carbide coating surface system by one of them person of program with chemical plating or plating, in conjunction with this one deck coat of metal at least; The thermal coefficient of expansion of this metal-carbide coating is between the thermal coefficient of expansion of the thermal coefficient of expansion of this diamond grains and this coat of metal.
6. according to claim 5 have a welding material that contains diamond grains, it is characterized in that wherein this metal-carbide coating be chromium, tungsten, titanium, vanadium, molybdenum, tantalum, zirconium or silicon respectively with one of them person of carbon compound.
7. according to claim 6 have a welding material that contains diamond grains, it is characterized in that wherein this at least the material of one deck coat of metal be gold, silver, copper, iron, aluminium, nickel, cobalt, titanium, tungsten, chromium, tin, zinc or one of them person of its alloy.
8. according to claim 7 have a welding material that contains diamond grains, it is characterized in that wherein this soldering tin material comprises tin, silver, copper, bismuth or plumbous one of them person.
9. a preparation method who contains the welding material of diamond grains is characterized in that comprising the steps:
Step 1; With the metal material of diamond grains with little evaporation or vacuum evaporation or sputtering sedimentation program coating one deck and diamond grains formation carbide, include chromium, molybdenum, tungsten, titanium, vanadium, tantalum, zirconium or silicon materials, then through after the reaction of high temperature program, the metal material of above-mentioned coating and the reaction of the carbon of diamond grains form metal-carbide coating, CrC is arranged, MoC, WC, TiC, VC, TaC, ZrC, SiC.
Step 2; With above-mentioned program, plate layer of metal coating and form the plated film diamond grains with diamond grains of metallic carbide coating with chemical plating or plating; The metal of this metal-plated rete is including but not limited to following material: gold, silver, copper, iron, aluminium, nickel, cobalt, titanium, tungsten, chromium, tin, zinc or its alloy material.
Step 3; Plated film diamond grains and soldering tin material are uniformly mixed to form the welding material of diamond grains; Wherein the coat of metal of plated film diamond grains can produce wetting action with soldering tin material and mixes in order to even; The material of soldering tin material is including but not limited to following material: tin, silver, copper, bismuth or lead.
10. a purposes that contains the welding material of diamond grains is characterized in that the welding material that contains the plated film diamond grains is used to make LED, CPU or GPU electronic building brick to be welded in metal heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010127960 CN101804526A (en) | 2010-03-19 | 2010-03-19 | Welding material containing diamond grains and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010127960 CN101804526A (en) | 2010-03-19 | 2010-03-19 | Welding material containing diamond grains and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101804526A true CN101804526A (en) | 2010-08-18 |
Family
ID=42606566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010127960 Pending CN101804526A (en) | 2010-03-19 | 2010-03-19 | Welding material containing diamond grains and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101804526A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85100286A (en) * | 1985-04-01 | 1986-08-27 | 林增栋 | The technology of diamond surface metallization |
| US4968326A (en) * | 1989-10-10 | 1990-11-06 | Wiand Ronald C | Method of brazing of diamond to substrate |
| US6365973B1 (en) * | 1999-12-07 | 2002-04-02 | Intel Corporation | Filled solder |
| US20030150604A1 (en) * | 2002-02-08 | 2003-08-14 | Koning Paul A. | Polymer with solder pre-coated fillers for thermal interface materials |
-
2010
- 2010-03-19 CN CN 201010127960 patent/CN101804526A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85100286A (en) * | 1985-04-01 | 1986-08-27 | 林增栋 | The technology of diamond surface metallization |
| US4968326A (en) * | 1989-10-10 | 1990-11-06 | Wiand Ronald C | Method of brazing of diamond to substrate |
| US6365973B1 (en) * | 1999-12-07 | 2002-04-02 | Intel Corporation | Filled solder |
| US20030150604A1 (en) * | 2002-02-08 | 2003-08-14 | Koning Paul A. | Polymer with solder pre-coated fillers for thermal interface materials |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105112754B (en) | Three-dimensional network diamond framework strengthens metal-base composites and preparation method | |
| EP1477467B1 (en) | Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate | |
| CN101545057B (en) | Method for preparing diamond/Cu composite material with high heat conductivity | |
| US8921996B2 (en) | Power module substrate, power module, and method for manufacturing power module substrate | |
| CN105220049B (en) | A kind of lamellar diamond reinforced metal-base composite material and preparation method | |
| US9095062B2 (en) | Power module substrate, power module, and method for manufacturing power module substrate | |
| CN104884411B (en) | Bonded material and method for producing same | |
| CN106238962A (en) | A kind of active solder alloy | |
| CN110387217A (en) | A kind of high-performance compound thermal interfacial material and preparation method thereof | |
| US20070243407A1 (en) | Machinable Metallic Composites | |
| US20060263584A1 (en) | Composite material, electrical circuit or electric module | |
| CN105774130B (en) | A kind of high heat conduction high-air-tightness composite and preparation method thereof | |
| JP2006045596A (en) | Composite body with high thermal conductivity and low thermal expansion, and its manufacturing method | |
| KR100945270B1 (en) | Low thermal expansion composite materials and manufacturing method the same | |
| CN201766072U (en) | Diamond particle used for welding material | |
| CN108155162A (en) | A kind of three-dimensional high heat conduction highly exothermic of no glue laminating and preparation method thereof | |
| CN101804526A (en) | Welding material containing diamond grains and preparation method thereof | |
| TWI380869B (en) | Welding materials containing diamond particles | |
| CN110933899A (en) | Composite heat conducting sheet, preparation method thereof and heat radiating piece | |
| CN104096938B (en) | A kind of diamond surface activating process based on brazing mode | |
| CN113860903B (en) | Preparation method of high-thermal-conductivity graphite-copper composite board | |
| JP2898877B2 (en) | Aluminum nitride sintered body having conductive metallized layer and method of manufacturing the same | |
| CN107099775A (en) | The preparation method of CIGS target material metal layer | |
| Dai et al. | Reaction wetting behaviour of improved Ti-based brazing fillers on carbon/carbon composites at 1423–1573 K | |
| TW201010585A (en) | Heat-dissipation structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100818 |