CN101895026A - 表面安装连接器 - Google Patents
表面安装连接器 Download PDFInfo
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- CN101895026A CN101895026A CN201010213237XA CN201010213237A CN101895026A CN 101895026 A CN101895026 A CN 101895026A CN 201010213237X A CN201010213237X A CN 201010213237XA CN 201010213237 A CN201010213237 A CN 201010213237A CN 101895026 A CN101895026 A CN 101895026A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
Abstract
一种安装于电路基板上的电连接器,包括具有主体的壳体,所述主体包括当连接器安装到基板上时面向基板的第一面,以及第二面,所述主体具有形成在其中的多个在第一面和第二面之间延伸用于接纳触头的第一孔,以及形成在其中的多个在第一面和第二面之间延伸的第二孔。
Description
技术领域
本发明涉及电连接器领域。更具体的,本发明涉及一种表面安装连接器,例如焊球网格阵列连接器(BGA连接器),其特征为允许空气在连接器中流通。
背景技术
表面安装连接器,例如BGA连接器,通常包括安装在壳体中的多个导电触头。每个导电元件具有连接于其尾部的焊球。焊球共同构成焊球网格阵列。
焊球用来在连接器和基板(例如其上安装连接器的印刷电路板(PCB))之间形成机电连接。通过加热焊球使其达到熔点将连接器安装到基板上。随后,熔化后的焊球冷却并再次硬化从而在连接器和基板之间形成焊接连接。
可将连接器和基板置于一对流式回流炉内对焊球进行加热。对流式回流炉直接对连接器上方的空气进行加热。通过传导与对流相结合的热传输方式,热量直接或间接地传输到焊球上。
在整个焊球网格阵列中,热量传输到各个焊球的速度通常是不同的。特别地,加热后的空气首先接触连接器的最外表面以及焊球网格阵列中最外侧的焊球,也就是位于靠近焊球网格阵列外周处的焊球。因此,最外侧的焊球比最内侧(即位于中心处)的焊球会接收到更多的热量。
通过降低连接器和电路基板通过对流式回流炉的速度的方法,即增加连接器和基板在对流式回流炉停留的时间,便可以对连接器的最内侧部分施加足够多的热量以熔化位于中心的焊球。但这种方法降低了对流式回流炉的工作效率,即,使对流式回流炉在单位时间内处理的连接器和基板对的数量减少。
另一种方法就是提高对流式回流炉内空气的加热温度。然而,这种方法可能导致连接器、基板或其组件产生难以预料的损坏。
发明内容
为了解决表面安装连接器中诸如焊球等可熔元件的加热不均问题,本发明的电连接器具有导热通道,和与导热通道流体连通的其他通道。通常,本发明一方面是指将连接器的中心部更多地暴露到:(1)回流过程的热空气中;和(2)周围的气流中以便促进操作中对连接器的冷却。
在一优选实施例中,电连接器包括具有主体的壳体,所述主体形成有穿过其中的触头接纳孔、以及沿着与所述触头接纳孔大致相同方向穿过其中的导热孔,所述导热孔促进空气流通过所述主体。
在一优选的实施例中,安装于电路基板上的电连接器包含多个嵌件成型的引线框架组件(insert-molded leadframe assemblies,IMLA),每个组件包括框架和安装在所述框架上的多个导电触头。连接器还包括具有主体的壳体,所述主体包括当连接器安装到基板上时面向基板的第一面,以及第二面。主体具有形成在其中的多个在第一面和第二面之间延伸用于接纳触头的第一孔,以及形成在其中的多个在第一面和第二面之间延伸的第二孔。
IMLA紧固于壳体上,使得壳体的第一面和相邻的IMLA限定邻接于所述多个第二孔的通路。
在另一个优选的实施例中,电连接器包括第一导电触头线性阵列和第二导电触头线性阵列;多个可熔元件,每个所述可熔元件与对应的一个触头相连;以及具有主体的壳体。所述主体具有形成在其中的第一线性阵列的孔和第二线性阵列的孔,用于接纳相应的第一触头线性阵列和第二触头线性阵列,以及位于第一线性阵列的孔和第二线性阵列的孔之间的第三线性阵列的孔,用于允许气流流通过主体。
附图说明
通过阅读下文对具体实施方式的描述并结合附图说明,将有助于上文所述的发明内容的理解。为了更好的描述本发明,附图示出的是一目前优选的实施例。然而本发明并不限于附图中公开的具体手段。在附图中:
图1是一个BGA类型的表面安装连接器的优选实施例的俯视图;
图2是图1中所示的BGA类型连接器的侧视图;
图3是图1和图2中所示的BGA类型连接器安装于基板上的侧视图;
图4是图1-3中所示BGA类型连接器的仰视图;图中未显示连接器薄板;
图5是图1-4中所示的BGA类型连接器的IMLA的透视图。
具体实施方式
各附图示出了BGA类型连接器10的一优选实施方式。各附图都采用一相同的坐标系20。如图3所示,连接器10可安装于基板11上。该连接器10包括壳体12,以及与所述壳体10机械耦接的多个IMLA 14。
每个IMLA 14包括导电触头16。每个IMLA 14还包括包覆成型(overmold)的框架18用于接纳触头16,使得每个IMLA 14的触头16形成一个线性阵列。如图5所示,框架18由例如塑料等合适的电绝缘材料制成。而连接器10又承载IMLA 14。根据所需的触头密度,可应用任何数量的IMLA 14或者导电触头16。
如图5所示,每一触头16具有配合部28。触头16例如可以是柔性的双柱配合触头,其中配合部28包括两个接触柱30。当连接器10与另一连接器或电装置耦接时,每个触头16的接触柱30能够接纳另一连接器或电装置的互补接触柱(图中未示出)。
每个触头16还包括邻接配合部28的中间部32,和邻接中间部32的尾部34。每个IMLA 14的框架18被围绕相应触头16的中间部32或其它适合部分成型。位于每个IMLA 14的相对端的触头16每个可包括翼片38,下文将介绍其用途。
作为可选的实施方式,触头16可采用其他结构。例如,作为备选方案,触头可以包括具有两个弹性梁的尾部。该类型的触头在2004年12月23日申请的美国专利申请No 11/022,137中进行了描述,上述美国专利申请中的每一个内容整体结合在此作为参考。
连接器10优选地包括多个焊球40形式的可熔元件,以及薄板41。各焊球40附着于相应的触头16的尾部34。如图4所示,焊球40共同组成了连接器10下部的焊球网格阵列42。
如图2和3所示,薄板41设置于焊球网格阵列42和IMLA 14的框架18之间。薄板41上具有多个孔和可选的插口,每个孔对应于一个可选的插口。每个触头16的尾部34通过对应的孔穿过薄板41。使用时,在第一回流操作中,各插口接纳对应的焊球40的一部分。插口有利于焊球40相对于触头16的尾部34定位。如下文所述,当连接器10被安装在基板11上时,焊球40在第二回流操作中熔化以在连接器10和基板11之间形成焊接连接92。
结合图2、3中所示的参考方向,同时使用如“之上”,“之下”,“上部”,“下部”等指示方向的词语。这些词语只作举例说明使用,除非特别说明,否则不应视为对本发明的限制。
壳体12包括主体50,主体50具有上部表面,或叫配合面52,和下部表面,或叫安装面54。配合面52和安装面54分别较好的展示在了图1和4中。主体50还包括邻接配合面52和安装面54各自外侧边缘的侧部56。
如图1所示,主体50上具有多个触头接纳孔70。触头接纳孔70在配合面52和安装面54之间延伸,每个触头接纳孔70接纳对应的一个触头16的配合部28。触头接纳孔70的排列方式为与由各IMLA 14组成的触头16的线性阵列相匹配。
如图1-3所示,壳体12还包括多个保持支脚60。保持支脚60从两相对的侧部56向下延伸。每个保持支脚60内部具有槽62。
相对的每对保持支脚60保持对应的一个IMLA 14。特别的,每个保持支脚60中的槽62接纳一个IMLA 14的最外侧触头16上的一个对应翼片38。翼片38和槽62的尺寸被设置成使每个翼片38和对应的槽62密配合,以此将最外侧触头16以及其余对应的IMLA 14固定到壳体12上。
如图2-4所示,相邻的保持支脚60之间具有一定的间隔。每个IMLA 14的框架18的宽度,或“x”方向上的尺寸,近似等于保持支脚60的宽度,或“x”方向上的尺寸。所述的保持支脚60的间隔使得相邻的IMLA 14的框架18之间具有对应的间隔。间隔结构在相邻框架18之间形成了孔隙或通路72。每个通路72由相邻的框架68以及安装面54的相邻部分限定。通路72在与框架18大致相同的方向上延伸,即通路72大致沿“y”方向延伸。
如下文所述,当焊球40熔化以在连接器10和基板11之间形成焊接连接92时,通路72可以促进空气流通以利于加热焊球40。因此,每个通路72的宽度,或者“x”方向上的尺寸应足够大以促进空气流过。在连接器10中,每个通路72的宽度近似等于保持支脚60和框架18的宽度的一半。应当注意的是,这里特殊的尺寸关系仅用于举例说明。其他的尺寸关系同样适用。例如,通道72的宽度可以根据需要的触头密度增加或者减少。
如图1和4所示,主体50上形成有多个导热孔88。导热孔88在配合面52和安装面54之间延伸。如下文所述,在焊球40熔化以在连接器10和基板11之间形成焊接连接92时,导热孔88可以促进空气流通以利于加热焊球40。
优选地可将一排导热孔88设置在两排相邻的触头接纳孔70之间。每个导热孔88的底部与相对应的通路72流体连通。尽管优选地设置有五排或者更多排的导热孔88,但每排导热孔88上孔的数量可以为任意多个。导热孔70优选地为矩形,但也可以采用其他形状。
如上文所述,当连接器10被安装到基板11时,焊球40在回流操作中熔化以形成连接器10和基板11之间的焊接连接92。特别地,连接器10优选地置于基板11上,以使每个焊球与基板11上的导电触头垫90基本对准。然后,连接器10和基板11被诸如热空气等热激介质(thermally-excited medium)加热。
对焊球40的加热最终使得焊球40熔化并在对应的每对触头16和焊接垫90之间形成焊接连接92。焊接连接92如图3所示。
允许由焊球40得到的液态焊料在连接器10和基板11离炉后冷却。一旦冷却,液态焊料便固化成为焊接连接92。焊接连接92将连接器10与基板11上的触头垫90机电耦接在一起。
导热孔88和通路72增加了对焊球40的热传输速度。特别的,如上文所述,导热孔88邻接通路72。因此,导热孔88和通路72为热空气流过连接器10提供了流体通道。
一旦进入通路72,一些热空气可以通过在薄板41中形成的附加孔(例如在触头端/焊球端的行和列之间)到达焊球40,加快了对焊球40的热传输速度。此外,在包括通路72的连接器10的结构中还会出现对流热传输。例如,热空气可以加热IMLA 14中的框架18。从框架18至对应的触头16和焊球40的对流热传输可进一步加热焊球40。
因此,导热孔88和通路72可以增加到焊球40的热传输速度,特别是可以增加到焊球网格阵列42的最内侧位置,即,位于中心的焊球40的热传输速度。因此,导热孔88和通路72有助于明显减少和消除在回流过程中出现的、触头16的最外侧温度和最内侧温度不一致的情况。
因此,导热孔88和通路72使得不必将连接器10和电路基板11在炉内进行过高温度或者过长时间的加热,仍然能够保证内部焊球40得到充分的加热。另外,导热孔88和通路72能够使焊接连接92更均匀、完整和可靠。另外,热气流使得更容易将已经焊接到基板上的连接器移除。对于已经焊接到基板上连接器而言,其底部与基板的表面之间具有较小的间隙。这将使得加热BGA图案上的内部点处的焊接连接更加困难。本发明正是有助于解决该问题。
导热孔88和通路72可以与其他技术同时使用以加热焊球。例如,连接器10,以及在与此有关的其他实施方式中,可以安装到一个帽上,有关帽的描述参见2003年1月10日申请的美国专利申请(No.10340,279),上述美国专利申请中的每一个内容整体结合在此作为参考。本发明还可通过阻塞导热孔88和通路72的方法来延迟焊球40的熔化。
此外,在操作时,导热孔88和通路72促进连接器10周围的空气循环,以利于冷却连接器10。
应当理解,前述的描述仅仅用于解释的目的,并非被解释作为对本发明的限制。在此所使用的词语是用于说明和解释的词语,而不是用于限制的词语。另外,虽然在此参考特定结构、材料和/或实施例描述了本发明,但是本发明不应被限制为所公开的实施方式。相反,本发明应扩展到所有功能上等效的结构、方法和使用,例如在所附权力要求的范围内。本领域普通技术人员在具有本说明书的教导之后,可以对此做出各种改型,并且没有偏离本发明的在这方面的范围和精神的情况下可以做出各种改变。
例如,在另一可选的实施方式中,连接器10可以不具有通道72或者导热孔88。换句话说,在可选实施方式中可以包括通路72而不具有导热孔88。其他可选实施方式可以包括导热孔88而不包括通路72。甚至,本发明的方法可应用于插头连接器,和插座连接器。本发明的方法可以用于任意类型的表面安装部件中,并不仅限于直角连接器。
Claims (8)
1.一种安装于电路基板上的电连接器,包括具有主体的壳体,所述主体包括当连接器安装到基板上时面向基板的第一面,以及第二面,所述主体具有形成在其中的多个在第一面和第二面之间延伸用于接纳触头的第一孔,以及形成在其中的多个在第一面和第二面之间延伸的第二孔。
2.根据权利要求1所述的电连接器,其中所述电连接器是插头连接器。
3.根据权利要求1所述的电连接器,其中电连接器是插座连接器。
4.根据权利要求1所述的电连接器,进一步包括附着于相应的电触头尾部的焊球。
5.根据权利要求4所述的电连接器,其中焊球共同组成了焊球网格阵列。
6.根据权利要求4所述的电连接器,进一步包括包覆成型的框架,所述框架接纳电触头。
7.根据权利要求6所述的电连接器,进一步包括设置于所述焊球和所述包覆成型的框架之间的薄板。
8.根据权利要求7所述的电连接器,薄板进一步包括多个插口,插口定位焊球。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US64856105P | 2005-01-31 | 2005-01-31 | |
US60/648,561 | 2005-01-31 | ||
US11/284,154 US7384289B2 (en) | 2005-01-31 | 2005-11-21 | Surface-mount connector |
US11/284,154 | 2005-11-21 |
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CN200580047451XA Division CN101112133B (zh) | 2005-01-31 | 2005-12-15 | 表面安装连接器 |
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CN201010213237XA Pending CN101895026A (zh) | 2005-01-31 | 2005-12-15 | 表面安装连接器 |
CN200580047451XA Active CN101112133B (zh) | 2005-01-31 | 2005-12-15 | 表面安装连接器 |
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CN200580047451XA Active CN101112133B (zh) | 2005-01-31 | 2005-12-15 | 表面安装连接器 |
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CN (2) | CN101895026A (zh) |
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-
2005
- 2005-11-21 US US11/284,154 patent/US7384289B2/en active Active
- 2005-12-15 WO PCT/US2005/045337 patent/WO2006083405A2/en active Application Filing
- 2005-12-15 CN CN201010213237XA patent/CN101895026A/zh active Pending
- 2005-12-15 CN CN200580047451XA patent/CN101112133B/zh active Active
- 2005-12-22 TW TW094145934A patent/TWI285457B/zh not_active IP Right Cessation
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2008
- 2008-05-12 US US12/119,233 patent/US7749009B2/en active Active
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CN101112133B (zh) | 2010-10-13 |
US7749009B2 (en) | 2010-07-06 |
TWI285457B (en) | 2007-08-11 |
US20080207038A1 (en) | 2008-08-28 |
WO2006083405A3 (en) | 2006-09-21 |
TW200627721A (en) | 2006-08-01 |
WO2006083405A2 (en) | 2006-08-10 |
US20060172570A1 (en) | 2006-08-03 |
CN101112133A (zh) | 2008-01-23 |
US7384289B2 (en) | 2008-06-10 |
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