CN101909540B - Sensor device - Google Patents
Sensor device Download PDFInfo
- Publication number
- CN101909540B CN101909540B CN2008801241385A CN200880124138A CN101909540B CN 101909540 B CN101909540 B CN 101909540B CN 2008801241385 A CN2008801241385 A CN 2008801241385A CN 200880124138 A CN200880124138 A CN 200880124138A CN 101909540 B CN101909540 B CN 101909540B
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- Prior art keywords
- sensor
- circuit board
- cover plate
- support
- interface
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
Abstract
A sensor device is disclosed, at least partly enclosed by a sensor housing (10), wherein the output signal from the first sensor (20) is transmitted over a first signal line (26) to an interface (13), comprising at least one second sensor (22), also at least partly enclosed by the sensor housing (10), wherein the output signal from the second sensor (22) is transmitted over at least one second signal line (30) to the interface (13), wherein the first and second signal lines (26, 30) run to the interface (13) in a common cable (12), but electrically insulated from each other. At least one power supply line (28, 32, 34) is arranged in the common cable (12) for power supply to the first and/or second sensor (20, 22).
Description
Prior art
The present invention relates to a kind of sensor device.
By the known a kind of device of surveying in combination axial acceleration and vehicle wheel rotational speed of WO03/031990A1.There, wheel speed sensor and acceleration receptor are combined in the common device and with axletree mechanical rigid ground together and are connected.Wherein regulation is used an interface and the power supply that needs altogether.Sensor combinations is in a public shell.Also be provided with in addition a treatment circuit that is used for two sensors.But the integrated circuit that for this reason must setting will develop specially.
Task of the present invention is to propose the favourable combination of avoiding the problems referred to above of a kind of cost.This task is by solving by sensor device of the present invention.Comprise the first sensor that is surrounded by sensor outer housing at least in part by sensor device of the present invention, wherein the output signal of first sensor is transferred to an interface through at least one first signal line, comprise the second sensor that at least one is surrounded by sensor outer housing equally at least in part, wherein the output signal of the second sensor is transferred to interface through at least one secondary signal line, wherein the first and second holding wires are in a public cable, but electrically insulated from one another is directed into interface dividually, arranges in public cable that wherein at least one is used for the supply lines to the power supply of the first and/or second sensor.
Advantage of the present invention
Correspondingly, have advantage according to sensor device of the present invention, can utilize on the one hand the potentiality of coordinative role by a plurality of sensors of combination in a shell.In addition, the solution of proposition also avoids using additional pickup wire in the dynamic area of automobile.On the other hand, the sensor or their the exploited integrated circuits that use so far can keep without change, thereby can again develop the integrated circuit that two sensors are integrated very expensively.By coming dividually signal transmission of electrically insulated from one another with electric wire separately, so that the vulnerability to jamming of whole system is reduced to minimum level.
Other favourable expansion scheme is by obtaining in the description.
Accompanying drawing
Shown in the drawingsly be described in detail according to a plurality of embodiment of sensor device of the present invention and following.
Shown in the accompanying drawing:
Fig. 1 is the perspective view of an embodiment,
Fig. 2 is the block diagram of the first form of implementation,
Fig. 3 is the block diagram of the second form of implementation,
Fig. 4 is the perspective view of each separate part, these arrangements of components in a shell,
Fig. 5 is mounted in the perspective view of the parts in the shell,
Fig. 6 is cutaway view embodiment illustrated in fig. 5, and
Fig. 7 is the top view of the different layout probability of the second sensor.
In sensor outer housing 10, arrange at least two sensors 20,22.Sensor outer housing 10 disposes the retaining element 14 of cover shape structure.Cup-shaped sensor outer housing 10 rectangular areas extend out.A side surface 15 parallel with sensor outer housing 10 is arranged in the end of sensor outer housing 10, and for example a sensing wheel that does not illustrate can be mobile along this side surface next door, thereby be arranged in the rotating speed that first sensor 20 in the shell 10 detects sensing wheel.These two sensors 20,22 are connected with an interface 13 that is made of plug through a public cable 12.
In the embodiment according to Fig. 2, first sensor 20 comprises the first integrated circuit 17, and it is switched on by supply lines 28 and holding wire 26.The second sensor 22 comprises sensor element 24, and this sensor element is connected with the second integrated circuit 18 by bonding connection.The second integrated circuit 18 is connected with the secondary signal line and is connected with controller 36 by supply lines 28 again.Therefore can use three-core cable to carry out power supply and the exchanges data of sensor 20,22.
Embodiment shown in Figure 3 and difference embodiment illustrated in fig. 2 be, integrated circuit 17,18 is respectively by supply lines 32 separately or 34 power supplies.In this embodiment, quad is used for power supply and the exchanges data of sensor 20,22.
In Fig. 4, can see the critical piece of sensor device.For example shell 10 is cup-shaped and opens wide in the side with larger open cross-section.Retaining element 14 comprises the cover 50 of a preferable alloy, and it for example is used for installing a threaded connector.End face 42 is directed perpendicular to the longitudinal axis of sensor outer housing 10, suitably arranging in the first integrated circuit 17 situations of first sensor 20, can survey moving of sensing wheel along this longitudinal axis.Constructed a circuit board 16 corresponding to the shape of cross section of sensor outer housing 10, it is extending out in groove 47 on the end direction that narrows down gradually in this wise, so that its left side and the right are respectively by the projection gauge of finger-like.Be provided with detent mechanism 48 at the position of these finger-like, this detent mechanism has the cross section of U-shaped basically and for example is implemented as retainer spring.Detent mechanism 48 extends out in the in the horizontal interconnective projection of per two U-shaped bendings again.Groove 47 is configured to make a support 40 to insert wherein.The support 40 of hollow also be used for to install Magnet 46, be arranged in H shape plate 44 between Magnet 46 and the first integrated circuit 17 and the first integrated circuit 17 of first sensor 20 disposed thereon.The first integrated circuit 17 or first sensor 20 have two connection legs, and they contact with supply lines 32 with holding wire 26 conductively by circuit board 16 or other suitable means respectively.For this reason can be at corresponding (conductor) circuit of printing of the back side of circuit board 16 structure, it forms electric connection point 55.These junction points 55 that are designed to through hole circuit engaging structure are used for peace and receive four line ends, i.e. the holding wire 30 of holding wire 26, the second sensors 22 of first sensor 20, the end of the supply lines 32 of first sensor 20 and the supply lines 34 of the second sensor 22.These lines 26,30,32,34 are guided through cover plate 41 in a public cable 12.On the wider end of circuit board 16, after junction point 55, arrange the second integrated circuit 18 of the second sensor 22 towards the direction of public cable 12.In circuit board 16, be provided with in addition four grooves that are not shown specifically, be used for peace and receive setting element 54 and fixed part 52.Fixed part 52 is preferably L shaped and made by metal or bronze.They not only can be connected with cover plate 41 but also can be connected with circuit board 16.In cover plate 41, setting element 54 is designed to the form of two pins that protrude perpendicular to shell 10 longitudinal axis.They for example are used in the mill in the scope of plastic riveting technique cover plate 41 and circuit board 16 being fixed up.
Fig. 5 shows the installment state at the independent parts of each shown in Fig. 4.Can see, the same with fixed part 52, also insert in the groove of circuit board 16 as the setting element 54 of the part of cover plate 41.The open side of cup-shaped sensor outer housing 10 is sealed by cover plate 41.Be provided with the mating surface 49 that protrudes into housings in the end of sensor outer housing 10, it is used for settling the end face of detent mechanism 48.Can see from Fig. 5 in addition, the steady pin of support 40 protrudes in order to carry out suitable location by the corresponding groove of the connection leg of first sensor 20.
In the view according to Fig. 6, that can also add is formed for the outside line of first sensor 20 with electronic devices and components 56, and it is arranged on the bottom surface of circuit board 16.And the second sensor 22 also needs to be arranged in other the outside line on the circuit board 16, but they are not ad hoc illustrated.
In another variant embodiment according to Fig. 7, on circuit board 16 different angles be provided with different junction point 65,65 '; 67,67 '.According under the different operating positions, sensor 22 can be installed on certain angle position.This is significant using in the acceleration transducer situation of single shaft for corresponding axially susceptiveness especially.For this reason, the first printed circuit 61 is positioned on the end face of circuit board 16, and the second printed circuit 63 can be arranged in and reboots on the end face of circuit board 16 on the bottom surface of circuit board 16 and by through hole circuit connection section, in order to connect sensor 22.Be particularly suitable for changing the applicable cases of angle position according to the layout of Fig. 7, circuit board can advantageously keep motionless 16 this moments.
Sensor device shown in the accompanying drawing is worked in such a way.First sensor 20 for example can relate to a kind of wheel speed sensor.It for example comprises the components and parts to magnetic-field-sensitive, such as for example Hall element.Executive signal pretreatment in affiliated integrated circuit 17.The sensor with magnetoresistance work based on AMR or GMR also can be expected.In order to encourage first sensor 20, used the sensing wheel of in the zone of axletree, installing, as the gear that for example conducts magnetic field or punching press grizzly bar (in the active sensor situation with sensor 20 in anti-bias magnet (Back-Bias-Magnet combination) or scribble rubber layer and divide part with south poles and carry out magnetized sensing wheel.For example adopt the steel wheel applicable cases of anti-bias magnet in sensor 20, sensing wheel affects magnetic field, thereby sensor 20 can be determined a yardstick that is used for the rotating speed of sensing wheel thus.Sensor 20 is powered through supply lines 28 and holding wire 26, and holding wire is also as earth cable.Earth lead uses as holding wire 26, wherein for example by means of current-modulation signal is modulated by this holding wire 26.Can cancel thus an independent holding wire.The rotary speed information of modulation is delivered to controller 36 with processing for further processing like this.
In addition, as an example of the second sensor 22, in shell 10, arrange an acceleration transducer.It is made of sensor element 24, a kind of micromachine for surveying acceleration for example, it and integrated circuit 18 bonding connections.Integrated circuit 18 is assessed the measuring-signal of sensor elements 24 and is implemented corresponding Signal Pretreatment.The second integrated circuit 18 is also the same as supply lines 28 and holding wire 30 power supplies with the first integrated circuit 17, and this holding wire also is earth lead.On the earth lead that uses as holding wire 30, also the information that will transmit is modulated.In public cable 12 with the holding wire 30 of the holding wire 26 of first sensor 20, the second sensor 22 and public supply lines 28 (at two integrated circuits 17, in 18 public use supply lines 28 situations) or alternatively two supply lines 32,34 be directed to the interface 13 that is configured to plug.The Signal Pretreatment of two sensors 20,22 is carried out in corresponding integrated circuit 17,18 dividually.The transmission of each output signal also is that electrically insulated from one another carries out at the line that separates dividually, namely carries out at holding wire 26 and holding wire 30.The second sensor 22 is particularly useful for the detection axis vibration.It can be configured to single shaft or multiaxis acceleration transducer for this reason.Be provided for the common retaining element (sleeve pipe, clip, protection flexible pipe etc.) that is fixed, leads and protect at body of a motor car and other structural partsof automobiles at public cable 12.Sensor outer housing 10 can by retaining element 14 or a kind of bonding or the location profile mechanically be fixed on the automobile.Alternatively, shell 10 also can be configured to cover or ring, and it is fitted on the wheel bearing.Sensor device is fixed on one on the automotive components that axle vibrates.In addition, sensor device can contain to be useful on and makes sensor 20,22 with respect to automobile directed structural detail definitely.
To embodiment shown in Figure 6, a circuit board 16 that correspondingly assembles is installed in the cup-shaped sensor outer housing 10 at Fig. 4.At first at the electronic devices and components 56 of circuit board 16 assembling the second integrated circuits 18 and an outside ingredient that connects up of other conduct, wherein on the second integrated circuit, for example realize acceleration transducer 22.By changing the narrow position of circuit board 16, can realize making first sensor 20 as the size sensor that meets certain application cases of wheel speed sensor work.
Pressure injection plastic components on cable 12, this plastic components can be used as the side of opening wide of cover plate 41 sealing sensor outer housings 10.By these cover plate 41 fixing circuit boards 16.This implements by setting element 54, and this setting element is combined in the cover plate 41 as pin and can rivets with circuit board 16.The line 26,30,32,34 of cable 12 passes cover plate 41 and protrudes, and their end is contacted on the junction point 55 of circuit board 16 conductively.Cover plate 41 is connected with circuit board 16 and corresponding connect and also by means of for example by metal, bronze for example, the fixed part 52 of formation carry out after other fixing cover plate 41 and circuit board 16 being pushed in the sensor outer housing 10.On the front end of circuit board 16, arranged detent mechanism 48, it when pushing, mesh from behind shell 10 ramp type mating surface 49 and be conducive to thus the part of the front of circuit board 16 correctly is positioned in the shell 10.Circuit board 16 can pass through plastic riveting technique (cold deformation or thermal deformation) and be connected with cover plate 41.Alternatively, this task also can be born with the metal steady pin, and this metal steady pin is the ingredient of cover plate module.Circuit board 16 can be compressed in or be inserted on the metallic pin and be soldered.Cover plate 41 seals cup-shaped shell 10 and can for example be connected hermetically with shell 10 by means of the welding of plastics laser-transmitting.Alternatively, sensor outer housing also can adopt MID technology implementation and direct placement sensor assembly 20,22 and sensor cable 12.In this form of implementation, can cancel circuit board 16.Cup 10 and sensor 20,22 also can alternatively with suitable material cast, wherein select can to cancel cover plate 41 in the suitable material situation.By cast sensor 20,22, can avoid intrinsic vibration excitation and pumping action and the corrosiveness of the interference of the gas volume that surrounds in the section in the enclosure.With respect to fixing circuit board 16 mechanically on cover plate 41, also can alternatively by injection moulding cover plate 41 be connected with circuit board 16.Acceleration transducer 22 also can at random be arranged on the circuit board 16 rotationally.Show such layout at Fig. 7.Herein, acceleration transducer 22 can be arranged in the circuit board plane rotationally with pitch angle, so that according to certain application cases that the axle of sensitivity is directed with respect to the Z-axle of automobile.Can use thus the single axle acceleration transducer of saving space and cost.
Alternatively, cable 12 also can be connected with shell 10 with banjo by means of plug.This has improved the convertibility of sensor cluster under repair.
Sensor type arbitrarily can be combined in the sensor outer housing 10 in principle.Because multiple application being arranged, the combination of speed probe and acceleration transducer is favourable, indirectly identifies tire pressure, damping initiatively or half active, the wearing and tearing of identification wheel bearing or identification track situation as for example being used for.But the use of this sensor device is not limited to these.
Claims (10)
1. sensor device, comprise the first sensor (20) that is surrounded by sensor outer housing (10) at least in part, wherein the output signal of first sensor (20) is transferred to an interface (13) through at least one first signal line (26), comprise the second sensor (22) that at least one is surrounded by sensor outer housing (10) equally at least in part, wherein the output signal of the second sensor (22) is transferred to interface (13) through at least one secondary signal line (30), the first and second holding wires (26 wherein, 30) in a public cable (12), but electrically insulated from one another is directed into interface (13) dividually, arrange in public cable (12) that wherein at least one is used for to the first and/or second sensor (20,22) supply lines (28 of power supply, 32,34).
2. according to device claimed in claim 1, it is characterized in that, the first and/or second sensor (20,22) is arranged on the circuit board (16).
3. according to device claimed in claim 1, it is characterized in that, be provided with a support (40), arrange first sensor (20) at this support.
4. according to device claimed in claim 2, it is characterized in that, be provided with a support (40), arrange first sensor (20) at this support, and in circuit board (16), be provided with the groove (47) for containment bracket (40).
5. according to device claimed in claim 2, it is characterized in that, be provided with at least one and be used for making circuit board (16) at the detent mechanism (48) of the correct location of shell (10).
6. according to device claimed in claim 3, it is characterized in that, arrange the plate (44) of at least one Magnet (46) and/or an armoured magnetic field at support (40).
7. according to device claimed in claim 1, it is characterized in that, cable (12) be furnished be configured to cover plate (41) be used for closure (10) around articles injection-moulded.
8. according to device claimed in claim 7, it is characterized in that, in cover plate (41), be provided with at least one fixed part (52) and/or at least one setting element (54), be used for circuit board (16) being fixed with cover plate (41) and/or being positioned at or making circuit board (16) on cover plate (41), to fix and/or the location.
9. according to device claimed in claim 2, it is characterized in that, circuit board (16) be provided with a plurality of different orientations for sensor (22) junction point (65,65 '; 67,67 ').
10. according to device claimed in claim 5, it is characterized in that, in shell (10), be provided with the mating surface (49) of at least one and detent mechanism (48) mating reaction.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008003341.3A DE102008003341B4 (en) | 2008-01-07 | 2008-01-07 | Sensor device |
| DE102008003341.3 | 2008-01-07 | ||
| PCT/EP2008/066187 WO2009086989A2 (en) | 2008-01-07 | 2008-11-26 | Sensor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101909540A CN101909540A (en) | 2010-12-08 |
| CN101909540B true CN101909540B (en) | 2013-01-02 |
Family
ID=40719440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801241385A Active CN101909540B (en) | 2008-01-07 | 2008-11-26 | Sensor device |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2229117A2 (en) |
| JP (1) | JP5453307B2 (en) |
| CN (1) | CN101909540B (en) |
| DE (1) | DE102008003341B4 (en) |
| WO (1) | WO2009086989A2 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011002741A1 (en) * | 2011-01-17 | 2012-07-19 | Zf Friedrichshafen Ag | Sensor module i.e. rotation speed sensor module, for detecting rotation speed of gear box for use in vehicle, has conductor comprising electrical contacts arranged in terminal portion and sensor carrier receiving regions |
| CN105452874A (en) * | 2013-12-24 | 2016-03-30 | 博世汽车部件(苏州)有限公司 | Modularized speed sensor |
| US9664705B2 (en) * | 2014-02-19 | 2017-05-30 | Sensata Technologies, Inc. | Speed sensor |
| GB2533090A (en) | 2014-12-08 | 2016-06-15 | Skf Ab | Sensor device with mounting means |
| DE102015202333A1 (en) * | 2015-02-10 | 2016-08-11 | Robert Bosch Gmbh | Sensor housing for a wheel sensor device, wheel sensor device and their connection component |
| US11229402B2 (en) * | 2015-05-29 | 2022-01-25 | Microvention, Inc. | Catheter circuit |
| CN105807079B (en) * | 2016-04-20 | 2019-02-26 | 宁波中车时代传感技术有限公司 | The speed sensor assembly and its manufacturing method of high speed automobile motor |
| JP6759751B2 (en) * | 2016-06-23 | 2020-09-23 | 日立金属株式会社 | Rotation detector and cable with sensor |
| CN107782340A (en) * | 2016-08-26 | 2018-03-09 | 大陆汽车电子（连云港）有限公司 | A kind of crankshaft sensor |
| DE102017220905A1 (en) * | 2017-11-23 | 2019-05-23 | Robert Bosch Gmbh | Sensor unit for a vehicle |
| DE102018221819A1 (en) * | 2018-12-14 | 2020-06-18 | Robert Bosch Gmbh | Connector and control device for a motor vehicle with a connector |
| DE102019219620A1 (en) * | 2019-12-13 | 2021-06-17 | Continental Automotive Gmbh | Magnetic field sensor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0552050A2 (en) * | 1992-01-17 | 1993-07-21 | Ethicon, Inc. | Endoscopic surgical system with sensing means |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3639340A1 (en) * | 1986-11-18 | 1988-05-26 | Mueller Arnold Gmbh Co Kg | DEVICE FOR DETECTING AND TRANSMITTING A MEASURING SIZE |
| JPH06160428A (en) * | 1992-11-18 | 1994-06-07 | Sumitomo Electric Ind Ltd | Revolution sensor and method for detecting its fault |
| JP3086563B2 (en) * | 1993-02-27 | 2000-09-11 | 愛三工業株式会社 | Rotation angle sensor |
| DE4340177A1 (en) * | 1993-11-25 | 1995-06-01 | Mannesmann Kienzle Gmbh | Sensor |
| DE4447894B4 (en) * | 1994-02-21 | 2005-09-15 | Siemens Ag | Tachometer |
| JP3329977B2 (en) * | 1995-02-13 | 2002-09-30 | 株式会社日立製作所 | Rotational position detector |
| JP3438064B2 (en) * | 1997-09-11 | 2003-08-18 | 帝国通信工業株式会社 | Rotation angle sensor |
| JP2003287440A (en) * | 1997-09-26 | 2003-10-10 | Sanyo Electric Co Ltd | Sensor device and brushless motor using the same |
| JP4003335B2 (en) * | 1999-02-05 | 2007-11-07 | 株式会社デンソー | Semiconductor dynamic quantity sensor and manufacturing method thereof |
| US6695483B2 (en) * | 2000-12-01 | 2004-02-24 | Nsk Ltd. | Sensor and rolling bearing apparatus with sensor |
| JP2002221528A (en) * | 2001-01-26 | 2002-08-09 | Sumitomo Electric Ind Ltd | Rotation sensor |
| JP2002318114A (en) * | 2001-02-08 | 2002-10-31 | Japan Highway Public Corp | Installation type clinometer using acceleration sensor |
| JP3975691B2 (en) * | 2001-06-01 | 2007-09-12 | オムロン株式会社 | Displacement sensor |
| WO2003031990A1 (en) | 2001-10-05 | 2003-04-17 | Continental Teves Ag & Co. Ohg | Device for combined detection of axle acceleration and wheel rotational speed, and method for determining pressure |
| JP2003287436A (en) * | 2002-01-28 | 2003-10-10 | Nsk Ltd | Detector and rolling device with sensor |
| US7350590B2 (en) * | 2002-11-05 | 2008-04-01 | Weatherford/Lamb, Inc. | Instrumentation for a downhole deployment valve |
| JP2004354231A (en) * | 2003-05-29 | 2004-12-16 | Nsk Ltd | Bearing device with sensor for railway vehicle |
| JP3840489B1 (en) * | 2005-04-28 | 2006-11-01 | Ｔｄｋ株式会社 | Moving object detection device |
| JP4059300B2 (en) * | 2005-06-30 | 2008-03-12 | 株式会社村田製作所 | Detection device and rotation angle sensor |
-
2008
- 2008-01-07 DE DE102008003341.3A patent/DE102008003341B4/en active Active
- 2008-11-26 CN CN2008801241385A patent/CN101909540B/en active Active
- 2008-11-26 EP EP08869364A patent/EP2229117A2/en not_active Withdrawn
- 2008-11-26 WO PCT/EP2008/066187 patent/WO2009086989A2/en active Application Filing
- 2008-11-26 JP JP2010541730A patent/JP5453307B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0552050A2 (en) * | 1992-01-17 | 1993-07-21 | Ethicon, Inc. | Endoscopic surgical system with sensing means |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009086989A2 (en) | 2009-07-16 |
| DE102008003341A1 (en) | 2009-07-09 |
| EP2229117A2 (en) | 2010-09-22 |
| JP5453307B2 (en) | 2014-03-26 |
| JP2011508894A (en) | 2011-03-17 |
| CN101909540A (en) | 2010-12-08 |
| WO2009086989A3 (en) | 2009-10-15 |
| DE102008003341B4 (en) | 2021-07-01 |
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