CN101964335B - Packaging member and production method thereof - Google Patents
Packaging member and production method thereof Download PDFInfo
- Publication number
- CN101964335B CN101964335B CN 200910165176 CN200910165176A CN101964335B CN 101964335 B CN101964335 B CN 101964335B CN 200910165176 CN200910165176 CN 200910165176 CN 200910165176 A CN200910165176 A CN 200910165176A CN 101964335 B CN101964335 B CN 101964335B
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- Prior art keywords
- notched
- lead frame
- connecting portion
- side weld
- weld pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Abstract
The invention discloses a packaging member and a production method thereof. The packaging member comprises a lead frame, a chip and a sealing compound, wherein the lead frame is provided with a notch, a plurality of first notch side lead pins, a plurality of first notch side solder pads, a plurality of second notch lead pins and a plurality of second notch side solder pads, wherein the first notch side lead pins extend to one side of the notch, the first notch side solder pads are arranged on the first notch side lead pins correspondingly, the second notch side lead pins extend to the other side of the notch, the second notch side solder pads are arranged on the second notch side solder pins correspondingly, the sealing compound covers the chip and the lead frame and exposes the lower surface of the lead frame, and the notch exposes a part of the sealing compound. In the invention, the quantity of the solder pads which can be accommodated by the lead frame is increased.
Description
Technical field
The present invention relates to a kind of packaging part and manufacture method thereof, and particularly relate to the jagged packaging part of a kind of tool and manufacture method thereof.
Background technology
Flourish along with electronic industry, semiconductor packaging is constantly progressive.Generally speaking, semiconductor packaging is to utilize the lead frame carries chips, and with sealing sealed guide frame and substrate, to avoid chip to make moist or to damage because of collision.Wherein, chip more is electrically connected with extraneous by the connection pad of lead frame, so that be electrically connected with printed circuit board (PCB).
Yet, to pursue at electronic product under the trend of " light, thin, short, little ", industry constantly is devoted to dwindle the volume of encapsulating structure with popular.
Summary of the invention
The present invention is relevant for a kind of packaging part and manufacture method thereof, and it utilizes the design of lead frame so that packaging part more meets the target of " light, thin, short, little ".
According to an aspect of the present invention, a kind of packaging part is proposed.Packaging part comprises lead frame (LeadFrame), chip, several conductive projections and sealing.Lead frame has recess.Lead frame comprises several the first notched side wiring foots, several the first notched side weld pads, several the second notched side wiring foots and several the second notched side weld pads.The first notched side wiring foot extends to a side of recess, and the first notched side weld pad is arranged on the first notched side wiring foot accordingly.The second notched side wiring foot extends to the opposite side of recess, and the second notched side weld pad is arranged on the second notched side wiring foot accordingly.Chip is arranged at lead frame, and chip has several connection pads.Conductive projection is electrically connected connection pad and the first notched side weld pad and the second notched side weld pad.Sealant covers chip, conductive projection and lead frame, and the lower surface of nuditing wire frame.Wherein, recess exposes the sealing of part.
A kind of manufacture method of packaging part is proposed according to a further aspect in the invention.Manufacture method may further comprise the steps.Lead frame is provided, and lead frame has the first connecting portion.Lead frame comprises several the first notched side wiring foots, several the first notched side weld pads, several the second notched side wiring foots and several the second notched side weld pads.The first notched side wiring foot extends to a side of the first connecting portion, and the first notched side weld pad is arranged on the first notched side wiring foot accordingly.The second notched side wiring foot extends to the opposite side of the first connecting portion, and the second notched side weld pad is arranged on the second notched side wiring foot accordingly.The upper surface distance of the upper surface of each the first notched side wiring foot and each the second notched side wiring foot and the first connecting portion wherein; Chip is provided, and chip has several connection pads; Several conductive projections are set on connection pad; Be electrically connected connection pad and the first notched side weld pad and the second notched side weld pad with conductive projection; With sealant covers chip, conductive projection and lead frame, and the lower surface of nuditing wire frame; Along the bearing of trend wire cutting frame of the first connecting portion, to remove the first connecting portion, the first notched side wiring foot is electrically separated with the second notched side wiring foot, and form recess, recess exposes this sealing of part.
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperation accompanying drawing are described in detail below:
Description of drawings
Fig. 1 illustrates the flow chart according to the manufacture method of the packaging part of the preferred embodiment of the present invention.
Fig. 2 illustrates the vertical view of lead frame of the packaging part of present embodiment.
Fig. 3 illustrates the front view of the lead frame of Fig. 2.
Fig. 4 illustrates the schematic diagram of the chip of present embodiment.
Fig. 5 illustrates the schematic diagram that present embodiment is provided with the chip of conductive projection.
Fig. 6 illustrates the schematic diagram that present embodiment is provided with the lead frame of chip.
It illustrates the schematic diagram of another kind of execution mode of the lead frame of present embodiment Fig. 7.
Fig. 8 illustrates the amplification stereogram of local A among Fig. 7.
Fig. 9 illustrates the vertical view of the lead frame of Fig. 7.
Figure 10 illustrates the schematic diagram with the lead frame of sealant covers Fig. 6, chip and conductive projection.
Figure 11 illustrates the schematic diagram according to the packaging part of the preferred embodiment of the present invention.
Description of reference numerals
200,256: lead frame
202: the first connecting portions
204: the second connecting portions
206: the three connecting portions
212: the first notched side wiring foots
214,246: the first notched side weld pads
216: the second notched side wiring foots
218,248: the second notched side weld pads
220: the first edge side wiring foots
222,250: the first edge side weld pads
224: the second edge side wiring foots
226,252: the second edge side weld pads
228: chip
230: connection pad
232: conductive projection
234: sealing
236: the lower surface of lead frame
238: recess
240: the upper surface of lead frame
242: the centre position
244: dented space
248: anti-oxidant metal layer
260: side surface
262: packaging part
The upper surface of 264: the first notched side wiring foots
The upper surface of 266: the second notched side wiring foots
The upper surface of 268: the first connecting portions
270: the part of sealing
272: the first sides
274: the second sides
S102-S114: step
Embodiment
Please refer to Fig. 1, it illustrates the manufacture method flow chart according to the packaging part of the preferred embodiment of the present invention.Manufacture method may further comprise the steps.
At first, please be simultaneously with reference to Fig. 2, it illustrates the vertical view of lead frame of the packaging part of present embodiment.In step S102, provide lead frame 200.Lead frame 200 has the first connecting portion 202 and corresponding the second connecting portion 204 and the 3rd connecting portion 206.The first connecting portion 202 is parallel in fact the second connecting portion 204 and the 3rd connecting portion 206.And the first connecting portion 202 is positioned in fact the centre position 242 of the second connecting portion 204 and the 3rd connecting portion 206.
In addition, lead frame 200 also comprises several the first edge side wiring foots 220, several the first edge side weld pads 222, several the second edge side wiring foots 224 and several the second edge side weld pads 226.The first edge side wiring foot 220 extends to the second connecting portion 204.The first edge side weld pad 222 is arranged on the first edge side wiring foot 220 accordingly.The second edge side wiring foot 224 extends to the 3rd connecting portion 206.The second edge side weld pad 226 is arranged on the second edge side wiring foot 224 accordingly.
The upper surface 268 of the upper surface 264 of the first notched side wiring foot 212, the upper surface 266 of the second notched side wiring foot 216 and the first connecting portion 202 is at a distance of a distance, make the first notched side wiring foot 212, the second notched side wiring foot 216 and the first connecting portion 202 form the depression external form, and the thickness of the first connecting portion 202 is relatively thin.
In addition, as shown in Figure 2, the first notched side weld pad 214 and the first edge side weld pad 222 be for being staggered, and the second notched side weld pad 218 and the second edge side weld pad 226 are for being staggered.By being staggered of those weld pads, fully used the space between those weld pads, increased lead frame 200 open ended weld pad numbers.Preferably but non-exclusively, each first notched side weld pad 214 and each the second notched side weld pad 218 are respectively by the second connecting portion 204 and the 3rd connecting portion 206 first distance B 1 that extends internally.By the second connecting portion 204 and the 3rd connecting portion 206 second distance D2 that extends internally, wherein, the first distance B 1 is greater than second distance D2 respectively for each first edge side weld pad 222 and each the second edge side weld pad 226.That is, the first notched side weld pad 214, the second notched side weld pad 218, the first edge side weld pad 222 and the second edge side weld pad 226 are arranged regularly, can make lead frame 200 open ended weld pad numbers increase manyly.
In addition, the lead frame 200 of present embodiment is pre-electroplated lead frame (Pre-Plating Lead Frame, PPF).As shown in Figure 3, it illustrates the front view of the lead frame of Fig. 2, and this kind lead frame has been electroplated anti-oxidant metal layer 248 in advance, for example is NiPdAu (Ni-Pd-Au) alloy.
Then, please be simultaneously with reference to Fig. 4, it illustrates the schematic diagram of the chip of present embodiment.In step S104, chip 228 is provided, chip 228 has several connection pads 230.
Come again, please be simultaneously with reference to Fig. 5, it illustrates the schematic diagram that present embodiment is provided with the chip of conductive projection.In step S106, several conductive projections 232 are set on connection pad 230.
Come again, please be simultaneously with reference to Fig. 6, it illustrates the schematic diagram that present embodiment is provided with the lead frame of chip.In step S108, be electrically connected connection pad 230 and the first notched side weld pad 214, the second notched side weld pad 218, the first edge side weld pad 222 and the second edge side weld pad 226 with conductive projection 232.
Although the first notched side weld pad 214, the second notched side weld pad 218, the first edge side weld pad 222 and the second edge side weld pad 226 are formed on the lead frame 200 with the form of Fig. 6.So in other execution mode, the first notched side weld pad 214, the second notched side weld pad 218, the first edge side weld pad 222 and the second edge side weld pad 226 also can other form be formed on the lead frame 200.For example, please refer to Fig. 7, it illustrates the schematic diagram of another kind of execution mode of the lead frame of the first embodiment.The external form of the first notched side weld pad 246 of lead frame 256, the second notched side weld pad 248, the first edge side weld pad 250 and the second edge side weld pad 252 is cylinder and the upper surface 240 that protrudes from lead frame 200.
Please refer to Fig. 8, it illustrates the amplification stereogram of local A among Fig. 7.The first edge side weld pad 250 is arranged on the lead frame 200 with the form of cylinder, has dented space 244 around the cylinder, and this dented space 244 is exposed the side surface 260 of cylinder.After conductive projection 232 (conductive projection 232 is illustrated in Fig. 6) was arranged on the first edge side weld pad 250, in follow-up reflow process (reflow), the conductive projection 232 of fusing can increase with the area that the first edge side weld pad 250 contacts.Contact area increases, and surface tension also increases, and can strengthen the associativity of conductive projection 232 and the first edge side weld pad 250.So, conductive projection 232 more can not misplace, thereby has promoted the contraposition of conductive projection 232 and the first edge side weld pad 250.Similarly, when the first notched side weld pad 246 that is cylinder, the second notched side weld pad 248 and the second edge side weld pad 252 and conductive projection 232 in conjunction with the time, also can produce the effect that the first edge side weld pad 250 and conductive projection 232 associativities strengthen.
In addition, please refer to Fig. 9, it illustrates the vertical view of the lead frame of Fig. 7.The cross sectional shape of the first notched side weld pad 246, the second notched side weld pad 248, the first edge side weld pad 250 and the second edge side weld pad 252 is circular.Although the cross section of the cylinder of this example explains as an example of circle example, so in other embodiments, the cross sectional shape of cylinder also can be triangle, quadrangle or other shape, and its shape is not limited by Fig. 9.
Then, please be simultaneously with reference to Figure 10, it illustrates the schematic diagram with the lead frame of sealant covers Fig. 6, chip and conductive projection.In step S110, with the lower surface 236 of sealing 234 coating chips 228, conductive projection 232 and lead frame 200 and nuditing wire frame 200.
In addition, although the lead frame 200 of present embodiment is pre-electroplated lead frame.Yet the lead frame 200 of Fig. 2 also can not be pre-electroplated lead frame.For instance, if lead frame 200 is not pre-electroplated lead frame, then after step S110, form anti-oxidant metal layer (for example being tin (Sn) or tin-lead (Sn-Pb)) alloy in the bottom surface of lead frame 200.The mode that forms anti-oxidant metal layer for example is to electroplate.
Then, please be simultaneously with reference to Figure 11, it illustrates the schematic diagram according to the packaging part of the preferred embodiment of the present invention.In step S112, bearing of trend along the first connecting portion 202 cuts the lead frame 200 that is coated by sealing 234, to remove the first connecting portion 202, the first notched side wiring foot 212 is electrically separated with the second notched side wiring foot 216, and forming recess 238, recess 238 exposes the part 270 of sealing 234.
Because the thickness of the first connecting portion 202 is relatively thin, so just can cut out recess 238 very easily.Wherein, remove the action of the first connecting portion 202 and can adopt cutter or laser, finish in the mode of cutting.
Because the first connecting portion 202 is positioned in fact the centre position of the second connecting portion 204 and the 3rd connecting portion 206, so the position of recess 238 is positioned in fact same position.
Then, in step S114, cut the lead frame 200 that is coated by sealing 234 along the bearing of trend of the second connecting portion 204 and the bearing of trend of the 3rd connecting portion 206, to remove the second connecting portion 204 and the 3rd connecting portion 206, and make the first edge side wiring foot 220 and the second edge side wiring foot 224 electrically separate the second connecting portion 204 and the 3rd connecting portion 206 cut after, expose the first corresponding in the packaging part 262 side 272 and the second side 274.So far, finished the packaging part 262 of the preferred embodiment of the present invention, as shown in figure 11.
The packaging part that the above embodiment of the present invention is disclosed and manufacture method thereof have multiple advantages, below only enumerate the part advantage and are described as follows:
(1) first notched side weld pad, the first edge side weld pad, the second notched side weld pad and the second edge side weld pad are array to be arranged, and has increased the open ended weld pad quantity of lead frame.
(2) first notched side weld pads and the first edge side weld pad are for being staggered and the second notched side weld pad and the second edge side weld pad also are staggered.Under the space that takes full advantage of between the weld pad, more increased the open ended weld pad quantity of lead frame.
(3) first notched side weld pads, the second notched side weld pad, the first edge side weld pad and the second edge side weld pad are formed on the lead frame with cylindrical form.So, in reflow process, increased the contact area of conductive projection and weld pad.Contact area increases, and surface tension also increases.So that conductive projection more can not misplace in reflow process.
In sum, although the present invention discloses as above with preferred embodiment, so it is not to limit the present invention.The persons of ordinary skill in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention defines and is as the criterion when looking appended claim.
Claims (10)
1. packaging part comprises:
Lead frame has recess, and this lead frame comprises:
A plurality of the first notched side wiring foots extend to a side of this recess;
A plurality of the first notched side weld pads are arranged on described a plurality of the first notched side wiring foot accordingly;
A plurality of the second notched side wiring foots extend to the opposite side of this recess; And
A plurality of the second notched side weld pads are arranged on described a plurality of the second notched side wiring foot accordingly;
Chip is arranged at this lead frame, and this chip has a plurality of connection pads;
A plurality of conductive projections are electrically connected described a plurality of connection pad and described a plurality of the first notched side weld pad and described a plurality of the second notched side weld pad; And
Sealing coats this chip, described a plurality of conductive projections and this lead frame, and the lower surface of exposed this lead frame, and this sealing has and the coplanar lower surface of the lower surface of this lead frame;
Wherein, this recess exposes this sealing of part, and the degree of depth of this recess is less than the thickness of described a plurality of the first notched side wiring foots and described a plurality of the second notched side wiring foots.
2. packaging part as claimed in claim 1, wherein this packaging part has the first corresponding side and the second side, this recess between this first side and this second side and the bearing of trend of this recess be parallel to this first side and this second side, this lead frame also comprises:
A plurality of the first edge side wiring foots extend to this first side;
A plurality of the first edge side weld pads are arranged on described a plurality of the first edge side wiring foot accordingly;
A plurality of the second edge side wiring foots extend to this second side; And
A plurality of the second edge side weld pads are arranged on described a plurality of the second edge side wiring foot accordingly;
Wherein, a plurality of conductive projections also are electrically connected described a plurality of connection pad and described a plurality of the first edge side weld pad and described a plurality of the second edge side weld pad.
3. packaging part as claimed in claim 2, wherein said a plurality of the first notched side weld pads and described a plurality of the first edge side weld pad be for being staggered, and described a plurality of the second notched side weld pad and described a plurality of the second edge side weld pad are staggered.
4. packaging part as claimed in claim 2, wherein respectively this first notched side weld pad and respectively this second notched side weld pad respectively by this first side and this second side first distance that extends internally, this the first edge side weld pad and respectively this second edge side weld pad is respectively by this first side and this second side second distance that extends internally respectively, this first distance is greater than this second distance.
5. packaging part as claimed in claim 2, the external form of wherein said a plurality of the first notched side weld pads, described a plurality of the second notched side weld pads, described a plurality of the first edge side weld pads and described a plurality of the second edge side weld pads is cylinder and the upper surface that protrudes from this lead frame.
6. the manufacture method of a packaging part comprises:
Lead frame is provided, this lead frame comprises the first connecting portion, this lead frame also comprises a plurality of the first notched side wiring foots, a plurality of the first notched side weld pads, a plurality of the second notched side wiring foots and a plurality of the second notched side weld pad, described a plurality of the first notched side wiring foot extends to a side of this first connecting portion, described a plurality of the first notched side weld pad is arranged on a plurality of the first notched side wiring foots accordingly, described a plurality of the second notched side wiring foot extends to the opposite side of this first connecting portion, described a plurality of the second notched side weld pad is arranged on described a plurality of the second notched side wiring foot accordingly, and wherein the upper surface of the upper surface of each described a plurality of the first notched side wiring foot and each described a plurality of the second notched side wiring foot and this first connecting portion is at a distance of a distance;
Chip is provided, and this chip has a plurality of connection pads;
A plurality of conductive projections are set on described a plurality of connection pads;
Be electrically connected described a plurality of connection pad and described a plurality of the first notched side weld pad and described a plurality of the second notched side weld pad with described a plurality of conductive projections;
With this chip of sealant covers, described a plurality of conductive projections and this lead frame, and the lower surface of exposed this lead frame; And
Bearing of trend along this first connecting portion cuts this lead frame, to remove this first connecting portion, described a plurality of the first notched side wiring foot is electrically separated with described a plurality of the second notched side wiring foots, and form a recess, and this recess exposes this sealing of part.
7. manufacture method as claimed in claim 6, wherein this lead frame also comprises:
The second corresponding connecting portion and the 3rd connecting portion, this first connecting portion is parallel to this second connecting portion and the 3rd connecting portion;
A plurality of the first edge side wiring foots extend to this second connecting portion;
A plurality of the first edge side weld pads are arranged on described a plurality of the second connecting portion edge side wiring foot accordingly;
A plurality of the second edge side wiring foots extend to the 3rd connecting portion; And
A plurality of the second edge side weld pads are arranged on described a plurality of the second edge side wiring foot accordingly;
In this step that is electrically connected with described a plurality of conductive projections, also comprise:
Be electrically connected described a plurality of connection pad and described a plurality of the first edge side weld pad and described a plurality of the second edge side weld pad with described a plurality of conductive projections.
8. manufacture method as claimed in claim 7 also comprises:
Cut by the lead frame of this sealant covers along the bearing of trend of this second connecting portion and the bearing of trend of the 3rd connecting portion, removing this second connecting portion and the 3rd connecting portion, and described a plurality of the first edge side wiring foot is electrically separated with described a plurality of the second edge side wiring foots.
9. manufacture method as claimed in claim 7, the external form of wherein said a plurality of the first notched side weld pads, described a plurality of the second notched side weld pads, described a plurality of the first edge side weld pads and described a plurality of the second edge side weld pads is cylinder and the upper surface that protrudes from this lead frame.
10. manufacture method as claimed in claim 6 also comprises:
Form anti-oxidant metal layer in this lower surface of this lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910165176 CN101964335B (en) | 2009-07-23 | 2009-07-23 | Packaging member and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910165176 CN101964335B (en) | 2009-07-23 | 2009-07-23 | Packaging member and production method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101964335A CN101964335A (en) | 2011-02-02 |
| CN101964335B true CN101964335B (en) | 2013-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910165176 Active CN101964335B (en) | 2009-07-23 | 2009-07-23 | Packaging member and production method thereof |
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| CN (1) | CN101964335B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8809119B1 (en) * | 2013-05-17 | 2014-08-19 | Stats Chippac Ltd. | Integrated circuit packaging system with plated leads and method of manufacture thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1744308A (en) * | 2004-09-04 | 2006-03-08 | 三星Techwin株式会社 | Flip chip semiconductor device and manufacturing method thereof |
| CN1941351A (en) * | 2005-09-30 | 2007-04-04 | 矽品精密工业股份有限公司 | Semiconductor packer and its production |
| CN101211886A (en) * | 2006-12-28 | 2008-07-02 | 日月光半导体制造股份有限公司 | Outer pin-free wire holder packaging structure |
| CN101276768A (en) * | 2007-03-26 | 2008-10-01 | 国家半导体公司 | Gang flipping for flip-chip packaging |
| US7495325B2 (en) * | 2005-05-05 | 2009-02-24 | Stats Chippac, Ltd. | Optical die-down quad flat non-leaded package |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6597059B1 (en) * | 2001-04-04 | 2003-07-22 | Amkor Technology, Inc. | Thermally enhanced chip scale lead on chip semiconductor package |
| US6838751B2 (en) * | 2002-03-06 | 2005-01-04 | Freescale Semiconductor Inc. | Multi-row leadframe |
| TW567598B (en) * | 2002-11-13 | 2003-12-21 | Advanced Semiconductor Eng | Flip chip semiconductor package |
| TWI273681B (en) * | 2004-06-24 | 2007-02-11 | Advanced Semiconductor Eng | Semiconductor package with flip chip on leadless leadframe |
| US20060170081A1 (en) * | 2005-02-03 | 2006-08-03 | Gerber Mark A | Method and apparatus for packaging an electronic chip |
| CN100521182C (en) * | 2006-04-11 | 2009-07-29 | 日月光半导体制造股份有限公司 | Lead frame encapsulation structure with the high-density pin array |
| CN101308830A (en) * | 2007-05-18 | 2008-11-19 | 飞思卡尔半导体（中国）有限公司 | Lead frame for semiconductor encapsulation |
-
2009
- 2009-07-23 CN CN 200910165176 patent/CN101964335B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1744308A (en) * | 2004-09-04 | 2006-03-08 | 三星Techwin株式会社 | Flip chip semiconductor device and manufacturing method thereof |
| US7495325B2 (en) * | 2005-05-05 | 2009-02-24 | Stats Chippac, Ltd. | Optical die-down quad flat non-leaded package |
| CN1941351A (en) * | 2005-09-30 | 2007-04-04 | 矽品精密工业股份有限公司 | Semiconductor packer and its production |
| CN101211886A (en) * | 2006-12-28 | 2008-07-02 | 日月光半导体制造股份有限公司 | Outer pin-free wire holder packaging structure |
| CN101276768A (en) * | 2007-03-26 | 2008-10-01 | 国家半导体公司 | Gang flipping for flip-chip packaging |
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| CN101964335A (en) | 2011-02-02 |
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