CN102033193A - Method and system for measuring the electricity behavior of a circuit - Google Patents
Method and system for measuring the electricity behavior of a circuit Download PDFInfo
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- CN102033193A CN102033193A CN2010102700503A CN201010270050A CN102033193A CN 102033193 A CN102033193 A CN 102033193A CN 2010102700503 A CN2010102700503 A CN 2010102700503A CN 201010270050 A CN201010270050 A CN 201010270050A CN 102033193 A CN102033193 A CN 102033193A
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Abstract
The invention provides a system for electricity measurement, comprising a first support structure; a first array connected with an electric insertion device of the first support structure, wherein each electric insertion device of the first array comprises a first terminal and a second terminal, the first terminal is connected with a first circuit, the second terminal is arranged so that the electric insertion device contacts with the point of the device to be measured when the electric insertion device is pressed on the point of the device to be measured; the electric insertion devices of the first array are arranged to change the height difference between the second terminal of the electric insertion device of the first array and the first support structure when the electric insertion devices are pressed on the device to be measured; the first circuit is arranged to couple the first array of the electric insertion device to a process unit and the process unit is arranged to measure at least one electricity parameter of the device to be measured.
Description
Related application
The sequence number that present patent application requires on June 3rd, 2009 to submit to is the right of priority of 61/183,553 U.S. Provisional Patent Application, incorporates it into this paper by reference at this.
Technical field
The present invention relates to be used for the method and system of the electric property of metering circuit.
Background technology
About the test of printing board PCB, for instance, each PCB can comprise a plurality of test contacts, wherein can pass through the mode of the child group (for example, paired) of contactor engaged test contact and test PCB, and measure electric property by processing unit.Owing to there are a plurality of test contacts, a small amount of contactor of mechanically moving with respect to checked PCB to handle slowly so prior art scheme or comprise is had to, comprise the contacted many contactors of test contact that are designed to the certain line of PCB, because test contact is positioned at different positions in each PCB product.The design of this many contactors testing apparatus and manufacturing are very complicated, slow and expensive.
In addition, another problem that can run in the method for utilizing prior art test PCB is that different test contacts (and other parts of PC) may be positioned at different height (for example, in multilayer circuit).Obviously, for this prior art, the substantive test contact that contact is positioned at differing heights has further increased extra complicacy.
Summary of the invention
A kind of system that is used for electric measurement, described system can comprise: (a) first supporting construction; (b) be connected to first array that is electrically interposed in device (electrical interposer) of described first supporting construction; When wherein, each of described first array is electrically interposed in utensil and first end that is connected to first circuit arranged and be arranged on will being electrically interposed in the point that device is pressed onto equipment under test and contacted second end of point of equipment under test; Wherein, a plurality of devices that are electrically interposed in of described first array are arranged to when it is forced on the described equipment under test, change described a plurality of second end of device and differences in height between described first supporting construction of being electrically interposed in of described first array; Wherein, described first array that is electrically interposed in device is configured as with the interested point of equipment under test and contacts, and does not consider the design of equipment under test; And (c) first circuit is arranged to described first array that is electrically interposed in device is electrically coupled to processing unit, and described processing unit is arranged to measure at least one electric parameter of equipment under test.
The density that is electrically interposed in device of described first array can be for two of equipment under test the part (1/2nd, 1/3rd, 1/4th or still less) of the distance between the interested point.
Each be electrically interposed in device can comprise be arranged in case will be electrically interposed in device and be pressed onto on the equipment under test time just with the contacted spring of point of equipment under test.
Each is electrically interposed in device and can comprises when in a single day being arranged to will to be electrically interposed in device is pressed onto on the equipment under test and the contacted elasticity of point of equipment under test and the element of conduction.
Described first array is configured as when it is pressed towards equipment under test, contacts with point on the whole equipment under test of being dispersed throughout of equipment under test simultaneously.
Described equipment under test can be a printed circuit board (PCB), and described first array can be shaped as when it is pressed towards described printed circuit board (PCB), and described first array contacts with the point of the most printed circuit board (PCB) that is dispersed throughout described printed circuit board (PCB).
A plurality of devices that are electrically interposed in are arranged to contact with the point of equipment under test in non-perpendicular mode.
The point that device is arranged to locate with first (facet) being positioned at equipment under test of equipment under test that is electrically interposed in of described first array contacts; And described system can also comprise: (a) second supporting construction; (b) be connected to second array that is electrically interposed in device of described second supporting construction; Each of wherein said second array is electrically interposed in utensil first end and second end, described first end is connected to second circuit, when described second end is arranged on being electrically interposed in the point that device is forced into equipment under test, contact with the point that is positioned on second of equipment under test of equipment under test; Second first of can be different from equipment under test of wherein said equipment under test; Wherein a plurality of devices that are electrically interposed in of second array are arranged to when it is forced on the described equipment under test, change described a plurality of second end of device and differences in height between described second supporting construction of being electrically interposed in of described second array; And (c) second circuit second array being arranged to be electrically interposed in device is electrically coupled to second processing unit, and described second processing unit is arranged to measure at least one electric parameter of equipment under test.
Described first can with described second relative.
Described equipment under test can be a printed circuit board (PCB), and described first can with described second relative.
Described first and second processing units are arranged to assess the electric parameter of equipment under test by relatively producing the electric signal that belongs to the point on the not coplanar among first and second of equipment under test from described equipment under test.
Described system can comprise a plurality of supporting constructions and a plurality of device array that is electrically interposed in, and each is electrically interposed in the device array and is connected to single supporting construction; Each of wherein said first array is electrically interposed in utensil to be had first end that is coupled to circuit and is arranged to when on the point that it is pressed onto equipment under test second end that contacts with the point of equipment under test; Wherein each is electrically interposed in device and is arranged to when it is forced on the equipment under test, changes to be electrically interposed in second end of device and the difference in height between described first supporting construction; And the array that wherein said circuit is arranged to be electrically interposed in device is electrically coupled to processing unit, and described processing unit is arranged to measure at least one electric parameter of equipment under test.
Described a plurality of device that is electrically interposed in is arranged to when it is forced on the equipment under test, difference in height in response between the point on described a plurality of described second ends that are electrically interposed in device of being forced into of equipment under test changes described a plurality of second end of device and difference in height between described first supporting construction of being electrically interposed in.
A kind of method that is used for electric measurement can be provided, described method comprises that first array that will be electrically interposed in device is pressed onto on the equipment under test, and a plurality of devices that are electrically interposed in of described first array are contacted with a plurality of points of equipment under test, and change and describedly a plurality ofly be electrically interposed in second end of device and be connected to difference in height between first supporting construction of described first array; Wherein, first end that is electrically interposed in device of described first array is coupled to first processing unit; And equipment under test is carried out electric measurement by described first processing unit.
Description of drawings
With reference to accompanying drawing, only further details of the present invention, aspect and embodiment are described by example.In the accompanying drawings, similarly Reference numeral is used for identifying similar or functional similar elements.For easy and clear for the purpose of, the element in the accompanying drawing needn't be drawn in proportion.
Fig. 1 shows electric measurement system according to an embodiment of the invention;
Fig. 2 A shows the side view of system according to an embodiment of the invention, and the side view that has the PCB of some test points according to embodiments of the invention;
Fig. 2 B shows the side view of system according to an embodiment of the invention;
Fig. 3 shows the side view of system according to an embodiment of the invention;
Fig. 4 shows system according to an embodiment of the invention;
Fig. 5 shows system according to an embodiment of the invention;
Fig. 6 shows method according to an embodiment of the invention;
Fig. 7 shows method according to an embodiment of the invention.
Embodiment
In conjunction with following detailed and accompanying drawing, foregoing of the present invention and other purpose, feature and advantage will become apparent.In the accompanying drawings, similar Reference numeral is represented similar elements in different views.
Because all using to a great extent, shown embodiments of the invention well known to a person skilled in the art that electronic component and circuit implement, and, will not explain detail to be higher than in order to understand and know from experience the necessary degree of potential notion of the present invention in order not obscure or non-migration instruction of the present invention.
Fig. 1 shows electric measurement system according to an embodiment of the invention 100, and described electric measurement system 100 can be used for measuring the electric property such as the circuit of (although being not limited to) printed circuit board (PCB) (PCB).
For convenience's sake, each is electrically interposed in device 110 or is flexible at least in part, perhaps is connected to the elastic construction that is connected to supporting construction 120.For example, each is electrically interposed in device 110 can be self rubber-like spring structure, perhaps goes up at elastic construction (for example silicones projection) to make up.According to another example, be electrically interposed in device 110 and can be mounted in static conductive component on flexible or other the flexible material.Should be noted in the discussion above that according to several embodiments of the present invention, with being connected between tested object can be vertical or off plumb.
Except other purposes, electric measurement system 100 can be used for electric measurement and/or be used to test circuit such as PCB.As mentioned above, (hereinafter, will represent the circuit of PCB or other type with term PCB) in sort circuit, different electrical contacts may be in different height.The elasticity that is electrically interposed in device 110 or the structure that is electrically interposed in device all is installed on it can help to be electrically interposed in the contact of device 110, the i.e. contact of each test point of PCB.Utilizing before system 100 tests, system 100 (it is as test envelope) can be pressed on the PCB.According to embodiments of the invention, can realize system 100 is pressed on the PCB by system 100 being pressed on the tested object (for example PCB).According to embodiments of the invention, can finish this pushing by measurand being pressed into the mode that is electrically interposed in device 110.
Be electrically interposed in device and can be located such that with the interested point of equipment under test and contact, and do not consider the design of equipment under test.For example, this can realize in the following way: will be electrically interposed in device and be provided with very close array format, the part of the distance between two interested points that the wherein adjacent distance that is electrically interposed between the device is an equipment under test (1/2nd, 1/3rd, 1/4th or still less).
Fig. 2 A shows according to an embodiment of the invention the side view of system 100 and the side view with PCB 10 of several test points (being expressed as the black rectangle).Fig. 2 B shows the side view of system 100 when contact PCB 10.As shown in the figure, when to different when being electrically interposed in device 110 and applying power, each is electrically interposed in device 110 and changes with respect to the height of supporting construction 120, can set up electric the contact with each test point of PCB 10.
Fig. 3 is the side view of system 100 according to an embodiment of the invention.Should be noted that the quantity that is electrically interposed in device 110 can be more much more than the indicative icon, and the array that is electrically interposed in device 110 can concentrate enough, to form good electric the contact with the test contact of all kinds of PCB.It should be noted that, the elasticity that is electrically interposed in device 110 or the structure that is electrically interposed in device 110 is installed on it can come from be used for making them material (for example, silicones structure, ameripol structure or the like) or come from structural design (for example, spring), perhaps come from their combination.
According to embodiments of the invention, the resolution that is electrically interposed in the array of device 110 is 400 microns, also can be other resolution (even can also be embodied as visibly different resolution).According to embodiments of the invention, comprise the individual device 110 that is electrically interposed in 32 * 32 (=1024) based on the array that is electrically interposed in device 110 of supporting construction 120.Should be noted that can use other quantity be electrically interposed in device 110, and be electrically interposed in device 110 and can dispose with other and customize (that is, not being grid) for X-Y.
Fig. 4 shows system 200 according to an embodiment of the invention.System 200 comprises one or more panels, and each panel comprises system 100.Described panel (for simplicity, representing with 100) can interconnect, and can be connected to public physical arrangement, perhaps is free of attachment to public physical arrangement, and can or cannot independently move and/or control.For example, can be with 100 panels (for example, 10 * 10 arrays) as 10
6The individual equipment under test that is electrically interposed in device 110, wherein each panel has 32 * 32 and is electrically interposed in device.In order to carry out electric measurement, system 200 can also comprise one or more processing units that are electrically interposed in device 110 250 (can maybe cannot be combined in one or more systems 100) that are suitable for being electrically connected to two or more.Should be noted that to be used for selecting described two or more switchgear that is electrically interposed in device 110 can be included in processing unit 150, perhaps be included in the unit coupled in each system 100 or be included in the combination of these schemes.
Should be noted that system 200 can be suitable for using the two or more devices 110 that are electrically interposed in from different panels to carry out electric measurement.
According to embodiments of the invention, each Unit 32 * 32 is of a size of 12.8mm * 12.8mm.According to embodiments of the invention, the size of each Unit 32 * 32 is determined by two distances that are electrically interposed between the device 110.Therefore, if the overall dimensions of each unit is 12.8mm * 12.8mm, then the distance that is electrically interposed between the device of 32 * 32 every pairs of being electrically interposed in the device is approximately 0.4mm.
Therefore, if the overall dimensions of each unit is 1.28 * 1.28mm, then 32 * 32 every pair of distances that are electrically interposed between the device that are electrically interposed in device are approximately 0.04mm.
With from a plurality of be electrically interposed in device 110 be electrically connected can or for being connected in parallel, perhaps for being connected in series.According to embodiments of the invention, system 100 and/or 200 can comprise power supply (for example, 3.3v direct supply).
Fig. 5 shows system 200 according to an embodiment of the invention.System 200 is suitable for two-sided PCB is carried out electric measurement.
Fig. 6 shows method 600 according to an embodiment of the invention.
Should be noted that for convenience the variation of described height comprises described at least one module is pressed onto on the circuit.
Be step 620 after step 610, in order to carry out electric measurement, step 620 is selected a plurality of devices that are electrically interposed in of described at least one module.The subclass (subset) that described selection allows to be electrically interposed in device is connected to processing unit.The selected quantity that is electrically interposed in device depends on the amount of port that is used to measure electric parameter of processing unit.
After step 620 for electrical connection is switched to the selected step 630 that is electrically interposed in device.
Be step 640 after step 630, step 640 by be connected to a plurality of be electrically interposed in device (for example, those selected and/or switch to be electrically interposed in device) processing unit come the electric parameter of metering circuit.
The electricity that measurement can comprise the electric capacity of measuring equipment under test, measure equipment under test is led or the like.
Fig. 7 shows method 700 according to an embodiment of the invention.
After the step 710 is the step 720 of equipment under test being carried out electric test by described first processing unit.
Step 710 can comprise that the spring that is electrically interposed in device with described first array is pressed onto on the equipment under test.Described spring conducts electricity, and in case just contacts with the point of equipment under test when being pressed onto on the equipment under test.Described spring is connected to described circuit.
Step 710 can comprise that elasticity and the conducting element that will be electrically interposed in device are pressed onto on the equipment under test.In the time of on being pressed onto equipment under test, described elasticity contacts the point of equipment under test with conducting element.
When step 710 can comprise on being forced into equipment under test, contact with the point of equipment under test simultaneously, these points are dispersed throughout whole equipment under test or are distributed at least on the major part of equipment under test.
Equipment under test can be a printed circuit board (PCB), and step 710 can comprise by first array and contacting with contact on the major part that is distributed in described printed circuit board (PCB) of described printed circuit board (PCB) simultaneously.
Step 710 can comprise by a plurality of devices that are electrically interposed in and contacting with the point of equipment under test in non-perpendicular mode.Therefore, be electrically interposed in device and can have when it contacts with the point of equipment under test, with the face off plumb longitudinal axis of equipment under test.
According to embodiments of the invention, step 710 comprises with the point that is positioned on first of equipment under test of equipment under test and contacting, and method 700 also comprises step 730, second array that step 730 will be electrically interposed in device is pressed onto on the equipment under test, and make a plurality of devices that are electrically interposed in of described second array contact, and make a plurality of differences in height that are electrically interposed in second end of device and are connected between second supporting construction of described second array change with a plurality of points of second that belong to equipment under test of equipment under test.First end that is electrically interposed in device of described second array is coupled to second processing unit.Described first can be different from second.Perhaps, first and second is with one side.
Step 710 and 730 can be carried out in the mode of parallel mode, partly overlapping mode or order.
Second processing unit can be different from first processing unit.Perhaps, first and second processing units can be same processing unit.
It after the step 730 step 740 of equipment under test being carried out electric test by second processing unit.
First can be relative with second.
Equipment under test can be a printed circuit board (PCB), and first can be relative with second.
Step 740 can comprise the electric parameter of assessing equipment under test from the electric signal that belongs to the point on the not coplanar among first and second of equipment under test of described equipment under test by relatively producing.This assessment can comprise the leakage current between two faces assessing printed circuit board (PCB).
Step 720 and 740 can comprise or select to be coupled to the device that is electrically interposed in of processing unit before them.
Fig. 7 shows by a pair of array and carries out electric test.The quantity that should be noted that array is not limited to 2 and can be above 2.For example, Fig. 5 shows 4 panels that comprise 4 arrays.Therefore, can comprise in method 700: a plurality of arrays that (a) will be electrically interposed in device are pressed onto on the equipment under test, and a plurality of devices that are electrically interposed in of a plurality of arrays are contacted with a plurality of points of equipment under test, and a plurality of differences in height that are electrically interposed in second end of device and are connected between a plurality of supporting constructions of described a plurality of arrays are changed, wherein, first end that is electrically interposed in device is coupled at least one processing unit; And (b) equipment under test is carried out electric test by described at least one processing unit, wherein, described a plurality of arrays comprise first array, and wherein said a plurality of supporting construction comprises first supporting construction.
Can adopt conventional instrument, method and parts to put into practice the present invention.Therefore, specifically do not set forth this instrument, parts and method here.In order to understand the present invention up hill and dale, in the description formerly, many details have been set forth.Yet, should recognize that practice of the present invention does not also rely on the detail of being set forth.
Shown in the disclosure and described exemplary embodiment of the present invention and the polyfunctional example of minority.Should be understood that the present invention can be used in various other combinations and the environment, and can in the scope of the invention spirit represented, carry out various modifications or modification as this paper.
Claims (25)
1. system that is used for electric measurement comprises:
First supporting construction;
Be connected to first array that is electrically interposed in device of described first supporting construction;
When wherein, each of described first array is electrically interposed in utensil and first end that is connected to first circuit arranged and be arranged on being electrically interposed in the point that device is forced into equipment under test and contacted second end of point of described equipment under test;
Wherein, when described first array a plurality of are electrically interposed in device and are arranged on being forced into described equipment under test, change described a plurality of second end of device and differences in height between described first supporting construction of being electrically interposed in of described first array;
Wherein, described first array that is electrically interposed in device is configured as with the interested point of equipment under test and contacts, and does not consider the design with described equipment under test; And
Wherein, described first circuit is arranged to described first array that is electrically interposed in device is electrically coupled to processing unit, and described processing unit is arranged to measure at least one electric parameter of equipment under test.
2. system according to claim 1, wherein, the density that is electrically interposed in device of described first array is the part of the distance between the interested point of two of described equipment under test.
3. system according to claim 1, wherein, each is electrically interposed in device and comprises spring, and described spring is arranged in case describedly just contact with the point of described equipment under test when being electrically interposed in device and being forced on the described equipment under test.
4. system according to claim 1, wherein, each is electrically interposed in device and comprises element flexible and conduction, and described element flexible and conduction is arranged in case describedly just contact with the point of described equipment under test when being electrically interposed in device and being forced on the described equipment under test.
5. system according to claim 1, wherein, described first array is configured as when it is forced on the described equipment under test, contacts with point on the whole described equipment under test of being dispersed throughout of described equipment under test simultaneously.
6. system according to claim 1, wherein, described equipment under test is a printed circuit board (PCB), and wherein said first array is configured as when it is forced on the described printed circuit board (PCB), and described first array contacts with point on the major part that is distributed in described printed circuit board (PCB).
7. system according to claim 1, wherein, a plurality of devices that are electrically interposed in are arranged to contact with the point of described equipment under test in non-perpendicular mode.
8. system according to claim 1, wherein, the device that is electrically interposed in of described first array is arranged to contact with the point that is positioned on first of described equipment under test of described equipment under test;
Wherein, described system also comprises:
Second supporting construction;
Be connected to second array that is electrically interposed in device of described second supporting construction;
Wherein, each of described second array is electrically interposed in utensil first end and second end, described first end is connected to second circuit, described second end is arranged to when each of described second array is electrically interposed on the point that device is forced into described equipment under test, contacts with the point that is positioned on second of described equipment under test of described equipment under test;
Wherein, described second face of described equipment under test is different from described first of described equipment under test;
Wherein, a plurality of devices that are electrically interposed in of described second array are arranged to when it is forced on the described equipment under test, change described a plurality of second end of device and differences in height between described second supporting construction of being electrically interposed in of described second array; And
Wherein, described second array that described second circuit is arranged to be electrically interposed in device is electrically coupled to second processing unit, and described second processing unit is arranged to measure at least one electric parameter of described equipment under test.
9. system according to claim 8, wherein, described first with described second relative.
10. system according to claim 8, wherein, described equipment under test is a printed circuit board (PCB), and wherein said first with described second relative.
11. system according to claim 8, wherein, described first and second processing units are arranged to assess the electric parameter of described equipment under test by relatively producing the electric signal that belongs to the point on the not coplanar among described first and second of described equipment under test from described equipment under test.
12. system according to claim 1 comprises a plurality of supporting constructions and a plurality of arrays that are electrically interposed in device, each array that is electrically interposed in device is connected to single supporting construction;
Wherein, each of described first array is electrically interposed in utensil first end and second end, described first end is coupled to circuit, and described second end is arranged to contact with the point of described equipment under test when each of described first array is electrically interposed on the point that device is forced into described equipment under test;
Wherein, each is electrically interposed in device and is arranged to when it is forced on the described equipment under test, changes described described second end of device and the difference in height between described first supporting construction of being electrically interposed in; And
Wherein, described circuit is arranged to the described array that is electrically interposed in device is electrically coupled to processing unit, and described processing unit is arranged to measure at least one electric parameter of equipment under test.
13. system according to claim 1, wherein, described a plurality of device that is electrically interposed in is arranged to when it is forced into described equipment under test, difference in height in response between the point of described a plurality of second ends that are electrically interposed in device of being forced into of described equipment under test changes described a plurality of described second end of device and difference in height between described first supporting construction of being electrically interposed in.
14. a method that is used for electric measurement comprises:
First array that is electrically interposed in device is pressed onto on the equipment under test, and a plurality of devices that are electrically interposed in of described first array are contacted with a plurality of points of described equipment under test, and described a plurality of difference in height that is electrically interposed in second end of device and is connected between first supporting construction of described first array is changed; Wherein, described first end that is electrically interposed in device of described first array is coupled to first processing unit; Wherein, described described first array that is electrically interposed in device is configured as with the interested point of equipment under test and contacts, and does not consider the design with described equipment under test; And
By described first processing unit described equipment under test is carried out electric measurement.
15. method according to claim 14 comprises that the described spring that is electrically interposed in device with described first array is pressed onto on the described equipment under test.
16. method according to claim 14 comprises the described element that is electrically interposed in the flexible of device and conduction is pressed onto on the described equipment under test.
17. method according to claim 14 when comprising on being forced into described equipment under test, contacts with point on the whole equipment under test of being dispersed throughout of described equipment under test simultaneously.
18. method according to claim 14, wherein, described equipment under test is a printed circuit board (PCB), and wherein said method comprises by described first array and contacting with point on the major part that is distributed in described printed circuit board (PCB) of described printed circuit board (PCB) simultaneously.
19. method according to claim 14 comprises by a plurality of devices that are electrically interposed in contacting with the point of described equipment under test in non-perpendicular mode.
20. method according to claim 14, wherein, described first array described is electrically interposed in device and is arranged to contact with the point that is on first of described equipment under test of described equipment under test, and wherein, described method also comprises:
Second array that is electrically interposed in device is pressed onto on the equipment under test, and a plurality of devices that are electrically interposed in of described second array are contacted with a plurality of points of second that belong to described equipment under test of described equipment under test, and described a plurality of difference in height that is electrically interposed in second end of device and is connected between second supporting construction of described second array is changed, wherein, described first end that is electrically interposed in device of described second array is coupled to second processing unit; And
By described second processing unit described equipment under test is carried out electric test;
Wherein, described first face is different from described second.
21. method according to claim 20, wherein, described first with described second relative.
22. method according to claim 20, wherein, described equipment under test is a printed circuit board (PCB), and wherein said first with described second relative.
23. method according to claim 20 comprises by relatively producing the electric signal that belongs to the point on the not coplanar among described first and second of described equipment under test from described equipment under test, assesses the electric parameter of described equipment under test.
24. method according to claim 23 comprises:
The a plurality of arrays that are electrically interposed in device are pressed onto on the equipment under test, and a plurality of devices that are electrically interposed in of described a plurality of arrays are contacted with a plurality of points of described equipment under test, and described a plurality of difference in height that is electrically interposed in second end of device and is connected between a plurality of supporting constructions of described a plurality of arrays is changed; Wherein, described first end that is electrically interposed in device is coupled at least one processing unit; By described at least one processing unit described equipment under test is carried out electric test; Wherein, described a plurality of arrays comprise described first array, and wherein said a plurality of supporting construction comprises described first supporting construction.
25. method according to claim 14, wherein, the described density that is electrically interposed in device of described first array is the part of the distance between two interested points of described equipment under test.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18355309P | 2009-06-03 | 2009-06-03 | |
| US61/183,553 | 2009-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102033193A true CN102033193A (en) | 2011-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102700503A Pending CN102033193A (en) | 2009-06-03 | 2010-06-03 | Method and system for measuring the electricity behavior of a circuit |
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| Country | Link |
|---|---|
| CN (1) | CN102033193A (en) |
| TW (1) | TW201109677A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9885671B2 (en) | 2014-06-09 | 2018-02-06 | Kla-Tencor Corporation | Miniaturized imaging apparatus for wafer edge |
| US9645097B2 (en) | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
| TW201708835A (en) | 2015-08-04 | 2017-03-01 | 財團法人工業技術研究院 | System for monitoring an electronic circuit and a method for monitoring an electronic circuit |
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2010
- 2010-06-03 TW TW99117911A patent/TW201109677A/en unknown
- 2010-06-03 CN CN2010102700503A patent/CN102033193A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4520314A (en) * | 1981-10-30 | 1985-05-28 | International Business Machines Corporation | Probe head arrangement for conductor line testing with at least one probe head comprising a plurality of resilient contacts |
| CN1159001A (en) * | 1996-02-13 | 1997-09-10 | 日本电子材料株式会社 | Probe, manufacture of same, and vertically operative type probe card assembly employing same |
| WO2001009623A1 (en) * | 1999-07-28 | 2001-02-08 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| CN2493943Y (en) * | 2001-07-23 | 2002-05-29 | 吴志成 | Tester structure for printed circuit board |
| US20080136433A1 (en) * | 2003-05-30 | 2008-06-12 | Fujitsu Limited | Contactor for electronic components and test method using the same |
| CN1661375A (en) * | 2004-02-23 | 2005-08-31 | 日本电子材料株式会社 | Probe card |
| CN101133338A (en) * | 2004-12-02 | 2008-02-27 | Sv探针私人有限公司 | Probe card with segmented substrate |
| CN201066364Y (en) * | 2006-09-26 | 2008-05-28 | 技鼎股份有限公司 | Electronic testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201109677A (en) | 2011-03-16 |
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Application publication date: 20110427 |