CN102039466B - Heat conducting device and hot melting and soldering method thereof - Google Patents
Heat conducting device and hot melting and soldering method thereof Download PDFInfo
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- CN102039466B CN102039466B CN200910180846A CN200910180846A CN102039466B CN 102039466 B CN102039466 B CN 102039466B CN 200910180846 A CN200910180846 A CN 200910180846A CN 200910180846 A CN200910180846 A CN 200910180846A CN 102039466 B CN102039466 B CN 102039466B
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- heat
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- transfer device
- weldment
- wall
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
The invention discloses a heat conducting device and a hot melting and soldering method thereof. The heat conducting device is applicable to hot melting and soldering between a circuit board and a welding part. The heat conducting device comprises a wind scooper and a heat conducting jig, wherein the wind scooper is connected with a hot wind supply source to deliver hot wind, and the wind scooper comprises a wind outlet hole for hot wind to flow out; the heat conducting jig is arranged at the wind outlet hole of the wind scooper, the heat conducting jig comprises a contact wall arranged below the wind outlet hole at an interval and used for contacting the welding part and a surrounding wall formed by upward extending the periphery of the contact wall and connected with the wind scooper, the contact wall and the surrounding wall jointly define a flow guide space for guiding the flowing of the hot wind, and the contact wall is used for conducting heat to the welding part so as to melt soldering tin between the welding part and the circuit board. Thus, the invention can reduce the influence on other electronic elements or good chips.
Description
Technical field
The present invention relates to a kind of heat-transfer device and hot melt tin-soldering method thereof, relate to particularly that a kind of mode through heat conduction or water conservancy diversion heats and melting fitting and circuit board between the heat-transfer device and the hot melt tin-soldering method thereof of scolding tin.
Background technology
Like Fig. 1 and shown in Figure 2; At present on the circuit board 11 like portable electric devices such as mobile phone, personal digital assistants; Mostly be welded with spherical grid array type BGA (Ball Grid Array) chip 12; In order chip to be repaired 12 ' to be carried out heavy industry (Rework) operation, existing heavy industry board (figure does not show) is to adopt the mode of hot air convection that the soldered ball between chip 12 ' and the circuit board 11 121 is heated to make its fusing, chip 12 ' is taken off to repair or to reset replacement again.
Owing to be welded with metal shell 13 on the circuit board 11 of portable electric device; Metal shell 13 can lid covers chip 12,12 ' with shielding electromagnetic wave; Therefore; Heavy industry board need elder generation with after 131 fusings of the tin cream between metal shell 13 and the circuit board 11 and taking off metal shell 13, just can carry out the heavy industry operation of chip 12 ' to be repaired with the thermal convection current mode.Yet; In the process of hot blast that is flowed out via the air outlet 141 of the wind-guiding tool 14 of heavy industry board to metal shell 13 heating; Hot blast receives stopping of metal shell 13 or circuit board 11 and can change flow to, and makes electronic component 151 and the tin cream 152 thereof of metal shell 13 outsides be subject to the heating of hot blast and melts.Moreover the part hot blast can flow into metal shells 13 inside via the ventilating opening on metal shell 13 tops 132, causes chip 12,12 ' soldered ball 121 to be fused simultaneously with the tin cream 131 of metal shell 13.
As shown in Figure 3; The size that can meet chip 12 ' to be repaired for the convection current scope of the hot blast that makes the heavy industry board; Present way is the wind-guiding tool that is designed with different big or small air outlets to the chip of different sizes respectively; To change wind-guiding tool accordingly along with the size of chip 12 ' to be repaired with suitable big or small air outlet, thus, to be reduced in the heavy industry process hot blast to the influence of other electronic components 151 or good chip 12.Yet this kind mode can increase the design and the manufacturing cost of wind-guiding tool in a large number, causes the cost of heavy industry operation to increase.Moreover; Because the hot blast that blows out via the air outlet 141 (like Fig. 1) of wind-guiding tool 14 all is to blow down regularly to chip 12 ' to locate; And can't adjust the angle of air-out, therefore, hot blast can receive chip 12 ' or stopping of circuit board 11 and change the flow direction; Make electronic component 151 or good chip 12 be vulnerable to the heating of hot blast; Cause electronic component 151 and chip 12 to be melted and impaired, or the soldered ball 121 of tin cream 152 and chip 12 is melted, and then causes electronic component 151 and chip 12 to produce loosening phenomenon.More seriously, the electronic component 151 of microminiaturization and chip 12 meetings are blown away by hot blast and lose, and cause the reduction of heavy industry quality.
Summary of the invention
Main purpose of the present invention is to provide a kind of heat-transfer device, conducts heat on the weldment through heat exchange pattern, with the scolding tin between heating and melting fitting and the circuit board, thus, can reduce the influence to other electronic components or good chip.
Another object of the present invention is to provide a kind of heat-transfer device; Through bent and be positioned at the adjustment angle position the pliability tool, can hot blast be guided to the scolding tin between weldment and the circuit board, with the heating and the fusing scolding tin; Thus, can reduce other electronic components or the well influence of chip.
Another purpose of the present invention is to provide a kind of hot melt tin-soldering method of heat-transfer device, conducts heat on the weldment through heat exchange pattern, with the scolding tin between heating and melting fitting and the circuit board.
A purpose more of the present invention is to provide a kind of hot melt tin-soldering method of heat-transfer device, through bent and be positioned at the adjustment angle position the pliability tool, can hot blast be guided to the scolding tin between weldment and the circuit board, with the heating and the fusing scolding tin.
The object of the invention and solution background technology problem adopt following technological means to realize; According to the heat-transfer device that the present invention disclosed; Be suitable for the scolding tin hot melt between a circuit board and the weldment, heat-transfer device comprises a wind scooper and at least one heat conduction tool.
Wind scooper is linked on the hot blast feeding source in order to heat air delivery; Wind scooper comprises at least one exhaust vent that flow out in order to hot wind supply the bottom of being located at; Heat conduction tool is arranged at the exhaust vent place of wind scooper; Hot conduction tool comprises one at interval, and this is positioned at the contact wall of exhaust vent below in order to the Contact welding fitting at interval, reaches one by contacting the surrounding wall that the wall outside is extended and is connected with wind scooper up; Contact wall and surrounding wall define one jointly in order to the mobile diversion space of guiding hot blast, and the contact wall is in order to conduct heat to weldment with the scolding tin between melting fitting and the circuit board.
Surrounding wall is a pliability pipe; Its bent angle position that is positioned at institute's desire adjustment; So that being flattened on weldment, the contact wall energy is on the roof of inclination; The contact wall is that copper is made and removably be engaged on the surrounding wall, can promote the heat conduction efficiency that contacts wall, and this pliability pipe is the pliability stainless steel tube.
Preferably; Heat conduction tool comprises that also one is sheathed on first instlated tubular of surrounding wall outer surface; Thus, heat conduction tool can supply operating personnel to touch to promote the security on using, and can effectively heat-sealing be locked in the surrounding wall to promote the efficiency of heating surface of contact wall simultaneously.Further, heat conduction tool also comprises second instlated tubular of being located at the surrounding wall inner surface, can more effectively prevent the heat leakage and the efficiency of heating surface that more promotes the contact wall.First, second instlated tubular is respectively fiberglass pipe.
According to the heat-transfer device that the present invention disclosed, be suitable for the scolding tin hot melt between a circuit board and the weldment, heat-transfer device comprises a wind scooper and a pliability tool.
Wind scooper is linked on the hot blast feeding source in order to heat air delivery; Wind scooper comprises at least one exhaust vent that flow out in order to hot wind supply the bottom of being located at; The pliability tool is arranged at the exhaust vent place of wind scooper; The pliability tool comprises that one is bent and be positioned at the pliability pipe of the angle position of institute desire adjustment, and pliability is effective in the hot blast that exhaust vent was flowed out be guided to the scolding tin place between weldment and the circuit board and melt scolding tin.
The pliability pipe is a stainless steel, and the pliability tool comprises that also one is sheathed on the 3rd instlated tubular of pliability tube outer surface, and thus, the pliability tool can supply operating personnel to touch to promote the security on using.Further, the pliability tool also comprises the 4th instlated tubular of being located at the pliability pipe internal surface, makes hot blast in the pliability pipe, can not absorbed heat by the pliability pipe in the process of flowing.Three, the 4th instlated tubular is respectively fiberglass pipe.
According to the hot melt tin-soldering method of the heat-transfer device that the present invention disclosed, be suitable for the scolding tin hot melt between a circuit board and the weldment, this method comprises following step:
(A) heat a heat conduction tool that contacts with weldment, make heat conduction tool conduct heat to the scolding tin between this weldment and melting fitting and the circuit board; And
(B) taking off weldment makes it separate with circuit board.
In step (A), be to conduct tool with heat hot in the diversion space with heat air delivery to heat conduction tool.In step (B), heat conduction tool is with magnet magnetic weldment mode weldment to be separated with circuit board.
According to the hot melt tin-soldering method of the heat-transfer device that the present invention disclosed, be suitable for the scolding tin hot melt between a circuit board and the weldment, this method comprises following step:
(A) bending one pliability pipe is positioned at corresponding to the scolding tin position between circuit board and the weldment it;
(B) heat air delivery and be guided to scolding tin through the pliability pipe and sentence fusing scolding tin; And
(C) taking off weldment makes it separate with circuit board.
In this step (B), be through one be assembled in the air-out tool of pliability pipe bottom a microscler air outlet be guided to the scolding tin place.
Through above-mentioned technological means, the advantage and the effect of heat-transfer device of the present invention are, conduct tool through the heat of heat-transfer device and with heat conducting mode weldment are heated; With the scolding tin between melting fitting and the circuit board; Or heat-transfer device can be guided to the scolding tin between weldment and the circuit board with hot blast through the bent design of pliability tool that is positioned at the adjustment angle position, with heating and fusing scolding tin; Thus, can reduce electronic component or good welds part are impacted.
Description of drawings
Fig. 1 is the three-dimensional exploded view of existing wind-guiding tool and circuit board;
Fig. 2 is existing wind-guiding tool and the cross-sectional schematic of circuit board, explains that the wind-guiding tool heats to melt the tin cream between itself and the circuit board metal shell with the thermal convection current mode;
Fig. 3 is existing wind-guiding tool and the cross-sectional schematic of circuit board, explains that the wind-guiding tool heats to melt the soldered ball between itself and the circuit board chip with the thermal convection current mode;
Fig. 4 is first preferred embodiment of heat-transfer device of the present invention and the three-dimensional exploded view of circuit board;
Fig. 5 is the three-dimensional exploded view of first preferred embodiment of heat-transfer device of the present invention;
Fig. 6 is the three-dimensional exploded view that first preferred embodiment of heat-transfer device of the present invention is watched by another visual angle;
Fig. 7 is first preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, and the assembled relation between wind hole edge tool, heat conduction tool and the pliability tool is described;
Fig. 8 is the flow chart of hot melt tin-soldering method of first preferred embodiment of heat-transfer device of the present invention;
Fig. 9 is first preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, explains that hot blast conducts heat on the weldment contact wall to the contact wall heating of heat conduction tool, with the scolding tin between melting fitting and the circuit board;
Figure 10 is first preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, explain that scolding tin is melted after, heat-transfer device can separate with circuit board to drive weldment through magnet magnetic weldment;
Figure 11 is first preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, and the surrounding wall of heat conduction tool and the bent angle of pliability pipe of pliability tool are described, the contact site of contact wall is flattened on the roof of inclination;
Figure 12 is first preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, explains that wind hole edge tool can assemble a plurality of heat conduction tools simultaneously with respectively to a plurality of weldments heating;
Figure 13 is the three-dimensional exploded view of second preferred embodiment of heat-transfer device of the present invention;
Figure 14 is second preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, explains that hot blast conducts heat on the weldment contact wall to the contact wall heating of heat conduction tool, with the scolding tin between melting fitting and the circuit board;
Figure 15 is second preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, and the bent angle of surrounding wall of heat conduction tool is described, the contact site of contact wall is flattened on the roof of inclination;
Figure 16 is second preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, explains that wind hole edge tool can assemble a plurality of heat conduction tools simultaneously with respectively to a plurality of weldments heating;
Figure 17 is the three-dimensional exploded view of the 3rd preferred embodiment of heat-transfer device of the present invention;
Figure 18 is the 3rd preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, explains that hot blast conducts heat on the weldment contact wall to the contact wall heating of heat conduction tool, with the scolding tin between melting fitting and the circuit board;
Figure 19 is the 3rd preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board, explains that heat conduction tool can move up and down and the angle of inclination with respect to wind hole edge tool, is flattened on the roof of inclination the contact site of contact wall;
Figure 20 is the 3rd preferred embodiment of heat-transfer device of the present invention and the three-dimensional exploded view of circuit board, explains that wind hole edge tool can assemble a plurality of heat conduction tools simultaneously;
Figure 21 is the 3rd preferred embodiment of heat-transfer device of the present invention and the side view of circuit board, explains that wind hole edge tool can assemble a plurality of heat conduction tools simultaneously with to there being roof to be the weldment heating of high low head;
Figure 22 is the three-dimensional exploded view of the 4th preferred embodiment of heat-transfer device of the present invention;
Figure 23 is the 4th preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board;
Figure 24 is the flow chart of hot melt tin-soldering method of the 4th preferred embodiment of heat-transfer device of the present invention;
Figure 25 is the 4th preferred embodiment of heat-transfer device of the present invention and the operation chart of circuit board, explains that the pliability tool bends and is positioned at corresponding to the scolding tin position between circuit board and the weldment, heats scolding tin hot blast is guided to the scolding tin place;
Figure 26 is the 4th preferred embodiment of heat-transfer device of the present invention and the schematic top plan view of circuit board, the bending of pliability tool is described and is positioned at each lateral location corresponding to the periphery wall of weldment;
Figure 27 is the 4th preferred embodiment of heat-transfer device of the present invention and the operation chart of circuit board, explains that the pliability tool bends and is positioned at corresponding to the scolding tin position between circuit board and the weldment, heats scolding tin hot blast is guided to the scolding tin place;
Figure 28 is the three-dimensional exploded view of the 5th preferred embodiment of heat-transfer device of the present invention;
Figure 29 is the 5th preferred embodiment of heat-transfer device of the present invention and the partial schematic sectional view of circuit board;
Figure 30 is the 5th preferred embodiment of heat-transfer device of the present invention and the operation chart of circuit board; The microscler air outlet of the bending of pliability tool being described and being positioned at the air-out tool heats scolding tin hot blast is guided to the scolding tin place corresponding to the scolding tin position between circuit board and the weldment;
Figure 31 is the 5th preferred embodiment of heat-transfer device of the present invention and the schematic top plan view of circuit board, the bending of pliability tool is described and is positioned at the microscler air outlet of air-out tool each lateral location corresponding to the periphery wall of weldment; And
Figure 32 is the 5th preferred embodiment of heat-transfer device of the present invention and the schematic top plan view of circuit board; The microscler air outlet of the bending of pliability tool being described and being positioned at the air-out tool heats scolding tin hot blast is guided to the scolding tin place corresponding to the scolding tin position between circuit board and the weldment.
The main element symbol description
Existing
11 circuit boards
12,12 ' chip
121 soldered balls
13 metal shells
131,152 tin creams
132 ventilating openings
14 wind-guiding tools
141 air outlets
151 electronic components
The present invention
21 circuit boards
22,22 ' weldment
26,26 ' weldment
221,221 ' roof
222,225 periphery walls
223 first top wall portion
224 second top wall portion
23,27 scolding tin
24 electronic components
25 tin creams
300,310 heat-transfer devices
320,330 heat-transfer devices
340 heat-transfer devices
3 wind scoopers
31 cover bodies
311 hollow posts bodies
312 hollow shell bodies
313 sidewalls
314 perforation
315 cushion spaces
32 wind hole edge tools
321 plate bodys
322 joined walls
323 screws
324 exhaust vents
325 perisporiums
326,412 external screw threads
33 screws
4,4 ', 4 " heat conduction tool
41,41 ' contact wall
411 spiro union portions
413 contact sites
414 outer peripheral faces
42,42 ' surrounding wall
421,513 times internal threads
422 vents
423, internal thread on 511
424 wall bodies
425 snap rings
43,43 ' diversion space
44 first instlated tubulars
441 first through holes
45 second instlated tubulars
451 second through holes
46 magnet
5 pliability tools
51 pliability pipes
512,711 external screw threads
52 the 3rd instlated tubulars
53 the 4th instlated tubulars
6 hide
7 air-out tools
71 cylindrical housings
72 elongate housing
721 microscler air outlets
81,82 steps
91～93 steps
The I arrow
The specific embodiment
About aforementioned and other technology contents, characteristics and effect of the present invention, in the detailed description of following cooperation, can clearly appear with reference to five preferred embodiments of accompanying drawing.Through the explanation of the specific embodiment, when can being to reach technological means and the effect that predetermined purpose takes to be able to more deeply and concrete understanding to the present invention, yet appended accompanying drawing only provides the usefulness of reference and explanation, is not to be used for the present invention is limited.
Before the present invention is described in detail, be noted that in following description similar elements is to represent with identical numbering.
As shown in Figure 4; It is first preferred embodiment of heat-transfer device of the present invention; This heat-transfer device 300 is to be assembled in one on the hot blast feeding source of heavy industry board (figure does not show); Mainly be suitable for scolding tin 23 hot melts between a circuit board 21 and the weldment 22, make that weldment 22 can be by taking off on the circuit board 21.In the present embodiment, weldment 22 is one to cover the metal shell of chip with shielding electromagnetic wave in order to lid, and scolding tin 23 is one in order to metal shell is welded on the tin cream on the circuit board 21.
Like Fig. 5, Fig. 6 and shown in Figure 7, heat-transfer device 300 comprises one and is linked on the hot blast feeding source in order to the wind scooper 3 of heat air delivery, and wind scooper 3 comprises a cover body 31, and one removably be assembled in cover body 31 bottoms wind hole edge tool 32.Cover body 31 comprises the hollow posts body 311 that is connected with the hot blast feeding source; Reach one and be located at the square-shaped hollow shell body 312 in hollow posts body 311 bottoms, the hot blast that the hot blast feeding source is provided can flow out via the inflow of hollow posts body 311 tops and through hollow shell body 312 bottoms.Wind hole edge tool 32 comprises a square-shaped plate body 321; Plate body 321 end faces convex with the joined wall 322 that is around shape; Joined wall 322 is in order to be connected to each sidewall 313 inner surface of hollow shell body 312; The perforation 314 and the screw lock that are arranged in each sidewall 313 through each screw 33 be in each screw 323 of joined wall 322, makes wind hole edge tool 32 removably be assembled on the hollow shell body 312 and hide in hollow shell body 312 bottoms.Wind hole edge tool 32 also comprises a plurality of exhaust vents 324 that run through plate body 321 up and down; Define the cushion space 315 that is connected with each exhaust vent 324 through hollow shell body 312; Make the hot blast that flows in the hollow shell body 312 via hollow posts body 311 to be covered with earlier in cushion space 315, and flow out to the outside via each exhaust vent 324.
Heat-transfer device 300 also comprises one in order to the conduction of the heat on the wind hole edge tool 32 that is assembled in wind scooper 3 tool 4, and heat conduction tool 4 selectively is arranged at a wherein exhaust vent 324 places of wind hole edge tool 32.Heat conduction tool 4 is tubular and comprises one at interval; This is positioned at the contact wall 41 of these exhaust vent 324 belows in order to Contact welding fitting 22 at interval; And one extended and surrounding wall 42 in order to be connected with wind hole edge tool 32 by contact wall 41 outsides up; Contact wall 41 comprises a spiro union portion 411 in the form of annular discs, is bolted in the following internal thread 421 of a contiguous bottom end position of surrounding wall 42 inner surfaces through an external screw thread 412 of spiro union portion 411 outer peripheral faces, makes contact wall 41 removably be engaged on the surrounding wall 42.Contact wall 41 and surrounding wall 42 define one jointly and are connected in order to guide hot blast mobile diversion space 43 with exhaust vent 324; Thus; After flowing out via exhaust vent 324, hot blast can flow downward and to 41 heating of contact wall along diversion space 43; The contact site 413 that makes one of contact wall 41 be convexly set in spiro union portion 411 bottom surfaces can conduct to the mode of heat with the contact conduction on one roof 221 of weldment 22, is connected in the periphery wall 222 at place, roof 221 outsides and the scolding tin 23 between the circuit board 21 with one of melting fitting 22.In the present embodiment, contact site 413 outer peripheral faces are to be octagonal, and thus, being convenient to operating personnel can will contact wall 41 locking on the surrounding wall 42 or dismounting on by surrounding wall 42, to promote the convenience of dismounting through anistree wrench.Certainly, the also polygon of hexagon or other kinds of the outer peripheral face of contact site 413.
Preferable for the heat-conducting effect that makes contact wall 41, contact wall 41 is made with the good copper of thermal conductivity, makes that hot blasts in the diversion space 43 can be fast and add thermo-contact wall 41 effectively and the contact site 413 through contact wall 41 conducts heat on the weldment 22.Moreover, on using, in order to let contact wall 41 ability angles of inclination; So that being flattened on one of weldment 22, contact site 413 is on the skewed roof 221 ' (like Figure 11); The surrounding wall 42 of heat conduction tool 4 is a pliability pipe, through the bent angle position that is positioned at institute's desire adjustment of pliability pipe, makes the contact site 413 of contact wall 41 can be flattened on the roof 221 ' that is skewed; In the present embodiment, this pliability pipe is the pliability stainless steel tube.
Preferably; In the present embodiment; For the angle that provides operating personnel in heat-transfer device 300 operation, can touch and bend surrounding wall 42, produce with the situation that prevents to be scalded, can prevent that hot blast is hot lost extremely outside to reach effect of saving energy via surrounding wall 42 in the process of flowing in diversion space 43 simultaneously again; Heat conduction tool 4 comprises that also one is sheathed on first instlated tubular 44 of surrounding wall 42 outer surfaces; First instlated tubular 44 is the fiberglass pipe of 600 degree high temperature can be anti-Celsius, and the elastic force of the elastic telescopic that first instlated tubular 44 can be had through itself be set in surrounding wall 42 outer surfaces, or cements in surrounding wall 42 outer surfaces through viscose glue.Because heat-transfer device 300 its operating temperature in the process of running is to be lower than 600 degree Celsius; Therefore; Through good first instlated tubular, 44 designs of hear resistance, scalded to promote the security on using except preventing operating personnel, can also effectively heat-sealing be locked in the surrounding wall 42 to promote the efficiency of heating surface of contact wall 41; Make the hot blast feeding source need not expend the heating that too much energy can be accomplished contact wall 41, to reach effect of saving energy.
In addition; In order more effectively to prevent the heat leakage and the efficiency of heating surface that promotes contact wall 41 further; Heat conduction tool 4 also comprise second instlated tubular, 45, the second instlated tubulars 45 of being located at surrounding wall 42 inner surfaces be similarly can anti-600 degree high temperature Celsius fiberglass pipe, second instlated tubular 45 can cement in surrounding wall 42 inner surfaces through viscose glue; Thus; Make hot blast in diversion space 43, can not absorbed heat in the process of flowing by surrounding wall 42, and can be directly to 41 heating of contact wall, significantly to promote the efficiency of heating surface to contact wall 41.What need explanation is, in the present embodiment, though first, second instlated tubular 44,45 is that example is explained with the fiberglass pipe, not as limit, so long as the material of high temperature resistant and poor heat conduction all can be used.In addition, the heat of present embodiment conduction tool 4 also can be only at sheathed first instlated tubular 44 of surrounding wall 42 outer surfaces, and omits second instlated tubular 45, can reach the effect that prevents heat leakage and promote contact wall 41 efficiencies of heating surface equally.
Surrounding wall 42 also comprises a plurality of middle section position places that are located at so that diversion space 43 and the vent 422 that is connected of outside; First instlated tubular 44 comprises a plurality of and said vent 422 positions and corresponding first through hole 441 of quantity; And second instlated tubular 45 comprises a plurality of and said vent 422 positions and corresponding second through hole 451 of quantity; Hot blast in the diversion space 43 blows downwards to contact wall 41 and can up reflux; Design through vent 422 and first, second through hole 441,451; Make the hot blast that up refluxes can be in regular turn be expelled to the outside, thus, can reduce the hot blast of up backflow and toward the situation of generation flow-disturbing between the hot blast of current downflow via second through hole 451, vent 422 and first through hole 441.
Wind hole edge tool 32 also comprises a plurality of perisporiums 325 that are convexly set in plate body 321 bottom surfaces and lay respectively at said exhaust vent 324 outsides; Heat-transfer device 300 also comprises a pliability tool 5, and pliability tool 5 comprises that one is stainless steel and the pliability pipe 51 that selectively engages with a wherein perisporium 325 of wind hole edge tool 32.The last internal thread 511 at the adjacent top end place through pliability pipe 51 inner surfaces is bolted in an external screw thread 326 of perisporium 325 outer surfaces, makes pliability pipe 51 removably engage with the wind hole edge tool 32 of wind scooper 3.In addition; The surrounding wall 42 of heat conduction tool 4 is to engage with wind hole edge tool 32 through pliability pipe 51; The last internal thread 423 at the adjacent top end place through surrounding wall 42 inner surfaces is bolted in the external screw thread 512 at an adjacent top end place of pliability pipe 51 outer surfaces, makes surrounding wall 42 removably be sheathed on pliability pipe 51 outsides.
Because the length of surrounding wall 42 is long than the length of pliability pipe 51; And the internal diameter of surrounding wall 42 is slightly larger than the external diameter of pliability pipe 51; Therefore; After surrounding wall 42 is set in pliability pipe 51, pliability pipe 51 bottoms can with the spiro union portion that contacts wall 41 411 separately, and pliability pipe 51 outer surfaces can with surrounding wall 42 separately.Thus; The hot blast that exhaust vent 324 flows out flow to contact wall 41 and after contacting the stopping of wall 41; Can up and outward be back to the gap between pliability pipe 51 and the surrounding wall 42; Be expelled to the outside by second through hole 451, vent 422 and first through hole 441 more at last, avoid hot blast down in the process of flowing, the hot blast of part can be directly be expelled to the outside via second through hole 451, vent 422 and first through hole 441.The efficiency of heating surface that can prevent heat leakage effectively and promote contact wall 41 simultaneously, can avoid hot blast to be back in the wind scooper 3 and injury heavy industry board via exhaust vent 324.
Like Fig. 8 and shown in Figure 9, in the present embodiment, heat-transfer device 300 also includes a plurality of coverings 6; Each hides 6 and can be spirally connected with the external screw thread 326 (like Fig. 5) of each perisporium 325 of wind hole edge tool 32, to cover on exhaust vent 324, therefore; When only assembling a heat conduction tool 4 on the wind hole edge tool 32 of heat-transfer device 300; Operating personnel can selectively be bolted in covering 6 on the perisporium 325 covers the exhaust vent 324 that is not provided with heat conduction tool 4 with lid, thus, can reduce the loss of hot blast and the consumption of the energy.
Below will be elaborated to the hot melt tin-soldering method of heat-transfer device 300, Fig. 8 is the hot melt scolding tin method flow diagram of heat-transfer device 300, and its main flow process is:
Like step 81, the heat conduction tool 4 that heating contacts with weldment 22 makes heat conduction tool 4 conduct heat to the scolding tin 23 between weldment 22 and melting fitting 22 and the circuit board 21.
Heat-transfer device 300 is to be displaced downwardly to position shown in Figure 9 by position shown in Figure 7 earlier when operation, makes the hot contact site 413 that conducts the contact wall 41 of tool 4 be connected to the roof 221 of weldment 22.Then; The hot blast that exhaust vent 324 flowed out of wind scooper 3 can flow to diversion space 43 bottoms along direction shown in the arrow via the guiding of pliability pipe 51; Contact wall 41 with direct heat hot conduction tool 4; Through the strength that hot blast blows, can make the contact site 413 of contact wall 41 closely fit in the roof 221 of weldment 22, downwards to increase heat conducting speed.Because contact the stopping of wall 41 makes hot blast up and outward to be back to the gap between pliability pipe 51 and the surrounding wall 42 along direction shown in the arrow, be expelled to the outside by second through hole 451, vent 422 and first through hole 441 again.Preferably, heat conduction tool 4 also comprises two magnet 46 that are magneted on the outer peripheral face 414 of two opposition sides of contact site 413, is magneted in the roof 221 of weldment 22 through magnet 46, makes the contact site 413 of contact wall 41 can more closely be fitted in roof 221.Certainly, the quantity that is provided with of magnet 46 also can be one or more.
When contact wall 41 conducts heat to weldment 22 and heat welded part 22, can be with the periphery wall 222 and 23 fusings of the scolding tin between the circuit board 21 of weldment 22, because the coefficient of heat conduction of circuit board 21 is far below the coefficient of heat conduction of the weldment 22 of metal material; Therefore; Contact wall 41 conducts heat in the process of weldment 22, and circuit board 21 heated degree are not as weldment 22, thus; Can reduce the tin cream 25 of electronic component 24 or the scolding tin 27 of weldment 26 are impacted; Wherein, weldment 26 is a BGA formula chip, and scolding tin 27 is soldered ball.
Like Fig. 8 and shown in Figure 10,, take off weldment 22 it is separated with circuit board 21 like step 82.After the periphery wall 222 of weldment 22 and the scolding tin 23 (like Fig. 9) between the circuit board 21 melt fully; Heat-transfer device 300 can be along moving on the direction shown in the arrow I; Because the magnet 46 on the outer peripheral face 414 of contact site 413 is magneted in the roof 221 of weldment 22, therefore, can drives simultaneously when moving on the heat-transfer device 300 to move on the weldment 22 it is separated with circuit board 21; Thus, can promote the convenience when taking off weldment 22.
Shown in figure 11, because pliability pipe 51 and surrounding wall 42 are all flexual stainless steel tube, therefore; When operating personnel adjust the angle of surrounding wall 42; Second instlated tubular 45 of surrounding wall 42 inner surfaces is run into pliability pipe 51 can drive 51 bendings of pliability pipe simultaneously, so, can be via the hot blast that flow out pliability pipe 51 bottoms directly to 41 heating of contact wall; Can not influence the efficient of hot blast, make contact wall 41 still can conduct heat to apace on the roof 221 ' of weldment 22 41 heating of contact wall.
When using, the wind hole edge tool 32 of heat-transfer device 300 also can be assembled a plurality of heat conduction tools 4 as illustrated in fig. 12, to 22 heating of a plurality of weldments on the circuit board 21, thus, can melt the scolding tin 23 between a plurality of weldments 22 and the circuit board 21 simultaneously with simultaneously.
Like Figure 13 and shown in Figure 14; It is second preferred embodiment of heat-transfer device of the present invention; Its hot melt tin-soldering method is roughly identical with first preferred embodiment; Difference is that heat-transfer device 310 has omitted pliability tool 5, and hot surrounding wall 42 external diameters that conduct surrounding wall 42 external diameters of tool 4 ' less than the heat conduction tool 4 of first preferred embodiment, and the surrounding wall 42 of heat conduction tool 4 ' is the external screw thread 326 that is bolted in the perisporium 325 of wind hole edge tool 32 with internal thread on it 423.
The hot blast that exhaust vent 324 flowed out of wind scooper 3 can be flowed directly to the bottom along direction shown in the arrow via the guiding of diversion space 43, with the contact wall 41 of heat hot conduction tool 4 '.Because contact the stopping of wall 41, make that hot blast can be along up exteenal reflux and be expelled to the outside via second through hole 451, vent 422 and first through hole 441 of direction shown in the arrow.When contact wall 41 conducts heat to weldment 22 and heat welded part 22, can be with the periphery wall 222 and 23 fusings of the scolding tin between the circuit board 21 of weldment 22.After treating that scolding tin 23 melts fully, be magneted in the roof 221 of weldment 22, make to drive simultaneously when moving on the heat-transfer device 310 and move on the weldment 22 and separate with circuit board 21 through magnet 46.
When using, the bent surrounding wall 42 of operating personnel makes its angle position that is positioned at institute's desire adjustment, makes the contact site 413 of contact wall 41 to be flattened on as illustrated in fig. 15 on the roof 221 ' that is skewed.Moreover the wind hole edge tool 32 of heat-transfer device 310 also can be assembled a plurality of heat conduction tools 4 ' as illustrated in fig. 16 simultaneously, to 22 heating of a plurality of weldments on the circuit board 21, thus, can melt the scolding tin 23 between a plurality of weldments 22 and the circuit board 21 simultaneously with simultaneously.
Like Figure 17 and shown in Figure 180; It is the 3rd preferred embodiment of heat-transfer device of the present invention; Its hot melt tin-soldering method is roughly identical with first preferred embodiment; Difference is that heat-transfer device 320 has omitted pliability tool 5, and heat conduction tool 4 " structure construct different with the heat conduction tool 4 of first preferred embodiment.
Hot blasts in the cushion space 315 of wind scooper 3 can flow directly into heat conduction tool 4 " diversion space 43 ' in; and flow to the bottom to the 41 ' heating of contact wall; when contact wall 41 ' conducts heat to weldment 22 and heat welded part 22, can the periphery wall 222 of weldment 22 be melted with the scolding tin between the circuit board 21 23 along direction shown in the arrow.After treating that scolding tin 23 melts fully, can be with weldment 22 by taking off on the circuit board 21.Shown in figure 19; Because wall body 424 external diameters of surrounding wall 42 ' are less than exhaust vent 324 apertures; And snap ring 425 external diameters are greater than exhaust vent 324 apertures, therefore, heat conduction tool 4 " can move up and down and the angle of inclination with respect to wind hole edge tool 32; thus, make heat conduction tool 4 " contact wall 41 ' can be flattened on as illustrated in fig. 19 on the roof 221 ' that is skewed.
Like Figure 20 and shown in Figure 21, desire on wind hole edge tool 32, to assemble simultaneously a plurality of and the corresponding heat conduction of exhaust vent 324 quantity tool 4 " time, the design that wind hole edge tool 32 can omit perisporium 325.A plurality of heat conduction tools 4 of heat-transfer device 320 " can be simultaneously to weldment a 22 ' heating with roof of high low head; when some heat conduction tool 4 " contact wall 41 ' when being connected to lower first top wall portion 223 of a level height of weldment 22 ', heat conduction tool 4 " snap ring 425 still remain on plate body 321 end faces that are connected in wind hole edge tool 32.When some heat conduction tool 4 " contact wall 41 ' when being connected to higher second top wall portion 224 of a level height of weldment 22 '; heat conduction tool 4 " can receive stopping of second top wall portion 224 and upwards passed, make snap ring 425 and plate body 321 separately.Thus; The heat of heat-transfer device 320 conduction tool 4 " can conduct heat to equably on first, second top wall portion 223,224 of weldment 22 '; so that the scolding tin 23 between periphery wall 225 and the circuit board 21 is all melted, the situation generation that can avoid the phenomenon because of high low head to cause part scolding tin 23 underheats to melt.
Shown in Figure 22 and 23, be the 4th preferred embodiment of heat-transfer device of the present invention, its unitary construction and hot melt tin-soldering method and first preferred embodiment are different.
Heat-transfer device 330 comprises a plurality of pliability tools of being located on the wind hole edge tool 32 5, in the present embodiment, is to be that example is explained with four.Each pliability tool 5 comprises that one is screwed onto the pliability pipe 51 of the perisporium 325 of wind hole edge tool 32, and pliability pipe 51 can supply operating personnel's bending angle to be guided to scolding tin 23 places between weldment 22 and the circuit board 21 and to melt scolding tin 23 with the hot blast that exhaust vent 324 is flowed out.Preferably; Each pliability tool 5 comprises that also one is sheathed on the 3rd instlated tubular 52 of pliability pipe 51 outer surfaces; The 3rd instlated tubular 52 is the fiberglass pipe of 600 degree high temperature can be anti-Celsius; The elastic force of the elastic telescopic that the 3rd instlated tubular 52 can be had through itself is set in pliability pipe 51 outer surfaces, or cements in pliability pipe 51 outer surfaces through viscose glue.Thus, scalded to promote the security on using, can also effectively heat-sealing be locked in the pliability pipe 51 to avoid hot blast in flow process, to be scattered and disappeared to outside by pliability pipe 51 except preventing operating personnel.Further; Each pliability tool 5 also comprises the 4th instlated tubular 53 of being located at pliability pipe 51 inner surfaces; The 4th instlated tubular 53 is similarly fiberglass pipe; It can cement in pliability pipe 51 inner surfaces through viscose glue, thus, makes hot blast in pliability pipe 51, can not absorbed heat by pliability pipe 51 in the process of flowing.
Like Figure 24, Figure 25 and shown in Figure 26, Figure 24 is the hot melt scolding tin method flow diagram of heat-transfer device 330, and its main flow process is:
Like step 91, bending pliability pipe 51 is positioned at corresponding to scolding tin 23 positions between circuit board 21 and the weldment 22 it.Because most weldment 22 is all square-shaped; Therefore; Through the setting of four groups of pliability tools 5, after with 5 bendings of each pliability tool, each pliability tool 5 can correspond to each side and scolding tin 23 positions between the circuit board 21 of the periphery wall 222 of weldment 22 respectively.
Like step 92, heat air delivery and through pliability pipe 51 be guided to scolding tin 23 sentence the fusing scolding tin 23.Through each pliability tool 5 hot blast is guided to each side of periphery wall 222 and the scolding tin 23 between the circuit board 21, can be simultaneously scolding tin 23 fusings of each side of periphery wall 222.
Like step 93, take off weldment 22 it is separated with circuit board 21.After treating that hot blast that each pliability tool 5 is derived melts scolding tin 23 fully, can be with weldment 22 by taking off on the circuit board 21.Can bend and be positioned at the angle position of adjustment through each pliability tool 5; Make operating personnel can accurately control the flow direction of the hot blast that pliability tool 5 derived; Thus; 24 heating are melted it and impaired to the electronic component of weldment 22 outsides to avoid hot blast, or with tin cream 25 fusings and make electronic component 24 produce loosening phenomenon.
Shown in figure 27, after weldment 22 is removed, the action that the scolding tin 27 (soldered ball) of the weldment 26 ' to be repaired (BGA formula chip) that heat-transfer device 330 can cover 22 lids of weldment heats.With each pliability tool 5 be bent to correspond to scolding tin 27 positions after, each pliability tool 5 can with hot blast be guided to scolding tin 27 sentence the fusing scolding tin 27.After treating that scolding tin 27 melts fully, can be with weldment 26 ' to be repaired by the action of taking off on the circuit board 21 to repair or to reset.In the process of hot melt scolding tin 27; Can avoid hot blast it to be melted and impaired to the electronic component 24 of weldment to be repaired 26 ' outside or good weldment 26 heating, or with tin cream 25 and scolding tin 27 fusings and make electronic component 24 or good weldment 26 produces loosening phenomenon.
Shown in Figure 28 and 29, be the 5th preferred embodiment of heat-transfer device of the present invention, its hot melt tin-soldering method is identical with the 4th preferred embodiment, and difference is that heat-transfer device 340 also comprises a plurality of air-out tools 7 of being located at pliability tool 5 bottoms respectively.
Each air-out tool 7 is a metal material; It comprises a cylindrical housings 71; And one be located at cylindrical housings 71 bottoms elongate housing 72; Be bolted in the internal thread 513 of pliability pipe 51 inner surface positon of near bottom through an external screw thread 711 of cylindrical housings 71 outer surface proximal portions, make air-out tool 7 removably be assembled on the pliability pipe 51.Elongate housing 72 bottoms of air-out tool 7 define a microscler air outlet 721, in order to the hot blast in the pliability tool 5 is derived.
Like Figure 30 and shown in Figure 31; Operating personnel can be through each pliability tool 5 of bending; The microscler air outlet 721 that makes air-out tool 7 is corresponding to each side of the periphery wall 222 of weldment 22 and scolding tin 23 positions between the circuit board 21; Because roughly each side edge length with periphery wall 222 is identical or approaching for microscler air outlet 721 length of each air-out tool 7, therefore, through microscler air outlet 721 hot blast is guided to scolding tin 23 places; Can avoid comforting the situation generation that uneven phenomenon causes part scolding tin 23 underheats to melt equably to scolding tin 23 heating and the fusing scolding tin 23 at every place because of hot blast blows.After treating that scolding tin 23 melts fully, can be with weldment 22 by taking off on the circuit board 21.
Shown in figure 32, after weldment 22 is removed, the action that the scolding tin 27 (soldered ball) of the weldment 26 ' to be repaired (BGA formula chip) that heat-transfer device 340 can cover 22 lids of weldment heats.After making the microscler air outlet 721 of air-out tool 7 correspond to scolding tin 27 positions 5 bendings of each pliability tool, the microscler air outlet 721 of each air-out tool 7 can be guided to scolding tin 27 with hot blast and sentence fusing scolding tin 27.After treating that scolding tin 27 melts fully, can be with weldment 26 ' to be repaired by the action of taking off on the circuit board 21 to repair or to reset.
Conclude above-mentioned; Heat conduction tool 4,4 ', 4 through heat-transfer device 300,310,320 " with heat conducting mode to weldment 22,22 ' heating; with melting fitting 22,22 ' with circuit board 21 between scolding tin 23, or heat-transfer device 330,340 is through the bent design that is positioned at the pliability tool 5 of adjustment angle position, can with hot blast be guided to weldment 22,26 ' with circuit board 21 between scolding tin 23,27; to heat and to melt scolding tin 23,27; thus, can reduce that electronic component 24 or good welds part 26 are impacted, so can reach the purpose of institute of the present invention demand really.
Above-describedly be merely preferred embodiment of the present invention; Can not limit the scope that the present invention implements with this; Be allly to change and modify, all still belong in the scope that patent of the present invention contains according to claim of the present invention and the simple equivalent done of invention description.
Claims (19)
1. a heat-transfer device is suitable for the scolding tin hot melt between circuit board and the weldment, and this heat-transfer device comprises:
Wind scooper is linked on the hot blast feeding source in order to heat air delivery, and this wind scooper comprises at least one exhaust vent that flows out in order to hot wind supply; And
At least one heat conduction tool; Be arranged at this exhaust vent place of this wind scooper; This heat conduction tool comprises one at interval, and this is positioned at this exhaust vent below at interval in order to contacting the contact wall of this weldment, and the surrounding wall that extended up and be connected with this wind scooper by this contact wall outside; This contact wall and this surrounding wall define one jointly in order to the mobile diversion space of guiding hot blast, and this contact wall is in order to conduct heat to this weldment to melt the scolding tin between this weldment and this circuit board.
2. heat-transfer device according to claim 1, wherein, this surrounding wall is the pliability pipe, its bent angle position that is positioned at institute's desire adjustment, this contact wall removably is engaged on this surrounding wall.
3. heat-transfer device according to claim 2, wherein, this heat conduction tool comprises that also one is sheathed on first instlated tubular of this surrounding wall outer surface.
4. heat-transfer device according to claim 3, wherein, this heat conduction tool also comprises second instlated tubular of being located at this surrounding wall inner surface.
5. heat-transfer device according to claim 4; Wherein, This contact wall comprise one be bolted in this surrounding wall spiro union portion; And one be convexly set in this spiro union portion bottom surface in order to contacting the contact site of this weldment, and this heat conduction tool comprises that also one is magneted in this contact site outer peripheral face and in order to the magnet of this weldment of magnetic.
6. heat-transfer device according to claim 5; Also comprise a pliability tool; This pliability tool comprises that one removably is engaged in the pliability pipe at this exhaust vent place of this wind scooper bottom; This surrounding wall of this heat conduction tool removably be sheathed on this pliability pipe outside and with its separately, this pliability pipe bottom contact wall separately with this, this surrounding wall comprises a plurality of this diversion space and outsides of making and is connected in order to the vents with the discharge of the hot blast in this diversion space.
7. heat-transfer device according to claim 6, wherein, this first instlated tubular comprises a plurality of and said vent position and corresponding first through hole of quantity, and this second instlated tubular comprises a plurality of and said vent position and corresponding second through hole of quantity.
8. heat-transfer device according to claim 6, wherein, this wind scooper comprises that one is convexly set in the bottom surface and is positioned at the perisporium of this exhaust vent outside, and this pliability pipe is bolted in this perisporium outer surface, and this surrounding wall is bolted in this pliability tube outer surface proximal portion.
9. heat-transfer device according to claim 2; Also comprise a pliability tool; This pliability tool comprises that one removably is engaged in the pliability pipe at this exhaust vent place of this wind scooper bottom; This surrounding wall of this heat conduction tool removably be sheathed on this pliability pipe outside and with its separately, this pliability pipe bottom contact wall separately with this, this surrounding wall comprises a plurality of this diversion space and outsides of making and is connected in order to the vents with the discharge of the hot blast in this diversion space.
10. heat-transfer device according to claim 9; Wherein, This contact wall comprise one be bolted in this surrounding wall spiro union portion; And one be convexly set in this spiro union portion bottom surface in order to contacting the contact site of this weldment, and this heat conduction tool comprises that also one is magneted in this contact site outer peripheral face and in order to the magnet of this weldment of magnetic.
11. heat-transfer device according to claim 9, wherein, this heat conduction tool comprises that also one is sheathed on first instlated tubular of this surrounding wall outer surface, and this first instlated tubular comprises a plurality of and said vent position and corresponding first through hole of quantity.
12. heat-transfer device according to claim 11; Wherein, This heat conduction tool also comprises second instlated tubular of being located at this surrounding wall inner surface; This second instlated tubular comprises a plurality of and said vent position and corresponding second through hole of quantity, and this first instlated tubular and this second instlated tubular are respectively fiberglass pipe.
13. heat-transfer device according to claim 5, wherein, this wind scooper comprises that one is convexly set in the bottom surface and is positioned at the perisporium of this exhaust vent outside, and this surrounding wall is bolted in this perisporium outer surface.
14. heat-transfer device according to claim 1; Wherein, This wind scooper comprises a cover body; And one removably be assembled in this cover body bottom and have the wind hole edge tool of this exhaust vent, and this surrounding wall comprises one and contacts the wall body that wall is connected and is arranged in this exhaust vent with this, reach one by this this external surface of wall radial outward protrude out and the adjacent top end place in order to be connected in the snap ring of this wind hole edge tool end face.
15. heat-transfer device according to claim 14, wherein, this this body diameter of wall is less than this exhaust vent aperture, and this snap ring external diameter is greater than this exhaust vent aperture.
16. heat-transfer device according to claim 1; Wherein, This wind scooper comprises a plurality of exhaust vents that flow out in order to hot wind supply the bottom of being located at, and this heat-transfer device comprises a plurality of heat conduction tools, and a plurality of coverings; Respectively should heat the conduction tool selectively be arranged at respectively this exhaust vent and sentence and conduct heat to this weldment, and respectively this covering selectively covers on and is not provided with respectively and should heat conducts on respectively this exhaust vent of tool.
17. the hot melt tin-soldering method of each described heat-transfer device is suitable for the scolding tin hot melt between circuit board and the weldment among employing such as the claim 1-16, this method comprises following step:
(A) this heat of contact with this weldment of heating is conducted tool, make this heat conduct tool conduct heat to this weldment and melt this weldment and this circuit board between scolding tin; And
(B) taking off this weldment makes it separate with this circuit board.
18. the hot melt tin-soldering method of heat-transfer device according to claim 17 wherein, in this step (A), is should heat conduct tool with heating in heat air delivery to the diversion space of this heat conduction tool.
19. the hot melt tin-soldering method of heat-transfer device according to claim 18, wherein, in this step (B), this heat conduction tool is with this weldment mode of a magnet magnetic this weldment to be separated with this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910180846A CN102039466B (en) | 2009-10-19 | 2009-10-19 | Heat conducting device and hot melting and soldering method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910180846A CN102039466B (en) | 2009-10-19 | 2009-10-19 | Heat conducting device and hot melting and soldering method thereof |
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| Publication Number | Publication Date |
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| CN102039466A CN102039466A (en) | 2011-05-04 |
| CN102039466B true CN102039466B (en) | 2012-09-26 |
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| CN200910180846A Expired - Fee Related CN102039466B (en) | 2009-10-19 | 2009-10-19 | Heat conducting device and hot melting and soldering method thereof |
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| JP5651575B2 (en) * | 2011-12-27 | 2015-01-14 | 株式会社カイジョー | Wire bonding apparatus and wire bonding method |
| CN104227168A (en) * | 2014-08-23 | 2014-12-24 | 华东光电集成器件研究所 | Device for detaching circuit with pins on four sides |
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| US2087432A (en) * | 1935-11-14 | 1937-07-20 | Frank S Hebden | Display apparatus |
| US5516030A (en) * | 1994-07-20 | 1996-05-14 | Compaq Computer Corporation | Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement |
| US6264094B1 (en) * | 1999-02-02 | 2001-07-24 | International Business Machines Corporation | Rework and underfill nozzle for electronic components |
| CN2841221Y (en) * | 2005-11-25 | 2006-11-29 | 超越电机股份有限公司 | Cooling apparatus capable of keeping fixed distance with delivering track of soldering machine |
| CN101014227A (en) * | 2007-02-02 | 2007-08-08 | 清华大学 | Method and equipment for disassembling circuit board using contacted impact |
| CN201012419Y (en) * | 2007-08-02 | 2008-01-30 | 徐章信 | Soldering tin melting groove |
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2009
- 2009-10-19 CN CN200910180846A patent/CN102039466B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2087432A (en) * | 1935-11-14 | 1937-07-20 | Frank S Hebden | Display apparatus |
| US5516030A (en) * | 1994-07-20 | 1996-05-14 | Compaq Computer Corporation | Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement |
| US6264094B1 (en) * | 1999-02-02 | 2001-07-24 | International Business Machines Corporation | Rework and underfill nozzle for electronic components |
| CN2841221Y (en) * | 2005-11-25 | 2006-11-29 | 超越电机股份有限公司 | Cooling apparatus capable of keeping fixed distance with delivering track of soldering machine |
| CN101014227A (en) * | 2007-02-02 | 2007-08-08 | 清华大学 | Method and equipment for disassembling circuit board using contacted impact |
| CN201012419Y (en) * | 2007-08-02 | 2008-01-30 | 徐章信 | Soldering tin melting groove |
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