CN102148316A - 采用电表面安装的发光晶片封装 - Google Patents

采用电表面安装的发光晶片封装 Download PDF

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CN102148316A
CN102148316A CN2011100215620A CN201110021562A CN102148316A CN 102148316 A CN102148316 A CN 102148316A CN 2011100215620 A CN2011100215620 A CN 2011100215620A CN 201110021562 A CN201110021562 A CN 201110021562A CN 102148316 A CN102148316 A CN 102148316A
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substrate
luminescent wafer
radiator
led
trace
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CN102148316B (zh
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彼得·S·安德鲁斯
班恩·P·洛
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Cree Huizhou Solid State Lighting Co Ltd
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Abstract

本发明揭示一种发光晶片封装。所述晶片封装包含一衬底、一反射板和一透镜。所述衬底可由导热但电绝缘的材料制成，或者由一既导热又导电的材料制成。在其中所述衬底由一导电材料制成的实施例中，所述衬底进一步包含一形成在所述导电材料上的电绝缘、导热的材料。所述衬底具有用以连接到一安装垫上的一发光二极管(LED)的迹线。所述反射板耦合到所述衬底且大体上围绕所述安装垫。所述透镜大体上覆盖所述安装垫。所述衬底(充当一底部散热体)和所述反射板(充当一顶部散热体)二者将运作期间由所述LED产生的热量从所述LED吸去。所述反射板包含一反射表面，用以将来自所述LED的光沿一所要方向引导。

Description

采用电表面安装的发光晶片封装
本申请为2004年10月20日提交，名称为“采用电表面安装的发光晶片封装”、申请号为200480030943.3的发明专利申请的分案申请。
本申请案为2003年5月27日申请的题为“Power Surface Mount Light Emitting Die Package”美国专利申请案第10/446,532号的部分接续申请案，主张2002年9月4日申请的题为“Power-SMT，LED Package with Dual Heat-Sinks and an Optical System or Chemical-Coated Lens”的美国临时申请案第60/408,254号的优先权。
技术领域
本发明涉及封装半导体设备领域，且更确切地说涉及封装发光二极管。
背景技术
发光二极管(LED)通常封装在引线框架封装中。引线框架封装通常包括一模制塑料体，所述模制塑料体将LED、透镜部分和连接到所述LED并延伸到所述塑料体外面的细小金属引线包封起来。引线框架封装的金属引线充当向LED供应电力的导管，且同时可以从LED中吸去热量。当向LED施加电力以发光时，LED会产生热量。引线中有一部分延伸出封装体，以便连接到引线框架封装外面的电路。
LED产生的热量中有些被塑料封装体驱散，然而，大多热量通过封装的金属组件而从LED中吸去。金属引线通常非常细小，且横截面较小。因此，金属引线从LED中移除热量的能力有限。这限制了可输送给LED的电量，从而限制了LED的发光量。
为了提高LED封装的散热能力，在一种LED封装设计中，将一散热条放置在LED封装内的金属引线下。散热条提高了LED封装的散热能力，但是散热条增加了LED封装的尺寸、质量和成本。尺寸、质量和成本的增加并不合乎需要。
在另一种LED封装设计中，引线框架的引线被延伸(以各种形状和构造)到LED封装体最近边缘之外。这增大了暴露到周围空气中的引线部分的表面积。延伸引线的暴露表面积的增大提高了LED封装的散热能力，但是，延伸引线增加了LED封装的尺寸、质量和成本。
当前引线框架封装设计另一不理想的方面涉及到与封装的热膨胀相关的问题。当热量产生时，LED封装会经受热膨胀。LED封装的每个部件均具有不同的热膨胀系数(CTE)。例如，LED的CTE、封装体的CTE、引线的CTE以及透镜的CTE互不相同。因此，当这些部件受热时，每个部件均会经受不同程度的热膨胀，这导致了封装部件之间存在机械应力，进而对封装的可靠性产生不利影响。
因此，仍然需要一种改进的LED封装，其可克服或缓解现有技术封装的一个或一个以上缺陷。
发明内容
本发明的实施例提供一种用于半导体晶片(例如发光二极管)的封装，所述封装包含：一衬底，其具有用以连接到安装垫上的发光二极管的导电元件；一反射板，其耦合到所述衬底并大体上围绕所述安装垫；和透镜，其大体上覆盖所述安装垫。
本发明的其他实施例提供一种半导体晶片封装，其包含一底部散热体(heat sink)和一顶部散热体。所述底部散热体的顶面上可具有迹线。半导体晶片可安装到所述底部散热体的顶面上并电连接到所述迹线。顶部散热体可机械耦合到底部散热体。
在其他实施例中，底部散热体可包含具有第一和第二表面的导热且导电的板。所述板可包括金属，例如铜、铝或任一者的合金。所述金属板的第一表面的部分上形成有较薄的导热绝缘膜，且金属板的其他表面上也可形成有较薄的导热绝缘膜。
陶瓷/聚合物膜上可形成有传导元件，例如金属迹线和/或金属引线。由于陶瓷/聚合物膜是绝缘的，所以传导迹线与金属板没有电接触。传导元件可形成或电连接到安装垫，所述安装垫经调整以接收例如LED的电子设备。
在有些实施例中，可穿过衬底形成一个或一个以上通孔。在有些实施例中，所述通孔内部可涂覆有绝缘材料，例如陶瓷/聚合物膜。可在通孔中形成例如导电迹线的电导体，以便将衬底第一表面上的传导元件电连接到衬底第二表面上的传导元件。
根据本发明实施例的衬底也可包含例如连接在一个或一个以上传导元件之间的齐纳二极管(Zener Diode)和/或电阻器网络的电子电路，用以静电放电(ESD)和/或过压保护。
本发明的其他方面和优势将通过以下详细说明而变得显而易见，所述详细说明与附图一起以举例的形式说明本发明的原理。
附图说明
图1A是根据本发明一个实施例的半导体晶片封装的透视图；
图1B是图1A中的半导体封装的分解透视图；
图2A是图1A中的半导体封装的一部分的顶视图；
图2B是图1A中的半导体封装的一部分的侧视图；
图2C是图1A中的半导体封装的一部分的前视图；
图2D是图1A中的半导体封装的一部分的仰视图；
图3是图1A中的半导体封装的部分的剖视侧视图；
图4是图1A的具有额外元件的半导体封装的侧视图；
图5是根据本发明另一实施例的半导体晶片封装的分解透视图；
图6A是图5中的半导体封装的一部分的顶视图；
图6B是图5中的半导体封装的一部分的侧视图；
图6C是图5中的半导体封装的一部分的前视图；
图6D是图5中的半导体封装的一部分的仰视图；
图7A是根据本发明另一实施例的半导体封装的一部分的顶视图；
图7B是图7A中的半导体封装的部分的前视图；
图7C是图7A中的半导体封装的部分沿线A-A截取的剖视前视图；
图8是根据本发明另一实施例的半导体封装的一部分的侧视图；
图9是根据本发明另一实施例的半导体封装的一部分的侧视图；
图10A是根据本发明另一实施例的半导体封装的一部分的顶视图；和
图10B是根据本发明另一实施例的半导体封装的一部分的顶视图。
具体实施方式
现在将参考图1至图10B描述本发明，所述图示说明本发明的不同实施例。如图所示，层或区域的尺寸被夸大以便进行说明，且因此提供来说明本发明的大体结构。此外，参考形成在衬底或者其他层或结构上的层或结构来描述本发明的各个方面。所属领域的技术人员应了解，一层形成在另一层或衬底“上”是指可能有额外的层介入。在本文中，一层在没有介入层的情况下形成在另一层或衬底上被描述为“直接形成在”所述层或衬底上。此外，例如下方的相关术语在本文中可用来描述图中所示的一个层或区域同另一层或区域的关系。应了解，这些术语旨在包括所述设备除图中描绘方位之外的不同方位。例如，如果图中的设备被颠倒，那么原本描述为位于其他层或区域“下方”的层或区域现在便定位在所述其他层或区域的“上方”。术语“下方”旨在包括这种情形下的上方和下方两种情况。相同数字始终指代相同元件。
如图中为说明起见所示，以一发光晶片封装来示范本发明的实施例，所述发光晶片封装包含：一底部散热体(衬底)，其具有用以连接到位于安装垫上的发光二极管的迹线；和一顶部散热体(反射板)，其大体上围绕所述安装垫。一透镜覆盖在安装垫上。实际上，根据本发明一些实施例的晶片封装包括两部分散热体，其中，底部散热体用作(除了其吸热和散热功效以外)衬底，LED安装并连接到其上，而顶部散热体用作(除了其吸热和散热功效以外)反射板，用以引导LED产生的光。因为底部和顶部散热体均从LED中吸热，所以可将更多的电力传递给LED，且因此LED可以产生更多的光。
此外，在本发明中，晶片封装本身可充当散热体，其从LED中移除热量并将其驱散。因此，本发明的LED晶片封装可无需单独的散热条或从封装中延伸出去的引线。因此，与现有技术的晶片封装相比，根据本发明的LED晶片封装可更加紧凑、更加可靠，并且制造成本更低。
图1A是根据本发明一实施例的半导体晶片封装10的透视图，且图1B是图1A中的半导体封装的分解透视图。参看图1A和1B，本发明的发光晶片封装10包含底部散热体20、顶部散热体40和透镜50。
图2A至2D中更加详细地说明底部散热体20。图2A、2B、2C和2D分别提供图1A中的底部散热体20的顶视图、侧视图、前视图和仰视图。此外，图2C除了展示底部散热体20的前视图之外，还展示了LED组合件60。LED组合件60在图1B中也有说明。参看图1A至2D，底部散热体20为电迹线22和24、焊垫26、32和34以及LED组合件60提供支撑。因此，底部散热体20也称为衬底20。在图中，为了避免混乱，只有代表性焊垫26、32和34标有参考数字。迹线22和24以及焊垫26、32和34可用传导材料制造。此外，可在衬底20的顶部、侧面或底部上制造额外迹线和连接件，或者将其布层在衬底20内部。迹线22和24、焊垫26、32和34以及其他任何连接件可以用已知方法(例如通孔)以任何组合形式彼此互连。
在有些实施例中，衬底20可由具有高导热性但电绝缘的材料制成，例如氮化铝(AlN)或氧化铝(Al2O3)。在其他实施例中，例如下文结合图7A至10B描述的实施例中，衬底20可包括一种既导电又导热的材料。在此类实施例中，金属引线、传导迹线22和24或者二者可通过形成在衬底部分上的绝缘膜而与衬底绝缘，以下将进行更详细的描述。衬底20的尺寸可根据用来制造晶片封装10的应用和工艺而广泛变化。例如，在所说明的实施例中，衬底20的尺寸可在数毫米(mm)到数十毫米之间变化。虽然本发明并不局限于特定尺寸，但本发明的晶片封装10的一个特定实施例在图中说明为具有其中所示的尺寸。图中所示的所有尺寸均以毫米(用于长度、宽度、高度和半径)和度(用于角度)计算，除非图中、此处的说明书中或二者中另有所指。
衬底20具有顶面21，顶面21包含电迹线22和24。迹线22和24提供从焊垫(例如顶部焊垫26)到安装垫28的电连接。顶部焊垫26可包括迹线22和24的大体上靠近衬底20侧面的部分。顶部焊垫26电连接到侧焊垫32。安装垫28是顶面(包含迹线22、迹线24或二者的部分)的一部分，LED组合件60安装在其上。安装垫28通常大体上位于邻近顶面21中心处。在本发明的替代实施例中，LED组合件60可由其他半导体电路或晶片代替。
迹线22和24提供电路线以允许LED组合件60电连接到焊垫26、32或34。因此，有些迹线称为第一迹线22，而其他迹线称为第二迹线24。在所说明的实施例中，安装垫28包含第一迹线22和第二迹线24二者的部分。在所说明的实例中，LED组合件60放置在安装垫28的第一迹线22部分上，从而与第一迹线22接触。在所说明的实施例中，LED组合件60的顶部和第二迹线24通过接合线62彼此连接。根据LED组合件60的构造和方位，第一迹线22可提供LED组合件60的阳极(正极)连接，且第二迹线24可包括LED组合件60的阴极(负极)连接，或反之亦然。
LED组合件60可包含额外元件。例如，在图1B和2C中，LED组合件60说明为包含LED接合线62、LED子组合件64和发光二极管(LED)66。此LED子组合件64在所属领域中是已知的，并且是为论述本发明的目的加以说明，而不是旨在限制本发明。图中，LED组合件60展示为晶片附着到衬底20。在替代实施例中，安装垫28可配置成允许LED组合件60的倒装晶片附着。此外，多个LED组合件可安装在安装垫28上。在替代实施例中，LED组合件60可安装在多个迹线上。如果使用倒装晶片技术的话尤其如此。
迹线22和24的布局可能与图中所说明的布局大不相同，但仍然属于本发明的范畴。图中展示了三个单独的阴极(负极)迹线24，以说明三个LED组合件可放置在安装垫28上，其中每一个连接到一不同的阴极(负极)迹线；因此，这三个LED组合件可单独电性控制。迹线22和24由传导材料制成，例如金、银、锡或其他金属。迹线22和24可具有图中所说明的尺寸，且根据应用而定具有数微米或数十微米的厚度。例如，迹线22和24可为15微米厚。图1A和2A说明一方位标记27。此种标记可用来识别晶片封装10的正确方位，即使在晶片封装10组装之后也是如此。如图所示，迹线22和24可从安装垫28延伸到衬底20侧面。
继续参看图1A至2D，衬底20界定半圆柱空间23和邻近其侧面的四分之一圆柱空间25。图中为避免混乱起见，只有代表性空间23和25标有参考数字。半圆柱空间23和四分之一圆柱空间25为焊料提供空间，以便当晶片封装10附着到印刷电路板(PCB)或另一装置(未图示)(晶片封装10是其组件)时，焊料可在所述空间中流动并在其中凝固。此外，半圆柱空间23和四分之一圆柱空间25在制造过程中提供便利的轮廓和分隔点。
衬底20可制造成一具有复数个相邻区段的条带中的一个个别区段，其中每个区段均为一衬底20。或者，衬底20可制造成一个由区段阵列组成的个别区段，所述阵列具有多行和多列相邻区段。在这种构造中，半圆柱空间23和四分之一圆柱空间25可在制造过程中用作所述条带或阵列的把手。
此外，半圆柱空间23和四分之一圆柱空间25(与区段之间的划线凹槽或其他蚀刻相结合)辅助将每一单个衬底与条带或晶圆隔开。可通过弯曲条带或晶圆向蚀刻线(越过半圆柱空间23和四分之一圆柱空间25)引入物理应力而实现所述隔离。因制造过程中无需用特殊载体夹具来操作条带或晶圆，所以这些特征简化了制造过程并进而降低了成本。此外，半圆柱空间23和四分之一圆柱空间25可充当通孔，将顶部焊垫26、侧部焊垫32和底部焊垫34连接起来。
衬底20具有一包含热接触垫36的底面29。所述热接触垫可用导热率较高的材料制造，例如金、银、锡或其他包含但不限于贵金属的材料。
图3说明图1A和1B的半导体封装的部分的剖视侧视图。确切而言，图3说明顶部散热体40和透镜50的剖视侧视图。参看图1A、1B和3，顶部散热体40由导热率较高的材料制成，例如铝、铜、陶瓷、塑料、复合物或这些材料的组合物。可用高温、机械硬度大的介电材料涂覆迹线22和24(中央晶片附着区域除外)，以便密封迹线22和24并保护其免受物理和环境损害，例如刮划和氧化。所述涂覆处理可以是衬底制造工艺的组成部分。当使用所述涂覆物时，其也可将衬底20与顶部散热体40绝缘。随后，可用高温胶粘剂(例如，THERMOSET制造的热界面材料)覆盖所述涂覆物，所述胶粘剂将衬底20与顶部散热体40接合。
顶部散热体40可包含反射表面42，其大体上围绕安装在安装垫28(图2A和2C中的)上的LED组合件60。反射表面42反射来自LED组合件60的光的部分，如样本光线63所说明。光的其他部分不经反射表面42反射，如样本光线61所说明。说明性光线61和63并不意图代表光学领域中经常使用的光迹线。为了有效地反射光，顶部散热体40优选由可抛光、可印花或既可抛光又可印花的材料制成。或者，为了获得高反射率，光学反射表面42或整个散热体40可用高反射材料电镀或沉积，例如银、铝或另一满足所述目的的物质。因此，顶部散热体40也称为反射板40。如果且当封装10的热性能需要时，反射板40可由导热率较高的材料制成。
在所说明的实施例中，反射表面42说明为平坦表面，其与反射板的水平面成例如45度的角。本发明并不局限于所说明的实施例。例如，反射表面42可与反射板的水平面成其他角度。或者，反射板可具有抛物线或另一形状。
反射板40包含边缘44，用以支撑透镜50并与之耦合。LED组合件60用包封材料46(例如，仅举例而言，硅酮)包封在晶片封装10(图1A和1B中)内。包封材料46优选为高温聚合物，其具有高透光率和与透镜50的折射率相匹配的折射率。
透镜50由具有高透光率的材料制成，例如(仅举例而言)玻璃、石英、高温塑料或这些材料的组合物。透镜50可放置成与包封材料46接触。因此，由于晶片封装10受热且经受热膨胀，所以透镜50可由包封材料46缓冲，以保护透镜50免受晶片封装10其他部件热膨胀所导致的机械应力的损害。在有些实施例中，透镜50界定一浅槽52，所述浅槽中可填有光学化学制品，例如磷光体、例如碳酸钙的散光剂、例如荧光材料的中心频率变换材料，或这些材料的组合物。
图4说明一耦合到外部散热体70的晶片封装10。参看图4，可使用环氧树脂、焊料或其他导热胶粘剂、导电胶粘剂或导热且导电的胶粘剂74将热接触垫36附着到外部散热体70。外部散热体70可为印刷电路板(PCB)或其他从晶片封装10吸热的结构。所述外部散热体可包含电路元件(未图示)或各种构造的散热翼片72。
图5至6D中展示本发明的一具有特定替代配置的实施例。此第二实施例的部分与图1A至4说明的第一实施例的相应部分相似。为方便起见，图5至6D中说明的第二实施例中与第一实施例相似的部分用相同参考数字表示，类似但有所变化的部分用附有字母“a”的相同参考数字表示，而不同部分则用不同的参考数字表示。
图5是根据本发明的其他实施例的LED晶片封装10a的分解透视图。参看图5，本发明的发光晶片封装10a包含底部散热体(衬底)20a、顶部散热体(反射板)40a和透镜50。
图6A、6B、6C和6D分别提供图5中的衬底20a的顶视图、侧视图、前视图和仰视图。参看图5至图6D，在所说明的实施例中，衬底20a包含一个正极迹线22a和四个负极迹线24a。这些迹线22a和24a的构造与图2A中的迹线22和24不同。衬底20a包含凸缘31，其界定闩锁空间33，用以接受反射板40a的支架(leg)35，从而将反射板40a与衬底20a机械啮合。
图7A至10B中说明本发明的其他实施例。根据这些实施例，用于高电力发光设备的衬底包含一导热且导电的板，其具有第一和第二表面。所述板可包括金属，例如铜、铝或任一者的合金。所述金属板的第一表面上形成有一较薄的导热绝缘膜。在有些实施例中，所述导热绝缘膜包括陶瓷/聚合物膜，例如可从USA，MN的The Bergquist Company of Chanhassen购买的Thermal Clad膜。
可在所述陶瓷/聚合物膜上形成传导元件，例如金属迹线和/或金属引线。由于所述陶瓷/聚合物膜是绝缘的，所以所述传导迹线与金属板没有电接触。一传导元件可形成或电连接到一安装垫，所述安装垫经调整以用于接收电子设备。如以上结合图1至6说明的实施例所述，金属迹线的布局可广泛变化而仍然属于本发明的范畴。
可通过焊接、热超声波接合或热压接合将LED组合件接合到安装垫。LED产生的热量中至少有一部分可以通过所述金属板驱散。由于衬底本身可以充当散热体，所以可以减少或免去将额外散热体接合到所述结构的需要。然而，可将一额外散热体放置成与金属板热连通，以便可更加有效地从运作设备中吸热。
在一个实施例中，可穿过绝缘膜和金属板形成一个或一个以上通孔。所述通孔内部可涂覆有绝缘材料，例如陶瓷/聚合物膜。可在所述通孔中形成例如导电迹线的电导体，且所述电导体可将衬底的第一表面上的传导元件电连接到衬底的第二表面上的传导元件。根据此种实施例的衬底可在不使用金属引线的情况下安装在一表面(例如印刷电路板)上，这样可获得更加机械坚固的封装。
根据本发明实施例的衬底也可包含例如离散齐纳二极管和/或电阻器网络的电子电路，用以静电放电(ESD)和/或过压保护。
虽然图7至10中未予说明，但所述衬底可进一步包含例如半圆柱和四分之一圆柱空间、方位标记、侧接合垫、凸缘或图1至6中说明的其他特征的特征。
图7A至10B中说明的实施例的部分与图1至6D中说明的实施例的相应部分相似。为方便起见，图7A至10B中说明的实施例中与第一实施例部分相似的部分用相同参考数字表示，类似但有所变化的部分用附有字母“b”的相同参考数字表示，而不同部分则用不同的参考数字表示。
现在参看图7A，图中说明了根据本发明另一实施例的衬底20b。图7A和7B分别提供衬底20b的顶视图和前视图。另外，除衬底20b的前视图之外，图7B还展示了LED组合件60。衬底20b包含导热且导电的板51，其具有第一和第二表面51a和51b。板51可包括例如铜、铝或任一者的合金的金属。金属板51的第一表面51a的至少若干部分上形成有较薄的导热绝缘膜48。在有些实施例中，导热绝缘膜48包括陶瓷/聚合物膜，例如可从USA，MN的The Bergquist Company of Chanhassen购买的Thermal Clad膜。此外，可在板51的第二表面51b以及侧面上形成导热绝缘膜49。
衬底20b为例如电迹线22和24的导电元件、焊垫26和LED组合件60提供支撑。此外，可在衬底20b的顶部、侧面或底部上制造额外迹线和连接件，或者将其布层在衬底20b内部。迹线22和24，焊垫26以及其他任何连接件可以用已知方法(例如通孔)以任何组合形式彼此互连。
衬底20b具有顶面21b，顶面21b包含电迹线22和24。迹线22和24提供从焊垫(例如顶部焊垫26)到安装垫28的电连接。顶部焊垫26可包括迹线22和24大体上邻近衬底20b侧面的部分。安装垫28是顶面(包含迹线22、迹线24或二者的部分)的一部分，LED组合件60安装在其上。安装垫28通常大体上位于邻近顶面21b中心处。在本发明的替代实施例中，LED组合件60可由其他半导体电路或晶片代替。
迹线22和24的布局可能与图中所说明的布局大不相同，但仍然属于本发明的范畴。图中只展示了一个阴极(负极)和一个阳极(正极)迹线。然而，可在衬底20b上包含多个阴极或阳极迹线，以便于在安装垫28上安装复数个LED组合件，每一个均连接到不同阴极或阳极迹线；因此，三个LED组合件可单独地电性控制。迹线22和24由例如金、银、锡或其他金属的传导材料制成。
衬底20b具有一底面29b，其包含一热接触垫36。所述热接触垫可用导热率较高的材料制造，例如金、银、锡或其他包含但不限于贵金属的材料。
图7C说明沿图7A中的剖面线A-A截取的衬底20b部分的剖视前视图。如图7C中所示，可穿过衬底20b形成一个或一个以上通孔45a、45b。通孔45a、45b的内部可涂覆有例如陶瓷/聚合物膜的绝缘材料。可在通孔中形成例如导电迹线47a、47b的电导体，且所述电导体可将衬底第一表面上的传导元件电连接到衬底第二表面上的传导元件。如图7C中所说明，通孔45a中的传导迹线47a将衬底20b的第一侧面21b或顶面21b上的迹线24连接到衬底20b的第二侧面29b或底面29b上的焊垫34。同样，穿过通孔45b延伸的传导迹线47b将传导迹线22连接到接合垫38。
根据此实施例的衬底可在不使用金属引线的情况下安装在一表面(例如印刷电路板)上，这样可获得更加机械坚固的封装。
如上所述，可用高温、机械硬度大的介电材料涂覆迹线22和24(中央晶片附着区域28除外)，以便密封迹线22和24并保护其免受物理和环境损害，例如刮划和氧化。所述涂覆处理可以是衬底制造工艺的组成部分。当使用所述涂覆物时，其也可将迹线22和24与顶部散热体40绝缘。随后，可用高温胶粘剂(例如，THERMOSET制造的热界面材料)覆盖所述涂覆物，所述胶粘剂将衬底20b与顶部散热体40接合。
图8和9中说明未利用通孔的其他实施例。如图8所说明，传导迹线22、24可形成或附着到金属引线39、41，其从封装中延伸出去且可直接安装到电路板。在此实施例中，只有衬底20b的第一表面21b可包含电绝缘、热传导膜48。
图9说明一实施例，其中传导迹线22、24从衬底20b的侧壁向下延伸，以接触衬底20b第二表面上的接合垫34和38。这种配置可允许在无需使用金属引线或通孔的情况下将封装直接安装到电路板上。
如图10A和10B中所说明，衬底20b可配置成包含例如离散齐纳二极管65、电阻器网络67、其他电子元件或其任何组合物的电子电路。所述电子电路可连接在迹线22和24之间，所述迹线可充当阳极和/或阴极元件。所述电子电路可用于各种目的，例如用以防止静电放电(ESD)、过压保护或二者。在所说明的实例中，图10B中说明的连接在迹线22与迹线24之间的齐纳二极管D1 65可防止过量反向电压施加到衬底20b上安装的光电设备。同样，例如印刷电阻器67的电阻器网络67可向衬底20上安装的设备提供ESD保护。
根据以上内容可知，本发明显然是新颖的并且提供超出当前技术的优势。虽然以上描述并说明了本发明的特定实施例，但本发明并不局限于所描述和说明的部件的特定形式和配置。例如，可使用不同的配置、尺寸或材料来实践本发明。本发明受随附权利要求书的限制。在权利要求书中，那些利用用以提供35 USC第112节“的构件或步骤”的权利要求用短语“用以……的构件”来标识。

Claims (12)

1.一种发光晶片封装，其包括：
一金属衬底，其具有一第一表面；
一传导迹线，其位于所述第一表面上，所述传导迹线通过一绝缘膜与所述金属衬底绝缘，所述传导迹线形成一用以安装一发光设备的安装垫；和
一金属引线，其电连接到所述传导迹线且从所述第一表面延伸出去。
2.一种发光晶片封装，其包括：
一金属衬底，其具有一第一表面和一与所述第一表面相对的第二表面，一通孔穿过所述衬底；
一传导迹线，其从所述第一表面延伸到所述第二表面，所述传导迹线通过绝缘膜与所述金属衬底绝缘；和
一金属接触垫，其位于所述第一和第二表面中的一者上，其电连接到所述传导迹线。
3.一种发光晶片封装，其包括：
一衬底，其包括一导电且导热的材料且具有一第一表面；
一导热的电绝缘膜，其覆盖所述第一表面的至少一部分；
一第一传导元件，其位于所述绝缘膜上；
一第二传导元件，其位于所述绝缘膜上，其中所述第一和第二传导元件中至少有一者包括一安装垫，用以将一发光晶片安装在所述安装垫上；
一散热体，其安装到所述衬底的顶端上；和
一透镜，其实质上覆盖所述安装垫。
4.根据权利要求3所述的发光晶片封装，其进一步包括一耦合到所述衬底的外部散热体。
5.根据权利要求4所述的发光晶片封装，其中所述衬底具有一镀有金属的底侧，用以与所述外部散热体耦合。
6.根据权利要求3所述的发光晶片封装，其中所述衬底包括沿至少一侧的凸缘，用以机械啮合所述顶置散热体。
7.根据权利要求3所述的发光晶片封装，其中所述顶置散热体耦合到所述衬底且位于所述第一和第二传导元件上，且实质上围绕所述安装垫。
8.根据权利要求3所述的发光晶片封装，其进一步包括一发光二极管(LED)，所述发光二极管安装在所述衬底上且连接到所述第一和第二传导元件。
9.根据权利要求3所述的发光晶片封装，其中所述顶置散热体定义一围绕所述发光二极管的反射表面。
10.一种发光晶片封装，其包括一顶置散热体。
11.根据权利要求10所述的发光晶片封装，其包括一衬底，所述衬底包括沿至少一侧的凸缘，用以机械啮合所述顶置散热体。
12.根据权利要求10所述的发光晶片封装，其中所述顶置散热体定义一反射表面。
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