CN102156334B - 适合在天线系统设备中安装和使用的光学接口卡、组件和相关的方法 - Google Patents

适合在天线系统设备中安装和使用的光学接口卡、组件和相关的方法 Download PDF

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CN102156334B
CN102156334B CN201110072455.0A CN201110072455A CN102156334B CN 102156334 B CN102156334 B CN 102156334B CN 201110072455 A CN201110072455 A CN 201110072455A CN 102156334 B CN102156334 B CN 102156334B
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CN102156334A (zh
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考斯·A·小布莱克威尔
特里·D·考克斯
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4278—Electrical aspects related to pluggable or demountable opto-electronic or electronic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

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  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
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  • Light Guides In General And Applications Therefor (AREA)
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Abstract

本发明公开了适合在天线系统设备中安装和使用的光学接口卡、组件及相关方法。在特定的实施例中，公开了包括印刷电路板(PCB)的光学接口卡(OIC)及相关的方法，该PCB具有至少一个光学子组件(OSA)，该至少一个OSA安装到该PCB的至少一个第一开口端并延伸到至少一个开口。在其他实施例中，公开了包括两个安装在一起的OIC的光学接口组件。在其他实施例中，公开了包括至少一个风扇的通信设备外壳，该至少一个风扇被配置为从该通信设备外壳的第一侧吸入空气，吸入的空气进入到下充气部并穿过多个通信部件，再进入到上充气部，以提供空气冷却。在另一个实施例中，公开了一种模块化的分布式天线系统组件。

Description

适合在天线系统设备中安装和使用的光学接口卡、组件和相关的方法
相关申请
本申请涉及序列号为_/_，_，名为“Modular Distributed Antenna System EquipmentHousings，Assemblies，And Related Alignment Feature(模块化的分布式天线系统设备的外罩、组件以及相关的对准部件)”的美国临时专利申请，在此通过引用的方式将其整体并入本文中。[HI10-006PN]
本申请还涉及序列号为_/_，_，名为“Modular Distributed Antenna SystemEquipment Housings，Assemblies，And Related Alignment Feature(模块化的分布式天线系统设备的外罩、组件以及相关的对准部件)”的美国临时专利申请，在此通过引用的方式将其整体并入本文中。[HI10-007PN]
本申请还涉及序列号为_/_，_，名为“Modular Distributed Antenna SystemEquipment Housings，Assemblies，And Related Alignment Feature(模块化的分布式天线系统设备的外罩、组件以及相关的对准部件)”的美国临时专利申请，在此通过引用的方式将其整体并入本文中。[HI10-006PN-A]
本申请还涉及序列号为_/_，_，名为“Modular Distributed Antenna SystemEquipment Housings，Assemblies，And Related Alignment Feature(模块化的分布式天线系统设备的外罩、组件以及相关的对准部件)”的美国临时专利申请，在此通过引用的方式将其整体并入本文中。[HI10-007PN-A]
本申请还涉及序列号为_/_，_，名为“Communications Equipment Housings，Assemblies，and Related Alignment Features and Methods(通信设备的外罩、组件和相关的对准部件及方法)”的美国临时专利申请，在此通过引用的方式将其整体并入本文中。[HI10-007]
技术领域
本公开的技术总体上涉及用于覆盖处于分布式天线系统中的分布式天线系统设备的外壳。该分布式天线系统设备可包括基于光纤的分布式天线设备，其用于将射频(RF)信号经由光纤分发到远程天线单元。
背景技术
随着人们对高速移动数据通信的不断增加的需求，无线通信正迅速发展。举例来说，所谓的“无线保真”或“WiFi”系统以及无线局域网(WLAN)正被运用于很多不同类型的领域(例如，咖啡店、机场、图书馆等)。无线通信系统与被称为“客户端”的无线设备进行通信，该无线设备必须位于无线范围或者“小区覆盖范围”内，以与接入点设备进行通信。
一种运用无线通信系统的方法涉及对“微微蜂窝(picocells)”的使用。微微蜂窝是射频(RF)覆盖区域。微微蜂窝可具有一半径，举例来说，该半径可在处于几米到多达二十米的范围。组合多个接入点设备可产生微微蜂窝阵列，其覆盖被称为“微微蜂窝覆盖区域”的区域。因为微微蜂窝覆盖很小的区域，所以每一微微蜂窝通常仅有很少的用户(客户端)。这允许将无线系统用户之间所共享的射频带宽的量最小化。就这一点而言，可提供头端通信设备以从有线或无线网络接收输入的射频信号。该头端通信设备将下行通信链路上的射频信号分发到广泛分布于建筑物或设施的远程天线单元。处于微微蜂窝范围内的客户端设备可以接收射频信号，并将射频信号传送回远程天线单元中的天线，该射频信号在上行通信链路上被传送回头端通信设备并被传送回网络上。头端通信设备可被配置为将射频信号转换为光纤信号，以将该光纤信号经由光纤传送到远程天线单元。
可能会期望为用于分布式天线系统的通信设备提供外罩或外壳，其中可以容易地装配该分布式天线系统。从而，可在现场容易地装配外罩或外壳。更进一步地，我们可能会期望为与微微蜂窝的扩展兼容的分布式天线系统提供通信设备。从而，举例来说，我们可能会期望为分布式天线系统提供通信设备，其中可以容易地升级或增强该分布式天线系统，以支持远程天线单元不断增加的数量或类型。我们可能会进一步的期望允许技术人员或者其他用户在现场提供这种增强的支持，从而使得我们期望允许在具有简单且正确的功能的通信设备中容易地进行设备的改变和升级。
发明内容
本发明公开了适合在天线系统设备中安装和使用的光学接口卡、组件及相关方法。在一个实施例中，公开了光学接口卡。光学接口卡可在通信系统中提供光学和电学信号之间的接口，举例来说，该通信系统包括分布式天线通信系统。在特定的实施例中，该光学接口卡包括具有第一端和与第一端相对的第二端的印刷电路板(PCB)。在PCB中至少设置一个开口，该至少一个开口位于PCB的第一端口和第二端口之间，并且具有至少一个第一开口端和与该至少一个第一开口端相对的至少一个第二开口端。将至少一个光学子组件(OSA，optical sub-assembly)安装到该至少一个第一开口端，并延伸到该至少一个开口中。以这种方式，可将该光学子组件安装到PCB的端部，以限制PCB上的暴露的、无屏蔽的电线延伸和印制痕迹的长度。这可以在转换为电学信号后为信号的信号完整性做准备。
在另一实施例中，提供了光学接口组件。该光学接口组件包括第一光学接口卡(OIC)，该第一光学接口卡包括处于该第一光学接口卡的第一端和第二端之间的至少一个第一开口，该第一光学接口卡具有至少一个第一开口端和至少一个第一光学子组件(OSA)，该至少一个第一光学子组件安装于该至少一个第一开口端，并且延伸到该至少一个第一开口。提供第二光学接口卡，其包括处于该第二光学接口卡的第一端和第二端之间的至少一个第二开口，该第二光学接口卡具有至少一个第二开口端和至少一个第二光学子组件，该至少一个第二光学子组件安装于该至少一个第二开口端，并且延伸到该至少一个第二开口中。该光学接口组件还包括配置于第一光学接口卡和第二光学接口卡之间的至少一个支座。
在另一实施例中，提供了装配光学接口卡的方法。该方法包括提供具有第一端和第二端的印刷电路板(PCB)，其中该第二端与该第一端相对。该方法还包括将至少一个光学子组件(OSA)安装到至少一个开口的至少一个第一开口端，该至少一个开口设置在PCB中，且位于PCB的第一端口和第二端口之间。
在另一实施例中，提供了通信设备外壳。该通信设备外壳包括至少一个分隔室，该至少一个分隔室被配置为覆盖位于下充气部和上充气部之间的多个通信部件。该通信设备外壳还包括至少一个风扇，其被配置为从该通信设备外壳的第一侧吸入空气，使吸入的空气进入到下充气部，并穿过该多个通信部件再进入到上充气部。该通信设备外壳还包括空气出口，该空气出口设置在该通信设备外壳的第二侧且连接到该上充气部，以通过该至少一个风扇引导空气经由该空气出口进入到该上充气部。
在另一实施例中，提供了一种提供安装在通信设备外壳中的通信部件的空气冷却的方法。该方法包括使用至少一个安装在该通信设备外壳中的风扇从该通信设备外壳的第一侧吸入空气，并使空气进入到下充气部。该方法还包括从该下充气部吸入空气，使空气穿过多个安装在该通信设备外壳中且处在该下充气部和上充气部之间的通信部件。该方法还包括通过空气出口从该通信设备外壳排出空气，该空气出口设置在该通信设备外壳的第二侧且连接到该上充气部。
在另一实施例中，提供了模块化的分布式天线系统组件。该组件包括至少一个第一板，其包括至少一个第一定位对准槽。该组件还包括至少一个第二板，其包括至少一个定位销。该至少一个定位销与该至少一个第一定位对准槽相结合，以使该至少一个第一板在至少两维上与该至少一个第二板对准，从而形成被配置为支持至少一个分布式天线系统部件的外壳。
在以下的详细说明中将阐明其他特征和优点，并且通过该说明，其中的一部分特征和优点对本领域技术人员来说是显而易见的，或通过实施如在此所描述的包括以下的详细说明、权利要求以及附图的实施例，本领域技术人员将会容易地认可这一部分特征和优点。
应当理解，对本实施例的以上的总体说明和以下的详细说明都意在提供用来理解本公开的实质和特征的概述或框架。附图也被包括在其中，以提供更进一步的理解，并且附图被合并到说明书中，构成了说明书的一部分。附图示出了各种实施例，并且附图连同说明书一起用来解释所公开的概念的原理和操作。
附图说明
图1是使用分布式天线系统的示例性的建筑物和建筑基础设施的局部示意截面图；
图2是用于图1中的分布式天线系统的示例性的头端通信单元(“HEU”)的示例性的原理图；
图3是被配置为支持图2中的HEU的示例性的分布式天线系统设备的外罩组件(“组件”)和外壳；
图4是由一对光学接口卡(OIC)组成的示例性的光学接口模块(OIM)，该OIC被配置为作为HEU的一部分安装于图3中的分布式天线系统设备的外罩组件中；
图5是图3中的外壳的前视图，其中，图2中的HEU的中平面接口卡安装于该外壳中；
图6是图3中的外壳的后侧透视图，其中，图5中的中平面接口卡安装在中平面支撑物上，该中平面支撑物安装于该外壳中；
图7是图5中的安装在中平面支撑物上的中平面接口卡的前侧和右侧的特写透视图，其中，该中平面支撑物安装于图3的外壳中；
图8示出了图5中的不具有附接到中平面接口卡的连接器的中平面接口卡的前视图；
图9示出了图3中的外壳的后视图，其中，下行链路基站收发台(BTS)接口卡(BIC)插入到外壳中，并且，上行链路BIC完全地插入到外壳中并连接到设置在外壳中的中平面接口卡；
图10A和10B分别示出了可插入到图3的外壳中的BIC组件的前透视图和后透视图，其中，该BIC设置在与设置于图3的外壳中的中平面接口卡相连接的组件中；
图11示出了图10A和10B中的BIC组件的底视图；
图12示出了图10A和10B中的安装于图3的外壳中的BIC组件的顶视图；
图13是图3中的组件的侧面透视图，其中，用于下行链路BIC的下行链路BIC连接器和用于上行链路BIC的上行链路连接器分别设置于下行链路和上行链路BIC连接器板，该连接器板连接到外壳的前端；
图14是在图13中示出的BIC连接器板的前透视图，其中，BIC连接器设置于BIC连接器板中；
图15是BIC连接器板的后透视图，其中，BIC连接器设置穿过在图14中示出的BIC连接器板中；
图16是图13中的外壳的后侧透视图，其示出了连接到BIC连接器的电缆，该BIC连接器被设置为穿过BIC连接器板，BIC连接器板被连接为穿过中平面支撑物中的开口，到达设置在外壳中的下行链路BIC和上行链路BIC；
图17是图13中的外壳的顶视图，其示出了连接到BIC连接器的电缆，该BIC连接器被设置为穿过BIC连接器板，BIC连接器板被连接为穿过中平面支撑物中的开口，到达设置在外壳中的下行链路BIC和上行链路BIC；
图18是图3中的外壳的板的分解透视图，其中，以模块化的方式将该板装配到一起，以形成外壳；
图19A和19B示出了图3中的外壳的顶透视图和底透视图；
图20示出了图3中的外壳的顶板与图3的外壳的侧板和中平面支撑物相结合的特写图；
图21示出了设置于图3的外壳中的顶板上的定位销与设置在图3的外壳中的侧板中的对准槽相结合的特写图；
图22是可以设置在图3的外壳中的OIM的侧视图；
图23是可以设置在图3的外壳中的OIM的另一个侧透视图；
图24是可以设置在图3的外壳中的OIM的后透视图；
图25是对准块的透视图，该对准块将OIC固定于图23和24的OIM的OIM板；
图26A是图23和24中没有安装屏蔽的OIM的后视图；
图26B是图23和24中安装了屏蔽板的OIM的后视图；
图27是图23和24中的OIM的特写后视图，其示出了设置在OIC的两个印刷电路板(PCB)之间的支座，其中，其中的一个PCB是浮动PCB；
图28是OIC的PCB的横断面侧视图，该OIC通过图27中的支座相互固定，以将其中的一个OIC PCB作为浮动PCB，并将其他OIC PCB作为固定PCB；
图29A和29B是图27中的浮动支座的透视图；
图29C和29D分别是图31中的支座的侧视图和顶视图；
图30是图27中的支座的横断面侧视图；
图31是选择性的支座的横断面侧视图，该选择性的支座可用来固定OICPCB，并将其中的一个OIC PCB作为浮动PCB；
图32A和32B是选择性的支座的横断面侧视图，该选择性的支座可用来固定OIC PCB和屏蔽板，并将其中的一个OIC PCB作为浮动PCB；
图33是图3中的组件的侧视图，其示出了连接到互补连接器的OIC数字连接器，该互补连接器设置于中平面接口卡中，以对准要被连接到设置在中平面接口卡中的互补射频连接器的OIC射频连接器；
图34是设置在图26A和26B中的OIM的OIC的顶透视图，其示出了OICPCB在设置在OIC PCB中的发射器光学子组件(TOSA)和接收器光学子组件(ROSA)之外的延伸；
图35是图3中的外壳和组件的前透视图，其中，安装了冷却风扇保护板以保护安装在外壳中的冷却风扇；
图36是图35中的外壳的横断面侧视图，其示出了设置在外壳中的冷却风扇后的冷却风扇管道，以通过冷气风扇引导空气，被吸入到外壳中，并使空气进入到外壳的下充气部中。
图37是通过冷却风扇将气流吸入到外壳的示例性的示意图，其中，该冷却风扇穿过图35中的外壳。
图38是图35中的外壳的另一个横断面侧视图，其示出了引导空气穿过下充气部中的开口，并引导空气穿过设置在外壳中的上充气部板中的开口，其中，该下充气部板穿过安装在外壳中的OIC。
图39是图35中的外壳的后透视图，其示出了来自外壳的上充气部的空气出口。
图40是图35中的外壳的后透视图，其示出了来自外壳的上充气部的空气出口，其中，移除了外壳的顶板，并且示出了上充气部板中的开口，其进入到外壳的上行链路BIC隔板中；以及
图41是上行链路BIC的顶视图，其中，在该上行链路BIC中设置开口，以允许空气在图35的外壳中从下行链路BIC流到设置在该下行链路上面的上行链路BIC。
具体实施例
现在将详细地提及实施例，附图中示出了实施例的例子，其中，示出了一些但不是全部的实施例。实际上，本发明的概念可能会以不同的形式体现，并且不应该在此将其解释为限制；相反，提供这些实施例是为了使得该公开将会满足申请的合法需求。相同的附图标记将会尽可能用于指示相同的部件或零件。
本发明公开了可能会适合在天线系统设备中安装和使用的光学接口卡、组件及相关方法。在一个实施例中，公开了光学接口卡。从图3开始在讨论示例性的分布式天线系统设备、组件、外壳和它们的对准部件之前，首先结合相关的附图1和2描述示例性的分布式天线系统。就这一点而言，图1是建筑物10的局部示意截面图，该建筑物10一般可代表可能会使用分布式天线系统12的任何类型的建筑物。分布式天线系统12并入头端通信单元或头端单元(HEU，head-end unit)14，以向在建筑物10的基础设施16之内的覆盖区域提供各种类型的通信服务。HEU14只是包括用于分布式天线系统12的至少一个通信部件的外壳。例如，如以下所更加详细的讨论的那样，该实施例中的分布式天线系统12是基于光纤的无线通信系统，其被配置为接收无线射频(RF)信号，并将该RF信号作为光载无线通信(ROF，Radio-over-Fiber)信号，该ROF信号将会经由光纤18传输到广泛分布于建筑物10的远程天线单元(RAU，remote antenna unit)20。例如，该实施例中的分布式天线系统12可为户内分布式天线系统(IDAS，indoor distributed antennasystem)，以在建筑基础设施10内提供无线服务。举例来说，这些无线服务可包括蜂窝式电话服务，诸如射频识别(RFID)追踪、无线保真(WiFi)、局域网(LAN)以及上述组合的无线服务。
术语“光缆”和/或“光纤”包括各种类型的单模和多模光波导，所述光波导包括一个或多个光纤，在电缆中的所述光纤可能是没有覆盖层的、有色的、磨光的、带状的和/或具有其他组织或保护结构，例如，一个或多个管、强度构件、外皮或类似物。同样地，其他类型的合适的光纤包括抗弯曲光纤或者用于传输光学信号的其他有利的媒介。抗弯曲光纤的一个例子是可从康宁公司购买到的多模光纤。
继续参考图1，基础设施16包括第一层(底层)22、第二层24和第三层26。层22、24和26均由HEU14通过主配线架28提供服务，以在基础设施16中提供覆盖区域30。为了显示简单，图1中只示出了层22、24和26的平顶。在该示例性的实施例中，主电缆32具有多个不同的段，其使得基础设施16中的大量RAU20的布置变得容易。在覆盖区域30中，每个RAU20轮流地对它自己的覆盖区域提供服务。例如，主电缆32可包括提升段34，其承载所有的输入到HEU14或从HEU14输出的上行链路和下行链路光缆。主电缆32可包括一个或多个多芯电缆(MC)连接器，其适于沿着电力线将选择的下行和上行光缆连接到多个光缆36。
在该示例性的实施例中，为每个层22、24和26配备了互连单元38。互连单元38包括光缆端口的单个无源光纤互连。光缆36包括匹配连接器。在该示例性的实施例中，提升段34包括总共三十六(36)个下行链路和三十六(36)个上行链路光纤，其中，六(6)个光缆36中的一个承载六(6)个下行链路和六(6)个上行链路光纤，以为六(6)个RAU20服务。为适应包括附加的第二，第三等HEU14的不同的应用，光缆36的数量是可以改变的。
根据本发明的一个方面，每个互连单元38都可以向光缆36中的电导体提供低压直流电，以向RAU20供电。例如，互连单元38可包括交流/直流(AC/DC)转换器，以转换可从基础设施16容易获得的110V的交流电。在一个实施例中，转换器提供48V的或小于光缆36的电压的的相对低压直流电。不间断电源可安装在互连单元38和HEU14中，以向分布式天线系统12提供可用的持续性电源。可基于系统所需的类型来选择在光缆36中所使用的光纤，可能会使用单模和/或多模光纤。
主电缆32使得光缆36能够广泛分布于基础设施16(例如，安装到每层22、24和26的平顶或其他支撑表面)，从而为第一层22、第二层24和第三层26提供覆盖区域30。在该示例性的实施例中，HEU14位于基础设施16内(例如，在小房间内或控制室内)，而在另一个示例性的实施例中，HEU14可位于建筑物的外面的远程位置。可以由第二方(例如，蜂窝电话服务供应商)提供的基站收发台(BTS，base transceiver station)40可连接到HEU14，并且可以位于或者与其他设备协同位于HEU14的远端。BTS是可向HEU14提供输入信号并可从HEU14接收返回信号的任何基站或源。例如，在典型的蜂窝电话系统中，在多个远程位置中应用多个BTS，以提供无线电话覆盖。每个BTS服务于相应的区域，并且当移动基站进入小区时，BTS与移动基站通信。每个BTS可包括至少一个无线收发器，该无线收发器使BTS能够与一个或多个在相关的小区内工作的用户单元通信。
在该实施例中，HEU14是没有与任何服务供应商绑定的主中立系统，其可以向具有同样的基础设施的一个或多个BTS40提供服务。在该实施例中，HEU14连接到六(6)个光缆36。
图2是安装于图1的分布式天线系统12中的示例性的HEU14的示意图，以提供更详细的细节。如图2所示，HEU14包括多个示例性的分布式天线系统部件。分布式天线系统部件可为支持分布式天线系统(例如，图1中的分布式天线系统12)通信的任何部件。例如，其中可包括头端控制器(HEC，head-endcontroller)42，该HEC管理HEU14部件的功能，并且通过接口(举例来说，诸如RS232端口44、通用串行总线(USB)端口46、以及以太网端口48)与外部装置通信。HEU14可通过基站收发器接口卡(BIC)连接器50，52连接到多个BTS、收发器等。BIC连接器50是下行链路连接器，BIC连接器52是上行链路连接器。每个下行链路BIC连接器50都连接到位于HEU14中的下行链路BTS接口卡(BIC)54，并且每个上行链路BIC连接器52都连接到也位于HEU14中的上行链路BIC56。如图2所示出的，下行链路BIC54被配置为从BTS输入端接收输入射频信号或下行链路射频信号，以将接收的射频信号传输到RAU20。上行链路56被配置为作为返回通信通路将来自RAU20的输出射频信号或上行链路射频信号提供给BTS。
下行链路BIC54连接到中平面接口卡58。上行链路BIC56也连接到中平面接口卡58。可在印刷电路板(PCB)中配置该下行链路BIC54和上行链路BIC56，该PCB包括可直接插入到中平面接口卡58的连接器。中平面接口卡58也可直接与多个光学接口卡(OIC，optical interface card)60进行电通信，该多个光学接口卡经由光缆36与RAU20进行光通信或电通信。OIC60将来自下行链路BIC54的电射频信号转换为光学信号，转换后的光学信号经由光缆36传输到RAU20。该实施例中的每个OIC60支持多达三(3)个RAU20。
OIC60也可以配置在PCB中，该PCB包括可直接插入到中平面接口卡58的连接器，以将OIC60中的链接连接到中平面接口卡58。由于HEU14可支持多达十二(12)个OIC60，所以以这种方式，HEU14的示例性实施例可扩展到支持多达三十六(36)个RAU20。如果HEU14要支持的RAU20少于三十四(34)个，那么HEU14可包括少于12个OIC60，并且该12个OIC60可连接到中平面接口卡58。在该实施例中，每三(3)个由HEU14支持的RAU20需要一个OIC60。如果希望在初始配置之后支持附加的RAU20，那么也可将OIC60添加到HEU14，并将其连接到中平面接口卡58。以这种方式，由HEU14支持的RAU20的数量是可变的，通过简单的将或多或少的OIC60连接到中平面接口卡58，其可以根据需要和现场的情况而增加或减少。
图3示出了可用于提供HEU(例如，图2中的HEU14)的示例性的分布式天线系统的外罩组件70(称为“组件70”)。HEU只是至少一个配置在外壳或外罩中的通信部件。如将在以下更加详细的描述的那样，组件70是模块化的。组件70被配置为技术人员可在工厂或现场容易的对其进行装配。此外，组件70支持多个部件，该多个部件可使接口卡能容易的插入并与中平面接口卡58对准，以保证与形成分布式天线系统(举例来说，诸如图1中的分布式天线系统12)的一部分的HEU14的其他部件的准确连接。如图3所示，组件70包括外壳72。外壳72由底板74和侧板76A，76B组成。当将底板74和侧板76A，76B装配在一起时，在它们内部所形成的空间中形成用于配置HEU14的部件(举例来说，诸如图2所示的部件)的内腔80。如图6所示，为了保护内腔80和设置在其中的HEU14的部件，还可以配置顶板82，并使其固定到侧板76A，76B。需要指出的是，如果需要，可以向外壳72只提供两块板。例如，一块板可为第一板，其中，第二板连接到第一板。第一板可为底板74、侧板76A，76B和顶板82中的任意一个。同样地，第二板可为底板74、侧板76A，76B和顶板82中的任意一个。
继续参考图3，外壳72被配置为支持图2所示的OIC60。如在如图4所示的该实施例中，OIC60成对的集合在一起，以形成光学接口模块(OIM)84。因此，OIM84由两(2)个OIC60组成，其中，每个OIC60支持多达三(3)个RAU20，从而，OIM84在该实施例中可支持多达六(6)个RAU20。如图4所示，提供的每个OIC60均作为PCB 86，其中，在该PCB 86中配置有集成电路，从而为下行通信链路，或者反之，为上行通信链路提供电学信号到光学信号的转换。配置了OIM板88，以帮助将一对OIC60连接在一起，从而形成OIM84。如将在本公开的下面所更加详细的描述的那样，该对OIC60固定在OIM板88上，以形成OIM84。OIM板88用于支持OIC60，并有助于将OIC60对准，使其准确地插入并附接到外壳72，其又反过来帮助将OIC60准确且对准地连接到如图3所示的中平面接口卡58。在该实施例中，为了提供对机械、射频和其他电磁干扰的屏蔽，PCB86附接到屏蔽板95A，95B，该屏蔽板95A，95B附接到OIM板88。
如图4所示，OIC60还通过支座连接器89固定在一起，该支座连接器89包括对准部件，以当OIC60连接到中平面接口卡58时，使OIC60之间能够进行自对准，在本公开中将对此进行更加详细的描述。连接器适配器90设置在OIM板88中，并可为OIC60的OIC PCB86的光连接做准备。连接器适配器90被设置为穿过OIM板88的开口92，以在OIM84安装在外壳72中时提供外部访问。RAU20可经由图1所示的正连接到连接器适配器90的光缆36连接到连接器适配器90，以建立与HEU14的OIC60的连接，由此，可提供作为分布式天线系统12的一部分的RAU20。这些连接器适配器90可容纳任何类型的光纤连接器，包括但不限于FC、LC、SC、ST、MTP和MPO。通过设置在OIM板88中的装弹簧的连接器螺钉85，可将OIM84固定在外壳72上，该螺钉85被配置为插入到孔87(参见图5)中，以将OIM板88固定到如图3所示的外壳72。
为了在HEU14中灵活的配置OIM84、HEC42、下行链路BIC54和上行链路BIC56，如图3所示，外壳72为中平面接口卡58做准备，该中平面接口卡58要设置在内腔80内，内腔80在基准面81中的侧板76A，76B之间延伸。如以下所更加详细的讨论的那样，在中平面接口卡58和外壳72中配置有对准部件，这样，当中平面接口卡58插入到外壳72中时，就能实现中平面接口卡58与外壳72的准确对准。因此，当OIM84、HEC42、下行链路BIC54和上行链路BIC56准确且完全地插入到外壳72中时，在这些部件和外壳72之间的对准实现了这些部件上的连接器(例如，连接器94)和中平面接口卡58之间的准确对准的连接。准确地连接到中平面接口卡58很重要，这样可以保证准确的连接到HEU14中的恰当的部件，以支持作为由HEU14支持的分布式天线系统的一部分的通信系统。对准这些连接对于准确的连接来说很重要，特别是在外壳72是模块化的并且外壳72中的外壳部件的耐受力可以不同的情况下。
为了示出用来将中平面接口卡58准确地对准外壳72的对准部件，提供了示出外壳72的前视图的图5，其中，中平面接口卡58安装于该外壳72中。图5示出了中平面接口卡58的前侧93。图6示出了外壳72的后侧透视图，其中，中平面接口卡58安装于该外壳72中。图5中还没有在外壳72中安装HEU14部件。图6示出了设置在外壳72的底板74中的沟槽91A，沟槽91A可用来容纳HEC42和OIM84的底部，以在外壳72的X和Y方向上对准这些部件。还可在顶板82上设置沟槽91B，并使其与设置在底板74中的沟槽91A对准，这样可以容纳HEC42和OIM84的顶部，以在X和Y方向上对准这些部件。如图5所示，中平面接口卡58在每个X、Y和Z方向均相对于外壳72准确的对准是很重要的，这是因为中平面接口卡58包括连接器94A，94B，94C，该连接器94A，94B，94C可容纳来自安装在外壳72中的HEU14的部件的互补连接器(下面会更加详细的描述)。
如图3所示，连接器94A设置在中平面接口卡58中，并且其被设计为接收来自HEC42或其他具有兼容的互补连接器的类似的卡的连接。连接器94B设置在中平面接口卡58中，并且其被设计为从OIC60接收数字连接。射频连接器94C设置在中平面接口卡58中，并且其被设计为从OIC60接收射频连接(参见图21和22中的部件195)。对外壳72进行设计，以在HEU14安装到外壳72中时实现HEU14部件相对于外壳72的对准。因此，如果连接器94A，94B，94C没有相对于外壳72准确地对准，那么通过HEU14的部件与外壳72的对准，HEU14的部件可能不能建立与中平面接口卡58的准确连接，因此也将不会连接到由HEU14提供的分布式天线系统。
在这方面，如图5和6所示，在外壳72的基准面81中安装中平面支撑物100，以使中平面接口卡58在X、Y和Z方向上相对于外壳72对准。中平面支撑物100可以是与底板74、侧板76A，76B和/或顶板82相同的材料形成的板。中平面支撑物100提供了在外壳72中安装中平面接口卡58的表面。如图6所示，还提供了连接到中平面支撑物100的隔板101，其用来分离出用于下行链路BIC54、上行链路BIC56以及电源59(图6)的隔间，电源59向HEC42和HEU14的其他部件供电。还如以下将更加详细的讨论的那样，提供了外壳72的模块化设计，这样当中平面支撑物100安装在外壳72中时，中平面支撑物100就能在基准面81中的X、Y和Z方向上准确地对准。因此，如果为了使中平面接口卡58与中平面支撑物100能准确地对准而在中平面支撑物100中设置对准部件，那么中平面接口卡58就能与外壳72准确的对准，结果是，安装在外壳72中的HEU14的部件的连接器将会与设置在中平面接口卡58中的连接器94A，94B，94C准确地对准。
如图5所示，在中平面支撑物100和中平面接口卡58中设置两个对准部件102，以使中平面接口卡58在X、Y和Z方向上相对于中平面支撑物100对准，由此相对于外壳72对准。图7示出了安装在中平面支撑物100上的中平面接口卡58的右手侧的特写视图，还示出了其中的一个对准部件102。该实施例中的对准部件102由被配置为设置在对准开口106，108中PCB支撑物导向销104组成，该对准开口106，108分别设置在中平面接口卡58和中平面支撑物100中。图8示出了不具有连接器的中平面接口卡58的前侧109。安装PCB支撑物导向销104并将其配置为穿过对准开口106，108而设置。在PCB支撑物导向销104能够穿过设置在中平面接口卡58和中平面支撑物100中的对准开口106和108之前，对准开口106，108要先与PCB支撑物导向销104对准。因此，通过该对准，中平面接口卡58在X，Y方向上与中平面支撑物100对准。例如，开口106，108的内径可为0.003英寸或稍大于PCB支撑物导向销104的外径。同样地，举例来说，对准开口106，108在X方向上的中心线之间的容差可小于0.01英寸或0.005英寸，这样在PCB支撑物导向销104被设置为可以穿过对准开口106和108之前，可提供对准开口106，108之间的对准。可提供其他任何期望的容差。
一旦PCB支撑物导向销104插入到开口106，108，就能将中平面接口卡58调节到中平面支撑物100的适当的位置。在这方面，如图5所示，在中平面接口卡58中设置附加开口110。当对准开口106，108对准或实质上对准时，这些开口110被配置为与设置在中平面支撑物100中的开口112对准。如图5所示，在中平面接口卡58或中平面支撑物100中设置总数为二十(20)或其他数量的开口110，112。可将紧固件114(例如，诸如螺钉)设置为穿过开口110，112，以将中平面接口卡58固定到中平面支撑物100上，或者反过来，使中平面接口卡58在Z方向上与中平面支撑物100对准。
图8示出了不具有设置在开口110中的紧固件114的中平面接口卡58，以更进一步的示出开口110。紧固件114拧入到自夹紧支座中。例如，自夹紧支座可设置在中平面支撑物100中。举例来说，自夹紧支座的高度容差可在+0.002到-0.005英寸之间。例如，由于开口110不用来提供由PCB支撑物导向销104和开口106，108提供的对准，所以开口110的内径可为0.030英寸，其大于紧固件114的外径。此外，如图5所示，在中平面支撑物100中设置开口115，以使电缆能延伸到中平面接口卡58的每侧。在一个实施例中，中平面支撑物100和中平面接口卡58之间的容差为0.121英寸，当然也可提供任何其他距离。
中平面接口卡58还被配置为当其安装到外壳72中时，接收来自下行链路BIC54和上行链路BIC56的直接的连接。如图9所示出的外壳72的后视图，下行链路BIC54和上行链路BIC56被设计为通过外壳72的后侧116插入。再返回去参考图8，在图8的显示中，连接器孔116A，116B设置在中平面接口卡58上，其中，当下行链路BIC54和上行链路BIC56被外壳72容纳并完全的插入到外壳72中时，提供了连接到下行链路BIC54和上行链路BIC56的连接器118(参见图10A和10B)的连接器。如在前面所讨论的，配置在中平面接口卡58和中平面支撑物100之间的对准部件102也提供连接器孔116A，116B的准确对准，这样当插入到外壳72中时，可以使连接器孔116A，116B与下行链路BIC54和上行链路BIC56中的连接器118对准。
图10A和10B示出了支持下行链路BIC54或上行链路BIC56的BIC组件120，该BIC组件120被配置为容纳在外壳72中，以将下行链路BIC54或上行链路BIC56连接到中平面接口卡58。无论是支持下行链路BIC54，还是支持上行链路BIC56，BIC组件120都是相同的；因此，图10A和10B中由BIC组件120支持的BIC既可以为下行链路BIC54，也可以为上行链路BIC56。BIC组件120包括BIC支撑板122，其被配置为固定下行链路BIC54和上行链路BIC56。配置支座124以提供支持BIC支撑板122上的下行链路BIC54和上行链路BIC56的BIC PCB 126的。如图9所示，BIC正面板128通常垂直的连接到BIC支撑板122，以将下行链路BIC54和上行链路BIC56固定到外壳。如图9所示，在BIC支撑板122和BIC正面板128之间提供对准部件130，以在下行链路BIC54和上行链路BIC56插入到外壳72中时，确保BIC PCB126及其连接器118在X和Y方向准确地对准。因此，连接器118将会与外壳72准确的对准，由此中平面接口卡58上的连接器孔116A，116B使下行链路BIC54和上行链路BIC56能准确的连接到中平面接口卡58。只要BIC PCB126准确的安装到BIC支撑板122上，对准部件130就将会确保BIC PCB126的对准，在以下将会更加详细的对此进行描述。如在图11中的BIC组件120的底侧127上所示出的，该实施例中的对准部件130是附接在BIC支撑板122上的突出物132，该突出物132被配置为设置成穿过开口134，如图10A所示，该开口134被设置为穿过BIC正面板128。根据实际情况，将下行链路BIC连接器50或上行链路BIC连接器52(同样参见图2)设置为穿过BIC正面板128，以使BTS输入和输出能连接到下行链路BIC54和上行链路BIC56，以及当下行链路BIC54和上行链路BIC56完全插入到外壳72中时，可使外部的设备连接到外壳72。
如图10A、10B、11和12所示，为了使BIC PCB126对准到BIC支撑板122，在BIC PCB126和BIC支撑板122中也设置对准部件140。如其中所示，当对准时，PCB支撑物导向销142被设置为穿过分别设置在BIC PCB126和BIC支撑板122中的对准开口144，146。当对准开口144，146对准成一线时，对准开口144和146被设计为仅将其对准成使PCB支撑物导向销142能设置在其中。例如，举例来说，对准开口144，146之间的容差(tolerance)可以小于0.01英寸或小于0.005英寸，以在PCB支撑物导向销142被设置为可以穿过对准开口144和146之前确保对准开口144，146之间的对准。可提供其他任何期望的容差。
图9-12描述了上面提供的被设置为穿过外壳72的后侧116的BIC连接器50，52。为了建立与BIC连接器50，52的连接，在外壳72的后侧116，建立了到BIC连接器50，52的连接。可选地，外壳72可被设计为能够建立到外壳72的前侧的下行链路BIC54和上行链路BIC76的连接。在这方面，图13是图3中的组件70的侧面透视图，其中，用于下行链路BIC的下行链路BIC连接器50和用于上行链路BIC56的上行链路连接器52被设置为穿过外壳72的前侧147。如其中所示，下行链路BIC连接器板149设置在组件70的前侧147，该下行链路BIC连接器板149包括设置在其中的下行链路BIC连接器50。类似地，上行链路BIC连接器板151也设置在组件70的前侧147，该上行链路BIC连接器板151包括设置在其中的上行链路BIC连接器52。
图14和15示出了示例性的BIC连接器板的前侧和后侧透视图，该BIC连接器板可为BIC连接器板149或151。如其中所示，BIC连接器50或52被设置为穿过BIC连接器板149或151，以使得可通过组件70的前侧147在外部访问BIC连接器50或52。紧固件153可被设置为穿过BIC连接器板149或151中的开口155，以将BIC连接器板149或151固定到组件70。通道向导173附接在BIC连接器板149或151上，该通道向导173被配置为容纳在组件70的通道91A，91B中，以在将BIC连接器板149或151设置在组件70中时，可有助于将BIC连接器板149或151与组件70对准。如图9-12所示，因为下行链路BIC54和上行链路BIC56设置在组件70的后部，所以BIC连接器50或52配置在BIC连接器板149或151中，从而，如图15所示，以及如将根据下面的图16和17所描述的，将BIC连接器50或52连接到下行链路BIC54或上行链路BIC56。此外，在BIC连接器板149或151中设置BIC带状连接器157，其连接到下行链路BIC54或上行链路BIC56，以承载关于下行链路BIC54或上行链路BIC56的状态信号，该状态信号要在设置在BIC连接器板149或151上的视觉指示器161上显示。
图16是外壳72的后侧透视图，其示出了连接到BIC连接器50，52的电缆165，167，该电缆165，167被设置为穿过中平面支撑物100中的开口169和隔板101中的开口171。电缆165，167提供BIC连接器50，52与BIC带状连接器157之间的连接，这样BIC连接器50，52可设置在组件70的前侧147，而下行链路BIC54和上行链路BIC56设置在组件70的后侧。图17是组件70的顶视图，其进一步地示出了电缆165，167的线路，该电缆165，167通过开口169，171将BIC连接器50，52和BIC带状连接器157连接到下行链路BIC54和上行链路BIC56。
外壳72还可以被配置为模块化设计，能够容易的对该外壳进行装配并能实现构成外壳72的各种板和部件的准确对准。例如，图18示出了外壳72的前侧分解透视图。如其中所示，通过将侧板76A，76B连接到底板74和顶板82，并使侧板76A，76B位于底板74和顶板82之间来形成外壳72。当装配时，中平面支撑物100被配置为设置在外壳72的基准面81(参见图5)中。隔板101被配置为将其连接到中平面支撑物100，并且隔板101通常垂直于基准面81，以分离出用于下行链路BIC54、上行链路BIC56以及电源模块的隔间，该下行链路BIC54、上行链路BIC56以及电源模块设置在中平面支撑物100后侧的HEU14中。
为了进一步的示出外壳72的组件的模块化及容易安装，图19A和19B分别示出了外壳72的顶透视图和底透视图，以进一步的示出侧板76A，76B如何连接到顶板82和底板74。在这方面，顶板82和底板74包括以定位销150，152的形式实现的对准部件。定位销150，152整体地形成在底板74和顶板82中，并且其被配置为与整体地设置在侧板76A，76B中的互补对准开口或对准槽154，156相结合。图19A，19B还示出了连接到侧板76B的顶板82和与对准槽154结合的定位销150的特写图。这使得在安装外壳72时能迅速的并且容易的将顶板82和底板74在准确的对准的情况下与侧板76A，76B连接。在外壳72中，有四(4)个设置在侧板76A，76B上的互补对准槽154，156，然而可运用任何期望的数量的定位销和对准槽。如图20所示，如果希望为了防止外壳72拆开而将定位销150，152固定在对准槽154，156内，可随后运用紧固件。在这方面，图20也示出了连接到侧板76B的顶板82的特写图。
如图20所示，顶板82包括轧制或弯起侧180和侧板76B的顶内侧182，该滚压或弯起侧180被配置为紧挨着侧板76B。在顶板82与侧板76A之间、底板74与侧板76A，76B之间提供了同样的设计。如图19A所示，将顶板82和底板74的外部宽度w1设计为使其合适的在侧板76A，76B的内部宽度w2之内。紧固件184设置在侧板76A，76B的开口186以及顶板82和底板74的开口188中，以将侧板76A，76B与顶板82和底板74紧密的连接在一起，从而在它们之间提供无缝的连接。此外，如图20所示，示出了从中平面支撑物100延伸出的对准销181，并且该对准销181延伸到了设置在顶板82中的槽183中，以进一步的将中平面支撑物100与外壳72对准。
图21也示出了设置在中平面支撑物100中的对准部件，该对准部件被配置为将中平面支撑物100与外壳72对准。如图21所示，当顶板82被固定到侧板76B时，顶板82包括整体的对准槽160。当侧板76B被固定于顶板82时，侧板76B还包括沿基准面81整体地设置的对准槽162。中平面支撑物100包括定位稍164，当中平面支撑物100与外壳72、顶板82和侧板76B(同样参见图7)准确的对准时，该定位稍164被设置为穿过对准槽160，162。以这种方式，如在前面所描述的那样，当中平面接口卡58与安装的中平面支撑物100准确的对准时，中平面接口卡58就会与外壳72以及安装在外壳72中的任何HEU14部件准确的对准。如图19B所示，在底板74中也整体地设置了与对准槽160相似的对准槽166。如图19B所示，这些对准槽166也被配置为容纳中平面支撑物100中的定位销168，以对准中平面支撑物100。
此外，如图19A，19B所示，外壳72还被配置为容纳其支持可移动的安装支架170A，170B，以将外壳72固定到设备架上。如其中所示，安装支架170A，170B包括形成销172A，172B的向下折叠的部件。侧板76A，76B分别包括被配置为容纳销172A，172B的整体的对准槽174，176。为了将销172A，172B固定到外壳72，紧固件178A，178B被设置为分别穿过销172A，172B中的开口179A，179B，这样，销172A，172B也能固定到顶板82和底板74。
配置其他部件，以支持HEU14的部件的对准和这些部件与中平面接口卡58的准确连接。例如，如在前面所讨论的那样，这些部件中的一个可为OIM84。图22示出了OIM84，其中，光纤线路向导190可设置在OIC60的PCB86的外侧，其有助于导向(route)来自连接器适配器90的光纤192的线路，该连接器适配器90被配置为对连接到RAU20(参见图2)的光纤进行连接。如在以前所讨论的那样，当OIM84插入到外壳72中时，光纤192连接到OIC60的电子部件，以将从RAU20接收到的光学信号转换为经由连接器194和连接到中平面接口卡58的射频连接器195传送到上行链路BIC56的电学信号。
如在以前所讨论的那样，OIM84包括两个连接到要设置在外壳72的通道91A，91B中的OIM板88的OIC60。同样地，通过在每个OIM84中配置两个OIC60，将连接器194准确地对准并给其留出空间，以与中平面接口卡58中的互补连接器94B(参见图5)的对准和空间相兼容，是很重要的。否则，OIC60可能就不能准确的连接到中平面接口卡58。例如，如图23所示，如果OIC60的两个PCB86没有都固定在准确的对准到OIM板88的位置，那么一个或两个OIC60可能就不会在Z方向上准确的对准。
在这方面，图24示出了对准部件200，以确保准确地固定OIC60的PCB86，并使PCB86在Z方向上相对于OIM板88准确地对准。如图24及更特别的如图25所示，配置了对准块202。如图25所示，对准块202包括两个对准表面204A，204B。如图24和25所示，对准表面204A被配置为背对着PCB86的表面而设置。同样地如图24所示，对准表面204B被配置为正对着OIM板88的后表面206而设置。如图25所示，从对准表面204A延伸出的导向销208被配置为将其设置在OIC60的PCB86中的开口。设置在对准表面204A中的开口210被配置为与设置在PCB86中的开口对准，其中，可以在开口210中设置并与开口210相结合的紧固件，以将PCB86固定到对准块202。为了将对准块202对准到PCB86，导向销208与PCB86中的开口对准，并且在对准时插入到该开口中。
对准表面204B还包括被配置为容纳紧固件214(图23)的开口212，该紧固件214被设置为穿过OIM板88并与开口212结合。如图23所示，其中的一些紧固件214可被配置为也穿过连接器适配器90中的开口而设置，以将连接器适配器90固定到OIM板88，并将OIM板88固定到OIC60。以这种方式，将OIM板88固定到对准块202，将对准块202对准并将其固定到PCB86。由此，OIM板88与OIC60的PCB86在Z方向上对准。
此外，当容差很小时，就可能难以确保OIC60和中平面接口卡58之间的所有连接器194，94B的准确匹配。例如，如图23所示，如果用来固定PCB86且又与PCB86相隔开的支座196之间的空间与中平面接口卡58中的连接器94B之间的空间不同，那么OIC60在X、Y或Z方向的对准可能就会不准确，由此可能会仅有一个或没有OIC60能连接到中平面接口卡58和/或不会损害中平面接口卡58和/或它的连接器94B。
在这方面，图26A示出了图23和24中的OIM84的后透视图，其中，在OIC60的两个PCB86之间配置有支座196，该支座196使一块PCB86相对于另一块PCB86浮动。图26B示出了图26A的OIM84的后透视图，其中，光屏蔽板95A，95B安装到PCB86和OIM板88，以提供对机械、射频和其他电磁干扰的屏蔽。在这方面，如图26A和26B所示，当OIC60固定到OIM板88时容差比较宽松，以使OIC60的一个连接器194能在X、Y或Z方向上相对于其他连接器60轻微的移动或浮动。图27示出了OIC60的两个PCB 86A，86B之间的一个支座196的特写图。如以下所更加详细的描述的那样，支座196能够在顶部PCB86A附近浮动，以使顶部PCB86A的位置或方向可在X、Y或Z方向上相对于底部PCB86B轻微的移动。
图28是OIM84的顶部PCB86A和底部PCB86B的横断面侧视图，如图26A、26B和28所示，通过支座196将顶部PCB86A和底部PCB86B安装到彼此之中，以进一步的示出浮动的顶部PCB86A。在这方面，支座196由主体199组成。图29A-29C中的支座的透视图、侧视图和顶视图也分别示出了支座196的主体199。如图28-30所示，主体199包括在主体199的第一端222的第一轴环220，该第一轴环220的外径OD1小于位于主体199的第二端226的第二轴环224的外径OD2。如图28所示，第一轴环220和第二轴环224被配置为容纳于顶板86A和底板86B的开口228，230中。主体199的第一端222和第二端226包括侧翼232，234，该侧翼232，234限制了设置的穿过顶部PCB86A和底部PCB86B的开口228，230的第一轴环220和第二轴环224的量。
如图28所示，将第二轴环224设计成可使得外径OD2与开口230的内径之间的容差较小。以这种方式，第二轴环224将不会在开口230内浮动。此外，第二轴环224的高度H2(参见图29C)小于PCB86A和设置在其中的开口230的宽度W3(如图28所示)。这可使得当为了将支座196牢固地固定到底部PCB86B而将紧固件238设置为穿过主体199的螺旋杆240时，紧固件238的头部236可直接固定到底部PCB86B的外表面239上。因为为支座196的第二轴环224准备的外径OD2和高度H2，底部PCB86B不会浮动。
然而，为了使顶部PCB86A能浮动，第一轴环220的外径OD1和高度H1与第二轴环224的外径和高度不同。在这方面，如图28-29C和30所示，第一轴环220的外径OD1小于开口228的内径。形成于开口228和外径OD1之间的空隙G使得当第一轴环220设置在其中时能相对于开口228轻微的移动。此外，如图28所示，第一轴环220的高度H1高于顶部PCB86A的宽度W1。因此，当紧固件242设置在螺旋杆240内并拧紧时，紧固件242的头部244将紧靠着第一轴环220的上表面246。因为第一轴环220延伸到了大约在顶部PCB86A的上表面248处的平面，所以紧固件242的头部244不与顶部PCB86A的上表面248接触。因此，当拧紧紧固件242时，在头部244和PCB86A的上表面248之间不会产生安装的摩擦，从而使顶部PCB86A相对于支座196和底部PCB86B浮动。
图31示出了与支座196相同的选择性的支座196’，但是与图30的支座196不同的是，螺旋杆始终没有延伸穿过主体199'。而是，螺旋杆240A'，240B'是分开的。支座196’仍可用来提供以上所讨论的浮动PCB86。还需要注意的是，被配置为使PCB浮动的支座196，196’还可以为被配备为安装HEU14的任何其他部件(包括但不限于下行链路BIC54和上行链路BIC56)的支座196，196’做准备。此外，对主体199，199'的设计可包括在主体199，199'的整个长度上的六边形的外表面。
图32A和32B是选择性的支座250的横断面侧视图，该选择性的支座250可用来固定OIC PCB86，并将其中的一个OIC PCB86作为浮动PCB。如图26B所示，当安装了屏蔽板95A，95B时，选择性的支座250可用于固定OIC PCB86。在这方面，一个支座252被配置为设置在另一个支座254中。第一支座252包括螺旋杆256，该螺旋杆256被配置为容纳紧固件，以将屏蔽板95固定到支座252和OIM84。支座252包括螺旋构件255，该螺旋构件255被配置为固定到设置在支座254中的螺旋杆257。支座254包括与轴环220类似的轴环258，如在图28-29B中的以上所述，该轴环258围绕轴环257并且被配置为容纳在OIC PCB86的开口之内，该OIC PCB86具有比轴环258的外径OD3更大的内径。这使得设置在轴环258上的OIC PCB86可相对于另一个被固定到支座254的螺旋杆260的OIC PCB86浮动。支座254具有轴环262，该轴环262具有外径OD4并且被配置为容纳在不能浮动的OIC PCB86的开口中。
由在此公开的实施例所提供的另一个对准部件是由设置在中平面接口卡58中的数字连接器提供的协助对准，该中平面接口卡58接收来自OIC60、下行链路BIC54和上行链路BIC56的数字连接。如在以前所讨论和示出的那样，当插入到外壳72中时，设置在中平面接口卡58中的包括连接器94B的数字连接器接到OIC60、下行链路BIC54和上行链路BIC56的互补数字连接器194。对OIC60、下行链路BIC54和上行链路BIC56进行设计，以使得它们在插入到外壳72中时，在将它们的射频连接发送到设置在中平面接口卡58上的射频连接器之前，首先作出它们与设置在中平面接口卡58中的相应的数字连接器的数字连接。以这种方式，这些数字连接器有助于使OIC60、下行链路BIC54和上行链路BIC56在X和Y方向上相对于中平面接口卡58对准。
在这方面，图33示出了组件70的侧视图，其示出了连接到设置于中平面接口卡58中的互补连接器94B的OIC60的数字连接器194。如其中所示，对设置在OIC60中的数字连接器194进行设计，以使得设置在OIC60中的射频连接器195与设置在中平面接口卡58中的互补射频连接器94C连接之前，数字连接器194与中平面接口卡58中的互补连接器94B连接。在这方面，当数字连接器194开始与互补连接器94B连接时，数字连接器194已与互补连接器94B对准。OIC60中的射频连接器195的终端与互补射频连接器94C仍有间距D。在一个非限制性的实施例中，该距离D可为0.084英寸。因为在该实施例中，OIC60上的数字连接器194与配置在其中的射频连接器195具有固定的关系，所以数字连接器194的对准也提供了OIC60的射频连接器195与也设置在中平面接口卡58中的互补射频连接器94C的对准。因此，当数字连接器194完全的插入到互补连接器94B中且当互补射频连接器94C设置在中平面接口卡58中时，射频连接器195将会与互补射频连接器94C对准。射频连接器195的对准对确保射频信号的有效传输来说很重要。如果射频连接比数字连接需要更高的对准精度，该对准可能也是有益的。也可以向下行链路BIC54和上行链路BIC56提供相同的对准部件。
如在先前所讨论的和图4所示出的那样，OIM板88为连接器90提供支持，并为OIC60附接到OIM板88提供支持，以在OIC60插入到外壳72中时，提供OIC60的对准。为了形成OIM84，提供了有助于将一对OIC60连接到一起的OIM板88。OIM板88用于支持OIC60并有助于OIC60的对准，以使OIC60能准确的插入并附接都外壳72，反过来，这又有助于为OIC60提供到中平面支持卡58的准确且对准的连接。在这方面，如图34所示，可在OIM84中提供一个部件，从而可以在在此所公开的实施例中提供OIM板88，该一个部件可提供延伸出配置在OIC60中的接收器光学子组件(ROSA)和发射器光学子组件(TOSA)的OIC PCB 86。
如图34所示，提供了OIM84的顶透视图，其示出了OIC PCB 86在发射器光学子组件(TOSA)262和接收器光学子组件(ROSA)260之外的延伸。TOSA 262和ROSA 260经由光纤263，265连接到连接器90，该连接器90穿过OIM板88延伸，以使得可在此进行连接。通过使OIC PCB延伸到TOSA 262和ROSA 260之外，无需妨碍TOSA 262和ROSA 260，OIM板88就可固定到OIC PCB 86。在该实施例中，TOSA 262和ROSA 260安装或安置在PCB的端部，以发送和/或接收与设置在OIC PCB 86中的电学信号部件互接的光学信号。将TOSA 262和ROSA 260安装或安置在PCB的端部可限制在TOSA 262和ROSA 260之间延伸的暴露的、没有屏蔽的电线的长度以及PCB上的印制轨迹的长度。这为在转换为电学信号后信号的信号完备性做准备。
因此，提供了使TOSA 262和ROSA 260能延伸到PCB的端部之外的足够的空间。在这方面，在该实施例中，开口264，266设置在OIC PCB 86中。开口264，266使得无需使TOSA 262和ROSA 260延伸到OIC PCB 86的端部268之外，就使TOSA 262和ROSA 260能设置在OIC PCB 86中，其中，OIM板84设置在OIC PCB86中。因此，开口264，266使TOSA 262和ROSA 260能设置在PCB的端部270，其中，开口264，266从PCB的端部270开始，而不是从设置有OIM板88的OICPCB 86的端部268开始。以这种方式，为TOSA 262和ROSA 260准备了空间，这样，它们就不会妨碍或阻止将OIM板88设置在OIC PCB 86的端部268。
可能还期望提供一种用于组件70的冷却系统。安装在组件70中的组件包括下行链路BIC54、上行链路BIC56、HEC42和OIC60，它们都会产生热量。如果由这些部件所产生的热量而形成的温度不能保持在阈值温度以下，那么这些部件的性能就可能会受到影响。在这方面，图35和36示出了图3的外壳72和组件70，在其中安装了可选择的冷却风扇280，以冷却安装在外壳72中的部件。在图35中，组件70的前透视图中的冷却风扇保护板282挡住了冷却风扇280的视图；然而，图36示出了组件70和外壳72的横断面侧视图，其示出了安装在外壳72中的冷却风扇280，该冷却风扇280在附接到外壳72的冷却风扇保护板282的后面。在该实施例中，如以下所更加详细的描述的那样，由冷却风扇280提供冷却，该冷却风扇280通过设置在冷却风扇保护板282的开口284将空气吸入到外壳72，并使空气穿过外壳72中的部件。如图36所示，可推入空气，使其通过空气出口穿过外壳72的后部。例如，可认为冷却风扇280以每分钟六十(60)立方英尺(60CFM)的流速或任何其他期望的流速导引空气。
继续参考图36，在外壳72中配置了下充气部286和上充气部288。下充气部286被配备为导引通过冷却风扇280推入到外壳72中的空气，被推入到外壳72中的空气首先到达外壳72的底部，随后可导引空气向上通过安装在外壳72中的OIC60，到达上充气部288，该上充气部288可导引空气到达外壳72的后部和外部。通过OIC60的空气可冷却OIC60。图37的气流示意图进一步地示出了这种气流设计。在这方面，参考图36，在冷却风扇280后面提供了风扇管道290，以导引空气通过冷却风扇280进入到外壳72中。板292安装在风扇管道290中，以导引空气从风扇管道290向下流入到下充气部286中。如图38所示，来自下充气部286的空气穿过设置在下充气部板294中的开口，并且随后穿过设置在OIC60之间的开口，其中，空气随后穿过设置在上充气部板298中的开口296。以这种方式，导引空气穿过OIC60，以对OIC60进行冷却。如图36所示，随后进入到上充气部288的空气可自由的退出外壳72。如图36、37和39所示，上充气部288直达外壳72的后部，并且其开口朝向对外壳72的外侧。
此外，如图40和41所示，开口300和302也可设置在下行链路BIC54中和位于上行链路BIC56上的上充气部板298中，以提供以冷却为目的的空气的进一步移动。这些开口300和302使得一些空气能够从冷却风扇280流入到外壳72中，并将空气从下充气部286吸入到下行链路BIC54，并随后经由开口302进入到上行链路BIC56。可随后引导空气从上行链路BIC56穿过开口300并进入到外壳72外侧的上充气部288。
此外，如图36，39和41所示，可选择的第二冷却风扇301配置在上充气部板298的下面。以这种方式，通过第二冷却风扇301从外壳72中吸入一些空气并使其穿过电源59，以为电源59提供冷却。例如，可认为第二冷却风扇301以每分钟十三(13)立方英尺(13CFM)的流速或任何其他期望的流速导引空气。
本领域技术人员应该会想到在此所提到的其他实施例和很多修改，与上述修改有关的实施例具有在上述说明及相关的附图中所提出的教导的优点。因此，应当理解的是，说明书和权利要求不应限制到所公开的特定的实施例，并且意在将修改和其他实施例包括在附加的权利要求的范围内。例如，在此所公开的实施例可用于任何类型的分布式天线系统，无论该分布式天线系统包括光纤或者不包括光纤。
本申请意在使实施例包括所提供的实施例的修改和变形，它们在附加的权利要求及其等价物的范围内。尽管在此使用了特定的术语，但是它们可只用在通用的和描述性的方面，并且不是为了限制的目的。

Claims (9)

1.一种光学接口卡，包括：
印刷电路板(PCB)，具有第一端和与该第一端相对的第二端；
至少一个开口，其设置在该PCB中，位于在该PCB的第一端和第二端之间，并且具有至少一个第一开口端和与该至少一个第一开口端相对的至少一个第二开口端；
至少一个光学子组件(OSA)，其安装到该至少一个第一开口端并延伸到该至少一个开口中；以及
光学接口模块板(88)，其在与该PCB(86)的平面正交的平面中安装到该PCB(86)的第一端(268)，其中，该至少一个开口(264，266)没有延伸到该印刷电路板(86)的该第一端(268)，使得该至少一个光学子组件(260，262)没有延伸到该光学接口模块板(88)。
2.如权利要求1所述的光学接口卡，其中，该至少一个开口没有延伸到该PCB的第一端。
3.如权利要求2所述的光学接口卡，其中，该至少一个OSA没有延伸到该PCB的第一端。
4.如权利要求1，2或3所述的光学接口卡，其中，该至少一个OSA由至少一个发射OSA(TOSA)和接收OSA(ROSA)组成。
5.如权利要求1，2或3所述的光学接口卡，进一步包括至少一个电导体，该至少一个电导体从该至少一个OSA的端部沿着实质的直线延伸，并与PCB上的一个或多个印制轨迹电连接。
6.如权利要求1，2或3所述的光学接口卡，其中，该至少一个开口由至少一个矩形开口组成。
7.如权利要求1，2或3所述的光学接口卡，进一步包括至少一个光纤线路向导，该至少一个光纤线路向导被配置为导向连接到至少一个OSA的一个或多个光纤的线路。
8.如权利要求1所述的光学接口卡，进一步包括至少一个对准块，该至少一个对准块安装在设置在PCB中且靠近该PCB的第一端的至少一个开口中，光学接口卡还包括设置在安装板中的用于将该PCB对准到该安装板的至少一个开口。
9.如权利要求8所述的光学接口卡，进一步包括设置在该至少一个对准块中的至少一个导引销，该至少一个导向销与设置在该PCB中的该至少一个开口结合。
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US8992099B2 (en) 2015-03-31
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US8593828B2 (en) 2013-11-26
CN102195712A (zh) 2011-09-21
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CN102156334A (zh) 2011-08-17
CN102195712B (zh) 2015-09-30

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