CN102156521A - Method for cooling laptop, cooling system and efficiently cooled laptop - Google Patents
Method for cooling laptop, cooling system and efficiently cooled laptop Download PDFInfo
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- CN102156521A CN102156521A CN 201110090412 CN201110090412A CN102156521A CN 102156521 A CN102156521 A CN 102156521A CN 201110090412 CN201110090412 CN 201110090412 CN 201110090412 A CN201110090412 A CN 201110090412A CN 102156521 A CN102156521 A CN 102156521A
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- heat pipe
- flat
- plate heat
- notebook computer
- evaporator section
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Abstract
The invention relates to a method for cooling a laptop, a cooling system and an efficiently cooled laptop. The cooling method comprises the following steps of: attaching an evaporation section of a first flat heat pipe directly or indirectly to a central processing unit (CPU) in the laptop or other heating device; connecting a condensation section of the first flat heat pipe with the evaporation section of a second flat heat pipe via a heat transmission structure for transmitting heat; and attaching the condensation section of the second flat heat pipe directly or indirectly to a cooling region of the laptop far from the CPU or other heating device, wherein both the first flat heat pipe and the second flat heat pipe are flat heat pipes with at least one group of micro-heat pipe arrays; the flat heat pipe is extruded and packaged through a metal sheet material and has one or more parallel micro heat pipes; and an equivalent diameter of the micro heat pipe is 0.3-2.5mm. By the method, the problem that the heat is hard to further dissipate due to the narrow cooling space inside the laptop is solved, and the cooing capacity of the laptop is improved.
Description
Technical field
The present invention relates to a kind of flat-plate heat pipe heat dissipation technology, particularly a kind of notebook computer is by the heat dissipating method and the cooling system of display backplane heat radiation, and this cooling system of use carries out the novel notebook computer of high efficiency and heat radiation.
Background technology
Have in the portable type electronic product of heater members such as the notebook computer owing to be provided with CPU or other heater members, continue service time along with people require to improve constantly and require constantly to prolong to notebook computer performance, the heat dissipation problem of CPU or other heater members becomes more and more outstanding.The heat dissipation problem of notebook computer is the key factor that is related to notebook computer performance.Traditional method mainly is to add the cooling system that fan constitutes by heat pipe with fin.This cooling system need consume extra electric power, and when higher or service time is longer, is difficult to satisfy its heat radiation requirement when ambient temperature, and not only fan noise is bigger, and has a strong impact on computing power.The traditional heat-dissipating method all is confined at the motherboard internal heat dissipating, because the heat-dissipating space of the inside of notebook computer is narrow and small, the method limitation of present improvement heat radiation is very big.
Summary of the invention
The heat dissipating method of a kind of notebook computer of the present invention, a part of heat transfer of CPU or other heater members being sent by the flat-plate heat pipe array to other of notebook computer than large area region, thereby carry out efficiently radiates heat by what be very beneficial for natural heat dissipation than large area region, solved that notebook computer internal heat dissipating space is narrow and small to be difficult to the further outer problem of loosing of heat.The invention still further relates to the cooling system of this method of employing and the notebook computer of high efficiency and heat radiation.
Technical scheme of the present invention is as follows:
A kind of heat dissipating method of notebook computer, the evaporator section of first flat-plate heat pipe is characterized in that comprising the steps: directly or indirectly fitting on CPU in notebook computer or other heater members, the condensation segment of first flat-plate heat pipe is linked to each other with the evaporator section of second flat-plate heat pipe by the heat transfer structure that transmits heat, the condensation segment and the described notebook computer of described second flat-plate heat pipe are directly or indirectly fitted away from the heat dissipation region of described CPU or other heater members; Described first flat-plate heat pipe and second flat-plate heat pipe are the flat-plate heat pipe with at least one group of micro heat pipe array, described flat-plate heat pipe is a sheet metal through the flat-plate heat pipe extruding encapsulated moulding, that have or a plurality of micro heat pipes arranged side by side in it, and the equivalent diameter of described micro heat pipe is 0.3mm～2.5mm.
Described heat transfer structure is warp architecture or bending structure, and its shape and notebook computer to renovate the rotating shaft periphery suitable; And/or described heat dissipation region away from described CPU or other heater members is the inside surface of notebook computer display backplane, and described display backplane is the metal material of good heat conductivity or thin nonmetallic materials.
Described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively.
Described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively, and described conductive structure is micro heat pipe array or the sheet metal of metal material through extrusion modling; And/or go back the big coating of application radiation coefficient on the described display backplane outside surface, the outside surface of described display backplane is plane or the compromise face that increases surface area.
A kind of cooling system of notebook computer, it is characterized in that comprising CPU or direct or indirect first flat-plate heat pipe of fitting of other heater members in its evaporator section and the notebook computer, with second flat-plate heat pipe that its condensation segment and described notebook computer are directly or indirectly fitted away from the heat dissipation region of described CPU or other heater members, the condensation segment of described first flat-plate heat pipe links to each other with the evaporator section of second flat-plate heat pipe by the heat transfer structure that transmits heat; Described first flat-plate heat pipe and second flat-plate heat pipe are the flat-plate heat pipe with at least one group of micro heat pipe array, described flat-plate heat pipe is a sheet metal through the flat-plate heat pipe extruding encapsulated moulding, that have or a plurality of micro heat pipes arranged side by side in it, and the equivalent diameter of described micro heat pipe is 0.3mm～2.5mm.
Described heat transfer structure is warp architecture or bending structure, and its shape and notebook computer to renovate the rotating shaft periphery suitable; And/or described heat dissipation region away from described CPU or other heater members is the inside surface of notebook computer display backplane, and described display backplane is the metal material of good heat conductivity or thin nonmetallic materials.
Described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively.
Described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively, and described conductive structure is micro heat pipe array or the sheet metal of metal material through extrusion modling; And/or go back the big coating of application radiation coefficient on the described display backplane outside surface, the outside surface of described display backplane is plane or the compromise face that increases surface area.
The notebook computer of high efficiency and heat radiation, comprise CPU or other heater members, it is characterized in that also comprising CPU or direct or indirect first flat-plate heat pipe of fitting of other heater members in its evaporator section and the notebook computer, with second flat-plate heat pipe that its condensation segment and described notebook computer are directly or indirectly fitted away from the heat dissipation region of described CPU or other heater members, the condensation segment of described first flat-plate heat pipe links to each other with the evaporator section of second flat-plate heat pipe by the heat transfer structure that transmits heat; Described first flat-plate heat pipe and second flat-plate heat pipe are the flat-plate heat pipe with at least one group of micro heat pipe array, described flat-plate heat pipe is a sheet metal through the flat-plate heat pipe extruding encapsulated moulding, that have or a plurality of micro heat pipes arranged side by side in it, and the equivalent diameter of described micro heat pipe is 0.3mm～2.5mm.
Notebook computer has display screen and backboard thereof and all realizes the folding of notebook computer by renovating rotating shaft, and described heat transfer structure is warp architecture or bending structure, and its shape and the described rotating shaft periphery of renovating are suitable; And/or described heat dissipation region away from described CPU or other heater members is notebook computer display backplane inside surface, and described display backplane is the metal material of good heat conductivity or thin nonmetallic materials.
Described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively.
Described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively, and described conductive structure is micro heat pipe array or the sheet metal of metal material through extrusion modling; And/or go back the big coating of application radiation coefficient on the described display backplane outside surface, the outside surface of described display backplane is plane or the compromise face that increases surface area.
Technique effect of the present invention is as follows:
The heat dissipating method of notebook computer of the present invention is by adopting two flat-plate heat pipes and heat transfer structure, notebook computer is comprised that the heat that the heater members of CPU produces is transmitted to the heat dissipation region of described notebook computer away from heater members, because flat-plate heat pipe can well be fitted with heater members heat-delivery surface such as CPU, therefore first flat-plate heat pipe can be derived heat fast, and rapidly with heat transferred to second flat-plate heat pipe, second flat-plate heat pipe and this heat dissipation region are fitted, this heat dissipation region is away from heater members, can conveniently select the bigger heat dissipation region of area, these areas of display backplane as notebook computer are big, be very beneficial for the position of natural heat dissipation, thereby greatly improve the heat-sinking capability of notebook computer.
Described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted, can make two direct face contacts of flat-plate heat pipe carry out heat interchange fully like this, reduce other heat transfer component and added the thermal-conduction resistance that causes, improved heat exchange efficiency.This combination is particularly suitable for notebook computer, heat transfer structure is set to warp architecture or bending structure, cooperate with the rotating shaft periphery of the flip structure of notebook computer by warp architecture or bending structure, can make notebook computer convenient heat is delivered to display backplane away from the heating equipment from the heating equipment renovating under the impregnable situation, the large tracts of land that makes full use of display backplane is carried out natural heat dissipation.
Description of drawings
Fig. 1 is that the cooling system of notebook computer of the present invention is provided with synoptic diagram.
Fig. 2 is the lateral plan of Fig. 1.
Fig. 3 a is respectively two kinds of different heat transfer structure synoptic diagram with Fig. 3 b.
Each label lists as follows among the figure:
1-first flat-plate heat pipe; 2-second flat-plate heat pipe; 3-CPU; Other heater members of 4-; The 5-display backplane; The 6-display screen; The 7-base plate; 8-renovates rotating shaft; The 9-heat transfer structure; The 10-fan.
Embodiment
The present invention is described further below in conjunction with accompanying drawing.
The present invention relates to a kind of cooling system of notebook computer, be used for the heat radiation of notebook computer, this cooling system is provided with synoptic diagram as shown in Figure 1, and Fig. 2 is the lateral plan of Fig. 1.This cooling system comprises first flat-plate heat pipe 1, second flat-plate heat pipe 2 and heat transfer structure 9, wherein, first flat-plate heat pipe 1 and second flat-plate heat pipe 2 are the flat-plate heat pipes with many group micro heat pipe arrays, described flat-plate heat pipe be sheet metal through the extruding encapsulated moulding, to have one or a plurality of, equivalent diameter arranged side by side in it be the flat-plate heat pipe of the micro heat pipe of 0.3mm～2.5mm.CPU in the evaporator section of first flat-plate heat pipe 1 and the notebook computer (indicating shown in 3) and other heater members 4 are directly or indirectly fitted, the condensation segment of second flat-plate heat pipe 2 and described notebook computer are directly or indirectly fitted as the inside surface of the display backplane 5 of heat dissipation region, and the condensation segment of first flat-plate heat pipe 1 links to each other with the evaporator section of second flat-plate heat pipe 2 by the heat transfer structure 9 that transmits heat.The structure of heat transfer structure 9 can be shown in Fig. 3 a and Fig. 3 b two kinds of different structures, heat transfer structure 9 is warp architecture or bending structure, and the periphery of renovating rotating shaft 8 of its shape and notebook computer is suitable.Among Fig. 3 a, heat transfer structure 9 is on the condensation segment of first flat-plate heat pipe 1 and the structure that is provided with on the evaporator section of second flat-plate heat pipe 2, both are directly fitted, be that heat transfer structure 9 is the part of first flat-plate heat pipe 1 and/or second flat-plate heat pipe 2, first flat-plate heat pipe 1 and second flat-plate heat pipe 2 can directly be fitted, by the sufficient heat interchange of direct face contact carrying out, reduce other conducting-heat elements and added the thermal-conduction resistance that causes, improved heat exchange efficiency.Among Fig. 3 b, first flat-plate heat pipe 1 and second flat-plate heat pipe 2 are fitted indirectly, at this moment, heat transfer structure 9 is the conductive structure of fitting with the evaporator section of the condensation segment of first flat-plate heat pipe 1 and second flat-plate heat pipe 2 respectively, this conductive structure can be a sheet metal, also can be the micro heat pipe array of metal material through extrusion modling.
When notebook computer in use, display screen 6 is freely opened, the CPU in the notebook computer and the heat of other heater members are absorbed by the evaporator section of first flat-plate heat pipe 1, i.e. evaporation heat absorption, condensation segment at first flat-plate heat pipe 1 carries out the condensation heat release then, by heat transfer structure 9 with heat transferred to the second flat-plate heat pipe 2, promptly first flat-plate heat pipe 1 and second flat-plate heat pipe 2 are directly or indirectly fitted and are realized the transmission of heat renovating rotating shaft place by heat transfer structure 9, the evaporator section of second flat-plate heat pipe 2 absorbs heat, heat transferred is extremely carried out the condensation heat release with the condensation segment that the inside surface of display backplane 5 is fitted, the metal material of display backplane 5 preferred good heat conductivity or thin nonmetallic materials, so heat can be distributed in the air by this display backplane, realize the heat radiation of notebook computer.Preferably, go back the big coating of application radiation coefficient on the outside surface of display backplane 5, described display backplane outside surface can be plane or the compromise face that increases surface area, to improve the efficient of heat radiation.
The invention still further relates to a kind of notebook computer of high efficiency and heat radiation, the structure of this notebook computer can be with reference to figure 1-4, comprise CPU (indicating shown in 3) and other heater members 4, also comprise display screen 6, display backplane 5, base plate 7, renovate devices such as rotating shaft 8 and fan 10, display screen 6 and backboard 5 thereof are together by renovating the free folding of rotating shaft 8 realization notebook computers, also comprise first flat-plate heat pipe 1 that its evaporator section and CPU or other heater members 4 are directly or indirectly fitted, with its condensation segment and second flat-plate heat pipe 2 of directly or indirectly fitting as the inside surface of the display backplane 5 of heat dissipation region, and the condensation segment that connects first flat-plate heat pipe 1 and the evaporator section of second flat-plate heat pipe 2 also can transmit the heat transfer structure 9 of heat; First flat-plate heat pipe 1 and second flat-plate heat pipe 2 are the flat-plate heat pipe with at least one group of micro heat pipe array, flat-plate heat pipe is a sheet metal through the flat-plate heat pipe extruding encapsulated moulding, that have or a plurality of micro heat pipes arranged side by side in it, and the equivalent diameter of described micro heat pipe is 0.3mm～2.5mm.
The invention still further relates to a kind of heat dissipating method of notebook computer, this method comprise the steps: directly or indirectly to fit on CPU in notebook computer or other heater members evaporator section of first flat-plate heat pipe, the condensation segment of first flat-plate heat pipe is linked to each other with the evaporator section of second flat-plate heat pipe by the heat transfer structure that transmits heat, the inside surface of the display backplane of the condensation segment of described second flat-plate heat pipe and described notebook computer is directly or indirectly fitted; Described first flat-plate heat pipe and second flat-plate heat pipe are the flat-plate heat pipe with at least one group of micro heat pipe array, described flat-plate heat pipe is a sheet metal through the flat-plate heat pipe extruding encapsulated moulding, that have or a plurality of micro heat pipes arranged side by side in it, and the equivalent diameter of described micro heat pipe is 0.3mm～2.5mm.Wherein, heat transfer structure is warp architecture or bending structure, and its shape and notebook computer to renovate the rotating shaft periphery suitable; Heat transfer structure can be on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively.Even without electronic product such as the panel computer or the mobile phone of flip structure, also can be by two flat-plate heat pipes and heat transfer structure with heat transferred to not on other surface of identical faces.This moment, heat transfer structure can be the heat transferred face of the direct formation arranged in a crossed manner of two flat-plate heat pipes, also the heat transfer structure of fitting with two flat-plate heat pipes by separating but is respectively led second flat-plate heat pipe from first flat-plate heat pipe rapidly with heat, the bigger notebook computer that the latter can contact with natural interface or the heat dissipation region of panel computer or mobile phone are fitted, to loose by these heat dissipation region, or further distribute by other radiating mode.
Should be pointed out that the above embodiment can make those skilled in the art more fully understand the invention, but do not limit the present invention in any way creation.Therefore; although this instructions has been described in detail the invention with reference to drawings and Examples; but; those skilled in the art are to be understood that; still can make amendment or be equal to replacement the invention; in a word, all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the invention, and it all should be encompassed in the middle of the protection domain of the invention patent.
Claims (12)
1. the heat dissipating method of a notebook computer, the evaporator section of first flat-plate heat pipe is characterized in that comprising the steps: directly or indirectly fitting on CPU in notebook computer or other heater members, the condensation segment of first flat-plate heat pipe is linked to each other with the evaporator section of second flat-plate heat pipe by the heat transfer structure that transmits heat, the condensation segment and the described notebook computer of described second flat-plate heat pipe are directly or indirectly fitted away from the heat dissipation region of described CPU or other heater members; Described first flat-plate heat pipe and second flat-plate heat pipe are the flat-plate heat pipe with at least one group of micro heat pipe array, described flat-plate heat pipe is a sheet metal through the flat-plate heat pipe extruding encapsulated moulding, that have or a plurality of micro heat pipes arranged side by side in it, and the equivalent diameter of described micro heat pipe is 0.3mm～2.5mm.
2. according to the heat dissipating method of the described notebook computer of claim 1, it is characterized in that described heat transfer structure is warp architecture or bending structure, and its shape and notebook computer to renovate the rotating shaft periphery suitable; And/or described heat dissipation region away from described CPU or other heater members is the inside surface of notebook computer display backplane, and described display backplane is the metal material of good heat conductivity or thin nonmetallic materials.
3. according to the heat dissipating method of claim 1 or 2 described notebook computers, it is characterized in that described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively.
4. according to the heat dissipating method of claim 1 or 2 described notebook computers, it is characterized in that described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively, and described conductive structure is micro heat pipe array or the sheet metal of metal material through extrusion modling; And/or go back the big coating of application radiation coefficient on the described display backplane outside surface, the outside surface of described display backplane is plane or the compromise face that increases surface area.
5. the cooling system of a notebook computer, it is characterized in that comprising CPU or direct or indirect first flat-plate heat pipe of fitting of other heater members in its evaporator section and the notebook computer, with second flat-plate heat pipe that its condensation segment and described notebook computer are directly or indirectly fitted away from the heat dissipation region of described CPU or other heater members, the condensation segment of described first flat-plate heat pipe links to each other with the evaporator section of second flat-plate heat pipe by the heat transfer structure that transmits heat; Described first flat-plate heat pipe and second flat-plate heat pipe are the flat-plate heat pipe with at least one group of micro heat pipe array, described flat-plate heat pipe is a sheet metal through the flat-plate heat pipe extruding encapsulated moulding, that have or a plurality of micro heat pipes arranged side by side in it, and the equivalent diameter of described micro heat pipe is 0.3mm～2.5mm.
6. the cooling system of notebook computer according to claim 5 is characterized in that described heat transfer structure is warp architecture or bending structure, and its shape and notebook computer to renovate the rotating shaft periphery suitable; And/or described heat dissipation region away from described CPU or other heater members is the inside surface of notebook computer display backplane, and described display backplane is the metal material of good heat conductivity or thin nonmetallic materials.
7. according to the cooling system of claim 5 or 6 described notebook computers, it is characterized in that described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively.
8. according to the cooling system of claim 5 or 6 described notebook computers, it is characterized in that described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively, and described conductive structure is micro heat pipe array or the sheet metal of metal material through extrusion modling; And/or go back the big coating of application radiation coefficient on the described display backplane outside surface, the outside surface of described display backplane is plane or the compromise face that increases surface area.
9. the notebook computer of high efficiency and heat radiation, comprise CPU or other heater members, it is characterized in that also comprising CPU or direct or indirect first flat-plate heat pipe of fitting of other heater members in its evaporator section and the notebook computer, with second flat-plate heat pipe that its condensation segment and described notebook computer are directly or indirectly fitted away from the heat dissipation region of described CPU or other heater members, the condensation segment of described first flat-plate heat pipe links to each other with the evaporator section of second flat-plate heat pipe by the heat transfer structure that transmits heat; Described first flat-plate heat pipe and second flat-plate heat pipe are the flat-plate heat pipe with at least one group of micro heat pipe array, described flat-plate heat pipe is a sheet metal through the flat-plate heat pipe extruding encapsulated moulding, that have or a plurality of micro heat pipes arranged side by side in it, and the equivalent diameter of described micro heat pipe is 0.3mm～2.5mm.
10. the notebook computer of high efficiency and heat radiation according to claim 9, it is characterized in that notebook computer has display screen and backboard thereof and all realizes the folding of notebook computer by renovating rotating shaft, described heat transfer structure is warp architecture or bending structure, and its shape and the described rotating shaft periphery of renovating are suitable; And/or described heat dissipation region away from described CPU or other heater members is notebook computer display backplane inside surface, and described display backplane is the metal material of good heat conductivity or thin nonmetallic materials.
11., it is characterized in that described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted according to the notebook computer of claim 9 or 10 described high efficiency and heat radiations; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively.
12., it is characterized in that described heat transfer structure is on the described first flat-plate heat pipe condensation segment and/or the structure that is provided with on the evaporator section of described second flat-plate heat pipe, both are directly fitted according to the notebook computer of claim 9 or 10 described high efficiency and heat radiations; Or described heat transfer structure is the conductive structure of fitting with the evaporator section of described first flat-plate heat pipe condensation segment and described second flat-plate heat pipe respectively, and described conductive structure is micro heat pipe array or the sheet metal of metal material through extrusion modling; And/or go back the big coating of application radiation coefficient on the described display backplane outside surface, the outside surface of described display backplane is plane or the compromise face that increases surface area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201110090412 CN102156521A (en) | 2011-04-11 | 2011-04-11 | Method for cooling laptop, cooling system and efficiently cooled laptop |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110090412 CN102156521A (en) | 2011-04-11 | 2011-04-11 | Method for cooling laptop, cooling system and efficiently cooled laptop |
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| CN102156521A true CN102156521A (en) | 2011-08-17 |
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| CN 201110090412 Pending CN102156521A (en) | 2011-04-11 | 2011-04-11 | Method for cooling laptop, cooling system and efficiently cooled laptop |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105324003A (en) * | 2014-07-10 | 2016-02-10 | 双鸿科技股份有限公司 | Flip-type electronic device and pivoted heat radiation device thereof |
| CN112817412A (en) * | 2019-11-18 | 2021-05-18 | 英业达科技有限公司 | Notebook computer |
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| US5910883A (en) * | 1997-08-06 | 1999-06-08 | International Business Machines Corporation | Hinge incorporating a helically coiled heat pipe for a laptop computer |
| US6148906A (en) * | 1998-04-15 | 2000-11-21 | Scientech Corporation | Flat plate heat pipe cooling system for electronic equipment enclosure |
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| US5872699A (en) * | 1995-07-25 | 1999-02-16 | Fujitsu Limited | Electronic apparatus, housing for electronic apparatus and housing manufacturing method |
| US5910883A (en) * | 1997-08-06 | 1999-06-08 | International Business Machines Corporation | Hinge incorporating a helically coiled heat pipe for a laptop computer |
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| CN1251048C (en) * | 2000-09-21 | 2006-04-12 | 株式会社东芝 | Cooling device of cooling exothermic element and electron equipment having said cooling device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105324003A (en) * | 2014-07-10 | 2016-02-10 | 双鸿科技股份有限公司 | Flip-type electronic device and pivoted heat radiation device thereof |
| CN105324003B (en) * | 2014-07-10 | 2017-12-12 | 双鸿科技股份有限公司 | Cover-lifting type electronic device and its pivoted heat abstractor |
| CN112817412A (en) * | 2019-11-18 | 2021-05-18 | 英业达科技有限公司 | Notebook computer |
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Application publication date: 20110817 |