CN102255056A - Method for reinforcing sealing performance of Organic Light-Emitting Diode (OLED) device sealed by glass material - Google Patents
Method for reinforcing sealing performance of Organic Light-Emitting Diode (OLED) device sealed by glass material Download PDFInfo
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- CN102255056A CN102255056A CN2011101929276A CN201110192927A CN102255056A CN 102255056 A CN102255056 A CN 102255056A CN 2011101929276 A CN2011101929276 A CN 2011101929276A CN 201110192927 A CN201110192927 A CN 201110192927A CN 102255056 A CN102255056 A CN 102255056A
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Abstract
The invention relates to a method for reinforcing sealing performance of an Organic Light-Emitting Diode (OLED) device sealed by a glass material, belonging to the technical field of element package of photoelectric devices. One or more grooves or corrosion grooves are etched before the glass material is printed and deposited on an edge of a first glass substrate of a glass packaged member, then the glass material is printed on the grooves; and the first glass substrate is bonded with a second glass substrate by a laser package method. Some examples of such glass packaged members are OLED displayers or other optical-mechanical-electrical devices. The invention is stated by taking the OLED device for examples.
Description
Technical field
The present invention relates to a kind of method of reinforcing glass material sealing OLED device sealing performance; relate to the application of etching tank in hermetic type glass shell packaging body simultaneously; described seal is fit to the thin-film device (organic light emitting diode display, solar cell and other ray machine electric system etc.) of protection to the surrounding environment sensitivity, belongs to photoelectric device component package technical field.
Background technology
In recent years, display of organic electroluminescence OLED enters popular sight line as a kind of emerging flat-panel monitor, because of its have good color contrast, active illuminating, wide visual angle, can slimming, response speed is fast and advantage such as low energy consumption, is acknowledged as the most promising a kind of Display Technique that substitutes LCD.Yet in display of organic electroluminescence, organic luminous layer and electrode are met water and oxygen lost efficacy easily, thereby influence the useful life of OLED device greatly.If the organic luminous layer in the OLED device and electrode and surrounding environment are separated by the mode of hermetically sealing, then can be prolonged the life-span of this device significantly.Industry adopts various material seal OLED devices in glass shell at present, and it is as follows to reach the hermetically sealing specific requirement:
Hermetically sealing should provide at oxygen (10
-3Centimetre
3/ rice
2/ day) and water (10
-6Gram/rice
2/ sky) barrier.
That the width of hermetically sealing should reach as far as possible is minimum (as, 1mm), reduce the adverse effect that the size of active display causes.
The temperature that produces in the seal process should be low as far as possible, reduces the adverse effect of material such as electrode and organic layer for example in the OLED device.And in seal process, the temperature apart from first pixel of the OLED at the about 1-2 millimeter of seal place in the OLED device should not be higher than 100 ° of C.
The gas that discharges in the seal process should be compatible with the material in the OLED device.
Hermetically sealing should be able to make electric connecting part (as membrane electrode) can enter the OLED device.
The method that present industry is commonly used on the OLED device package has epoxy encapsulation and the metal bonding that adopts inorganic filler and/or organic filler, but all perfect inadequately.Now, a kind of method of frit-sealed glass shell has applied on the OLED device package, and it adopts laser beam to move the fusing of heating glass material and forms the hermetic type encapsulation, and frit is melted in and forms one deck seal on the glass substrate plane, and hermetically sealing is provided.The shortcoming that adopts this process is the adhesion deficiency of frit and glass baseplate surface, and enough mechanical strengths can not be provided.
Summary of the invention
The method that the purpose of this invention is to provide a kind of reinforcing glass material sealing OLED device sealing performance.
The present invention is a kind of method of reinforcing glass material sealing OLED device sealing performance, it is characterized in that having following process and step:
A. will be positioned at the one or multi-channel etching tank of etching on first glass substrate above the organic light emitting display (being OLED); The method of etching etching tank is as follows: (1) is at first cleaned first glass substrate; (2) at the last figure photoresist of first glass substrate; (3) first glass substrate is placed mask aligner, paint the plate aligning with the light that has straight line or curve etch pattern and carry out photoetching; (4) after first glass substrate after will exposing developed, bath dried, and post bake is handled then; (5) place the etching machine to carry out dry method or wet etching first glass substrate; (6) processing of then first glass substrate after the etching being removed photoresist;
B. in the line strip etching tank of above-mentioned first glass substrate, deposit or be coated on wherein by silk screen printing web plate or some glue mode with the glass fine powder material; The placement of glass fine powder material highly needs the degree of depth greater than etching tank;
C. adopt certain pre-sintering temperature curve to carry out presintering in the glass fine powder material in the described etching tank then;
D. with above-mentioned first glass substrate that has etching tank with deposited organic light emitting display in advance, promptly second glass substrate of OLED aligns joint; And employing laser package method bonding; Promptly adopt PC control laser head to scan along glass powder, laser sees through first glass substrate, is absorbed and fusion by glass powder, reaches the fusion fully with glass substrate, and finishes the sealing fully to the OLED device.
Description of drawings
Fig. 1 a is the local microstructure enlarged diagram of the side-looking demifacet of glass capsulation body among the present invention program one.
Fig. 1 b is the plan view from above of the whole glass substrate that surrounded by etching tank among the present invention program one.
Fig. 1 c is the local microstructure enlarged diagram of first glass substrate among the present invention program one.
Fig. 2 a is the local microstructure enlarged diagram of the side-looking demifacet of glass capsulation body among the present invention program two.
Fig. 2 b is the plan view from above of the whole glass substrate that surrounded by etching tank among the present invention program two.
Fig. 2 c is the local microstructure enlarged diagram of first glass substrate among the present invention program two.
Specific embodiments
Referring to accompanying drawing, accompanying drawing has been described concrete scheme of the invention process more fully.Though described the present invention is about the sealing improvement method of the OLED display of sealing.It should be understood that the present invention can be to the utilization equally in two glass substrates process sealed to each other of other devices.
Embodiment one
With reference to Fig. 1 a, be depicted as the local microstructure enlarged diagram of glass capsulation body of the OLED device of one embodiment of the present invention.The sealing body comprises first glass substrate 1, etching tank 2, frit 3, second glass substrate 4, at least one OLED element 5 and at least one electrode 6 that contacts with this OLED element 5.Frit 3 and is positioned within the outward flange of OLED display 5 between first, second glass substrate, forms the hermetic seal of the inner OLED device 5 of protection.OLED device 5 is positioned within the periphery of hermetic seal, and the electrode 6 that links to each other with OLED device 5 passes hermetic seal, thereby OLED device 5 is linked to each other with the outside.In an embodiment, frit is deposited on the etching tank by silk screen printing or some glue mode, and then carries out laser bonding exactly.Clearly, 3 thickness of the frit after the sealing play sealing function greater than the thickness of OLED device 5.
One etching tank of etching 2 on first glass substrate 1, the width of etching tank 2 is 0.8mm, the degree of depth is 10-15um; Frit 3 width also are 0.8mm, highly are 30-40 um; First glass substrate, 1 thickness is 0.7mm, is far longer than the degree of depth of etching tank 2, has guaranteed the intensity of first glass substrate 1.Frit 3 engages with 1 three of first glass substrates, has increased contact area, has improved the bond strength of the frit 3 and first glass substrate.
Embodiment two: with reference to Fig. 2 a, be depicted as etching twice etching tank 2 on first glass substrate 1.Frit 3 width are 1.2mm, height 30-40 um; The width of the etching tank 2 of twice etching is 0.2mm, and the degree of depth is 10-15um; Width d is 0.8mm between the twice etching tank.Frit 3 and etching have the bonding of first glass substrate 1 of twice etching tank 2, have increased contact area, have improved the bond strength of the frit 3 and first glass substrate 1.Fig. 2 b is depicted as the two seals ring-type etching tank that is distributed on the glass substrate edge, and the distance between the two groove inward flanges is 0.8mm.Fig. 2 c is depicted as and adopts the frit of silk screen printing or some glue mode to be coated between the twice etching tank, and frit has covered etching tank.Clearly, the etching etching tank among the present invention can etching multiple tracks etching tank, is not limited to described two kinds of case study on implementation.The groove that is corroded on first glass substrate is many more, and contact area is big more, has improved the sealing intensity of the frit 3 and first glass substrate 1 to a great extent.
Claims (11)
1. the method for reinforcing glass material sealing OLED device sealing performance is characterized in that having following process and step:
A) will be positioned at the one or multi-channel etching tank of etching on the first top glass substrate of organic light emitting display (being OLED); The method of etching etching tank is as follows: (1) is at first cleaned first glass substrate; (2) at the last figure photoresist of first glass substrate; (3) first glass substrate is placed mask aligner, paint the plate aligning with the light that has straight line or curve etch pattern and carry out photoetching; (4) after first glass substrate after will exposing developed, bath dried, and post bake is handled then; (5) place the etching machine to carry out dry method or wet etching first glass substrate; (6) processing of then first glass substrate after the etching being removed photoresist;
B) in the line strip etching tank of above-mentioned first glass substrate, deposit or be coated on wherein by silk screen printing web plate or some glue mode with the glass fine powder material; The placement of glass fine powder material highly needs the degree of depth greater than etching tank;
C) adopt certain pre-sintering temperature curve to carry out presintering in the glass fine powder material in the described etching tank then;
D) with above-mentioned first glass substrate that has etching tank with deposited organic light emitting display in advance, promptly second glass substrate of OLED aligns joint; And employing laser package method bonding; Promptly adopt PC control laser head to scan along glass powder, laser sees through first glass substrate, is absorbed and fusion by glass powder, reaches the fusion fully with glass substrate, and finishes the sealing fully to the OLED device.
2. the method for claim 1 is characterized in that, it comprises a kind of etching process of one or multi-channel groove.
3. the method for claim 1 is characterized in that, described encapsulating method can improve mechanical strength in sealing OLED device.
4. the method for claim 1 is characterized in that, described encapsulating method improves the air-tightness of glass packages.
5. the method for claim 1 is characterized in that, described printed glass material method is silk screen printing or some glue mode.
6. the method for claim 1 is characterized in that, the printed glass material adopts the accurate contraposition of gauge point on the etching groove.
7. the method for claim 1 is characterized in that, described frit composition has high laser absorption rate.
8. the method for claim 1 is characterized in that, described glass substrate has permeability to laser.
9. the method for claim 1 is characterized in that, described laser package method is that laser beam moves the fusing of heating glass material, makes two glass substrates form seal, and hermetically sealing is provided.
10. method as claimed in claim 2 is characterized in that, the degree of depth of described etching groove less than the height of frit, forms level Hermetic Package respectively.
11. method as claimed in claim 5 is characterized in that, the thickness after the described frit printing in groove is greater than 1/3rd of frit thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101929276A CN102255056A (en) | 2011-07-12 | 2011-07-12 | Method for reinforcing sealing performance of Organic Light-Emitting Diode (OLED) device sealed by glass material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101929276A CN102255056A (en) | 2011-07-12 | 2011-07-12 | Method for reinforcing sealing performance of Organic Light-Emitting Diode (OLED) device sealed by glass material |
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| CN102255056A true CN102255056A (en) | 2011-11-23 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103280540A (en) * | 2013-05-09 | 2013-09-04 | 深圳市华星光电技术有限公司 | Display device and manufacturing method thereof |
| CN103311445A (en) * | 2012-12-24 | 2013-09-18 | 上海天马微电子有限公司 | OLED (Organic Light Emitting Diode) encapsulation structure and forming method thereof |
| CN104362167A (en) * | 2014-10-27 | 2015-02-18 | 京东方科技集团股份有限公司 | Organic electroluminescent display panel, substrate and manufacturing method thereof and display device |
| CN104465704A (en) * | 2014-12-03 | 2015-03-25 | 京东方科技集团股份有限公司 | Display panel, packaging method of display panel and display device |
| WO2015043053A1 (en) * | 2013-09-24 | 2015-04-02 | 京东方科技集团股份有限公司 | Encapsulation structure and encapsulation method for oled device |
| CN105405987A (en) * | 2015-12-23 | 2016-03-16 | 昆山国显光电有限公司 | Method for improving OLED (Organic Light Emitting Diode) packaging effect |
| US9368748B2 (en) | 2013-05-09 | 2016-06-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Display device and manufacturing method thereof |
| CN106920889A (en) * | 2015-12-28 | 2017-07-04 | 昆山国显光电有限公司 | A kind of screen method for packing |
| CN106960919A (en) * | 2016-01-12 | 2017-07-18 | 三星显示有限公司 | The manufacture method of display device |
| WO2017128736A1 (en) * | 2016-01-28 | 2017-08-03 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method therefor, and corresponding display panel and display device |
| CN107026243A (en) * | 2016-01-29 | 2017-08-08 | 上海和辉光电有限公司 | A kind of display panel and display device |
| US10505143B2 (en) | 2015-08-07 | 2019-12-10 | Boe Technology Group Co., Ltd. | Display substrate having driving wires and fabrication method thereof, display panel and display apparatus |
| WO2020248246A1 (en) * | 2019-06-14 | 2020-12-17 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display apparatus |
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| CN101501808A (en) * | 2005-12-06 | 2009-08-05 | 康宁股份有限公司 | System and method for frit sealing glass packages |
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| CN1951154A (en) * | 2004-06-11 | 2007-04-18 | 三洋电机株式会社 | Display panel manufacturing method and display panel |
| CN101501808A (en) * | 2005-12-06 | 2009-08-05 | 康宁股份有限公司 | System and method for frit sealing glass packages |
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Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103311445A (en) * | 2012-12-24 | 2013-09-18 | 上海天马微电子有限公司 | OLED (Organic Light Emitting Diode) encapsulation structure and forming method thereof |
| CN103311445B (en) * | 2012-12-24 | 2016-03-16 | 上海天马微电子有限公司 | Organic light-emitting diode packaging structure and forming method thereof |
| WO2014180044A1 (en) * | 2013-05-09 | 2014-11-13 | 深圳市华星光电技术有限公司 | Display device and manufacturing method therefor |
| US9368748B2 (en) | 2013-05-09 | 2016-06-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Display device and manufacturing method thereof |
| CN103280540A (en) * | 2013-05-09 | 2013-09-04 | 深圳市华星光电技术有限公司 | Display device and manufacturing method thereof |
| WO2015043053A1 (en) * | 2013-09-24 | 2015-04-02 | 京东方科技集团股份有限公司 | Encapsulation structure and encapsulation method for oled device |
| US9349984B2 (en) | 2013-09-24 | 2016-05-24 | Boe Technology Group Co., Ltd | Encapsulation structure and encapsulating method of OLED device |
| CN104362167A (en) * | 2014-10-27 | 2015-02-18 | 京东方科技集团股份有限公司 | Organic electroluminescent display panel, substrate and manufacturing method thereof and display device |
| CN104465704B (en) * | 2014-12-03 | 2019-08-23 | 京东方科技集团股份有限公司 | Display panel and its packaging method, display device |
| CN104465704A (en) * | 2014-12-03 | 2015-03-25 | 京东方科技集团股份有限公司 | Display panel, packaging method of display panel and display device |
| US10505143B2 (en) | 2015-08-07 | 2019-12-10 | Boe Technology Group Co., Ltd. | Display substrate having driving wires and fabrication method thereof, display panel and display apparatus |
| CN105405987A (en) * | 2015-12-23 | 2016-03-16 | 昆山国显光电有限公司 | Method for improving OLED (Organic Light Emitting Diode) packaging effect |
| CN106920889A (en) * | 2015-12-28 | 2017-07-04 | 昆山国显光电有限公司 | A kind of screen method for packing |
| CN106920889B (en) * | 2015-12-28 | 2018-10-26 | 昆山国显光电有限公司 | A kind of screen packaging method |
| CN106960919A (en) * | 2016-01-12 | 2017-07-18 | 三星显示有限公司 | The manufacture method of display device |
| CN106960919B (en) * | 2016-01-12 | 2021-06-04 | 三星显示有限公司 | Method for manufacturing display device |
| US10304856B2 (en) | 2016-01-28 | 2019-05-28 | Boe Technology Group Co., Ltd. | Array substrate and methods of manufacturing same, and display panel and display apparatus including the array substrate |
| WO2017128736A1 (en) * | 2016-01-28 | 2017-08-03 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method therefor, and corresponding display panel and display device |
| CN107026243A (en) * | 2016-01-29 | 2017-08-08 | 上海和辉光电有限公司 | A kind of display panel and display device |
| CN107026243B (en) * | 2016-01-29 | 2019-06-11 | 上海和辉光电有限公司 | A kind of display panel and display device |
| WO2020248246A1 (en) * | 2019-06-14 | 2020-12-17 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method therefor, and display apparatus |
| US11495772B2 (en) * | 2019-06-14 | 2022-11-08 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate and method for manufacturing same, and display device |
| US11956988B2 (en) | 2019-06-14 | 2024-04-09 | Chengdu Boe Optoelectronics Technology Co. Ltd. | Display substrate and method for manufacturing same, and display device |
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Application publication date: 20111123 |