CN102255180A - Electrical connector system - Google Patents
Electrical connector system Download PDFInfo
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- CN102255180A CN102255180A CN2011100901593A CN201110090159A CN102255180A CN 102255180 A CN102255180 A CN 102255180A CN 2011100901593 A CN2011100901593 A CN 2011100901593A CN 201110090159 A CN201110090159 A CN 201110090159A CN 102255180 A CN102255180 A CN 102255180A
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- thin slice
- base module
- connector system
- housing
- electric connector
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Abstract
An electrical connector system includes a plurality of chip components (204). Each chip component includes a shell component (211), a plurality of electrical contact channels (217) on the side of the shell component, and electrical contact arrays substantially arranged in the plurality of electrical contact channels. The electrical contact arrays comprises a plurality of cooperation connectors (218) extending from one end of the shell component and a plurality of installation connectors (220) extending from the other end of the shell component. The electrical connector system further comprises a chip shell (206) which positions the plurality of chip components adjacently to each other. The chip shell comprises a first guide component (704).A tube socket module (902) in cooperation with the chip shell comprises a second guide component (1102) which is prepared in a certain size to be connect with the first guide component and thereby to align the tube socket module with the shell component. A power contact (208) traverses the openings (802,908) of the chip shell and the tube socket module so as to provide power transmission paths in the electrical connector system.
Description
Technical field
The present invention relates to a kind of electric connector system that is used for circuit board or the interconnection of other substrates.
Background technology
Typically, electric connector system is used for first substrate, and printed circuit board (PCB) for example is parallel or vertically be connected in second substrate, for example another printed circuit board (PCB).Because electronic component dimensions reduces generally to become more complicated with electronic component, wish in circuit board or other on-chip less space, to install more element usually.Thereby, wish to reduce the spacing between the electric terminal in the electric connector system and increase the quantity that is contained in the electric terminal in the electric connector system.Therefore, wish that research and development can move the electric connector system that can also increase the quantity that is contained in the electric terminal in the electric connector system simultaneously under the situation that speed increases.
Summary of the invention
According to the present invention, electric connector system comprises a plurality of wafer assemblies.Each wafer assemblies comprises the electrical contact passage on housing parts, a plurality of side that is formed on housing parts and is located substantially on electrical contacts array in a plurality of electrical contact passages.Electrical contacts array comprises a plurality of extended matching connectors of an end from housing parts, and from the extended mounted connector of the other end of housing parts.Electric connector system further comprises the thin slice housing that makes a plurality of wafer assemblies adjacent one another are.The thin slice housing comprises first guide member.The base module that cooperates with the thin slice housing comprises second guide member, and its size is made with first guide member and engaged with base module and the thin slice housing of aliging.The opening of the alignment in electrical contact process thin slice housing and the base module is to provide power transmission path in electric connector system.
Description of drawings
Fig. 1 is the schematic diagram that first substrate is connected to the back plane connector system of second substrate;
Fig. 2 is the perspective view that comprises the electric connector system of a plurality of wafer assemblies;
Fig. 3 shows the wafer assemblies of the electric connector system among Fig. 2;
Fig. 4 shows the metal center ground plane of the wafer assemblies among Fig. 3;
Fig. 5 shows a plurality of ribs on the metal center ground plane that is over molded among Fig. 4;
Fig. 6 is the zoomed-in view from the electrical contact of the electric connector system among Fig. 2;
Fig. 7 is the zoomed-in view from the thin slice housing of electric connector system among Fig. 2;
Fig. 8 is another view of the thin slice housing among Fig. 7;
Fig. 9 shows the base module that engages with thin slice housing among Fig. 7;
Figure 10 is another view of the base module among Fig. 9;
Figure 11 shows another view of base module;
Figure 12 shows a view again of base module;
Figure 13 is the perspective view that comprises another electric connector system of a plurality of wafer assemblies;
Figure 14 is another view of the electric connector system among Figure 13;
Figure 15 shows the housing parts from the electric connector system among Figure 13;
Figure 16 shows the electrical contacts array from the electric connector system among Figure 13.
Embodiment
The disclosure content is devoted to be connected to the back plane connector system of one or more substrates.Operation that the back plane connector system can be under high speed (for example, up to 25Gbps) at least simultaneously, in some embodiments, also provides high pin density (for example, the general at least 50 pairs electric connector of per inch).In one embodiment, as shown in fig. 1, back plane connector system 102 can be used for first substrate 104, and printed circuit board (PCB) for example is parallel or vertically be connected to second substrate 106, for example another printed circuit board (PCB).The execution mode of disclosed connector system can comprise the earth shield structure, and it passes the base plate trace, back plane connector, and/or the subcard trace roughly to encapsulate the right electric connector of the electric connector that can be difference with three dimensional constitution right.The ground structure of these encapsulation together with surrounding the insulating packing of electric connector to the different grooves of itself, can prevent in high speed backplane connector system operating period undesirable non-horizontal, longitudinally and the more propagation of higher modes.
Fig. 2 is the perspective view that is used to connect the electric connector system 202 of a plurality of substrates.In one embodiment, electric connector system 202 defines installation end that is connected with first substrate and the abutting end that is connected with second substrate.Can directly or by interface connector be connected with first substrate or second substrate.In some embodiments, when engaging with electric connector system 202, first and second substrates can become generally perpendicularly to arrange.
The central frame 212 of wafer assemblies 204 can be a housing parts, and it is contained in the electrical contacts array 210 and 214 on each side of central frame.First side of central frame 212 can comprise the conductive surface that limits a plurality of first passages 217.Similarly, second side of central frame 212 can comprise the conductive surface that limits a plurality of second channels.Although the second channel on second side of central frame 212 is invisible in the view of Fig. 2, they are roughly similar to a plurality of first passages 217 of illustrating on first side of central frame 212.
In some embodiments, each passage of central frame 212 all is coated with insulating barrier, for example over-molded plasticity insulator, so that when electrical contacts array 210 and 214 was located substantially in the passage, insulating barrier was isolated the current-carrying part of electrical contacts array 210 and 214 and the conductive surface of central frame 212.In other embodiments, electrical contacts array 210 and 214 is surrounded with the conductive lead frame in electrical contacts array 210 and 214 and other conductive surfaces channel separation of central frame 212 for example by over-molded insulating barrier at least in part.
Fig. 3 show with electrical contacts array 210 and 214 and organizer 216 be connected to a wafer assemblies 204 after the central frame 212.Electrical contacts array 210 can be located substantially in described a plurality of first passages 217 of first side of central frame 212 and electrical contacts array 214 can be located substantially in described a plurality of passages of second side of central frame 212.When being positioned at the passage of central frame 212, the corresponding electrical contact adjacent positioned of each electrical contact of electrical contacts array 210 and electrical contacts array 214.In some embodiments, electrical contacts array 210 and 214 in the passage of central frame 212 so that the distance between the adjacent electrical contacts in whole wafer assemblies 204 scopes is substantially the same.Simultaneously, to form a series of electrical contact right for electrical contacts array 210 and 214 adjacent electrical contact.For example, among Fig. 3, wafer assemblies 204 comprises eight pairs of electrical contacts.Every pair of contact comprises a contact and the contact from electrical contacts array 214 from electrical contacts array 210.In some embodiments, electrical contact is to being the differential pair of electrical contact.For example, electrical contact is to being used for sending out differential signal.
In some embodiments, right for each electrical contact, the electrical contact mirror image of the electrical contact of an electrical contacts array and another adjacent electrical contacts array.Make the right electrical contact mirror image of electrical contact aspect the row consistency, provide benefit, simultaneously, also in two paired row, provide unique structure at the row of making and be used for the high speed electric property.
Can be limited to reference to figure 2 and 3, the first electrical contacts array 210 wafer assemblies 204 abutting end a plurality of electric matching connector 218 and at a plurality of mounted connectors 220 of the installation end of wafer assemblies 204.Similarly, second electrical contacts array 214 can be limited to wafer assemblies 204 abutting end a plurality of electric matching connector 222 and at a plurality of mounted connectors 224 of the installation end of wafer assemblies 204. Matching connector 218 and 222 can be to close band shape, three batten shapes, two batten shape, circle, positive type, cloudy type, hermaphroditic type, or the connector type of other pairings.Mounted connector 220 and 224 can be the substrate joint element, and for example electrical contact is installed pin, its be sized with in respective aperture in the substrate of packing into or the through hole to be connected with substrate.
When electrical contacts array 210 and 214 is positioned at the passage of central frame 212, electricity matching connector 218 and 222 the abutting end of wafer assemblies 204 from an end of the passage of central frame 212 extend with first substrate or another cooperating equipment, for example the base module couples.Similar, when electrical contacts array 210 and 214 was positioned at the passage of central frame 212, mounted connector 220 and 224 extended to couple with second substrate or another cooperating equipment at the installation end of wafer assemblies 204 other end from the passage of central frame 212.In electrical contacts array 210, an end that can be positioned on each electrical path of array in the electric matching connector 218, and an other end that can be positioned on each electrical path of array in the mounted connector 220.Similarly, in electrical contacts array 214, an end that can be positioned on each electrical path of array in the matching connector 222, and an other end that can be positioned on each electrical path of array in the mounted connector 224.
Fig. 4 shows the stamped metal centre-point earth layer 402 of the central frame 212 in Fig. 2 and 3.Metal center ground plane 402 can be made by brass, phosphor bronze or another centre-point earth layer material.Metal center ground plane among Fig. 4 also illustrates the manufacturing framework of removing 404 before operation.Metal center ground plane 402 can comprise a plurality of holes 406, its from first side of metal center ground plane 402 through second side of metal center ground plane 402.Hole 406 is used for allowing that plastic molded material passes metal center ground plane 402 during the over-molded process of the passage 217 that forms central frame 212.
Fig. 5 shows the central frame 212 of passage 217 after being formed on the metal center ground plane 402 among Fig. 4.In some embodiments, passage 217 is limited by a plurality of ribs of plastic 502.Ribs of plastic 502 can plate electric conducting material or can be by the conductive plastics moulding.Ribs of plastic 502 can be by liquid crystal polymer (" LCP "), high-temperature thermoplastics, or another timber material forms.On metal center ground plane 402, form in the structure of passage 217, ribs of plastic 502 by over-molded to metal center ground plane 402.
In some embodiments, ribs of plastic 502 can be over molded on first side of metal center ground plane 402 to form a plurality of first electrical contact passages on first side of metal center ground plane 402.Then, first electrical contacts array can be located substantially in a plurality of first electrical contact passages 217.Form a plurality of second and electrically contact in the structure of passage on second side of metal center ground plane 402, over-molded ribs of plastic 502 also can be formed on second side of metal center ground plane 402.Second electrically contacts array and can be located substantially in a plurality of second electrical contact passages then.Although the most of ribs of plastic 502 on second side of metal center ground plane 402 is invisible in Fig. 5, the rib 502 on second side is similar to the rib 502 on first side of metal center ground plane 402 basically.Therefore, the rib 502 on first side can be with respect to the alignment of the rib on second side, so that the corresponding electrical contact adjacent positioned of each electrical contact of first electrical contacts array and second electrical contacts array is to form the differential pair of a plurality of electrical contacts.
In one embodiment, metal center ground plane 402 can be exposed to the bottom of each passage 217 in the central frame 212.For example, the passage 217 of central frame 212 is limited between the first plastics flank 504 and the second plastics flank 506.The first and second plastics flanks 504 and 506 can be over molded on the metal center ground plane 402, so that the metal center ground plane 402 of a part is exposed between the first plastics flank 504 and the second plastics flank 506.In some embodiments, after being formed on ribs of plastic 502 on the metal center ground plane 402, metal center ground plane 402 can be electrically connected to the conductive surface of one or more ribs of plastic 502 on the one or both sides of central frame 212.
As shown in Figure 5, the part of central frame 212 passage 217 is limited by flank 504, flank 506, flank 508 and flank 510.In addition, other flanks also can help to limit whole passages 217, as shown in Figure 5.Flank 504 and flank 508 form the part of first wall on a side of passage 217.Equally, flank 506 and flank 510 form the part of second wall on an opposite side of passage 217.As shown in Figure 5, flank 504 can be parallel with the flank 506 on the opposite side of passage 217 basically.Flank 508 is can be basically parallel with the flank 510 at the opposite side of passage 217.As shown in Figure 5, flank 504 is not parallel with flank 510 basically, and flank 506 is not parallel with flank 508 basically.Therefore, to hold electrical contacts array, this electrical contacts array connects two roughly perpendicular substrates by over-molded flank in the variation of passage 217 service orientations among Fig. 5.Passage 217 can have other sizes, structure and configuration.For example, passage 217 may be tailored to size and the configuration that is used for connecting at electric connector 202 electrical contacts array of a plurality of substrates.
Return with reference to Fig. 2 and 3, a plurality of ground strips 215 can be positioned at the abutting end of wafer assemblies 204.Ground strip 215 extends out and can be electrically connected to first side and/or second side of central frame 212 from central frame 212.Ground strip 215 can be oar shape or other arbitrary shapes, the electrical contact that its shielding is adjacent.In some embodiments, a abutting end in the ground strip 215 in wafer assemblies 204 be arranged in each electric connector on and another of ground strip 215 be positioned at each electric connector under.In some embodiments, ground strip 215 is included in the brass of zinc-plated (Sn) on nickel (Ni) coating or the coating or the base metal of other conductions.
As ground strip 215, organizer 216 can be positioned at the abutting end of wafer assemblies 204.Organizer 216 comprises a plurality of apertures, these apertures be made into certain size with the electric matching connector 218 that when organizer 216 is positioned at the abutting end of wafer assemblies 204, allows to extend from wafer assemblies 212 and 222 and ground strip 215 pass organizer 216.In some embodiments, organizer 216 is used for central frame 212, first electrical contacts array 210, second electrical contacts array 214 and ground strip 215 are locked together securely.
With reference to figure 2, electric connector system 202 also can comprise thin slice housing 206.Thin slice housing 206 is used for receiving a plurality of wafer assemblies 204 and a plurality of wafer assemblies 204 is positioned at electric connector system 202 adjacent to each other.In some embodiments, thin slice housing 206 engages with each wafer assemblies 204 at the abutting end of wafer assemblies 204.For example, thin slice housing 206 can receive the electric matching connector 218 that extends from the abutting end of a plurality of wafer assemblies 204 and 222 and ground strip 215.Connection between thin slice housing 206 and the wafer assemblies 204 is with each wafer assemblies 204 and another wafer assemblies 204 adjacent positioned.The size of the interface connector of thin slice housing 206 defines the relative spacing of a plurality of wafer assemblies 204.
As shown in Figure 2, electric connector system 202 also can comprise one or more power contacts 208 and 209, and it is positioned to be positioned at the outside of independent wafer assemblies 204. Power contacts 208 and 209 is made certain size to pass the one or more openings in the thin slice housing 206.It is one or more at the power transmission path that is connected between two substrates of electric connector system 202 that power contacts 208 and 209 is used to provide.
Fig. 6 shows power contacts 208 among Fig. 2 and 209 zoomed-in view.As seen in Figure 6, power contacts 208 comprises first 602 and second portion 604, this first 602 is configured to engage first substrate, and this second portion 604 is made certain size with the opening that is passed in the alignment in thin slice housing 206 and the base module 902 and be connected to second substrate.As shown in Figure 6, first 602 can be approximately perpendicular to second portion 604.In some embodiments, first 602 locatees so that power contacts 208 and 209 can be connected to two substrates of approximate vertical with respect to second portion 604.Each power contacts 208 and 209 also can comprise one or more substrate joint elements 606, as electrical contact pin is installed, thereby it is made certain size and is connected to substrate with corresponding hole or the through hole that passes in the substrate.
Fig. 7 and 8 shows another view of the thin slice housing 206 of the electric connector system 202 among Fig. 2.Thin slice housing 206 comprises one or more apertures 702 in thin slice housing 206, it makes certain size to allow being connected to the corresponding matching connector relevant with substrate or other cooperating equipments, the base module 902 as shown in Fig. 9-12 from the matching connector 218 and 222 that wafer assemblies 204 is extended.
As shown in Figure 7, thin slice housing 206 also can comprise guide member 704 and the opening 706 that is sized with the parts part that receives base module 902.Fig. 8 shows the opposition side of the thin slice housing 206 among Fig. 7.In Fig. 8, show thin slice housing 206 with one or more grooves 802 and 804, this groove 802 and 804 is made certain size to receive power contacts 208 and 209.For example, groove 802 can receive power contacts 208, and groove 804 can receive power contacts 209. Power contacts 208 and 209 can comprise the surface portion 608 and 610 of one or more protrusions, as shown in Figure 6, when power contacts 208 and 209 is placed in the groove 802 and 804 enter thin slice housing 206, described surface portion be provided at power contacts 208 and 209 and thin slice housing 206 between interference fit.
Illustrated among Fig. 9-12 and be fit to and the different views of the base module 902 that the thin slice housings 206 in Fig. 7 and 8 cooperate.In one embodiment, base module 902 is as the interface link between thin slice housing 206 and substrate.Base module 902 can comprise framework 904, opening 906, groove 908 and 910.
As shown in Fig. 9 and 10, that part of framework 904 that forms groove 908 and 910 can be outstanding from the back side of base module 902.When base module 902 engaged with thin slice housing 206, these protuberances fitted in the opening 706 of thin slice housing 206.When base module 902 joins in the thin slice housing 206, the groove 908 in the framework 904 of base module 902 and 910 with Fig. 7 and 8 in thin slice housing 206 in groove 802 and 804 align.After thin slice housing 206 and base module 902 joined to together, the power contacts 208 and 209 among Fig. 2 was sized the groove that alignd to pass to provide power transmission path between two substrates.For example, power contacts 208 can pass the groove 802 of thin slice housing 206 and the groove 908 of base module 902.Similarly, power contacts 209 can pass the groove 804 of thin slice housing 206 and the groove 910 of base module 902.
As shown in figure 11, base module 902 also can comprise power contacts interface connector 1106 and 1108.Power contacts interface connector 1106 and an end of 1108 comprise substrate joint element 1109, and for example electrical contact is installed pin, and it makes certain size to be assembled in corresponding hole in the substrate or the through hole to be connected to substrate.The power contacts interface connector 1106 and 1108 the other end can comprise that sheet connector system 1110 is to produce pressing or interference fit between electrical contact interface connector 1106,1108 and power contacts separately 208 and 209.A sheet in the sheet connector system 1110 is designed to first side in abutting connection with power contacts, and another sheet in the sheet connector system 1110 is designed to second side in abutting connection with power contacts.
Shown in Figure 11 and 12, the opening 906 in the framework 904 provides a position to be connected to base module 902 for guide member 1102.In one embodiment, securing member 1104 joint guide members 1102 keep guide member 1102 in place with the framework 904 with respect to base module 902.Guide member 1102 can work together with the corresponding guide member 704 of thin slice housing 206 among Fig. 7 and align cooperating between thin slice housing 206 and base module 902 to improve.In one embodiment, the guide member 1102 of base module 902 can comprise guide post, and the guide member 704 of thin slice housing 206 can comprise guide recess, and when thin slice housing 206 engaged with base module 902, this guide recess received this guide post.Usually, before thin slice housing 206 joined base module 902 to, the guide member 1102 of base module 902 and the guide member of corresponding thin slice housing 206 704 engaged so that initial location to be provided.For example, before the signal pins 1116 of base module 902 joined the corresponding matching connector of electrical contacts array 210 and 214 to, guidance system can be with base module 902 and 206 alignment of thin slice housing.As shown in figure 11, guide member 1102 can be connected with the framework 904 of base module 902, and perhaps guide member 1102 can be the integral part of framework 904.Same, as shown in Figure 7, guide member 704 can be the integral part of the framework of thin slice housing 206, perhaps guide member 704 can append to the framework of thin slice housing 206.
As shown in Figure 11 and 12, the mating surface of base module 902 can comprise earth shield 1112, row's ground strip 1114 of a plurality of C shapes and form the right a plurality of signal pins 116 of signal pins.When wafer assemblies 204, thin slice housing 206 and base module 902 all engaged, signal pins 1116 was couple to the matching connector 218 and 222 of wafer assemblies 204.In some embodiments, the earth shield 1112 of the C shape of base module 902, that row ground strip 1114 and a plurality of signal pins are identical to 1116 configuration, assembling and use with configuration, assembling and the use of the corresponding part of the base module described in No. 12/474,568, the U.S. Pat.
Figure 13 is the perspective view that is used to connect the electric connector system 1302 of many substrates.As electric connector system 202, electric connector system 1302 can comprise one or more wafer assemblies 1304, thin slice housing 206 and power contacts 208 and 209.Figure 14 shows in wafer assemblies 1304 assemblings and the electric connector system 1302 after joining thin slice housing 206 to.The wafer assemblies 1304 among Figure 13 of not being both of electric connector system 1302 and electric connector system 202 is different from wafer assemblies 204 among Fig. 2.In electric connector system 1302, wafer assemblies 1304 can comprise first housing 1306, electrical contacts array 1308, electrical contacts array 1310, second housing 1312 and earth shield 1314.
In some embodiments, configuration, the assembling of first housing 1306 of electric connector system 1302, electrical contacts array 1308, electrical contacts array 1310, second housing 1312 and earth shield 1314 is identical in conjunction with configuration, assembling and the use of the corresponding part of described electric connector system as Figure 41 among the US 12/474,568-47 with the U.S. Patent number that uses and be incorporated by reference.For example, as shown in figure 15, housing parts 1306 can limit a plurality of passages 1502, and it is made into certain size to receive one or more electrical contacts array.Figure 16 shows electrical contacts array 1308, and it is sized in a plurality of passages 1502 with the housing parts 1306 that is assembled to Figure 15.As U.S. Patent number US12/474,568 is described, and similar with 214 to above-mentioned electrical contacts array 210, and electrical contacts array 1308 comprises a plurality of matching connectors 1602 and a plurality of mounted connector 1604, is used to connect many substrates.
Each wafer assemblies 1304 include a housing (as, housing 1306 or housing 1312), this housing have with the electrical contacts array in the wafer assemblies 1,304 1308 and 1310 and the contiguous slices assembly in the electrical contacts array face of isolating.As mentioned above, power contacts 208 and 209 passes the opening that is alignd of thin slice housing 206 and base module 902.The opening that is alignd with respect to other links (as, the link of the thin slice housing 206 that engages with wafer assemblies 1304) location, so that when power contacts 208,209 and a plurality of wafer assemblies 1304 when joining thin slice housing 206 to, power contacts 208 and 209 is positioned at the outside of housing parts 1306 and 1312.For example, power contacts 208 and 209 can be in the outside of the housing of wafer assemblies 1304.
Claims (6)
1. electric connector system is characterized in that:
A plurality of wafer assemblies (204), each wafer assemblies comprises:
Housing parts (212);
A plurality of electrical contact passages (217), these a plurality of electrical contact passages are formed on the side of described housing parts; And
Electrical contacts array (214), this electrical contacts array is located substantially in described a plurality of electrical contact passage, and wherein said electrical contacts array comprises a plurality of matching connectors (218) that extend from an end of described housing parts and a plurality of mounted connectors (220) that extend from the other end of described housing parts;
Thin slice housing (206), this thin slice housing is positioned at described a plurality of wafer assemblies in the described electric connector system adjacent to each other, and wherein said thin slice housing comprises first guide member (704);
Base module (902), this base module cooperates with described thin slice housing, wherein said base module comprises second guide member (1102), this second guide member is made into certain size engaging with described first guide member, thereby when described thin slice housing cooperates with described base module described base module and described thin slice housing is alignd; And
Power contacts (208), this power contacts are passed in the opening (802,908) that is alignd in described thin slice housing and the described base module, to provide power transmission path in described electric connector system.
2. electric connector system as claimed in claim 1, wherein said first guide member comprises guide recess, and wherein said second guide member comprises guide post, this guide post is sized to be assembled in the described guide recess.
3. electric connector system as claimed in claim 2, wherein said guide post is sized engaging with described guide recess, with the signal pins of described base module with described base module and described thin slice housing are alignd before the corresponding matching connector of described electrical contacts array engages.
4. electric connector system as claimed in claim 1, wherein said power contacts comprise first (602), and this first is configured to engage with described first substrate; And second portion (604), this second portion is sized passing the opening that alignd in described thin slice housing and the described base module and to be connected with described second substrate, and wherein said first is substantially perpendicular to described second portion.
5. electric connector system as claimed in claim 1, wherein said thin slice housing and described base module comprise second opening (804 of one group of alignment, 910), and described electric connector system further comprises second power contacts (209), this second power contacts passes second opening of that group alignment in described thin slice housing and the described base module, to provide second power transmission path between described first substrate and described second substrate.
6. electric connector system as claimed in claim 1, the opening that is alignd in wherein said thin slice housing and the described base module is with respect to other link location of described thin slice housing, so that when described power contacts and described a plurality of wafer assemblies engage with described thin slice housing, make described power contacts be positioned at the outside of described a plurality of wafer assemblies.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/713,710 US8187034B2 (en) | 2008-12-05 | 2010-02-26 | Electrical connector system |
| US12/713,710 | 2010-02-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102255180A true CN102255180A (en) | 2011-11-23 |
| CN102255180B CN102255180B (en) | 2015-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110090159.3A Active CN102255180B (en) | 2010-02-26 | 2011-02-28 | Electrical connector system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102255180B (en) |
| TW (1) | TWI556518B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105191004A (en) * | 2013-03-14 | 2015-12-23 | 富加宜（亚洲）私人有限公司 | Flexible power connector |
| CN110635279A (en) * | 2018-06-21 | 2019-12-31 | 广濑电机株式会社 | Right-angle electric connector |
| CN110783756A (en) * | 2019-09-23 | 2020-02-11 | 中航光电科技股份有限公司 | Mixed printed board connector |
| CN111490419A (en) * | 2019-01-28 | 2020-08-04 | 泰连公司 | Power connector for bus |
| CN113193407A (en) * | 2021-02-02 | 2021-07-30 | 中山得意电子有限公司 | Electrical connector |
| US20220094116A1 (en) * | 2020-09-21 | 2022-03-24 | Dongguan Luxshare Technologies Co., Ltd | Terminal module for easy determination of electrical performance and backplane connector thereof |
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| TWI492461B (en) * | 2013-10-18 | 2015-07-11 | Topconn Electronic Kunshan Co Ltd | Communication connecting device and lead frame pair thereof |
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| TWM322090U (en) * | 2007-05-11 | 2007-11-11 | Chief Land Electronic Co Ltd | Ground terminal capable of preventing noise |
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| CN1515051A (en) * | 2002-03-29 | 2004-07-21 | ̩ | Matrix connector with integrated power contacts |
| US7381092B2 (en) * | 2004-01-09 | 2008-06-03 | Japan Aviation Electronics Industry, Limited | Connector |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105191004A (en) * | 2013-03-14 | 2015-12-23 | 富加宜（亚洲）私人有限公司 | Flexible power connector |
| CN105191004B (en) * | 2013-03-14 | 2017-10-27 | 富加宜（亚洲）私人有限公司 | flexible power connector |
| CN110635279A (en) * | 2018-06-21 | 2019-12-31 | 广濑电机株式会社 | Right-angle electric connector |
| CN111490419A (en) * | 2019-01-28 | 2020-08-04 | 泰连公司 | Power connector for bus |
| CN110783756A (en) * | 2019-09-23 | 2020-02-11 | 中航光电科技股份有限公司 | Mixed printed board connector |
| US20220094116A1 (en) * | 2020-09-21 | 2022-03-24 | Dongguan Luxshare Technologies Co., Ltd | Terminal module for easy determination of electrical performance and backplane connector thereof |
| US11646535B2 (en) * | 2020-09-21 | 2023-05-09 | Dongguan Luxshare Technologies Co., Ltd | Terminal module for easy determination of electrical performance and backplane connector thereof |
| CN113193407A (en) * | 2021-02-02 | 2021-07-30 | 中山得意电子有限公司 | Electrical connector |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI556518B (en) | 2016-11-01 |
| TW201145705A (en) | 2011-12-16 |
| CN102255180B (en) | 2015-03-04 |
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