CN102299144A - Discreet IGBT module and substrate thereof - Google Patents
Discreet IGBT module and substrate thereof Download PDFInfo
- Publication number
- CN102299144A CN102299144A CN2011101611600A CN201110161160A CN102299144A CN 102299144 A CN102299144 A CN 102299144A CN 2011101611600 A CN2011101611600 A CN 2011101611600A CN 201110161160 A CN201110161160 A CN 201110161160A CN 102299144 A CN102299144 A CN 102299144A
- Authority
- CN
- China
- Prior art keywords
- substrate
- igbt
- discrete
- igbt module
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a discreet insulated gate bipolar transistor (IGBT) module and a substrate thereof. The substrate comprises: grooves, which are matched with IGBTs and are used for disposing the IGBTs; and through holes, which are matched with screws. The installation of the screws enables the substrate to be fixed on a metal plate of a radiator. According to the discreet IGBT module and the substrate thereof provided in the invention, rapid installation of IGBTs is allowed and assembly efficiency is high, so that mass production can be satisfied; on the basis of cooperation between the discreet IGBTs and the ceramic substrate, a heat radiating effect is good; a problem on effective insulation between the IGBTs and the metal plate of the radiator is solved by utilizing a good insulating property of the ceramic substrate; and a thickness of the substrate is consistent with thicknesses of circumjacent components, so that smoothness of all the components during installation can be ensured.
Description
Technical field
The present invention relates to a kind of module, specially refer to discrete IGBT module and substrate.
Background technology
(the Intelligent Power Module of the IPM of extensive use in convertible frequency air-conditioner, Intelligent Power Module), have high reliability, characteristics such as easy to use, be applicable to the frequency converter and the various inverter of drive motors, being widely used in fields such as frequency control, metallurgical machinery, electric traction, servo-drive, frequency-conversion domestic electric appliances, is a kind of very desirable power electronic device.But because manufacturer usually adopts the packaged type that oneself defines when encapsulation IPM, the IPM specification difference of each manufacturer's encapsulation, make different IPM modules must use with it corresponding drive circuit and pcb board to support, cause the IPM of each specification each other can't be compatible.In order to break this deadlock, can adopt 6 discrete IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor), replace the IPM module, because of each IGBT manufacturer all encapsulates IGBT according to international standard TO220, the IGBT uniform specification that is provided can solve the compatibling problem of IGBT well.But traditional fit needs respectively 6 discrete IGBT to be installed, and efficiency of assembling is low; In addition, the insulating material between IGBT and the radiator metallic plate is difficult to guarantee simultaneously insulation and radiating effect between IGBT and the metallic plate.
Summary of the invention
Main purpose of the present invention is for providing the discrete IGBT module and the substrate of a kind of efficiency of assembling height, insulation and good heat dissipation effect.
The present invention proposes a kind of substrate of discrete IGBT module, and its key is, comprising:
With the groove of IGBT coupling, place described IGBT;
With the through hole of screw coupling, described screw is installed, described substrate is fixed on the radiator metallic plate.
Preferably, described groove specifically comprises:
Body groove is arranged at the upper surface of described substrate, the main body of placing described IGBT.
Preferably, described groove also specifically comprises:
The pin groove is arranged at by the described body groove, places the pin of described IGBT.
Preferably, described through hole is half through hole, is arranged at the edge of described substrate, and opening is outside.
Preferably, described substrate also comprises brace table, makes described substrate thickness unanimity.
Preferably, described brace table is two, is arranged at the edge of the relative both sides of described substrate respectively.
Preferably, the concave shape of described brace table for erectting, described concave shape bottom surface and described upper surface of base plate are one-body molded.
Preferably, the material of described substrate is a pottery.
The present invention also proposes a kind of discrete IGBT module, comprises IGBT, and its key is, also comprises substrate, and described IGBT is installed, and is fixed on the radiator metallic plate.
Discrete IGBT module that the present invention proposes and substrate can be realized the Fast Installation to IGBT, and the efficiency of assembling height can satisfy mass production; Cooperate good heat dissipation effect with ceramic substrate by discrete IGBT; Utilize ceramic substrate good insulation performance performance, solve the effective insulation between IGBT and the radiator metallic plate; The thickness of substrate and the thickness of peripheral components and parts are consistent, guarantee the planarization when each components and parts is installed.
Description of drawings
Fig. 1 is the vertical view of the substrate of discrete IGBT module in one embodiment of the invention;
Fig. 2 is the front view of the substrate of discrete IGBT module in one embodiment of the invention;
Fig. 3 is the right view of the substrate of discrete IGBT module in one embodiment of the invention;
Fig. 4 is the whole assembling stereogram of discrete IGBT module in one embodiment of the invention.
The realization of the object of the invention, functional characteristics and advantage will be in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
As shown in Figure 1, the vertical view of the substrate of the main IGBT module of a kind of branch that one embodiment of the invention is mentioned comprises:
With the groove 10 of IGBT coupling, place described IGBT;
With the through hole 20 of screw coupling, described screw is installed, described substrate is fixed on the radiator metallic plate.
The material of the substrate in the foregoing description is a pottery, and insulating properties and thermal diffusivity are better.The shape of above-mentioned groove 10 is consistent with IGBT, can play the effect of location IGBT, during assembling IGBT is positioned in the groove 10, and the insulating material that perfusion is easily solidified above IGBT, as epoxy resin, can finish encapsulation, form a module, promptly discrete IGBT module.In addition, between groove 10 and IGBT, scribble heat-conducting cream, help IGBT heat is conducted to substrate, and pass through the radiator auxiliary heat dissipation at substrate rear, good heat dissipation effect.
For discrete IGBT module well is fixed on the metallic plate of radiator, need at first on the radiator metallic plate, to punch, form screwed hole, and screw is passed the through hole 20 of aforesaid substrate and the screwed hole on the radiator metallic plate, finish the fixing of substrate and radiator.It is fixing respectively to a plurality of IGBT that above-mentioned mounting means has been avoided, and installation rate is faster, and efficiency of assembling is higher, can satisfy mass production; Screw only with the substrate contacts of insulation, contact with IGBT, can avoid the electric conductivity of coping screw nail to cause the metal of IGBT partly to be connected with the radiator metallic plate, better improved insulating properties.
Above-mentioned groove 10 specifically comprises:
In the foregoing description, be provided with six grooves 10, can place six IGBT, according to the physical circuit needs, number that can conversion groove 10.Each groove 10 comprises a body groove 11, and body groove 11 shapes are consistent with the shape of IGBT main body, is a rectangular slot, and when the chip that is mounted was other shapes, body groove 11 can be designed to correspondingly-shaped.When body groove 11 numbers are one, be arranged on the upper surface center of substrate; When body groove 11 numbers when being a plurality of, the long limit of each body groove 11 is adjacent, is arranged in the upper surface center of substrate.Each body groove 11 corresponding three pin groove 12, pin groove 12 mates with the pin of IGBT, and when the chip pin quantity that is mounted changed, the quantity of pin groove 12 also changed thereupon.Pin groove 12 be shaped as bar-shaped trough, three pin grooves 12 are arranged in parallel within the top surface edge of substrate, an end communicates with the minor face of body groove 11, the edge that the other end passes substrate communicates with the external world.In addition, above-mentioned groove 10 also can not comprise pin groove 12, directly with all upwards bendings of pin of IGBT, or body groove 11 is designed to an end minor face communicates with the external world, can place the pin of IGBT.The foregoing description is installed on the substrate of insulation with IGBT, does not directly contact with the metallic plate of radiator, can realize effective insulation, and can avoid using screw fixing IGBT respectively, effectively improves installation rate, improves efficiency of assembling.
Above-mentioned through hole 20 is half through hole, is arranged at the edge of described substrate, and opening is outside.
In the foregoing description, through hole 20 is designed to the semicylinder through hole cut open from central shaft, half of screw drops on the substrate, and second half drops on outside the substrate, can save baseplate material, saves cost.In addition, also through hole 20 can be designed to complete cylinder through hole, make substrate fixing more firm.
The number of above-mentioned through hole 20 is two, is arranged at the edge of the aforesaid substrate left and right sides respectively, with through hole 20 corresponding position auger shell pits, imports screw at through hole 20 and screwed hole on radiator metallic plate below the substrate, and substrate is fixed on the radiator.It is fixing respectively to a plurality of IGBT that above-mentioned mounting means has been avoided, and installation rate is faster, and efficiency of assembling is higher; And screw does not contact with IGBT, can avoid the electric conductivity of coping screw nail to cause the metal part of IGBT to be connected with the radiator metallic plate, has better improved insulating properties.
As shown in Figure 2, in the front view of aforesaid substrate, substrate also comprises brace table 30, makes described substrate thickness unanimity.
Described brace table 30 is two, is arranged at the edge of the relative both sides of described substrate respectively.
The foregoing description utilizes brace table 30 that the thickness of substrate and the thickness of peripheral components and parts are consistent, and guarantees the planarization when each components and parts is installed to pcb board.
As shown in Figure 3, in the right view of aforesaid substrate, through hole 20 specifically comprises first through hole 21 and second through hole 22, first through hole 21 is positioned at the top of second through hole 22, two halves through hole central shaft overlaps, the hole circle radius of first through hole 21 is greater than the hole circle radius of second through hole 22, and first through hole 21 mates with the head of screw of screw, and second through hole 22 mates with the screw rod of screw.This structure can make the screw fixed-site not slide.
The concave shape of above-mentioned brace table 30 for erectting, described concave shape bottom surface and described upper surface of base plate are one-body molded.
In the foregoing description, when the concave shape structure of brace table 30 can guarantee that module is installed to pcb board, form a space between module surface and the pcb board, help heat radiation.In addition, brace table 30 can also be cuboid or fence structure, and the thickness of substrate and the thickness of peripheral components and parts are consistent, and guarantees the planarization when each components and parts is installed to pcb board.
As shown in Figure 4, one embodiment of the invention also proposes a kind of whole assembling stereogram of discrete IGBT module, comprises IGBT 100, also comprises substrate 200, and described IGBT 100 is installed, and is fixed on radiator 300 metallic plates.
In the foregoing description, the material of substrate 200 is a pottery, and insulating properties and thermal diffusivity are better.IGBT 100 is positioned in the groove 10 on the substrate 200, scribbles heat-conducting cream between groove 10 and the IGBT 100, help IGBT heat is conducted to substrate, and the radiator auxiliary heat dissipation by the substrate rear, good heat dissipation effect.The insulating material that perfusion is easily solidified above IGBT 100 is packaged into a discrete IGBT module, perhaps the groove 10 of substrate 200 is designed to tighten the structure of IGBT 100, makes IGBT 100 difficult drop-offs.Substrate 200 both sides are provided with through hole 20, are drilled with screwed hole on the metallic plate of radiator 300, and screw is passed the through hole 20 of aforesaid substrate 200 and the screwed hole on radiator 300 metallic plates, and discrete IGBT module well is fixed on the metallic plate of radiator 300.It is fixing respectively to a plurality of IGBT 100 that above-mentioned mounting means has been avoided, and installation rate is faster, and efficiency of assembling is higher, can satisfy mass production; Screw only contacts with the substrate 200 of pottery, does not contact with IGBT 100, can avoid the electric conductivity of coping screw nail to cause the metal part of IGBT 100 to be connected with the metallic plate of radiator 300, has better improved insulating properties.In addition, substrate 200 both sides are provided with brace table 30, utilize brace table 30 that the thickness of substrate 200 and the thickness of peripheral components and parts are consistent, and guarantee the planarization when each components and parts is installed to pcb board.
The above only is the preferred embodiments of the present invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. the substrate of a discrete IGBT module is characterized in that, comprising:
With the groove of IGBT coupling, place described IGBT;
With the through hole of screw coupling, described screw is installed, described substrate is fixed on the radiator metallic plate.
2. the substrate of discrete IGBT module according to claim 1 is characterized in that, described groove specifically comprises:
Body groove is arranged at the upper surface of described substrate, the main body of placing described IGBT.
3. the substrate of discrete IGBT module according to claim 2 is characterized in that, described groove also specifically comprises:
The pin groove is arranged at by the described body groove, places the pin of described IGBT.
4. the substrate of discrete IGBT module according to claim 1 is characterized in that, described through hole is half through hole, is arranged at the edge of described substrate, and opening is outside.
5. the substrate of discrete IGBT module according to claim 1 is characterized in that, also comprises brace table, makes described substrate thickness unanimity.
6. the substrate of discrete IGBT module according to claim 5 is characterized in that, described brace table is two, is arranged at the edge of the relative both sides of described substrate respectively.
7. according to the substrate of claim 5 or 6 described discrete IGBT modules, it is characterized in that, the concave shape of described brace table for erectting, described concave shape bottom surface and described upper surface of base plate are one-body molded.
8. the substrate of discrete IGBT module according to claim 1 is characterized in that, the material of described substrate is a pottery.
9. a discrete IGBT module comprises IGBT, it is characterized in that, also comprises substrate, and described IGBT is installed, and is fixed on the radiator metallic plate.
10. discrete IGBT module according to claim 9 is characterized in that described substrate is the substrate of each described discrete IGBT module in the claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101611600A CN102299144A (en) | 2011-06-15 | 2011-06-15 | Discreet IGBT module and substrate thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101611600A CN102299144A (en) | 2011-06-15 | 2011-06-15 | Discreet IGBT module and substrate thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102299144A true CN102299144A (en) | 2011-12-28 |
Family
ID=45359449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101611600A Pending CN102299144A (en) | 2011-06-15 | 2011-06-15 | Discreet IGBT module and substrate thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102299144A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103406867A (en) * | 2013-03-06 | 2013-11-27 | 国网智能电网研究院 | Device for assembling flexible power transmission valve |
| CN103839927A (en) * | 2014-02-28 | 2014-06-04 | 上海沪工焊接集团股份有限公司 | Protective device of single IGBT and power module provided with single IGBT |
| CN103855106A (en) * | 2012-12-06 | 2014-06-11 | 三菱电机株式会社 | Power conversion device |
| CN108900109A (en) * | 2018-06-27 | 2018-11-27 | 浙江禾川科技股份有限公司 | A kind of inverter module of servo-driver |
| CN109548367A (en) * | 2018-11-13 | 2019-03-29 | 杭州富特科技股份有限公司 | Heat conductive insulating structure for multiple heating elements |
| CN109904130A (en) * | 2019-02-13 | 2019-06-18 | 浙江天毅半导体科技有限公司 | A kind of integral electrical module heat radiator |
| CN115513073A (en) * | 2022-11-23 | 2022-12-23 | 季华实验室 | Power device heat dissipation structure and assembly method thereof |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5252141A (en) * | 1991-02-20 | 1993-10-12 | Canon Kabushiki Kaisha | Modular solar cell with protective member |
| US6201701B1 (en) * | 1998-03-11 | 2001-03-13 | Kimball International, Inc. | Integrated substrate with enhanced thermal characteristics |
| CN1356764A (en) * | 2001-12-28 | 2002-07-03 | 西安交通大学 | Process for preparing integrated electric and electronic module based on discrete elements |
| US20020167064A1 (en) * | 2000-12-26 | 2002-11-14 | Yoshifumi Takeyama | Substrate for mounting a semiconductor element thereon and semiconductor device comprising a semiconductor element mounted on said substrate |
| JP2004282952A (en) * | 2003-03-18 | 2004-10-07 | Matsushita Electric Ind Co Ltd | Power supply unit |
| US20050161786A1 (en) * | 2004-01-28 | 2005-07-28 | International Rectifier Corporation | Hermetic surface mounted power package |
| US20050167696A1 (en) * | 2004-02-03 | 2005-08-04 | Visteon Global Technologies, Inc. | Silicon nitride insulating substrate for power semiconductor module |
| CN201266607Y (en) * | 2008-09-10 | 2009-07-01 | 海尔集团公司 | Discrete power module |
| CN201298978Y (en) * | 2008-04-18 | 2009-08-26 | 海尔集团公司 | Electric bicycle controller |
| CN201490164U (en) * | 2009-05-07 | 2010-05-26 | 康舒电子(东莞)有限公司 | Crystal assembled jig with positioning function |
| CN201774444U (en) * | 2010-08-02 | 2011-03-23 | 深圳市安托山技术有限公司 | Novel frequency converter |
| CN201788962U (en) * | 2010-08-31 | 2011-04-06 | 昆山瑞凌焊接科技有限公司 | Radiating structure of radiator and device adopting radiating structure |
| CN201845769U (en) * | 2010-11-04 | 2011-05-25 | 嘉兴斯达微电子有限公司 | Compact power module |
-
2011
- 2011-06-15 CN CN2011101611600A patent/CN102299144A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5252141A (en) * | 1991-02-20 | 1993-10-12 | Canon Kabushiki Kaisha | Modular solar cell with protective member |
| US6201701B1 (en) * | 1998-03-11 | 2001-03-13 | Kimball International, Inc. | Integrated substrate with enhanced thermal characteristics |
| US20020167064A1 (en) * | 2000-12-26 | 2002-11-14 | Yoshifumi Takeyama | Substrate for mounting a semiconductor element thereon and semiconductor device comprising a semiconductor element mounted on said substrate |
| CN1356764A (en) * | 2001-12-28 | 2002-07-03 | 西安交通大学 | Process for preparing integrated electric and electronic module based on discrete elements |
| JP2004282952A (en) * | 2003-03-18 | 2004-10-07 | Matsushita Electric Ind Co Ltd | Power supply unit |
| US20050161786A1 (en) * | 2004-01-28 | 2005-07-28 | International Rectifier Corporation | Hermetic surface mounted power package |
| US20050167696A1 (en) * | 2004-02-03 | 2005-08-04 | Visteon Global Technologies, Inc. | Silicon nitride insulating substrate for power semiconductor module |
| CN201298978Y (en) * | 2008-04-18 | 2009-08-26 | 海尔集团公司 | Electric bicycle controller |
| CN201266607Y (en) * | 2008-09-10 | 2009-07-01 | 海尔集团公司 | Discrete power module |
| CN201490164U (en) * | 2009-05-07 | 2010-05-26 | 康舒电子(东莞)有限公司 | Crystal assembled jig with positioning function |
| CN201774444U (en) * | 2010-08-02 | 2011-03-23 | 深圳市安托山技术有限公司 | Novel frequency converter |
| CN201788962U (en) * | 2010-08-31 | 2011-04-06 | 昆山瑞凌焊接科技有限公司 | Radiating structure of radiator and device adopting radiating structure |
| CN201845769U (en) * | 2010-11-04 | 2011-05-25 | 嘉兴斯达微电子有限公司 | Compact power module |
Non-Patent Citations (1)
| Title |
|---|
| XING, KUN: "《Digital Library and Archives: CDRS Services》", 7 October 2009 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103855106A (en) * | 2012-12-06 | 2014-06-11 | 三菱电机株式会社 | Power conversion device |
| CN103406867A (en) * | 2013-03-06 | 2013-11-27 | 国网智能电网研究院 | Device for assembling flexible power transmission valve |
| CN103406867B (en) * | 2013-03-06 | 2015-06-10 | 国网智能电网研究院 | Device for assembling flexible power transmission valve |
| CN103839927A (en) * | 2014-02-28 | 2014-06-04 | 上海沪工焊接集团股份有限公司 | Protective device of single IGBT and power module provided with single IGBT |
| CN108900109A (en) * | 2018-06-27 | 2018-11-27 | 浙江禾川科技股份有限公司 | A kind of inverter module of servo-driver |
| CN109548367A (en) * | 2018-11-13 | 2019-03-29 | 杭州富特科技股份有限公司 | Heat conductive insulating structure for multiple heating elements |
| CN109548367B (en) * | 2018-11-13 | 2023-06-20 | 浙江富特科技股份有限公司 | Heat conduction and insulation structure for multiple heating components |
| CN109904130A (en) * | 2019-02-13 | 2019-06-18 | 浙江天毅半导体科技有限公司 | A kind of integral electrical module heat radiator |
| CN115513073A (en) * | 2022-11-23 | 2022-12-23 | 季华实验室 | Power device heat dissipation structure and assembly method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102299144A (en) | Discreet IGBT module and substrate thereof | |
| CN106206483B (en) | Power module | |
| CN103311193B (en) | Semiconductor power module package structure and preparation method thereof | |
| CN101675520B (en) | Semiconductor module for electric power | |
| CN105514095A (en) | Crimped IGBT module with variable boss height | |
| CN207165544U (en) | A kind of power model provided with two-side radiation device | |
| CN201894030U (en) | Structure for improving heat dissipation effect of heat conducting component | |
| CN218677134U (en) | Intelligent power module and terminal equipment with same | |
| CN209056480U (en) | A kind of ceramic copper-clad panel assembly applied to IGBT power module encapsulation | |
| CN203774281U (en) | Intelligent power module integrally injection-moulded and packaged | |
| CN109548367B (en) | Heat conduction and insulation structure for multiple heating components | |
| CN206524327U (en) | A kind of power model | |
| CN209526082U (en) | A kind of New IGBT radiator structure | |
| CN202455701U (en) | Plastic waterproof electrical box for ventilation and circular heat dissipation | |
| CN209708971U (en) | A kind of anti-fracture steady type chip diode | |
| CN210308773U (en) | Make things convenient for quick fashioned degradable sprout cultivation box processing mould of heat dissipation | |
| CN212970226U (en) | Main power board encapsulation integral structure and electric welding | |
| CN203573979U (en) | Igbt module | |
| CN211509670U (en) | Mounting structure of high-efficient heat dissipation circuit board | |
| CN213459723U (en) | EPS power module | |
| CN212750873U (en) | Intelligent power module and household appliance | |
| CN204792755U (en) | Triode | |
| CN220402253U (en) | Heat dissipation device | |
| CN204131906U (en) | Cooling heat source structure | |
| CN207690787U (en) | Intelligent power module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111228 |