CN102422455A - Substrate processing system - Google Patents
Substrate processing system Download PDFInfo
- Publication number
- CN102422455A CN102422455A CN2010800212147A CN201080021214A CN102422455A CN 102422455 A CN102422455 A CN 102422455A CN 2010800212147 A CN2010800212147 A CN 2010800212147A CN 201080021214 A CN201080021214 A CN 201080021214A CN 102422455 A CN102422455 A CN 102422455A
- Authority
- CN
- China
- Prior art keywords
- substrate
- organic compound
- pump
- cooling
- tube connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
- B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
Abstract
The present invention relates to a substrate processing system, and more particularly, to a substrate processing system comprising antifouling means for preventing the interior of a chamber from being fouled by the diffusion of organic compounds during a process of coating a substrate with said organic compounds. The substrate processing system according to the present invention comprises a coating module and a hardening module. The coating module includes a spray unit and a pump. The spray unit sprays organic compounds on the substrate in the chamber, and has a cooling plate which is spaced apart from the substrate and which has a cooling path formed therein for circulating a coolant in order to prevent the diffusion of the dripping organic compounds which are not coated on the substrate.; The pump has a cooling trap arranged in a lower portion outside the chamber, said pump being connected to the spray unit through a pump connection pipe having a branched or curved portion formed in the direction intersecting the direction in which the pump connection pipe extends lengthwise. The hardening module irradiates ultraviolet rays by means of an ultraviolet lamp onto the substrate coated with the organic compounds, and has a heating coil for heating a transmissive window interposed between the substrate and the ultraviolet lamp.
Description
Technical field
The present invention relates to a kind of base plate processing system; More detailed; Relate to a kind of base plate processing system, the inside of contamination preventing unit in order to prevent during applying a substrate with organic compound, to pollute a chamber because of the distribution of organic compound with a contamination preventing unit.
Background technology
Organic Light Emitting Diode (organic light emitting diode; OLED) refer to the LED that a kind of its luminescent layer is made up of for example conjugated polymer organic compound thin film such as (conjugated polymers).This kind OLED utilizes electroluminescence (electroluminescence) phenomenon that produces light via making an electric current flow through a fluorescence organic compound.OLED comes the real main color of doing via a RGB (red, green, blue) method, a color-converting material (CCM) method and a filter method usually.According to the amount of organic compound in the used luminescent material, OLED is categorized as low Molecule OLEDs and macromolecule OLED.In addition, also can OLED be categorized as passive-matrix (passive matrix according to driving method; PM) type OLED and active-matrix (active matrix; AM) type OLED.
Recently, OLED generally is applied to the for example display of midget plant such as mobile phone and digital camera.Can further expand the range of application of OLED via a glass (glass) substrate that replaces OLED with rotatable film (film) substrate.
The manufacturing of OLED needs a coating processes and a packaging technology; Coating processes is in order to apply a substrate organic compound with a plural layers form as a luminescent layer, and encapsulation (encapsulation) technology is then in order to prevent that oxygen and moisture from getting into organic luminous layer and to prevent that organic luminous layer from receiving exterior vibration.
A kind of being used for comprises according to the base plate processing system of correlation technique manufacturing OLED: module is covered in an a pair of quasi-mode piece and a shielding, is used for a substrate and a shielding are aimed at; One coat module is used for the atomizing of liquids organic compound to forming shielded substrate; One curing module is used for the radiation ultraviolet ray to the substrate that is coated with organic compound thin film; And a refrigerating module, be used to cool off substrate through solidifying.In addition, the pump as a pressure control unit is connected with an organic compound feeder.Pump is installed on a side of coat module, and to keep the vacuum in the chamber, said chamber is used to provide a processing substrate space.Organic compound feeder supply fluid organic compound is to monomer (monomer).
Yet, in the coat module of correlation technique, be installed in the chamber of coat module and just be connected to the pump that is installed on the chamber outside with linear fashion with an injector that sprays organic compound to substrate.Therefore, be easy to scatter and the organic compound assembled may stop up a tube connector that is used for interconnect injector and pump or pollute pump, and then pump is caused mechanical failure.In addition, the uncoated organic compound of leaving in substrate may be because of being easy in chamber, scatter and assemble an inwall that pollutes chamber.
Solidify via radiation ultraviolet ray pass coat module in the correlation technique curing module of organic compound coated substrate; Because of the temperature that is installed on the transmission window between a ultra-violet lamp and substrate is lower than substrate, so the organic compound particle that falls from substrate can be attached to a upper surface of transmission window.In other words, transmission window can be polluted by organic compound particle, and then reduces the ultraviolet transmittance of transmission window.In addition, the curing uniformity of substrate also can reduce.
Summary of the invention
A purpose of the present invention is to provide a kind of base plate processing system that a contamination preventing unit is installed, and contamination preventing unit is applying substrate with organic compound to scatter the inside of polluting a chamber because of organic compound during making an Organic Light Emitting Diode (OLED) in order to preventing.
According to another exemplary embodiment, a kind of base plate processing system comprises: a chamber has a processing space; One injection unit in order to the substrate in injection organic compound to the chamber, and is equipped with a coldplate, and coldplate scatters in order to prevent the uncoated organic compound of leaving in substrate; One pump is installed on an outer lower portion of chamber, and is connected to injection unit through one first pump tube connector, and the first pump tube connector is equipped with a cold-trap; One first feed unit is in order to present organic compound to injection unit; And one second feed unit, in order to a cooling agent to injection unit and cold-trap to be provided.
According to an exemplary embodiment again, a kind of base plate processing system comprises: a chamber has a processing space; At least one ultra-violet lamp is installed in the chamber with the radiation ultraviolet ray; One lampshade is in order to ccontaining ultra-violet lamp; One transmission window is connected to an opening upper surface of lampshade, and in order to transmission from the ultraviolet ray of ultra-violet lamp to substrate; One heat(ing) coil is attached to lampshade along a circumference of transmission window; And a power-supply unit, in order to power supply to ultra-violet lamp and heat(ing) coil.
According to another exemplary embodiment; A kind of base plate processing system comprises: a coat module; Comprise an injection unit and a pump, injection unit is in order to spraying the substrate in organic compound to a chamber and a coldplate is installed, and coldplate and substrate are spaced apart and be formed with the cooling path of a confession one cooling agent circulated therein; To prevent that uncoated organic compound in a substrate from scattering; Pump is connected to injection unit through a pump tube connector, and the pump tube connector is along divide out branch or bending and a cold-trap is installed partly perpendicular to a direction of one of which length direction, and this cold-trap is installed on an outer lower portion of this chamber; And a curing module, in order to via a ultra-violet lamp radiation ultraviolet ray to the substrate that is coated with organic compound, and a heat(ing) coil is installed, heat(ing) coil is installed on the transmission window between substrate and ultra-violet lamp in order to heating.
Description of drawings
In conjunction with the explanation of advantages preceding text, can understand exemplary embodiment of the present invention in more detail, in the accompanying drawing:
Fig. 1 is for showing graphic according to the structure of a base plate processing system of an exemplary embodiment;
Fig. 2 is for showing graphic according to the internal structure of a coat module of said exemplary embodiment;
Fig. 3 is for schematically showing the stereogram of an ejector body shown in Figure 2;
Fig. 4 is the stereogram of a pump tube connector shown in Figure 2;
Fig. 5 is the stereogram of demonstration according to the structure of a coldplate of said exemplary embodiment;
Fig. 6 is the stereogram of demonstration according to an improvement structure of the coldplate of said exemplary embodiment; And
Fig. 7 is the stereogram according to a ultraviolet generation unit of a curing module of said exemplary embodiment.
Accompanying drawing primary clustering symbol description
Embodiment
Below, with the specific embodiment that present invention will be described in detail with reference to the accompanying.Yet the present invention also can be embodied as different forms, does not only limit to embodiment as herein described and should not be regarded as.On the contrary, provide these embodiment in order to make disclosure of the present invention thoroughly and complete and pass on scope of the present invention comprehensively to those who familiarize themselves with the technology.In each accompanying drawing, identical reference numerals is represented same components.
Fig. 1 shows the structure according to a base plate processing system of an exemplary embodiment.
With reference to Fig. 1, base plate processing system 1000 comprises: module (mask shield module) 1400 is covered in a pair of quasi-mode piece (align module) 1300 and one shielding, in order to aim at a substrate 10 and to arrange a shielding (mask); One coat module (coating module) 1500, the organic compound that is in a liquid condition in order to injection be to the substrate that comprises shielding 10, and a contamination preventing unit is installed to prevent polluting its inside because of the distribution and the gathering of organic compound; One curing module (hardening module) 1600 comprises a heating unit, and heating unit is in order to make the organic compound M that is a form of film that is coated on substrate 10 solidify and reduce the whereabouts of organic compound M from substrate 10 via the radiation ultraviolet ray; One refrigerating module (cooling module) 1700 is in order to the substrate 10 of cooling through solidifying; And a controller (scheming not shown), constitute the driving of the building block of substrate processing unit 1000 in order to control.In addition,, a substrate transferring unit is provided, flatly transmits substrate 10 with the outside or inboard at a chamber 1100 although scheme not shownly.
According to present embodiment, the building block of substrate processing unit 1000 (being that module 1400, coat module 1500, curing module 1600 and refrigerating module 1700 are covered in alignment modules 1300, shielding) is connected with an in-line arrangement (in-line) arrangement (being that serial ground is arranged) according to the processing substrate order.Yet, also can use group variety formula (cluster) arrangement or other the various types of arrangements radially arranged of building block wherein.
The building block 1300,1400,1500,1600 and 1700 of base plate processing system 1000 respectively has a separate space, to be used for treatment substrate.For this reason, each building block can have a separate chamber that is independent of other building block and forms.As other a kind of selection, can an integrated spatial of a chamber be divided into a plurality of spaces and be used for each building block.
One lock unit 1200 is arranged at the one or both sides of chamber 1100, introduces in the chamber 1100 and the substrate 10 of in chamber 1100, discharging with control.Opening and closing by the controller that is associated with substrate transferring unit of lock unit 1200 controlled.In base plate processing system 1000, can following mode carry out the turnover of substrate 10 according to this exemplary embodiment.For example, after coat module 1500 was accomplished processing substrate, according to a time difference that sets in the controller, control external brake 1200a and 1200f and inner brake 1200b, 1200c, 1200d and 1200e opening and closing.Correspondingly, transmit substrate 10 to curing modules 1600 being used for next technology, and self-shileding is covered module and is transmitted next substrate (scheming not shown) to coat module 1500 from coat module 1500.In other words, substrate 10 is transmitted as continuous execution.Thus, because of the continuous execution that is transmitted as, so can shorten the processing substrate time via building block 1300,1400,1500,1600 and 1700 pairs of substrates 10.Yet; May command processing substrate technology; Make and after a substrate being introduced in the building block 1300,1400,1500,1600 and 1700 and behind experience whole base plate treatment process, being discharged building block 1300,1400,1500,1600 and 1700, then next new substrate is introduced in the building block 1300,1400,1500,1600 and 1700 to handle.
Fig. 2 shows the internal structure according to the coat module of exemplary embodiment.Fig. 3 is for schematically showing the stereogram of an ejector body shown in Figure 2, and Fig. 4 is the stereogram of a pump tube connector shown in Figure 2.
With reference to Fig. 2 to Fig. 4, coat module 1500 comprises: chamber 1100 is used to provide a space to be used for treatment substrate 10; One injection unit 3000, in order to spray organic compound M to the chamber 1100 substrate 10 and a coldplate 3500 is installed, coldplate 3500 prevents that the uncoated organic compound M that leaves in substrate 10 from scattering; One pump 2120a, an outer lower portion that is installed on chamber 1100 also is connected to injection unit 3000, the first pump tube connector 2150a through one first pump tube connector 2150a one cold-trap 2180 is installed; One first feed unit 2200 is in order to present organic compound M to injection unit 3000; And one second feed unit 2300, in order to present a cooling agent to injection unit 3000 and cold-trap 2180.
Spray opening door 3200 in order to open and to close the injection opening 3100 that is formed at ejector body 3100 places, it is formed a curved slab, to be driven by the inner circumferential surface along cylindrical jet device body 3100.
When not when carrying out processing substrate (when injection nozzle 3300 does not spray organic compound M), spray opening door 3200 and close injection opening 3110.On the contrary, when substrate 10 is introduced in the coat module 1500 and be sent to a top of injection unit 3000, spray opening door 3200 via clockwise or be rotated counterclockwise and open and spray opening 3110 along the inner circumferential surface of ejector body 3100.Then, the spray slits 3320 that is in the organic compound M self-injection nozzle 3300 of liquid condition is injected into substrate 10 through the injection opening 3110 that is opened.Further transmitting that substrate 10 reaches a preset distance and, spraying opening door 3200 and be back to its initial position, close by this and spray opening 3110 through behind the top of injection unit 3000.If substrate 10 moves around in transfer path on the top of injection unit 3000, then spray opening 3110 keep open until substrate 10 final through till the injection unit 3000.One sprays the side that opening door driver element is installed on ejector body 3100, sprays opening door 3200 to drive.Spraying opening door driver element can be powered with second feed unit 2300 explicitly.Opening and close by controller of injection opening door 3200 controlled.
Although in the present embodiment, spraying opening door 3200 can be along the inner circumferential surface rotation of ejector body 3100, and so spraying opening door 3200 also can be along the external peripheral surface rotation of ejector body 3100.
One pump unit 2100 is installed on the outer lower portion of coat module 1500, and is connected with the suction opening 3120 of ejector body 3100.Pump unit 2100 comprises pump tube connector 2150 (2150a and 2150b) and pump 2120 (2120a and 2120b).More specifically; Pump tube connector 2150 comprises one first pump tube connector 2150a and one second pump tube connector 2150b; Suction opening 3120, the second pump tube connector 2150b that the first pump tube connector 2150a is connected to a lower surface that penetrates chamber 1100 then are connected directly to chamber 1100.Hereinafter, with mainly setting forth the first pump tube connector 2150a that is different from correlation technique.
The first pump tube connector 2150a comprises a vertical tube connector, a horizontal connection tube 2154 and an organic compound acceptance division 2190.Vertical tube connector is connected to the bottom of suction opening 3120, extends perpendicular to the direction on ground along one, and the cold-trap (cooling trap) 2180 that is adjacent to suction opening 3120 is installed.Out branch is divided perpendicular to the direction of the length direction of vertical tube connector in horizontal connection tube 2154 edges one, and one first pump 2120a is installed therein.Organic compound acceptance division 2190 is installed on a lower end of vertical tube connector, to collect the organic compound of whereabouts.
More specifically, the first pump tube connector 2150a extends with linear fashion perpendicular to the direction on ground along one simply, and comprises a branching portion perpendicular to its length in addition, and promptly horizontal connection tube 2154.The first pump 2120a is installed in the horizontal connection tube 2154.In the present embodiment, branching portion be configured to make the first pump 2120a be installed on one depart from the length direction of the first pump tube connector 2150a the position.In an improved instance, the part of the first pump tube connector 2150a (promptly of the first pump tube connector 2150a bottom) can be flatly crooked, and the first pump 2120a can be installed on the bend place.In this kind situation, organic compound acceptance division 2190 (will explain after a while) is arranged at the place, a top of the bend in the first pump tube connector 2150a.
Thus, because of the organic compound of having avoided introducing in the suction opening 3120 directly falls to the top of the first pump 2120a, so can prevent that organic compound from polluting the first pump 2120a and and then cause mechanical failure.
Cold-trap 2180 contiguous suction openings 3120 are installed on the top of the first tube connector 2150a, to cool off the inside of the first pump tube connector 2150a.
Cold-trap 2180 comprises: a cooling coil 2182, in a side direction of the vertical tube connector of the first pump tube connector 2150a, insert, and the cooling agent of being presented by second feed unit 2300 circulates in cooling coil (cooling coil) 2182; A plurality of cooling fins (cooling plate) 2184 match to increase the film-cooled heat in the vertical tube connector with cooling coil 2182; And a circular seal lid 2186, in order to cooling coil 2182 is fixed to vertical tube connector.Gap between the seal cover 2186 and the first pump tube connector 2150a seals (sealing), pressure loss occurs to prevent the first pump tube connector 2150a.Because of cold-trap 2180 is installed on the top of the first pump tube connector 2150a, so can minimize the obstruction that the first pump tube connector 2150a is caused by organic compound.
The crooked parallel to the groundly several times of cooling coil 2182, and the cooling fin 2184 that inserts in the cooling coil 2182 tilts with perpendicular to the ground.Therefore, be able to increase, improve cooling effectiveness according to this organic compound with the contact area of the organic compound that falls along the first pump tube connector 2150a.
Organic compound acceptance division 2190 is installed on the lower end of the first pump tube connector 2150a, to collect the organic compound by the whereabouts of cold-trap 2180 coolings.
Organic compound acceptance division 2190 comprises a container 2192 and a container entrance door (scheming not shown); Container 2192 is installed in the inner space, a bottom of the first pump tube connector 2150a, and the container entrance door is installed on the downside of the first pump tube connector 2150a and is opened and closes to allow the withdrawal of container 2192.Between the container entrance door and the first pump tube connector 2150a, also carry out sealing, escape into outside the first pump tube connector 2150a to prevent pressure loss and organic compound.
In the present embodiment, only branching portion and cold-trap 2180 are provided to the first pump tube connector 2150a that links to each other with injection unit 3000.Yet, one branching portion and a cold-trap also can be installed with the second pump tube connector 2150b that the inner space of chamber 1100 directly links to each other.Simultaneously, used pump 2120 (2120a and 2120b) can be turbomolecular pump (turbo molecular pump in the present embodiment; TMP), it is a kind of mechanical type vacuum pump via the gas molecule of rotary pump wing edge one direction expeling at high speed.
Coldplate 3500 is installed on a upper end of ejector body 3100 along substrate direction of transfer X level.For this reason, support bar 3400 is close to an outer surface of ejector body 3100 and vertically is installed on the inboard lower surface of chamber 1100.According to present embodiment, coldplate 3500 has a rectangular shape, and uses four support bars 3400 to support four angles of a lower surface of coldplate 3500.
In addition, cooling agent transfer path 3410 is formed at respectively this support bar 3400 that is used for supporting coldplate 3500, to the cooling unit and the self-cooling mono unit that are installed in the coldplate 3500, discharges cooling agent with supply coolant.
Cooling unit is installed in the coldplate 3500, with the temperature of the coldplate 3500 that reduces adjacent substrates 10.Therefore, if uncoated on substrate 10, then leave over organic compound and can bond or be attached on the coldplate 3500 of cooling towards some organic compound of substrate 10 injections.Therefore, can minimize distribution or the gathering of organic compound in the inner space of chamber 1100.
Now, will come explained in detail coldplate 3500 with reference to figure 5 and Fig. 6.
Fig. 5 is the stereogram of demonstration according to the structure of the coldplate of exemplary embodiment.Fig. 6 is the stereogram of demonstration according to an improvement structure of the coldplate of exemplary embodiment.
With reference to these accompanying drawings, coldplate 3500 comprises a lower plate 3510 and a upper plate 3520.Lower plate 3510 is installed on the upper end of these support bars 3400 and comprises one first through hole, 3512, the first through holes 3512 were vertically formed and were installed on a body of this lower plate 3510 corresponding to spraying opening 3110 middle part.The cooling path 3514 that links to each other with cooling agent transfer path 3410 is arranged in the both sides of first through hole 3512, more specifically, is arranged on the whole upper inside surface of lower plate 3510.Upper plate 3520 comprises one second through hole 3522 and is attached to a upper surface of lower plate 3510, and second through hole 3522 is vertically formed corresponding to first through hole 3512.Here, cooling path 3514 can have the nonoverlapping simple bending structure in each circulate coolant path (Fig. 5) or the lattice structure (Fig. 6) that overlaps of circulate coolant path wherein wherein.
One width W 3 of first through hole 3512 depends on the size of injection nozzle 3300.Generally speaking, an area of section of first through hole 3512 greater than the spray slits 3320 of injection nozzle 3300 aperture area so that can not influence the injection of organic compound.
Lower plate 3510 with an integral form can be divided with respect to first through hole 3512 with upper plate 3520 identical modes.On the other hand, upper plate 3520 can have an integral form, and with lower plate 3510 identical modes one second through hole 3522 to be installed therebetween.The cooling path 3514 that is installed on the upper inside surface of lower plate 3510 is connected with cooling agent transfer path 3410 in being formed at support bar 3400, and support bar 3400 supports each corner of lower plates 3510 and cooling agent can be circulated.With when cooling path 3514 is connected, the other end of cooling agent transfer path 3410 is connected with second feed unit 2300 that is used for presenting from chamber 1100 outsides cooling agent at an end of cooling agent transfer path 3410.
The whole surface that is adjacent to substrate 10 and coldplate 3500 because of above-mentioned coldplate 3500 is cooled, so uncoatedly concentrate and be focused on the coldplate 3500 in substrate 10 and the organic compound that intersperses among the inner space of chamber 1100.In other words, coldplate 3500 prevents that organic compound from interspersing among in the inner space of chamber 1100 randomly and pollute the inwall of chamber 1100.Although scheme not shownly, can more form an acceptance division or along a circumference of coldplate 3500 and receive groove to receive the organic compound of assembling.
Fig. 7 is the stereogram according to a ultraviolet generation unit of a curing module of exemplary embodiment.
With reference to figure 7, ultraviolet generation unit 4000 comprises: at least one ultra-violet lamp 4200, in order to produce ultraviolet ray; One lampshade 4300 is at a upper surface place opening and in order to ccontaining ultra-violet lamp 4200; One transmission window 4100, in order to the opening upper surface that covers lampshade 4300 and simultaneously transmitting UV lamp 4200 produced ultraviolet ray; One heat(ing) coil 4500, in order to via around transmission window 4100 as a contamination preventing member; And a power-supply unit 4400, in order to power supply to ultra-violet lamp 4200 and heat(ing) coil 4500.
Ultra-violet lamp 4200 extends along a direction (promptly perpendicular to the substrate direction of transfer) of the width W 1 of substrate 10, with the whole surface of radiation ultraviolet ray to substrate 10.One length L 4 of ultra-violet lamp 4200 is greater than the width W 1 of substrate 10.Although the substrate curing efficiency can increase with the number of ultra-violet lamp 4200 and improve, the use number of ultra-violet lamp 4200 depends on the size and the processing speed of the object that is cured in reality, to avoid exceedingly increasing installation cost.
In the present embodiment, the lampshade 4300 that is used for ccontaining ultra-violet lamp 4200 has a rectangular column shape, yet it is not limited in this, but also can have other various forms.The upper surface of lampshade 4300 can be an opening, and a lower surface of lampshade 4300 then is positioned on the inside bottom surface of chamber of curing module 1600.
The temperature of rising transmission window 4100 via a heating unit around transmission window 4100 (being heat(ing) coil 4500).In the correlation technique transmission window of no heating unit, the organic compound from substrate 10 whereabouts usually can be attached to a upper surface of the low relatively transmission window of temperature 4100, hinders ultraviolet radiation by this.Therefore, substrate 10 maybe not can be solidified equably.
Yet the ultraviolet generation unit 4000 of this exemplary embodiment comprises the heat(ing) coil 4500 around transmission window 4100, and it is in order to improve the temperature of transmission window 4100.Therefore, can reduce from substrate 10 to fall and be attached to the organic compound of the upper surface of transmission window 4100.In other words, the pollution of transmission window 4100 is able to suppress, and makes ultraviolet ray radiation to substrate 10 equably according to this.
As stated, a coat module and the curing module according to the base plate processing system of this exemplary embodiment respectively comprises a contamination preventing unit.Coat module and curing module can be applied to base plate processing system individually or simultaneously.
In view of the above, because of the organic compound that can prevent to desire to be coated on a substrate scatters in chamber and assembles, so can minimize or prevent pollution to the inside of chamber.Therefore, the quality of substrate gets a promotion, and the processing substrate time obtains shortening, and maintenance and replacement cost be reduced, and boosts productivity by this.
According to above-mentioned exemplary embodiment; Can minimize pollution via a coldplate is provided to the inboard of a chamber; Coldplate is in order to prevent that the uncoated organic compound of leaving in a substrate scatters in the injection unit, and injection unit is installed in the coat module to be used for spraying the substrate of organic compound to chamber.In addition, one be installed on an outer lower portion of chamber the pump tube connector have one a cold-trap is installed branching portion or bend.When injection unit is connected mutually through the pump tube connector with a pump, can prevents organic compound block pumps tube connector and damage pump.
In addition, one be used for making substrate to solidify curing module, along a circumference of a transmission window one heat(ing) coil is installed, with the heating transmission window.Therefore, can reduce the organic compound amount that falls from substrate, prevent according to this to pollute and make the whole surface of substrate to solidify equably transmission window.
Thus, because of the coat module and the curing module of base plate processing system comprises contamination preventing unit respectively, so make the parts for maintenance that causes by the distribution of organic compound and gathering with change minimized.Therefore, can reduce and be used to the processing time and the cost that keep in repair and change, and improve work productivity simultaneously.
Although preceding text are illustrated a kind of device, method and system that are used to deposit a film with reference to specific embodiment, be not limited in this.Therefore, those who familiarize themselves with the technology will readily appreciate that, can under the condition that does not deviate from claims defined by enclosing spirit of the present invention and scope, make various modifications and change to it.
Claims (9)
1. base plate processing system comprises:
One chamber has a processing space;
One injection unit in order to the substrate in injection organic compound to the said chamber, and is equipped with a coldplate, and said coldplate scatters in order to prevent the uncoated organic compound of leaving in said substrate;
One pump is installed on an outer lower portion of said chamber, and is connected to said injection unit through one first pump tube connector, and the said first pump tube connector is equipped with a cold-trap;
One first feed unit is in order to present said organic compound to said injection unit; And
One second feed unit is in order to present a cooling agent to said injection unit and said cold-trap.
2. base plate processing system as claimed in claim 1 is characterized in that, said injection unit comprises:
One injector; Comprise an ejector body, an injection nozzle and an injection opening door; Said ejector body is formed with one and sprays opening and and penetrate the suction opening of one of which inner hollow space along a vertical direction; Said injection nozzle is installed in the said ejector body; In order to spray said organic compound to the said substrate of being presented by said first feed unit through said injection opening, said injection opening door is driven by the inner circumferential surface along this ejector body, to open and close said injection opening;
Said coldplate is installed on a top of said injector along a substrate direction of transfer level, and a cooling path is installed therein, and the said cooling agent of being presented by said second feed unit circulates in said cooling path; And
A plurality of support bars, in the said injector outside, each said support bar comprises the cooling agent transfer path that is formed at wherein, so that said second feed unit connects the said cooling path of said coldplate in order to the said coldplate of vertical support.
3. base plate processing system as claimed in claim 2; It is characterized in that; Said ejector body has a cylindrical shape, and said cylindrical shape has a circular vertical section, and a upper end in said circular vertical section and a lower end are outstanding; Said ejector body has the width that a length is equal to or greater than said substrate, and said ejector body is extended across said substrate direction of transfer.
4. base plate processing system as claimed in claim 2 is characterized in that, said coldplate comprises:
One lower plate; Be installed on the upper end of said support bar and be formed with one first through hole; Said first through hole vertically forms and is installed on the centre of a body of said lower plate corresponding to said injection opening, and the said cooling path that links to each other with said cooling agent transfer path is installed on the both sides that are arranged in said first through hole on the whole upper inside surface of said lower plate; And
One upper plate is formed with one second through hole and is attached to a upper surface of said lower plate, and said second through hole is vertical formation corresponding to said first through hole,
Wherein said cooling path has the lattice structure that overlaps of the nonoverlapping simple bending structure in each circulate coolant path or a wherein said circulate coolant path wherein.
5. base plate processing system as claimed in claim 2 is characterized in that, said pump tube connector comprises:
One vertical tube connector, a bottom that is connected to said suction opening to be extending perpendicular to a ground, and this cold-trap that is adjacent to said suction opening is installed;
One horizontal connection tube, out branch or bending are divided across a direction of a length direction of said vertical tube connector in the edge, and said pump is installed; And
One organic compound acceptance division is installed on a lower end of said vertical tube connector, to collect the organic compound of whereabouts.
6. base plate processing system as claimed in claim 5 is characterized in that, said cold-trap comprises:
One cooling coil inserts in a side direction of said vertical tube connector, and the said cooling agent of being presented by said second feed unit circulates in said cooling coil;
A plurality of cooling fins match to increase by a film-cooled heat with said cooling coil; And
One seal cover is in order to be fixed to said cooling coil said vertical tube connector.
7. base plate processing system comprises:
One chamber has a processing space;
At least one ultra-violet lamp is installed in the said chamber with the radiation ultraviolet ray;
One lampshade is in order to ccontaining said ultra-violet lamp;
One transmission window is connected to an opening upper surface of said lampshade, and in order to said ultraviolet ray to the said substrate of transmission from said ultra-violet lamp;
One heat(ing) coil, a circumference of the said transmission window in edge is attached to said lampshade; And
One power-supply unit is in order to power supply to said ultra-violet lamp and said heat(ing) coil.
8. base plate processing system comprises:
One coat module; Comprise an injection unit and a pump; Said injection unit is in order to spray the substrate in organic compound to a chamber and a coldplate is installed; Said coldplate and said substrate spaced apart and be formed with one supply a cooling agent circulated therein cooling path, scatter to prevent uncoated said organic compound in a substrate, said pump is connected to said injection unit through a pump tube connector; Said pump tube connector is along divide out branch or bending and a cold-trap is installed partly perpendicular to a direction of one of which length direction, said cold-trap is installed on an outer lower portion of said chamber; And
One curing module, in order to via a ultra-violet lamp radiation ultraviolet ray to the said substrate that is coated with said organic compound, and a heat(ing) coil is installed, said heat(ing) coil is installed on the transmission window between said substrate and said ultra-violet lamp in order to heating.
9. base plate processing system as claimed in claim 8 is characterized in that, said coat module is connected with an in-line arrangement arrangement or a group variety formula arrangement with said curing module.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090040940A KR101069842B1 (en) | 2009-05-11 | 2009-05-11 | Substrate processing system |
| KR10-2009-0040940 | 2009-05-11 | ||
| PCT/KR2010/002952 WO2010131878A2 (en) | 2009-05-11 | 2010-05-10 | Substrate processing system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102422455A true CN102422455A (en) | 2012-04-18 |
| CN102422455B CN102422455B (en) | 2015-03-18 |
Family
ID=43085436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080021214.7A Expired - Fee Related CN102422455B (en) | 2009-05-11 | 2010-05-10 | Substrate processing system |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5430749B2 (en) |
| KR (1) | KR101069842B1 (en) |
| CN (1) | CN102422455B (en) |
| TW (1) | TWI427838B (en) |
| WO (1) | WO2010131878A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI481080B (en) * | 2011-07-13 | 2015-04-11 | Lustrous Green Technology Of Lighting | Led package method for maintaining a predetermined luminous quality |
| KR101325489B1 (en) * | 2012-02-15 | 2013-11-07 | 에스엔유 프리시젼 주식회사 | Thin film encapsulation apparatus |
| KR102446556B1 (en) | 2015-09-21 | 2022-09-23 | 삼성디스플레이 주식회사 | Apparatus for treating substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999013545A2 (en) * | 1997-09-11 | 1999-03-18 | Applied Materials, Inc. | Vaporization and deposition apparatus and process |
| JP2004103512A (en) * | 2002-09-12 | 2004-04-02 | Fujitsu Ltd | Manufacturing method and device for organic el element |
| US20090017192A1 (en) * | 2007-07-12 | 2009-01-15 | Hiroyasu Matsuura | Vapor deposition method and apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3593654B2 (en) * | 2000-05-25 | 2004-11-24 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| JP3772325B2 (en) * | 2000-06-20 | 2006-05-10 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| KR100462046B1 (en) * | 2001-11-05 | 2004-12-16 | 네오뷰코오롱 주식회사 | evaporation apparatus for inorganic material layer of organic material display |
| JP4974832B2 (en) | 2007-09-10 | 2012-07-11 | 株式会社アルバック | Vapor deposition source, vapor deposition equipment |
-
2009
- 2009-05-11 KR KR1020090040940A patent/KR101069842B1/en not_active IP Right Cessation
-
2010
- 2010-05-10 WO PCT/KR2010/002952 patent/WO2010131878A2/en active Application Filing
- 2010-05-10 CN CN201080021214.7A patent/CN102422455B/en not_active Expired - Fee Related
- 2010-05-10 JP JP2012510744A patent/JP5430749B2/en not_active Expired - Fee Related
- 2010-05-11 TW TW099114931A patent/TWI427838B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999013545A2 (en) * | 1997-09-11 | 1999-03-18 | Applied Materials, Inc. | Vaporization and deposition apparatus and process |
| KR20010023887A (en) * | 1997-09-11 | 2001-03-26 | 조셉 제이. 스위니 | Vaporization and deposition apparatus and process |
| JP2004103512A (en) * | 2002-09-12 | 2004-04-02 | Fujitsu Ltd | Manufacturing method and device for organic el element |
| US20090017192A1 (en) * | 2007-07-12 | 2009-01-15 | Hiroyasu Matsuura | Vapor deposition method and apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012526653A (en) | 2012-11-01 |
| WO2010131878A3 (en) | 2011-02-24 |
| WO2010131878A2 (en) | 2010-11-18 |
| JP5430749B2 (en) | 2014-03-05 |
| CN102422455B (en) | 2015-03-18 |
| KR20100121975A (en) | 2010-11-19 |
| TW201115806A (en) | 2011-05-01 |
| TWI427838B (en) | 2014-02-21 |
| KR101069842B1 (en) | 2011-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI611847B (en) | System for depositing one or more layers on a substrate supported by a carrier and method using the same | |
| KR101997808B1 (en) | Evaporation source for organic material | |
| KR101983213B1 (en) | Evaporation source for organic material | |
| US20170005297A1 (en) | Evaporation source for organic material, apparatus having an evaporation source for organic material, system having an evaporation deposition apparatus with an evaporation source for organic materials, and method for operating an evaporation source for organic material | |
| JP5981115B2 (en) | Deposition equipment | |
| CN102422455B (en) | Substrate processing system | |
| KR20180048444A (en) | NOZZLE FOR DISTRIBUTION ASSEMBLY OF MATERIAL VAPOR SOURCE AREAS, METHOD FOR MAKING SOURCE ARRANGEMENT, VACUUM VAPOR DEPOSITION SYSTEM, AND METHOD FOR VAPORING MATERIAL | |
| US20210269912A1 (en) | Evaporation source for organic material, deposition apparatus for depositing organic materials in a vacuum chamber having an evaporation source for organic material, and method for evaporating organic material | |
| CN104561923A (en) | Apparatus of depositing organic material and method of depositing organic material | |
| JP6550464B2 (en) | Material deposition system and method of depositing material in a material deposition system | |
| KR102158652B1 (en) | Deposition System, Deposition Apparatus, and Method of Operating Deposition System | |
| CN107078215B (en) | Material source configuration and material distribution configuration for vacuum deposition | |
| CN103288356B (en) | Coating device | |
| JP2020147787A (en) | Film deposition device | |
| KR20200082026A (en) | Glass deposition apparatus | |
| JP2019214791A (en) | Evaporation source for organic materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150318 Termination date: 20170510 |