CN102518956B - Luminous source encapsulation body - Google Patents
Luminous source encapsulation body Download PDFInfo
- Publication number
- CN102518956B CN102518956B CN201110310569.4A CN201110310569A CN102518956B CN 102518956 B CN102518956 B CN 102518956B CN 201110310569 A CN201110310569 A CN 201110310569A CN 102518956 B CN102518956 B CN 102518956B
- Authority
- CN
- China
- Prior art keywords
- encapsulation body
- luminous source
- shell
- source encapsulation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 230000004308 accommodation Effects 0.000 abstract description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical class C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract description 9
- 230000005855 radiation Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 235000008645 Chenopodium bonus henricus Nutrition 0.000 description 1
- 244000138502 Chenopodium bonus henricus Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003657 tungsten Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
Abstract
A kind of luminous source encapsulation body comprises: a metal base, and this pedestal is suitable for being connected with suitable electrical outlets; One is placed in the transparent shell this pedestal making to be formed together with this pedestal an accommodation space; And a light emission unit be placed in this accommodation space, this light emission unit comprises a LED wafer, and this LED wafer is placed in this accommodation space operationally so that be all exported utilization from six surface emitting light out of this LED wafer.
Description
The application is the divisional application that the application number submitted on May 21st, 2009 is " 200910138968.X ", denomination of invention is " luminous source encapsulation body ".
Technical field
The present invention relates to a kind of luminous source encapsulation body.
Background technology
Different from the principle of luminosity that conventional incandescent is generated heat, the principle of luminosity of light emitting diode (LED) mainly applies electric current can on luminescent substance, and to reach illumination effect, therefore LED is called as cold light source.Because LED has the advantages such as high-durability, the life-span is long, light and handy, power consumption is low, and not containing harmful substances such as mercurys, therefore, the solid-state illumination of application LED is also made to become the important R&D target of following global Lighting Industry and semiconductor industry.
Fig. 1 shows a kind of known osram lamp B.This bulb B comprise one be suitable for metal base B1 that E27 type socket (not shown) connects, to be combined with this metal base B1 make can with this metal base B1 jointly formed an accommodation space B20 transparent shell B2, one to be placed in this accommodation space B20 and the conductive connecting pin group B3 and be fixed on this pedestal B1 is connected electrically to the tungsten filament coil B4 of this conductive connecting pin group B3.When this B1 is connected with the socket switched on power, this tungsten filament coil B4 can be energized shinny and reach the object of illumination.But, conventional illuminator so very power consumption and the life-span short, do not meet economic principle and do not meet the carbon reduction trend in the at present whole world.
Summary of the invention
The object of this invention is to provide a kind of not only economy but also the luminous source encapsulation body of environmental protection.According to feature of the present invention, a kind of luminous source encapsulation body, comprises: a cup type shell, and described shell has the sealed bottom open top relative with described bottom with; A heat dissipating layer be formed on the inner surface of described shell, described heat dissipating layer is formed by the material of the coefficient of heat transfer with 400W/ (mK) to 700W/ (mK); A heat-conducting layer be formed on described heat dissipating layer, described heat-conducting layer is formed by the material of the coefficient of heat transfer with 800W/ (mK) to 1200W/ (mK); A reflecting layer be formed on described heat-conducting layer; A light emission unit, described light emission unit comprises installation base plate on a reflecting layer being placed on the inner surface being formed in described shell, the power source control circuit device for providing described LED wafer operating current of outer surface being installed on the LED wafer on described substrate in upside-down mounting mode and being placed in described shell.
Accompanying drawing explanation
Fig. 1 is the schematic side plane of a known incandescent lamp bulb of display;
Fig. 2 is the schematical sections stereogram of the light emission unit of the luminous source encapsulation body of display first preferred embodiment of the present invention;
Fig. 3 is the schematical sections sectional view of the luminous source encapsulation body of display first preferred embodiment of the present invention;
Fig. 4 is the schematical sections side plan view of the change example of the luminous source encapsulation body of display first preferred embodiment of the present invention;
Fig. 5 is the schematic side plane of the another change example of the luminous source encapsulation body of display first preferred embodiment of the present invention;
Fig. 6 is the schematic side plane of the luminous source encapsulation body of display second preferred embodiment of the present invention;
Fig. 7 is the schematical sections stereogram of the luminous source encapsulation body of display the 3rd preferred embodiment of the present invention;
Fig. 8 is the diagrammatic side view of the luminous source encapsulation body of display the 4th preferred embodiment of the present invention;
Fig. 9 is the schematic side plane of the change example of the luminous source encapsulation body of display the 4th preferred embodiment of the present invention; And
Figure 10 is a block schematic diagram showing circuit used in the present invention.
Detailed description of the invention
In the detailed description of the preferred embodiments of the present invention below, same or similar element is indicated by identical label, and their detailed description will be omitted.In addition, in order to clear announcement feature of the present invention, the element in accompanying drawing is not pressed actual ratio and is described.
Fig. 2 and Fig. 3 is the schematic diagram of the luminous source encapsulation body U1 showing the first preferred embodiment of the present invention, and Fig. 2 is a schematic isometric being presented at the light emission unit 4 used in the luminous source encapsulation body U1 shown in Fig. 3.
Refer to shown in Fig. 2 and Fig. 3, the luminous source encapsulation body U1 of the first preferred embodiment of the present invention comprises one and is located at for metal base 1, light emission unit 4 of connecting with socket (not shown) and one transparent shell 5 this pedestal 1 making to be formed together with this base 1 accommodation space of this light emission unit 4 accommodating.
This base 1 be designed to according to need to be suitable for, such as, the base 1 that the socket as E27, PAR 30, PAR 38, M R16 etc. connects and there is a positive electrode contact and a ground contact.In the present embodiment, this base 1 take E27 as example, and its positive electrode contact is located at bottom and negative electrode contact is located at sidewall.
This transparent shell 5 can be made up of any applicable material, and is connected to this pedestal 1 and makes can cooperatively form this accommodation space with this pedestal 1.
This light emission unit 4 comprises pair of conductive electrode 21,22, reflector 3 and LED wafer 40.
This is to conductive electrode 21,22 be fixed on this pedestal 1 by rights and also be respectively have first conduction link 210,220 and the second conduct electricity link 211,221.First conduction link 210 of this conductive electrode 21 is connected to the positive electrode contact of this base 1, and first of this conductive electrode 22 the conduction link 220 is connected to the negative electrode contact of this base 1.
This reflector 3 insulation ground be set in this to conductive electrode 21, on 22 and close to described multiple conductive electrode 21,22 second conduct electricity link 211,221.
This LED wafer 40 has the second surface that a first surface being provided with the first electrode 41 and are provided with the second electrode 42.This first electrode 41 and this second electrode 42 respectively with this to conductive electrode 21, the second conduction link 211,221 of 22 be electrically connected so that this LED wafer 40 by this to conductive electrode 21,22 support fixing.The first surface and second surface of this LED wafer 40 are formed heat radiation film 43.In the present embodiment, the material that this heat radiation film 43 is 800 to 1200W/mk by coefficient of heat transfer is formed.Four side surfaces of each heat radiation film 43 and this LED wafer 40 are formed with phosphor powder layer 44.
Answer it should be noted that the setting like this of this LED wafer 40 can make all to be exported utilization by six of this LED wafer 40 surface emitting light out, and then overall brightness is promoted.
Embodiment is in figure 3 applicable to dc source, but the present invention is also applicable to AC power.Refer to shown in Fig. 4, in the present embodiment, at this to conductive electrode 21, connect a capacitor C between 22 and directly can use AC power at this conductive electrode 21 current-limiting resistance R and diode D that connects.
On the other hand, as shown in FIG. 5, non-conductive heat dissipating fluid can be set in the accommodation space that this is formed jointly by pedestal 1 and transparent shell 5, such as, as non-conductive heat radiation oily or its similar as.Also can doped with fluorescent material in this non-conductive heat dissipating fluid.Certainly, any applicable fluid (air inclusion) should covered within scope of the present invention.
Fig. 6 shows the luminous source encapsulation body U2 of the second preferred embodiment of the present invention.The luminous source encapsulation body U2 of this second preferred embodiment comprises an installation base plate 6, LED wafer 40 and a heat pipe 7.
This installation base plate 6 is transparent high heat-radiating substrates, and has the mounting surface 60 that is laid with predetermined circuit trace (not shown).
In the mounting surface 60 that this LED wafer 40 is installed on this installation base plate 6 and there is the first electrode 400 and the second electrode 401.This first electrode 400 is connected to the circuit trace of the correspondence of this substrate 6 via wire 61.
In the present embodiment, this heat pipe 7 has through hole 70.This substrate 6 attaches to this heat pipe 7 so that LED wafer 40 on this substrate 6 is positioned at the through hole 70 of this heat pipe 7.Second electrode 401 of this LED wafer 40 is connected to this heat pipe 7 via wire 62.
Make to cover this LED wafer 40 in the through hole 70 that transparent fluorescent bisque 71 is formed in this heat pipe 7.
Fig. 7 shows the luminous source encapsulation body U3 of the 3rd preferred embodiment of the present invention.This luminous source encapsulation body U3 comprises heat pipe 7 ' and multiple LED wafer 40.In the present embodiment, the end section effect of this heat pipe 7 ' is as having the mounting portion of five wafer mounting surface (only showing three wafer mounting surface wherein in the accompanying drawings).Each wafer mounting surface is provided with LED wafer 40 in upside-down mounting mode.
Fig. 8 shows the luminous source encapsulation body U4 of the 4th preferred embodiment of the present invention.This luminous source encapsulation body U4 comprises light emission unit and a cup type shell 8.
This cup type shell 8 is formed by pottery material and is had sealed bottom and the open top relative with bottom this.Should it should be noted that this shell 8 can also be formed by the pottery material sintering doped with iron (Fe) powder.
On the inner surface of this cup type shell 8, be formed with a heat dissipating layer 80.In the present embodiment, this heat dissipating layer 80 can be formed by the material as diamond film and its coefficient of heat conduction is 400W/ (mK) to 700W/ (mK).
On this heat dissipating layer 80, be formed with a heat-conducting layer 81.In the present embodiment, this heat-conducting layer 81 can be formed by the picture row material separated as carbon and its coefficient of heat conduction is 800 to 1200W/mk.
On this heat-conducting layer 81, be formed with a reflecting layer 82.This reflecting layer 82 has been come by plating or plasma coating means, and can be formed by metal or nonmetallic material.
Should it should be noted that potter's clay add that Fe etc. metal or nonmetallic materials are after high temperature sintering, form ceramal or non-alloyed pottery and promote the heat conduction of reflector and the function of heat radiation.
This light emission unit comprises LED wafer 40, installation base plate 45 and power source control circuit device 46.
This LED wafer 40 is installed on in the wafer mounting surface of this installation base plate 45 in upside-down mounting mode.This installation base plate 45 is installed on the inner surface of this cup type shell 8, be positioned at the bottom place of this shell 8, and have the predetermined circuit trace be electrically connected with the corresponding weld pad (not shown) of this LED wafer 40 (to be not shownly arranged in the wafer mounting surface of this installation base plate 45.
This installation base plate 45 also has the conductive connecting pin 47 of the bottom extending through this shell 8 for a pair.This is electrically connected the predetermined circuit trace of the link of conductive connecting pin 47 and this installation base plate 45, and its free end extending through the bottom of this shell 8 is suitable for being connected with the Connection Block of external power source supply.
This power source control circuit device 46 is placed in the outer surface of this shell 8, is positioned at the accommodation space 80 of the bottom of this shell 8.This power source control circuit device 46 comprises AC/DC change-over circuit 460 and a constant-current circuit 461, as shown in Figure 10.
This AC/DC change-over circuit 460 has and is connected electrically to this input to conductive connecting pin 47.This constant-current circuit 461 has the input of the output being connected electrically to this AC/DC change-over circuit 460, and is connected electrically to the output of this LED wafer 40.
This power-supply controller of electric also can have the frequency conversion of PW M function and export, and can save the energy and reaches 20% and reduce LED heating more than 30%.
This power-supply controller of electric also can have overtemperature protection, overcurrent voltage protection.Because overtemperature protection, overcurrent voltage protection are aobvious and easily know to those skilled in the art, its be described in more detail in this and repeat no more for this reason.
Fig. 9 is the change example of the embodiment for Fig. 8.Different from the embodiment in fig. 8, the outer surface of this reflector is formed with multiple fin 83 extended in radial directions.Described multiple fin 83 adds high-thermal conductive metal sintering by high heat transfer metal or pottery and forms.
The surface of described multiple fin 83 also can be coated with high heat radiation powder to reach heat conduction and heat radiation combines.
Claims (7)
1. a luminous source encapsulation body, comprises:
A cup type shell, described shell has the sealed bottom open top relative with described bottom with;
A heat dissipating layer be formed on the inner surface of described shell, described heat dissipating layer is formed by the material of the coefficient of heat transfer with 400W/ (mK) to 700W/ (mK);
A heat-conducting layer be formed on described heat dissipating layer, described heat-conducting layer is formed by the material of the coefficient of heat transfer with 800W/ (mK) to 1200W/ (mK);
A reflecting layer be formed on described heat-conducting layer;
A light emission unit, described light emission unit comprises installation base plate on a reflecting layer being placed on the inner surface being formed in described shell, the power source control circuit device for providing described LED wafer operating current of outer surface being installed on the LED wafer on described substrate in upside-down mounting mode and being placed in described shell.
2. luminous source encapsulation body as claimed in claim 1, is characterized in that, described shell is sintered by the pottery material doped with iron powder and formed.
3. luminous source encapsulation body as claimed in claim 1, is characterized in that, described reflecting layer has been come by plating or plasma coating means, and can be formed by metal or nonmetallic material.
4. luminous source encapsulation body as claimed in claim 1, it is characterized in that, described installation base plate also has the conductive connecting pin of the bottom extending through described shell for a pair, the link of described pair of conductive pin and the predetermined circuit trace of described installation base plate are electrically connected, and its free end extending through the bottom of described shell is suitable for being connected with the Connection Block of external power source supply.
5. luminous source encapsulation body as claimed in claim 4, it is characterized in that, described power source control circuit device comprises an AC/DC change-over circuit and a constant-current circuit, described AC/DC change-over circuit has the input being connected electrically to described pair of conductive pin, described constant-current circuit has the input of the output being connected electrically to described AC/DC change-over circuit, and is connected electrically to the output of described LED wafer.
6. luminous source encapsulation body as claimed in claim 5, it is characterized in that, described power source control circuit device also can have one for controlling the PW M circuit of the output of described constant-current circuit.
7. luminous source encapsulation body as claimed in claim 1, it is characterized in that, the outer surface of described shell is also formed with multiple fin extended in radial directions, and described multiple fin adds high-thermal conductive metal sintering by high heat transfer metal or pottery and forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110310569.4A CN102518956B (en) | 2009-05-21 | 2009-05-21 | Luminous source encapsulation body |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110310569.4A CN102518956B (en) | 2009-05-21 | 2009-05-21 | Luminous source encapsulation body |
| CN200910138968A CN101893212B (en) | 2009-05-21 | 2009-05-21 | Packaging body for luminous source |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910138968A Division CN101893212B (en) | 2009-05-21 | 2009-05-21 | Packaging body for luminous source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102518956A CN102518956A (en) | 2012-06-27 |
| CN102518956B true CN102518956B (en) | 2015-08-19 |
Family
ID=43102494
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110310569.4A Expired - Fee Related CN102518956B (en) | 2009-05-21 | 2009-05-21 | Luminous source encapsulation body |
| CN200910138968A Expired - Fee Related CN101893212B (en) | 2009-05-21 | 2009-05-21 | Packaging body for luminous source |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910138968A Expired - Fee Related CN101893212B (en) | 2009-05-21 | 2009-05-21 | Packaging body for luminous source |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN102518956B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102725580A (en) * | 2011-01-25 | 2012-10-10 | 松下电器产业株式会社 | Lighting source |
| CN102691935A (en) * | 2012-05-22 | 2012-09-26 | 深圳市华星光电技术有限公司 | Backlight system, manufacturing method of backlight system and flat panel display device |
| CN103486473B (en) * | 2013-09-23 | 2015-06-10 | 浙江阳光照明电器集团股份有限公司 | LED (light emitting diode) bulb lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6316826B1 (en) * | 1998-10-02 | 2001-11-13 | Sumitomo Electric Industries, Ltd. | Semiconductor mounting package |
| CN1750282A (en) * | 2005-07-18 | 2006-03-22 | 简稚文 | Light emitting diode |
| TW200730766A (en) * | 2005-06-10 | 2007-08-16 | Cree Inc | High power solid-state lamp |
| CN201121817Y (en) * | 2007-11-23 | 2008-09-24 | 绿电光能有限公司 | Ceiling embedded LED illumination device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201000026Y (en) * | 2006-09-08 | 2008-01-02 | 陈中 | Light emitting diode road lamp |
| CN101086325A (en) * | 2006-11-21 | 2007-12-12 | 孙小安 | LED lamp bulb |
| TW200828632A (en) * | 2006-12-28 | 2008-07-01 | Yu-Nung Shen | Package body of luminous source |
| CN101276861B (en) * | 2007-03-26 | 2011-08-17 | 李崇华 | Led |
| US20100219734A1 (en) * | 2007-06-08 | 2010-09-02 | Superbulbs, Inc. | Apparatus for cooling leds in a bulb |
| CN101089461A (en) * | 2007-06-11 | 2007-12-19 | 安提亚科技股份有限公司 | Twist type LED module and LED device |
| CN201166308Y (en) * | 2008-02-28 | 2008-12-17 | 钟建兴 | Illuminating device |
-
2009
- 2009-05-21 CN CN201110310569.4A patent/CN102518956B/en not_active Expired - Fee Related
- 2009-05-21 CN CN200910138968A patent/CN101893212B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6316826B1 (en) * | 1998-10-02 | 2001-11-13 | Sumitomo Electric Industries, Ltd. | Semiconductor mounting package |
| TW200730766A (en) * | 2005-06-10 | 2007-08-16 | Cree Inc | High power solid-state lamp |
| CN1750282A (en) * | 2005-07-18 | 2006-03-22 | 简稚文 | Light emitting diode |
| CN201121817Y (en) * | 2007-11-23 | 2008-09-24 | 绿电光能有限公司 | Ceiling embedded LED illumination device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101893212A (en) | 2010-11-24 |
| CN102518956A (en) | 2012-06-27 |
| CN101893212B (en) | 2012-09-05 |
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Owner name: CHANGCHUNTENG HOLDING CO., LTD. Free format text: FORMER OWNER: SHEN YUNONG Effective date: 20130129 |
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