CN102581851A - Mechanical arm movement control system and method - Google Patents
Mechanical arm movement control system and method Download PDFInfo
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- CN102581851A CN102581851A CN2011100077495A CN201110007749A CN102581851A CN 102581851 A CN102581851 A CN 102581851A CN 2011100077495 A CN2011100077495 A CN 2011100077495A CN 201110007749 A CN201110007749 A CN 201110007749A CN 102581851 A CN102581851 A CN 102581851A
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Abstract
A mechanical arm movement control system runs on a control computer. The system determines an original point of a coordinate system of a mechanical arm according to distances among an original point of a coordinate system of a PCB (printed circuit board), a probe and the PCB to be measured, computes a displacement value of a testing point on the PCB relative to the original point of the coordinate system of the PCB according to two-dimensional coordinates of the testing point, and controls the mechanical arm to correspondingly move in the coordinate system of the mechanical arm according to the relative displacement value. The system further computes pixel difference between a center point of a geometric graph of the testing point in a current image of the PCB and a center point of the current image, computes displacement correction of the mechanical arm and correspondingly corrects the displacement of the mechanical arm in the coordinate system of the mechanical arm, so that the probe is positioned above the testing point on the PCB, the system controls the mechanical arm to correspondingly move along a Z-axis direction according to the distance from the probe to the testing point on the PCB, and the probe is accurately positioned on the testing point on the PCB. The invention further provides a method for controlling movement of the mechanical arm.
Description
Technical field
The present invention relates to a kind of automatic measuring system and method, especially about a kind of mechanical arm kinetic control system and method.
Background technology
At present, mechanical arm is widely used in the automatic measurement field.In measuring process, generally be to utilize mechanical arm to grasp testing tool (for example probe), and testing tool navigated to the relevant position on the product to be measured according to the coordinate information of the test point that writes down in product to be measured (for example PCB) the cloth map file.On the one hand; Because the coordinate information that writes down in the product cloth map file to be measured is normally based on the rectangular coordinate system of linearity; And the motion of mechanical arm is by the rotating drive of a plurality of CD-ROM drive motors; The motion of CD-ROM drive motor is based on polar coordinates information, that is to say, the coordinate system of mechanical arm is non-linear.On the other hand, test point generally is that part (for example electric capacity) is welded to the pad (pad) on the PCB, and being actually what have certain size is not simple " point ".So there is certain error in the motion that direct coordinate information according to the test point that writes down in the product cloth map file to be measured is controlled mechanical arm.
Summary of the invention
In view of above content, be necessary to propose a kind of mechanical arm kinetic control system and method, can revise the motion of mechanical arm, improve the accuracy of mechanical arm motion control.
A kind of mechanical arm motion control method runs on the control computer.This method comprises: (a) read the cloth map file of PCB to be measured, obtain the layout information of PCB to be measured, comprise PCB coordinate system to be measured origin (x0, y0), the information of part to be measured and test point information; (b) according to the origin of PCB coordinate system to be measured (x0, y0) produce first control instruction control mechanical arm traveling probe to PCB coordinate origin to be measured (x0, y0) directly over; (c) utilize probe that radium-shine stadia surveying mechanical arm grasps and PCB to be measured apart from Z0; (d) according to the origin of PCB coordinate system to be measured (x0, y0) and probe and PCB to be measured apart from Z0 confirm the mechanical arm coordinate system origin (X0, Y0, Z0); (e) from layout information, read the two-dimensional coordinate of the last test point of PCB to be measured, calculate the relative displacement value of this test point and PCB coordinate origin to be measured; (f) produce second control instruction control mechanical arm according to the relative displacement value that calculates and in the mechanical arm coordinate system, do corresponding displacement; (g) utilize image capture unit to capture the current image of PCB to be measured; (h) in current image, confirm the geometric figure of this test point according to the layout information of PCB to be measured, calculate the geometric central point of this test point and the pixel value difference of current image center point in current image; (i) scaling according to current image and PCB to be measured converts pixel value difference the displacement correction amount of mechanical arm in the mechanical arm coordinate system into; (j) according to the displacement correction volume production that calculates give birth to the 3rd control instruction to mechanical arm the displacement in the mechanical arm coordinate system do corresponding correction, with probe is navigated to this test point on the PCB to be measured directly over; (k) utilize the probe of radium-shine stadia surveying mechanical arm extracting and the current distance Zn of this test point on the PCB to be measured; And (l) produce the 4th control instruction control mechanical arm according to the current distance Zn of this test point on probe and the PCB to be measured and move along Z-direction and bear Zn, so that probe accurately navigates to this test point on the PCB to be measured.
A kind of mechanical arm kinetic control system runs on the control computer.This system comprises: information reading module, control module, coordinate determination module, computing module and Figure recognition module.Information reading module reads the cloth map file of PCB to be measured, obtains the layout information of PCB to be measured.Control module according to the origin of PCB coordinate system to be measured (x0, y0) produce first control instruction control mechanical arm traveling probe to PCB coordinate origin to be measured (x0, y0) directly over.The coordinate determination module according to the origin of PCB coordinate system to be measured (x0, y0) and the probe that obtains of radium-shine stadia surveying and PCB to be measured apart from Z0 confirm the mechanical arm coordinate system origin (X0, Y0, Z0).Computing module calculates test point and the relative displacement value of PCB coordinate origin to be measured on the PCB to be measured.Control module produces second control instruction control mechanical arm according to the relative displacement value that calculates and in the mechanical arm coordinate system, does corresponding displacement.The Figure recognition module is confirmed the geometric figure of this test point in the current image of the PCB to be measured of image capture unit acquisition according to the layout information of PCB to be measured.Computing module calculates the geometrical center point of this test point in current image and the pixel value difference of current image center point, and converts pixel value difference the displacement correction amount of mechanical arm in the mechanical arm coordinate system into according to the scaling of current image and PCB to be measured.Control module according to the displacement correction volume production that calculates give birth to the 3rd control instruction to mechanical arm the displacement in the mechanical arm coordinate system do corresponding correction; And the current distance Zn of probe that obtains according to radium-shine stadia surveying and this test point on the PCB to be measured produces the 4th control instruction control mechanical arm and moves negative Zn along Z-direction, so that probe accurately navigates to this test point on the PCB to be measured.
Compared to prior art; Mechanical arm kinetic control system provided by the present invention and method; Utilize the cognitive two dimensional surface of adjustment of image mechanical arm of the PCB to be measured of image capture unit acquisition; Utilize the probe of radium-shine stadia surveying mechanical arm extracting and the distance that PCB to be measured goes up test point, improved the accuracy of mechanical arm motion control.
Description of drawings
Fig. 1 is the applied environment figure of mechanical arm kinetic control system of the present invention preferred embodiment.
Fig. 2 is the functional block diagram of mechanical arm kinetic control system of the present invention preferred embodiment.
Fig. 3 A and Fig. 3 B are the flow charts of mechanical arm motion control method of the present invention preferred embodiment.
Fig. 4 is the sketch map of PCB coordinate system to be measured and mechanical arm coordinate system.
The main element symbol description
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| Radium-shine |
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| PCB to be measured | 60 |
| The mechanical arm |
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The specific embodiment
As shown in Figure 1, be the applied environment figure of mechanical arm kinetic control system 11 preferred embodiments of the present invention.This mechanical arm kinetic control system 11 runs in the control computer 10.This control computer 10 is connected with mechanical arm 20, image capture unit 30, radium-shine rangefinder 40 and tester 50 respectively through data wire.Mechanical arm 20 utilizes the probe grabbing device to grasp the probe of tester 50.Image capture unit 30 acquisitions printed circuit board (PCB) to be measured (Printed Circuit Board, PCB) 60 image, probe that radium-shine rangefinder 40 measurement mechanical arms 20 grasp and the distance of PCB to be measured 60.
It is pointed out that in the process of mechanical arm 20 motions the probe that mechanical arm 20 grasps is positioned at the dead ahead of the optical center point of image capture unit 30 all the time.Mechanical arm kinetic control system 11 is controlled the motion of mechanical arm 20 in mechanical arm coordinate system X, Y direction according to the coordinate information of test point on the PCB 60 to be measured; And the motion of mechanical arm 20 is revised according to the image information of the PCB to be measured 60 of image capture unit 30 acquisition; Control the motion of mechanical arm 20 according to the probe of mechanical arm 20 extractings and the distance of PCB to be measured 60 at last, probe is accurately navigated to the test point on the PCB 60 to be measured in mechanical arm coordinate system Z-direction.
As shown in Figure 2, be the functional block diagram of mechanical arm kinetic control system 11 preferred embodiments of the present invention.This mechanical arm kinetic control system 11 comprises information reading module 110, Figure recognition module 111, coordinate determination module 112, control module 113 and computing module 114.Said module 110 to 114 comprises the sequencing code, and these sequencing code storage are in the memory 13 of control computer 10, and the processor 14 of control computer 10 is carried out these sequencing codes, and the above-mentioned functions of mechanical arm kinetic control system 11 is provided.Concrete function below in conjunction with Fig. 3 A and each module of Fig. 3 B explanation.
Consulting shown in Fig. 3 A and Fig. 3 B, is the flow chart of mechanical arm motion control method of the present invention preferred embodiment.
Step S301, information reading module 110 read the cloth map file 12 of PCB 60 to be measured from memory 13.This cloth map file 12 has write down the layout information of PCB 60 to be measured; Origin (the x0 that comprises PCB60 coordinate system to be measured; Y0), the type of part to be measured (like resistance, electric capacity, inductance), the quantity of all kinds part to be measured; The test point (pad) that comprises on the dimension information of each part to be measured and each part to be measured, each test point two-dimensional coordinate and the information such as size of each test point in PCB 60 coordinate systems to be measured.For example, if part to be measured (or test point) is circular, then dimension information comprises radii size, if rectangle, then dimension information comprises long and wide.
Step S302, information reading module 110 read PCB 60 to be measured origin (x0, y0).
Step S303, control module 113 according to the origin of PCB 60 to be measured (x0, y0) produce first control instruction control mechanical arm 20 with probe move to PCB 60 to be measured initial point (x0, y0) directly over.
Step S304; The initial image of image capture unit 30 acquisitions PCB 60 to be measured; Figure recognition module 111 is discerned part or the test point that each geometric figure is represented in the initial image according to the layout information in the cloth map file 12, confirms the origin position in the initial image according to the distribution of initial image part and test point.
Step S305, probe that radium-shine rangefinder 40 measurement mechanical arms 20 grasp and PCB60 to be measured apart from Z0.
Step S306, coordinate determination module 112 be used for according to PCB 60 coordinate origin coordinates to be measured (x0, y0) and probe and PCB to be measured 60 apart from Z0 confirm the mechanical arm coordinate system origin (X0, Y0, Z0), X0=x0 wherein, Y0=y0.As shown in Figure 4, said mechanical arm coordinate system is so that (X0, Y0 Z0) are initial point, being respectively X, Y axle with PCB 60 coordinate system x to be measured, the parallel straight line of y axle, being the space coordinates that the Z axle is confirmed with the vertical direction of PCB 60 coordinate systems to be measured.
Step S307, information reading module 110 read n test point on the PCB 60 to be measured two-dimensional coordinate (xn, yn) and dimension information.Wherein, the initial value of n is 1.
Step S308, (xn yn) calculates the relative displacement value of the initial point of this n test point and PCB to be measured 60 coordinate systems to computing module 114 according to the two-dimensional coordinate of n test point on the PCB 60 to be measured.For example, (x0, relative displacement value y0) is dX (n)=xn-x0 to the initial point of n test point on the PCB 60 to be measured and plane coordinate system, dY (n)=yn-y0.
Step S309, control module 113 is used for relative displacement value according to the initial point of each test point and plane coordinate system and produces second control instruction control mechanical arm 20 and do corresponding displacement at the mechanical arm coordinate system.For example, control mechanical arm 20 along mechanical arm coordinate system X-direction move dX (n), Y direction moves dY (n).
Step S310, the current image of image capture unit 30 acquisitions PCB 60 to be measured.
Step S311; Figure recognition module 111 is confirmed the geometric central point of this n test point according to the dimension information of this n test point; Computing module 114 calculates the geometric central point and the current image center point X of this n test point in current image, the pixel value difference of Y direction.For example, the resolution of supposing current image is the 640*480 pixel, and then the pixel coordinate of current image center point is (320; 240); The pixel coordinate of supposing the geometric central point of this n test point is (312,234), and then the pixel value difference of the geometric central point of this n test point and current image center point is 320-312=8 along the pixel value difference of mechanical arm coordinate system X-direction; The pixel value difference of Y direction is 240-234=6, and unit is a pixel.
Step S312, with X, the pixel value difference of Y direction converts displacement correction amount dXr (n) and the dYr (n) of mechanical arm in X, Y direction into to computing module 114 according to the scaling of current image and PCB to be measured 60.Scaling can be confirmed according to the enlargement ratio of image capture unit 30.For example, the enlargement ratio of supposing image capture unit 30 is 1: 2, and PCB 60 to be measured is of a size of Lcm*H cm, dXr (n)=(8/640) * L/2 then, dYr (n)=(6/480) * H/2.
Step S313, control module 113 according to the displacement correction volume production that calculates give birth to the 3rd control instruction to mechanical arm 20 displacement in the mechanical arm coordinate system do corresponding correction.For example, control mechanical arm 20 along mechanical arm coordinate system X-direction continue to move dXr (n), Y direction continues to move dYr (n), with probe is navigated to this n test point on the PCB 60 to be measured directly over.The current X coordinate of probe in the mechanical arm coordinate system that mechanical arm 20 grasps is Xn=xn+dXr (n), and the Y coordinate is Yn=yn+dYr (n).
Step S314, probe and last n the test point of PCB60 to be measured (xn, current distance Zn yn) that radium-shine rangefinder 40 measurement mechanical arms 20 grasp.
Step S315; (xn, current distance Zn yn) confirm coordinate (Xn, the Yn of this n test point in the mechanical arm coordinate system to coordinate determination module 112 according to n test point on coordinate, the displacement correction amount that calculates and the probe and the PCB to be measured 60 of the test point on the PCB 60 to be measured in PCB 60 coordinate systems to be measured; Zn); And (Xn, Yn is Zn) to memory 13 to write down the coordinate of this n test point in the mechanical arm coordinate system.For example, the two-dimensional coordinate of n test point on the PCB 60 to be measured be (xn, yn), then the coordinate of this n test point in the mechanical arm coordinate system be (Xn, Yn, Zn).Wherein, Xn=xn+dXr (n), Yn=yn+dYr (n).
Step S316; The probe that control module 113 grasps according to mechanical arm 20 and the current distance Zn of last n the test point of PCB60 to be measured produce the 4th control instruction and control mechanical arm 20 and move along Z-direction and bear Zn and make probe accurately navigate to n test point on the PCB 60 to be measured, and this n test point tested.
Step S317, information reading module 110 judges according to the layout information of record in the cloth map file 12 whether PCB 60 to be measured also has other test point not test.If also have other test point not test, execution in step S318 then, control module 113 produces the 5th control instruction control mechanical arm 20 and resets, promptly control mechanical arm 20 with probe be repositioned onto the mechanical arm coordinate system initial point (X0, Y0, Z0).Afterwards, flow process begins repetition from step S307, and all test points are all tested and finished on PCB 60 to be measured, and flow process finishes.
Claims (10)
1. mechanical arm motion control method; Run on the control computer; This control computer expert crosses data wire and is connected with mechanical arm, image capture unit, radium-shine rangefinder and tester respectively; Mechanical arm utilizes the probe grabbing device to grasp the probe of tester, it is characterized in that this method comprises:
(a) read the cloth map file of PCB to be measured, obtain the layout information of PCB to be measured, comprise PCB coordinate system to be measured origin (x0, y0), the information of part to be measured and test point information;
(b) according to the origin of PCB coordinate system to be measured (x0 y0) produces first control instruction, control mechanical arm traveling probe to PCB coordinate origin to be measured (x0, y0) directly over;
(c) utilize probe that radium-shine stadia surveying mechanical arm grasps and PCB to be measured apart from Z0;
(d) according to the origin of PCB coordinate system to be measured (x0, y0) and probe and PCB to be measured apart from Z0 confirm the mechanical arm coordinate system origin (X0, Y0, Z0);
(e) from layout information, read the two-dimensional coordinate of the last test point of PCB to be measured, calculate the relative displacement value of this test point and PCB coordinate origin to be measured;
(f) produce second control instruction according to the relative displacement value that calculates, the control mechanical arm is done corresponding displacement in the mechanical arm coordinate system;
(g) utilize image capture unit to capture the current image of PCB to be measured;
(h) in current image, confirm the geometric figure of this test point according to the layout information of PCB to be measured, calculate the geometric central point of this test point and the pixel value difference of current image center point in current image;
(i) scaling according to current image and PCB to be measured converts pixel value difference the displacement correction amount of mechanical arm in the mechanical arm coordinate system into;
(j) give birth to the 3rd control instruction according to the displacement correction volume production that calculates, corresponding correction is done in the displacement in the mechanical arm coordinate system to mechanical arm, with probe is navigated to this test point on the PCB to be measured directly over;
(k) utilize the probe of radium-shine stadia surveying mechanical arm extracting and the current distance Zn of this test point on the PCB to be measured; And
(l) the current distance Zn according to this test point on probe and the PCB to be measured produces the 4th control instruction, and the control mechanical arm moves negative Zn along Z-direction, so that probe accurately navigates to this test point on the PCB to be measured.
2. mechanical arm motion control method as claimed in claim 1 is characterized in that, in the process of mechanical arm motion, the probe that mechanical arm grasps is positioned at the dead ahead of the optical center point of image capture unit all the time.
3. mechanical arm motion control method as claimed in claim 1; It is characterized in that this method also comprises step: the distance according to this test point on coordinate, the displacement correction amount that calculates and the probe and the PCB to be measured of this test point in PCB coordinate system to be measured is confirmed the coordinate of this test point in the mechanical arm coordinate system.
4. mechanical arm motion control method as claimed in claim 1 is characterized in that, this method also comprises step: judge according to the layout information in the cloth map file whether PCB to be measured also has other test point not test; If also have other test point not test, then control initial point (X0, Y0 that mechanical arm is repositioned onto probe the mechanical arm coordinate system; Z0); And return step (e), and all to test up to all test points of PCB to be measured and finish, flow process finishes.
5. mechanical arm motion control method as claimed in claim 1; It is characterized in that; The information of said part to be measured and test point information comprise: the type of part to be measured; The quantity of all kinds part to be measured, the test point that comprises on the dimension information of each part to be measured and each part to be measured, each test point two-dimensional coordinate and the dimension information of each test point in PCB coordinate system to be measured.
6. mechanical arm kinetic control system; Run on the control computer; This control computer expert crosses data wire and is connected with mechanical arm, image capture unit, radium-shine rangefinder and tester respectively; Mechanical arm utilizes the probe grabbing device to grasp the probe of tester, it is characterized in that this system comprises:
Information reading module is used to read the cloth map file of PCB to be measured, obtains the layout information of PCB to be measured, comprise PCB coordinate system to be measured origin (x0, y0), the information of part to be measured and test point information;
Control module, be used for according to PCB coordinate system to be measured origin (x0 y0) produces first control instruction, control mechanical arm traveling probe to PCB coordinate origin to be measured (x0, y0) directly over;
The coordinate determination module, be used for according to PCB coordinate system to be measured origin (x0, y0) and the probe that obtains of radium-shine stadia surveying and PCB to be measured apart from Z0 confirm the mechanical arm coordinate system origin (X0, Y0, Z0);
Information reading module also is used to read the two-dimensional coordinate of the last test point of PCB to be measured;
Computing module is used to calculate the relative displacement value of this test point and PCB coordinate origin to be measured;
Control module also is used for producing second control instruction according to the relative displacement value that calculates, and the control mechanical arm is done corresponding displacement in the mechanical arm coordinate system;
The Figure recognition module is used for confirming at the current image of the PCB to be measured of image capture unit acquisition according to the layout information of PCB to be measured the geometric figure of this test point;
Computing module; Also be used for calculating at the geometrical center point of current this test point of image and the pixel value difference of current image center point, and convert pixel value difference the displacement correction amount of mechanical arm in the mechanical arm coordinate system into according to the scaling of current image and PCB to be measured;
Control module; Also be used for giving birth to the 3rd control instruction according to the displacement correction volume production that calculates; Corresponding correction is done in displacement in the mechanical arm coordinate system to mechanical arm; And the probe that obtains according to radium-shine stadia surveying and the current distance Zn of this test point on the PCB to be measured produce the 4th control instruction, and the control mechanical arm moves negative Zn along Z-direction, so that probe accurately navigates to this test point on the PCB to be measured.
7. mechanical arm kinetic control system as claimed in claim 6 is characterized in that, in the process of mechanical arm motion, the probe that mechanical arm grasps is positioned at the dead ahead of the optical center point of image capture unit all the time.
8. mechanical arm kinetic control system as claimed in claim 6; It is characterized in that said coordinate determination module also is used for confirming the coordinate of this test point in the mechanical arm coordinate system according to the distance of this test point this test point on the coordinate of PCB coordinate system to be measured, the displacement correction amount that calculates and probe and PCB to be measured.
9. mechanical arm kinetic control system as claimed in claim 6; It is characterized in that; Said information reading module also is used for judging according to the layout information of cloth map file whether PCB to be measured also has other test point not test; If also have other test point not test, after then control module produced the 5th control instruction control mechanical arm probe is repositioned onto the initial point of mechanical arm coordinate system, the control mechanical arm navigated to probe the next test point of PCB to be measured.
10. mechanical arm kinetic control system as claimed in claim 6; It is characterized in that; The information of said part to be measured and test point information comprise: the type of part to be measured; The quantity of all kinds part to be measured, the test point that comprises on the dimension information of each part to be measured and each part to be measured, each test point two-dimensional coordinate and the dimension information of each test point in PCB coordinate system to be measured.
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Application publication date: 20120718 |