CN102618214A - Alumina micro-powder production method capable of preventing microelectronic substrate grinding medium agglomeration - Google Patents
Alumina micro-powder production method capable of preventing microelectronic substrate grinding medium agglomeration Download PDFInfo
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- CN102618214A CN102618214A CN2011100299166A CN201110029916A CN102618214A CN 102618214 A CN102618214 A CN 102618214A CN 2011100299166 A CN2011100299166 A CN 2011100299166A CN 201110029916 A CN201110029916 A CN 201110029916A CN 102618214 A CN102618214 A CN 102618214A
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Abstract
The invention relates to an alumina micro-powder production method capable of preventing microelectronic substrate grinding medium agglomeration. The alumina micro-powder production method comprises the following steps of 1, carrying out ball-milling of alumina micro-powder by a ball mill, 2, putting milled alumina micro-powder, water and a dispersing agent into a sorting barrel, carrying out full stirring, and carrying out sedimentation, 3, carrying out sorting through sucking out upper slurry from the sorting barrel by a siphon, then adding clear water into the sorting barrel until the level of a liquid in the sorting barrel reaches to the level of the liquid which is not subjected to siphoning, then carrying out stirring, sedimentation and siphoning, repeating a cycle 6 to 10 times to obtain a certain grade of micro-particles, adding a dispersing agent and clear water into the sorting barrel until the level of the liquid in the sorting barrel reaches to the level of the liquid which is not subjected to siphoning, and repeating the cycle of stirring, sedimentation and siphoning 6 to 10 times to obtain the other grade of micro-particles, wherein the micro-particles having smaller sizes are separated out prior to the micro-particles having larger sizes until grading is finished fully, and 4, drying the micro-particles obtained by the step 3 to obtain finished products. The invention solves the problem that during a microelectronic substrate grinding process, grinding medium agglomeration occurs, and realizes good uniformity.
Description
Technical field
The present invention relates to a kind of micro mist working method, especially a kind of working method that prevents the alumina powder that the microelectronic substrates grinding medium is united belongs to the micro mist production technical field.
Background technology
In the microelectronic substrates process of lapping, the reunion of abrasive micropowder will impact substrate surface, and the surface can be grown dim even scratch.Be in process of lapping, to add suspension-s to control the reunion in the process of lapping in the prior art, but owing in the mixing process, be difficult to evenly, address this problem up hill and dale.
Summary of the invention
The present invention seeks to have overcome above-mentioned weak point, a kind of working method that prevents the alumina powder that the microelectronic substrates grinding medium is united is provided, solved the agglomeration of grinding medium in the microelectronic substrates process of lapping, good uniformity.
According to technical scheme provided by the invention, a kind of working method that prevents the alumina powder that the microelectronic substrates grinding medium is united, its component ratio is counted by weight, comprises following process step:
(1) ball milling: alumina powder is carried out ball milling obtain the alumina powder that particle diameter is 2.3～11 μ m on ball mill, the ball milling time is 3 ~ 8 hours;
(2) in the sorting bucket, drop into 800 ~ 1000 parts in ball milling is good 300 ~ 500 parts of alumina powders, water and 1 ~ 5 part of dispersion agent, fully stir, stirring velocity is 300 ~ 500 rev/mins, and churning time is 5 ~ 60min; Stir the back standing sedimentation, the settling time is 10 ~ 30min;
(3) sorting:
A, with U trap the upper strata slip sucking-off in the sorting bucket once adds the initial liquid level before clear water to the siphon then in the sorting bucket; Stir again, sedimentation, siphon, said stirring velocity is 300 ~ 500 rev/mins, churning time is 1 ~ 20min, the settling time is 10 ~ 50min; Repeat 6 ~ 10 times, can obtain other particulate of level, the particle diameter of said particulate is 2.3～5.2 μ m;
B, in the sorting bucket, add initial liquid level before 0.5 ~ 4 part of dispersion agent and clear water to the siphon again, repeat the step of stirring among the above-mentioned steps a, sedimentation, siphon, repetitive operation 6 ~ 10 times obtains another other particulate of level, and the particle diameter of said particulate is 5.8～7 μ m;
Classification by thin to slightly carrying out, divide earlier thin level other, the back divide thick grade other, finish until whole classifications;
(4) will under 220 ~ 250 ℃ condition, dry 24 ~ 36 hours through the particulate that step (3) classification obtains, get product.
The present invention just adds dispersion agent when producing micro mist, the dispersion medium of allotment is a relation of utilizing trickle object wet property and tabular alpha-alumina crystals, and uniting through the viscosity solution micro powder granule of control sorting liquid forms oarse-grained phenomenon; Solved the agglomeration of grinding medium in the microelectronic substrates process of lapping, good uniformity thoroughly solves grow diming phenomenon and largely reduces the scuffing rate.
Embodiment
Below in conjunction with specific embodiment the present invention is described further.
Dispersion agent water glass employing used in the present invention Wuxi shakes and reaches the water glass (liquid glass water) that cast material ltd produces, and outward appearance is colourless or has a little the transparent or semitransparent viscous liquid of look that performance index are as shown in table 1.
The performance index of table 1 dispersion agent water glass
| Degree Beaume (20 ℃) | 36 |
| Sodium oxide Na 2O%≥ | 7 |
| Silicon-dioxide SiO 2%≥ | 24.6 |
| Modulus (M) | 3.45 |
| Iron (Fe) %<= | 0.05 |
| Water-insoluble %<= | 0.3 |
Embodiment one: a kind of working method that prevents the alumina powder that the microelectronic substrates grinding medium is united, and its component ratio is counted by weight, comprises following process step:
(1) ball milling: with particle diameter is that 22-32 μ m alumina powder carries out ball milling and obtains the alumina particulate that particle diameter is 2.3～11 μ m on ball mill, and the ball milling time is 3 hours.
(2) in the sorting bucket, drop into 1 part of ball milling is good 800 parts in 300 parts of alumina powders, water and dispersion agent water glass, fully stir, stirring velocity is 300 rev/mins, and churning time is 5min; Stir the back standing sedimentation, the settling time is 10min;
(3) sorting:
A, with U trap the upper strata slip sucking-off in the sorting bucket once adds the initial liquid level before clear water to the siphon then in the sorting bucket; Stir again, sedimentation, siphon, said stirring velocity is 300 rev/mins, churning time is 1min, the settling time is 10min; Repeat 6 times, can obtain other particulate of level, the particle diameter of said particulate is 2.3～5.2 μ m;
B, in the sorting bucket, add initial liquid level before 0.5 part of water glass and clear water to the siphon again, repeat the step of stirring among the above-mentioned steps a, sedimentation, siphon, repetitive operation 6 times obtains another other particulate of level, and the particle diameter of said particulate is 5.8～7 μ m;
Classification by thin to slightly carrying out, divide earlier thin level other, the back divide thick grade other, finish until whole classifications;
(4) will under 220 ℃ condition, dry 24 hours through the particulate that step (3) classification obtains, get product.
Embodiment two: a kind of working method that prevents the alumina powder that the microelectronic substrates grinding medium is united, and its component ratio is counted by weight, comprises following process step:
(1) ball milling: with particle diameter is that 22-32 μ m alumina powder carries out ball milling and obtains the alumina particulate that particle diameter is 2.3～11 μ m on ball mill, and the ball milling time is 8 hours.
(2) in the sorting bucket, drop into 5 parts of ball milling is good 1000 parts in 500 parts of alumina powders, water and dispersion agent water glass, fully stir, stirring velocity is 500 rev/mins, and churning time is 60min; Stir the back standing sedimentation, the settling time is 30min;
(3) sorting:
A, with U trap the upper strata slip sucking-off in the sorting bucket once adds the initial liquid level before clear water to the siphon then in the sorting bucket; Stir again, sedimentation, siphon, said stirring velocity is 500 rev/mins, churning time is 20min, the settling time is 50min; Repeat 10 times, can obtain other particulate of level, the particle diameter of said particulate is 2.3～5.2 μ m;
B, in the sorting bucket, add initial liquid level before 4 parts of water glass and clear water to the siphon again, repeat the step of stirring among the above-mentioned steps a, sedimentation, siphon, repetitive operation 10 times obtains another other particulate of level, and the particle diameter of said particulate is 5.8～7 μ m;
Classification by thin to slightly carrying out, divide earlier thin level other, the back divide thick grade other, finish until whole classifications;
(4) will under 250 ℃ condition, dry 36 hours through the particulate that step (3) classification obtains, get product.
Embodiment three: a kind of working method that prevents the alumina powder that the microelectronic substrates grinding medium is united, and its component ratio is counted by weight, comprises following process step:
(1) ball milling: with particle diameter is that 22-32 μ m alumina powder carries out ball milling and obtains the alumina particulate that particle diameter is 2.3～11 μ m on ball mill, and the ball milling time is 5 hours.
(2) in the sorting bucket, drop into 2 parts of ball milling is good 900 parts in 40 parts of alumina powders, water and dispersion agent water glass, fully stir, stirring velocity is 400 rev/mins, and churning time is 30min; Stir the back standing sedimentation, the settling time is 20min;
(3) sorting:
A, with U trap the upper strata slip sucking-off in the sorting bucket once adds the initial liquid level before clear water to the siphon then in the sorting bucket; Stir again, sedimentation, siphon, said stirring velocity is 400 rev/mins, churning time is 10min, the settling time is 30min; Repeat 8 times, can obtain other particulate of level, the particle diameter of said particulate is 2.3～5.2 μ m;
B, in the sorting bucket, add initial liquid level before 2 parts of water glass and clear water to the siphon again, repeat the step of stirring among the above-mentioned steps a, sedimentation, siphon, repetitive operation 8 times obtains another other particulate of level, and the particle diameter of said particulate is 5.8～7 μ m;
Classification by thin to slightly carrying out, divide earlier thin level other, the back divide thick grade other, finish until whole classifications;
(4) will under 230 ℃ condition, dry 28 hours through the particulate that step (3) classification obtains, get product.
The present invention just adds dispersion agent when producing micro mist, the dispersion medium of allotment is a relation of utilizing trickle object wet property and tabular alpha-alumina crystals, and uniting through the viscosity solution micro powder granule of control sorting liquid forms oarse-grained phenomenon; Grinding medium agglomeration can not occur in the microelectronic substrates process of lapping.
Claims (2)
1. working method that prevents the alumina powder that the microelectronic substrates grinding medium is united, it is characterized in that: its component ratio is counted by weight, comprises following process step:
(1) ball milling: alumina powder is carried out ball milling obtain the alumina powder that particle diameter is 2.3～11 μ m on ball mill, the ball milling time is 3 ~ 8 hours;
(2) in the sorting bucket, drop into 800 ~ 1000 parts in ball milling is good 300 ~ 500 parts of alumina powders, water and 1 ~ 5 part of dispersion agent, fully stir, stirring velocity is 300 ~ 500 rev/mins, and churning time is 5 ~ 60min; Stir the back standing sedimentation, the settling time is 10 ~ 30min;
(3) sorting:
A, with U trap the upper strata slip sucking-off in the sorting bucket once adds the initial liquid level before clear water to the siphon then in the sorting bucket; Stir again, sedimentation, siphon, said stirring velocity is 300 ~ 500 rev/mins, churning time is 1 ~ 20min, the settling time is 10 ~ 50min; Repeat 6 ~ 10 times, can obtain other particulate of level, the particle diameter of said particulate is 2.3～5.2 μ m;
B, in the sorting bucket, add initial liquid level before 0.5 ~ 4 part of dispersion agent and clear water to the siphon again, repeat the step of stirring among the above-mentioned steps a, sedimentation, siphon, repetitive operation 6 ~ 10 times obtains another other particulate of level, and the particle diameter of said particulate is 5.8～7 μ m;
(4) will under 220 ~ 250 ℃ condition, dry 24 ~ 36 hours through the particulate that step (3) classification obtains, get product.
2. the working method that prevents the alumina powder that the microelectronic substrates grinding medium is united as claimed in claim 1 is characterized in that: said dispersion agent is a water glass.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103146227A (en) * | 2012-12-22 | 2013-06-12 | 湖南磊鑫新材料科技有限公司 | Submicron order coarse whiting size production method and combination equipment thereof |
| CN111607360A (en) * | 2020-06-02 | 2020-09-01 | 无锡晨旸科技股份有限公司 | Grinding material for large-diameter silicon wafer and production method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS582377A (en) * | 1981-06-29 | 1983-01-07 | Pentel Kk | Abrasive material |
| US5593467A (en) * | 1993-11-12 | 1997-01-14 | Minnesota Mining And Manufacturing Company | Abrasive grain |
| JP2005223260A (en) * | 2004-02-09 | 2005-08-18 | Asahi Kasei Chemicals Corp | Metal abrasive water-based dispersing element containing abrasive grains |
| CN101291879A (en) * | 2005-09-16 | 2008-10-22 | 欧米亚发展股份公司 | Process of preparing mineral material with particular ceria-containing zirconium oxide grinding beads, obtained products and their uses |
| CN101628728A (en) * | 2009-01-17 | 2010-01-20 | 汉寿金诚研磨材有限公司 | White alundum hyperfine abrasive micropowder preparation method |
-
2011
- 2011-01-28 CN CN2011100299166A patent/CN102618214A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS582377A (en) * | 1981-06-29 | 1983-01-07 | Pentel Kk | Abrasive material |
| US5593467A (en) * | 1993-11-12 | 1997-01-14 | Minnesota Mining And Manufacturing Company | Abrasive grain |
| JP2005223260A (en) * | 2004-02-09 | 2005-08-18 | Asahi Kasei Chemicals Corp | Metal abrasive water-based dispersing element containing abrasive grains |
| CN101291879A (en) * | 2005-09-16 | 2008-10-22 | 欧米亚发展股份公司 | Process of preparing mineral material with particular ceria-containing zirconium oxide grinding beads, obtained products and their uses |
| US20100074827A1 (en) * | 2005-09-16 | 2010-03-25 | Christian Rainer | Process of Preparing Mineral Material with Particular Ceria-Containing Zirconium Oxide Grinding Beads, Obtained Products and their Uses |
| CN101628728A (en) * | 2009-01-17 | 2010-01-20 | 汉寿金诚研磨材有限公司 | White alundum hyperfine abrasive micropowder preparation method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103146227A (en) * | 2012-12-22 | 2013-06-12 | 湖南磊鑫新材料科技有限公司 | Submicron order coarse whiting size production method and combination equipment thereof |
| CN111607360A (en) * | 2020-06-02 | 2020-09-01 | 无锡晨旸科技股份有限公司 | Grinding material for large-diameter silicon wafer and production method thereof |
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Application publication date: 20120801 |