CN102709280A - Chip on board (COB) integrated light source module - Google Patents

Chip on board (COB) integrated light source module Download PDF

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Publication number
CN102709280A
CN102709280A CN2012101765478A CN201210176547A CN102709280A CN 102709280 A CN102709280 A CN 102709280A CN 2012101765478 A CN2012101765478 A CN 2012101765478A CN 201210176547 A CN201210176547 A CN 201210176547A CN 102709280 A CN102709280 A CN 102709280A
Authority
CN
China
Prior art keywords
light source
source module
silica gel
integrated light
cob
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101765478A
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Chinese (zh)
Inventor
张日光
林胜
叶兵
张耀华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NINGBO SUNPU-OPTO SEMICONDUCTOR Co Ltd
Original Assignee
NINGBO SUNPU-OPTO SEMICONDUCTOR Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NINGBO SUNPU-OPTO SEMICONDUCTOR Co Ltd filed Critical NINGBO SUNPU-OPTO SEMICONDUCTOR Co Ltd
Priority to CN2012101765478A priority Critical patent/CN102709280A/en
Publication of CN102709280A publication Critical patent/CN102709280A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

The invention relates to a chip on board (COB) integrated light source module, which comprises a frame. A lead circuit is laid on the frame. Light-emitting diode (LED) wafers electrically connected with the lead circuit are arranged in the frame. The COB integrated light source module is characterized in that a transparent silica gel layer is uniformly coated on the frame; a silica gel sheet covers the transparent silica gel layer; and yellow fluorescent powder, red fluorescent powder and green fluorescent powder are printed on the silica gel sheet respectively. Compared with the prior art, the COB integrated light source module has the advantages that the phenomenon of mutual absorption between light emitted by the red fluorescent powder and light emitted by the green fluorescent powder is avoided, a display index is improved to be 90 without reduction in luminous flux, and the overall luminous efficiency of the product can reach 100lm/W.

Description

A kind of COB integrated light source module
Technical field
The present invention relates to a kind of COB integrated light source module.
Background technology
LED (Light Emitting Diode; Be called for short LED; Chinese light-emitting diode by name) lamp be called as the 4th generation lighting source or green light source; Have characteristics such as energy-saving and environmental protection, volume are little, reliability height, be widely used in fields such as various indications, demonstration, decoration, backlight, general lighting and urban landscape.Along with improving constantly of the integral level of LED wafer, the whole light efficiency of LED lamp constantly promotes, and makes the application of its lighting field constantly be able to enlarge.
At present, the LED illumination market is main with COB integrated optical source still, and the making of COB integrated optical source trend is that power is done high volume and done for a short time, and light efficiency refers to also need to improve relatively with showing simultaneously.But existing C OB integrated optical source refers in order to improve to show, and can adopt the silica gel 4 ' that is mixed with green emitting phosphor 3 ' and red fluorescence powder 2 ' to encapsulate usually; Referring to shown in Figure 4, the blue light that blue led 1 ' sends is excitated red fluorescent powder 2 ' and green emitting phosphor 3 ' respectively, sends ruddiness and green glow respectively; Blue light and ruddiness and green glow are mixed into white light; But the light absorption phenomenon can take place in green emitting phosphor and red fluorescence powder each other, can lose part light, and this can cause showing finger and improve light efficiency decline.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of high light efficiency the high COB integrated light source module that refers to that shows to above-mentioned prior art.
The present invention solves the problems of the technologies described above the technical scheme that is adopted: this COB integrated light source module; Comprise the framework that is equipped with lead wire circuit; The framework set inside has the LED wafer that is electrically connected with lead wire circuit, it is characterized in that: be coated with transparent substrate layer on the said framework uniformly, transparent substrate layer is coated with the silica gel sheet outward; Be printed with yellow fluorescent powder respectively on this silica gel sheet, red fluorescence powder and green emitting phosphor.
As improvement, evenly be provided with printing zone separate, that be used for process yellow fluorescent material, red fluorescence powder and green emitting phosphor on the said silica gel sheet.
Preferably, said silica gel sheet thickness is 0.25mm~0.35mm, is good with 0.3mm.
Compared with prior art, the invention has the advantages that: the phenomenon of absorption mutually can not appear in the light that red fluorescence powder sends with green emitting phosphor, can not reduce luminous flux when apparent finger brings up to 90, and product integral light usefulness reaches 100lm/W.
Description of drawings
Fig. 1 is the structural representation of COB integrated light source module in the embodiment of the invention;
Fig. 2 is the vertical view of silica gel sheet in the embodiment of the invention;
Fig. 3 is printed with the vertical view behind yellow fluorescent powder, red fluorescence powder and the green emitting phosphor for silica gel sheet in the embodiment of the invention;
Fig. 4 is the structural representation of COB integrated light source module in the prior art.
Embodiment
Embodiment describes in further detail the present invention below in conjunction with accompanying drawing.
COB integrated light source module shown in Fig. 1~3; It comprises the framework 1 that is equipped with lead wire circuit; Framework 1 set inside has the LED wafer 2 that is electrically connected with lead wire circuit, is coated with transparent silicon glue-line 3 on the framework 1 uniformly, the transparent silicon glue-line 3 outer silica gel sheets 4 that are coated with; Be printed with yellow fluorescent powder c respectively on this silica gel sheet 4, red fluorescence powder a and green emitting phosphor b; In the present embodiment, evenly be provided with printing zone 41 separate, that be used for process yellow fluorescent material, red fluorescence powder and green emitting phosphor on the silica gel sheet 4, these printings are used for process yellow fluorescent material c, red fluorescence powder a and green emitting phosphor b; Silica gel sheet thickness is 0.3mm; The colour temperature of product can be adjusted according to total number to be printed of three kinds of different colours fluorescent material; And total number to be printed of three kinds of different colours fluorescent material is to obtain with printing area according to the print pass of respective color fluorescent material is surplus, and its adjustment mode has multiple: for example need do the product of colour temperature 3000K, wherein a kind of adjustment mode preferably is: adjust printing apparatus earlier; The ratio of the printing zone that three kinds of different colours fluorescent material is shared is confirmed as 1:1:1; The distributing position of three kinds of different colours fluorescent material on silica gel sheet 4 can be unrestricted, can arbitrarily adjust printing apparatus, is used for adjusting three kinds of ratios that fluorescent powder printed area is shared; As long as the ratio of the printing zone that final three kinds of different colours fluorescent material are shared is 1:1:1; Carry out the first impression then, after the first impression finishes, higher to some extent as finding colour temperature; Only increase the red fluorescence powder print pass during second impression, till colour temperature meets the requirements; After LED wafer 2 adopts the blue-ray LED wafers, blue-light excited this silica gel sheet, apparent finger can reach 90, and improving about 20% of mixing of the redder green powder of light efficiency, can reach 100lm/W.

Claims (4)

1. COB integrated light source module; Comprise the framework that is equipped with lead wire circuit; The framework set inside has the LED wafer that is electrically connected with lead wire circuit, it is characterized in that: be coated with transparent substrate layer on the said framework uniformly, transparent substrate layer is coated with the silica gel sheet outward; Be printed with yellow fluorescent powder respectively on this silica gel sheet, red fluorescence powder and green emitting phosphor.
2. COB integrated light source module according to claim 1 is characterized in that: evenly be provided with printing zone separate, that be used for process yellow fluorescent material, red fluorescence powder and green emitting phosphor on the said silica gel sheet.
3. COB integrated light source module according to claim 1 and 2 is characterized in that: said silica gel sheet thickness is 0.25mm~0.35mm.
4. COB integrated light source module according to claim 1; It is characterized in that: the colour temperature of COB integrated light source module is adjusted according to total number to be printed of three kinds of different colours fluorescent material, and total number to be printed of three kinds of different colours fluorescent material is then to obtain with printing area according to the print pass of respective color fluorescent material is surplus.
CN2012101765478A 2012-05-29 2012-05-29 Chip on board (COB) integrated light source module Pending CN102709280A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101765478A CN102709280A (en) 2012-05-29 2012-05-29 Chip on board (COB) integrated light source module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101765478A CN102709280A (en) 2012-05-29 2012-05-29 Chip on board (COB) integrated light source module

Publications (1)

Publication Number Publication Date
CN102709280A true CN102709280A (en) 2012-10-03

Family

ID=46901935

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101765478A Pending CN102709280A (en) 2012-05-29 2012-05-29 Chip on board (COB) integrated light source module

Country Status (1)

Country Link
CN (1) CN102709280A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103489991A (en) * 2013-09-27 2014-01-01 五邑大学 Partitioned COB LED fluorescent film with high color rendering
CN103972222A (en) * 2014-06-03 2014-08-06 宁波升谱光电半导体有限公司 LED (light-emitting diode) light source packaging method, LED light source packaging structure and light source module
CN103972221A (en) * 2014-06-03 2014-08-06 宁波升谱光电半导体有限公司 LED (light-emitting diode) light source packaging structure and method
CN109524392A (en) * 2018-12-07 2019-03-26 厦门大学 A kind of LED matrix of near ultraviolet excited white light

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1364318A (en) * 2000-03-14 2002-08-14 拉米尔德斯照明设备有限公司 Light-emitting diode, lighting device and method of manufacturing same
TW200603434A (en) * 2004-02-23 2006-01-16 Lumileds Lighting Llc Wavelength converted semiconductor light emitting devices
US20090272998A1 (en) * 2006-05-23 2009-11-05 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip comprising a wavelength conversion substance, and optoelectronic semiconductor component comprising such a semiconductor chip, and method for producing the optoelectronic semiconductor chip
CN201956394U (en) * 2011-01-19 2011-08-31 宁波升谱光电半导体有限公司 LED (Light-Emitting Diode) lighting module
WO2012042452A2 (en) * 2010-09-29 2012-04-05 Koninklijke Philips Electronics N.V. Wavelength converted light emitting device
CN202678308U (en) * 2012-05-29 2013-01-16 宁波升谱光电半导体有限公司 COB integrated optical source module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1364318A (en) * 2000-03-14 2002-08-14 拉米尔德斯照明设备有限公司 Light-emitting diode, lighting device and method of manufacturing same
TW200603434A (en) * 2004-02-23 2006-01-16 Lumileds Lighting Llc Wavelength converted semiconductor light emitting devices
US20090272998A1 (en) * 2006-05-23 2009-11-05 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip comprising a wavelength conversion substance, and optoelectronic semiconductor component comprising such a semiconductor chip, and method for producing the optoelectronic semiconductor chip
WO2012042452A2 (en) * 2010-09-29 2012-04-05 Koninklijke Philips Electronics N.V. Wavelength converted light emitting device
CN201956394U (en) * 2011-01-19 2011-08-31 宁波升谱光电半导体有限公司 LED (Light-Emitting Diode) lighting module
CN202678308U (en) * 2012-05-29 2013-01-16 宁波升谱光电半导体有限公司 COB integrated optical source module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103489991A (en) * 2013-09-27 2014-01-01 五邑大学 Partitioned COB LED fluorescent film with high color rendering
CN103489991B (en) * 2013-09-27 2016-03-23 江门朗天照明有限公司 A kind of high colour developing, subregional COB packaged LED fluorescent film
CN103972222A (en) * 2014-06-03 2014-08-06 宁波升谱光电半导体有限公司 LED (light-emitting diode) light source packaging method, LED light source packaging structure and light source module
CN103972221A (en) * 2014-06-03 2014-08-06 宁波升谱光电半导体有限公司 LED (light-emitting diode) light source packaging structure and method
US9379292B2 (en) 2014-06-03 2016-06-28 Ningbo Sunpu Led Co., Ltd. LED light source packaging method, LED light source package structure and light source module
CN109524392A (en) * 2018-12-07 2019-03-26 厦门大学 A kind of LED matrix of near ultraviolet excited white light

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Application publication date: 20121003