CN102738033B - Semiconductor processing apparatus provided with modified column structure - Google Patents
Semiconductor processing apparatus provided with modified column structure Download PDFInfo
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- CN102738033B CN102738033B CN201110094306.4A CN201110094306A CN102738033B CN 102738033 B CN102738033 B CN 102738033B CN 201110094306 A CN201110094306 A CN 201110094306A CN 102738033 B CN102738033 B CN 102738033B
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Abstract
The invention discloses a semiconductor processing apparatus provided with a modified column structure. The semiconductor processing apparatus comprises a micro chamber which is used for closely accommodating and processing a semiconductor wafer, wherein the micro chamber includes an upper chamber portion which forms an upper working surface and/or an upper peripheral part and a lower chamber portion which forms a lower working surface and/or a lower peripheral part. Edges of the upper chamber portion and the lower chamber portion are provided with corresponding column holes. The upper chamber portion and/or the lower chamber portion can move between an open position and a closed position under the guidance of a column device penetrating the column holes, wherein the open position is used for loading and/or removing the semiconductor wafer and the closed position is used for closely accommodating the semiconductor wafer. The column device comprises a column and a sleeve which is arranged on the outer surface of the column in a sleeve manner, wherein the column is made of metal or alloy, and the sleeve is made of a high temperature resistant and corrosion resistant material.
Description
[technical field]
The present invention relates to the field of surface treatment of semiconductor crystal wafer or similar workpiece, particularly a kind of for chemical treatment semiconductor wafer surface, and the device of clean, etching and other processing.
[background technology]
Wafer is the carrier of producing used in integrated circuits.In actual production, need the wafer of preparation to there is smooth, super clean surface, and can be divided into two kinds for the preparation of the existing method of super clean wafer surface: such as the wet treatment process of submergence and spraying technique, and such as the dry process process based on chemical gaseous phase and plasma technology.Wherein wet treatment process is that prior art adopts method comparatively widely, and wet treatment process generally includes a succession of step composition that adopts suitable chemical solution submergence or spray wafer.
In prior art, comprise a kind of device that adopts wet treatment process wafer to be surpassed to clean.In this device, be formed with a micro chamber that can closely receive and process semiconductor crystal wafer, this micro chamber can be in open mode for loading and removing semiconductor crystal wafer, also can the processing for semiconductor crystal wafer in closed condition, wherein in processing procedure, chemicals and other fluids can be introduced to described micro chamber.Described open mode and closed condition by two drive units that comprise in this device drive respectively form described micro chamber upper and lower two working faces relatively move realize.
But find in actual use, also there is following shortcoming in said apparatus: first, the structure that drives respectively upper and lower two working faces that form described micro chamber by two drive units in described device is comparatively complicated, if adopt a drive unit to drive the upper working face of described micro chamber or lower working face also can reach effect same; The second, for the semiconductor crystal wafer of different size, when processing, need to change the micro chamber assembly of corresponding different size, while changing this micro chamber assembly, entire machine need to be taken apart, very inconvenient; The 3rd, in the time that micro chamber is poorly sealed or the pipeline generation chemicals of circulation chemicals reveals, leakage collection mechanism relevant in described device is perfect not; The 4th, when relatively moving, described upper and lower two working faces rely on some metal upright posts that run through described upper and lower two working surfaces to complete, and the high temperature that described column is easily produced in chemical treating process and/or corrosive gas corrode and damage.
Therefore be necessary to provide a kind of new solution to solve the problems referred to above.
[summary of the invention]
The object of the present invention is to provide a kind of semiconductor processing device that improves pillar construction that comprises, described semiconductor processing device has replaceable, corrosion-resistant and resistant to elevated temperatures pillar construction.
According to object of the present invention, the invention provides a kind of semiconductor processing device that improves pillar construction that comprises, utilize processing fluid to process semiconductor crystal wafer and similar workpiece, described semiconductor processing device comprises that one for closely holding and process the micro chamber of semiconductor crystal wafer, described micro chamber comprises the lower chambers portion that forms the portion of upper chamber of upper working surface and/or upper periphery part and form lower working surface and/or following peripheral part, the edge of portion of described upper chamber and lower chambers portion comprises corresponding hole, post position, portion of described upper chamber and/or described lower chambers portion can move for closely holding between the off-position of this semiconductor crystal wafer for the open position and that loads and/or remove this semiconductor crystal wafer along running through under the guiding of stand column device in hole, described post position one,
When portion of upper chamber or described lower chambers portion are time in the closed position, semiconductor crystal wafer is installed between described upper working surface and lower working surface, and be formed with for processing the mobile space of fluid with the inwall of described micro chamber, portion of described upper chamber and/or described lower chambers portion comprise that at least one enters entrance of described micro chamber and at least one for the outlet of processing micro chamber described in fluid expulsion for processing fluid
Wherein said stand column device comprises column and is socketed in the sleeve of described column outer surface.
Further, described column comprises that some sections of diameters become large cylindrical column successively, and described some sections of cylindrical column are end to end and be positioned on same central axis.
Further, the inner surface of described sleeve fits tightly in the outer surface of the column type cylinder of described diameter maximum.
Further, described cylindrical column does not include screw thread with one end that larger another cylindrical column of diameter is joined, and utilizes the nut of the described screw thread of coupling the assembly that comprises hole, post position can be held between another cylindrical column that described nut and diameter are larger.
Further, the cylindrical column of described diameter maximum does not also comprise a bulge with one end that less another cylindrical column of diameter is joined, described bulge also comprises the screwed hole being positioned on axis, described cylinder place, utilizes the screw of the described screwed hole of coupling the assembly that comprises aperture can be held between described screw and described bulge.
Further, described column adopts metal or alloy manufacture, material manufacture high temperature resistant, corrosion resistance that described sleeve adopts.
Further, described semiconductor processing device also comprises a smooth means for correcting, and described smooth means for correcting provides perpendicular to working surface and points to the pressure of micro chamber inside in the chamber portion that cannot move.
Further, the described chamber portion that cannot move comprises a working surface and the stress surface parallel with working surface, between described working surface and stress surface, include rigid material, described smooth means for correcting comprises the correcting plate fitting tightly with the stress surface of irremovable chamber, is formed with the pressure apparatus that the one side that can fastening correcting plate makes correcting plate and described stress surface fit tightly in the part of correcting plate.
Further, described pressure apparatus is included in the screw device that can fastening correcting plate correcting plate and described stress surface is fitted tightly that the quadrangle of described correcting plate becomes.
Further, described smooth means for correcting also comprise parallel with respect to described correcting plate and with the top board of described correcting plate partial fixing, be formed with the threaded perforations of some diverse locations in the on-fixed region of described top board, can screw in described threaded perforations and provide pressure in the another side of described correcting plate corresponding to the screw of described threaded perforations, the direction of described pressure is different and different with length with the position that size screws according to described screw.
Compared with prior art, the stand column device that the present invention adopts is divided into column and sleeve two parts, and described column has multistage stair-stepping cylindrical column, very convenient in the fixing and engaging of other assemblies; Described sleeve selects suitable material can realize high temperature resistant and corrosion resistant characteristic, and described sleeve be worn or corrode after be easy to change.
[brief description of the drawings]
In conjunction with reference to accompanying drawing and ensuing detailed description, the present invention will be easier to understand, wherein structure member corresponding to same Reference numeral, wherein:
Fig. 1 is semiconductor processing device in the present invention schematic perspective view in one embodiment;
Fig. 2 is semiconductor processing device in the present invention front schematic view in one embodiment;
Fig. 3 is base plate in the present invention schematic top plan view in one embodiment;
Fig. 4 is the first intermediate plate in the present invention schematic perspective view in one embodiment;
Fig. 5 is the second intermediate plate in the present invention reverse side schematic perspective view in one embodiment;
Fig. 6 is upper plate in the present invention schematic top plan view in one embodiment;
Fig. 7 is lower box device in the present invention schematic perspective view in one embodiment;
Fig. 8 be lower chambers plate in the present invention in one embodiment with the assembling schematic diagram of described lower box device;
Fig. 9 is plug-in unit in the present invention reverse side schematic perspective view in one embodiment;
Figure 10 is top box device in the present invention schematic perspective view in one embodiment;
Figure 11 is top box device in the present invention schematic top plan view in one embodiment; Figure 12 is dividing plate in the present invention schematic top plan view in one embodiment;
Figure 13 is column in the present invention front elevational schematic in one embodiment;
Figure 14 is sleeve in the present invention generalized section in one embodiment;
Figure 15 is correcting plate in the present invention elevational schematic view in one embodiment;
Figure 16 is top board in the present invention schematic perspective view in one embodiment; With
Figure 17 adopts smooth correction module to carry out the work schematic diagram of smooth timing in the present invention.
[embodiment]
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Please refer to Fig. 1 and Fig. 2, it shows respectively semiconductor processing device in the present invention schematic perspective view and the front schematic view in an embodiment 100.Simply, described semiconductor processing device 100 comprises smooth correction module 110, micro chamber module 120, driver module 130 and stand column device 140.Each assembly in described first three module is fixed, is supported or guided by four stand column device 140 parallel to each other, and is respectively from lower to upper driver module 130, micro chamber module 120 and smooth correction module 110 along described stand column device 140.Wherein micro chamber module 120 comprises the micro chamber of a processing semiconductor crystal wafer, described micro chamber includes upper chamber's plate 122 and lower chambers plate 126 forms, described upper chamber plate 122 is supported by top box device 124, and is fixed in described top box device 124 by the smooth correction module 110 of the side of being located thereon; Correspondingly, described lower chambers plate 126 is supported by lower box device 128, and lower box device 128 is supported and driven by the driver module 130 that is positioned at its below again.
Described driver module 130 can drive described lower box device 128 guide and move with respect to described top box device 124 according to described stand column device 140, need to load and remove semiconductor die bowlder with box lunch and can open or close top box device 124 and lower box device 128, also can open or close the micro chamber that upper chamber's plate 122 and lower chambers plate 126 form.In the time closing described micro chamber, chemical reagent and other fluids can be introduced to described micro chamber inside and carry out chemical analysis, clean, etching and other processing for the semiconductor crystal wafer in it, and after being disposed, described chemical reagent and other fluids are drawn to described micro chamber.
The present invention for convenience of description, first described driver module 130 is described, described driver module 130 comprises base plate 132 from bottom to top successively, be positioned at base plate top the first intermediate plate 134, be positioned at the second intermediate plate 136 of the first intermediate plate 134 tops and be positioned at the upper plate 138 of the second intermediate plate 136 tops.In the cavity being formed by described base plate 132, the first intermediate plate 134, the second intermediate plate 136 and upper plate 138, also comprise a driver (not shown).In the time that described driver produces actuating force upwards, described the second intermediate plate 136 and upper plate 138 can drive the lower box device 128 and the lower chambers plate 126 that are positioned at described upper plate 138 tops to move up along the guiding of described stand column device 140, and make described micro chamber complete the conversion from open mode to closed condition.
Fig. 3 is the schematic top plan view of described base plate 132 in an embodiment 300.The shape of described base plate 300 is square, and draw together the hole, four post positions 302 corresponding to described stand column device 140 at the tetra-pack of described base plate 300, and tighten together by the first screw 151 (seeing Fig. 2) that is positioned at described base plate 300 belows being connected with described stand column device 140 and the bottom that is positioned at the described four root post devices 140 of described base plate 300 tops.Obviously, described base plate 300 and other plates plane of living in are all vertical with place, the axis straight line of described stand column device 140.Described base plate 300 one side downward also includes the fin 304 being positioned on described base plate 300 diagonal.The cross section of described fin 304 is rectangular, and described fin 304 provides high-intensity support for described base plate.The close middle body of described base plate 300 also comprises circular perforations 306 and two threaded perforations 308, and described circular perforations 306 is for providing other equipment, pipeline or device; Described two threaded perforations 308 can be used for the below in conjunction with the fixing described driver of the parts such as screw.On the other hand, four limits of described base plate 300 are also formed with respectively the breach 309 of three rectangles arranged side by side.
Fig. 4 is the schematic perspective view of described the first intermediate plate 134 in an embodiment 400.The shape of described the first intermediate plate 400 is also square, and in four jiaos of holes, four post positions 402 that comprise equally corresponding to described stand column device 140 of described the first intermediate plate 400, and tighten together by the first screw 151 (seeing Fig. 1) that is positioned at described base plate 300 belows being connected with described stand column device 140 and the bottom that is positioned at the described four root post devices 140 of described the first intermediate plate 400 tops together with described base plate 300.One side upwards of described the first intermediate plate 400, extend and be formed with the first circular barrel 404 that volume is slightly larger than driver size to hold described driver with the direction perpendicular to described the first intermediate plate 400 place planes.Described the first intermediate plate 400 is also comprising circular perforations 406 and two threaded perforations 408 corresponding to described base plate 300 near middle body, and described circular perforations 406 is for providing other equipment, pipeline or device; Described two threaded perforations 408 can be used for the below in conjunction with the fixing described driver of the parts such as screw.Four limits of described the first intermediate plate 400 are also formed with respectively the perforation 409 of three rectangles arranged side by side.
Fig. 5 is the reverse side schematic perspective view of described the second intermediate plate 136 in an embodiment 500.Described the second intermediate plate 500 has almost symmetry in the structure of described the first intermediate plate 400.The tetra-pack of described the second intermediate plate 500 is drawn together the hole, four post positions 502 corresponding to described stand column device 140, and this plate can be along the guiding of described stand column device 140 and upwards or move down.The downward one side of described the second intermediate plate 500 (also i.e. one side upwards in diagram), extend and be formed with the second circular barrel 504 that volume is slightly larger than driver size to hold described driver with the direction perpendicular to described the second intermediate plate 500 place planes.The diameter of described the second barrel 504 should be slightly larger than or be slightly less than the diameter of the first barrel 404 of described the first intermediate plate 400, when the second intermediate plate 500 is moved to the first intermediate plate 400 described in the second barrel 504 can comprise or be embedded in described the first barrel 404.Described the second intermediate plate 500 is also comprising two threaded perforations 508 near middle body, and described two threaded perforations 508 can be used for the top in conjunction with the fixing described driver of the parts such as screw.Four limits of described second intermediate plate 500 of described the second intermediate plate 500 are also formed with respectively the perforation 509 of three rectangles arranged side by side.
Fig. 6 is described upper plate 138 600 schematic top plan view in one embodiment.The shape of described upper plate 600 is square corresponding to base plate 300, and the tetra-pack of described upper plate 600 is drawn together the hole, four post positions 602 corresponding to described stand column device 140, and described upper plate 600 can be along the guiding of described stand column device 140 and upwards or move down.The central authorities of described upper plate 600 also include two perforation 608 arranged side by side.Described perforation 608 can be in conjunction with the top of the fixing described driver of the parts such as screw.Four limits of described upper plate 600 are also formed with respectively the breach 609 of three rectangles arranged side by side.
In sum, the columniform cavity that described base plate 132, the first intermediate plate 134, the second intermediate plate 136 and upper plate 138 form, its inner space can accommodate driver, described driver is product comparatively ripe in prior art, such as air impeller, similarly, also can adopt other drivers such as Mechanical Driven, motorized motions or hydraulic-driven principle.But should recognize, in the time that described driver produces actuating force upwards, described the second intermediate plate 136 and upper plate 138 can be driven by the actuating force of described driver and move up; In the time that described driver produces downward actuating force, described the second intermediate plate 136 and upper plate 138 can be driven and move down by the actuating force of described driver and self gravitation.
Easily full of beard and, in another embodiment, described base plate 132 and the first intermediate plate 134 can one-body molded making become a bottom plate; Described the second intermediate plate 136 and upper plate 138 can become a top plate in conjunction with making.That is to say, described drive unit 130 is also not limited to the embodiment describing in above-described embodiment, all can as long as can reach the execution mode of same or more excellent effect.
The micro chamber module 120 going out as shown in Figures 1 and 2 is then described.Lower chambers plate 126, dividing plate 125, the top box device 124 of dividing plate 125 tops and the upper chamber's plate 122 being supported by top box device 124 that described micro chamber module 120 comprises successively from bottom to top lower box device 128, supported by lower box device 128.Described lower box device 128 and the lower chambers plate 126 that supported by lower box device 128 can be under the driving of described driver module 130 along the guiding of described stand column device 140 and upwards or move down.The top box device 124 of described dividing plate 125, dividing plate 125 tops and the common transfixion of upper chamber's plate 122 being supported by top box device 124, carry out the summary inching about planarization by described smooth correction module 110 only, and relevant this details below will describe in detail.When described lower box device 128 and the lower chambers plate 126 that supported by lower box device 128 under the driving of described driver module 130 along the guiding of described stand column device 140 and move up and with described upper chamber plate 122 and top box device 124 closures after, will form micro chamber.
Fig. 7 is described lower box device 124 700 schematic perspective view in one embodiment.It is that foursquare uncovered is box-like that the shape of described lower box device 700 is bottom surface substantially.Draw together the hole, four post positions 702 corresponding to described stand column device 140 at the tetra-pack of described lower box device 700.The bottom surface of described lower box device 700 is thicker, and it is identical with inclination mode, side by side and the identical slope 704 of width to include three angles of inclination with respect to the one side of top box device 124, comprises that the bottom surface of slope is designed for chemical agent or other fluids of the lower chambers plate water clock of collecting the side of being located thereon herein.By above-mentioned slope, at the bottom of chemicals or other fluids finally can flow to the slope of described slope 704.Now coordinate again the device that is communicated with at the bottom of the slope of described slope diversion groove, hole, pipeline or receiver of 704 and so on can collect this fluid.
Will be appreciated that at the bottom of the slope of described odd number slope simultaneously 704 towards box wall disappearance non-existent, and the inwall position that other three box walls 706 contact with described bottom surface is recessed to form a groove 707 to horizontal direction.Described lower chambers plate 128 can, via the box wall position of disappearance, enter described lower box device 700 and by described bottom supporting along groove 707 horizontal slips on other box walls 706.In like manner, in the time that described lower chambers plate 128 is positioned at lower box device 700, also can slide along described groove 707, from disappearance box wall position slide out described box device 700.Four limits of described lower box device 700 are also formed with respectively the breach 708 of rectangle.
Please refer to Fig. 8, its show described lower chambers plate 128 in an embodiment 800 with the assembling schematic diagram of described lower box device 700.Although described lower chambers plate 800 is generally one-body molded.The size of described bottom 820 and edge thickness correspond respectively to distance between the box wall 706 of described lower box device 700 and the width of groove 707.So that described lower chambers plate 800 can slide along the groove 707 on the box wall 706 of described lower box device 700.The lower working face that the upper surface 842 on described top 840 is described micro chamber.
Will be appreciated that, described lower chambers plate 800 adopts pullable mode to slip into or shift out, and can load easily and remove.Because the size of semiconductor crystal wafer is divided into the equal-specifications such as 4 inches, 5 inches, 6 inches, 8 inches, add man-hour requirement according to the lower chambers plate of the wafer replacement coupling of different size.Simultaneously, in the time that described lower chambers plate 800 slips into described lower box device 700, can also use a plug-in unit 160 (as shown in fig. 1) to be sticked in described lower box device, figure 9 illustrates the reverse side schematic perspective view of described plug-in unit 160 in an embodiment 900.The both sides of described plug-in unit 900 comprise the fin corresponding with the groove 707 of described lower box device 700 902, and including above corresponding to the projection 904 of described even number slope and the depression 906 of odd number slope during the bottom of described plug-in unit 900 also illustrates constructed with the bottom surface of the described lower box device 700 of correspondence.Apparently, by the fixation of described plug-in unit 900, described lower chambers plate 800 can be fixed in described lower box device 700.
Described upper chamber plate 122 includes the structure that is symmetrical in substantially described lower chambers plate 800 substantially.Described upper chamber plate 122 comprises and is foursquare top and is discoidal bottom, and those skilled in the art is highly susceptible to thinking by Fig. 8 and to the structure of described upper chamber plate 122, therefore omit the relevant schematic diagram of described upper chamber plate 122 herein.Obviously, the diameter of the length of side on the foursquare top of described upper chamber plate 122 and described disc bottom can be identical or close with described lower chambers plate 800, and the lower surface of the described bottom upper working face that is described micro chamber.Will be appreciated that, in the time that the upper working face of the lower working face of described lower chambers plate 800 and described upper chamber plate is closed or be close to, wherein can form a cavity for holding semiconductor wafer.
Figure 10 and Figure 11 show respectively schematic perspective view and the upward view of described top box device 124 in an embodiment 1000.It is that foursquare uncovered is box-packed that the shape of described top box device 1000 is substantially bottom.Four jiaos of described top box device 1000 have respectively the circular cavity 1040 that includes the bottom that is slightly larger than described upper chamber plate corresponding to the middle body of bottom described in the hole, post position 1020 of described stand column device 140, and described circular cavity 1040 includes the circumference fin 1042 that extends described bottom downwards.And the box-like space matching by the top with described upper chamber plate 122 that comprises three box walls 1060, the structure of described upper chamber plate 122 can be closely held in formation.By this structure, described upper chamber plate 122 can be by the stable support of described top box device 1000.
Figure 12 shows the schematic top plan view of described dividing plate 125 in an embodiment 1200.The shape of described dividing plate 1200 is square, and draws together the hole, four post positions 1220 corresponding to described stand column device 140 at the tetra-pack of described dividing plate 1200.The middle body of described dividing plate 1200 includes the circumferential notch 1240 of the circumference fin 1042 that can closely receive top box device 1000.The Main Function of described dividing plate 1200 is the square thereon top box devices 1000 of support level and is contained in the upper chamber's plate 122 in described top box device 1000.Four limits of described dividing plate 1200 are also formed with respectively the breach 1260 of rectangle, and described breach 1260 can and be installed other elements such as valve, flow governor, sensor for containing pipe line.In one embodiment, described dividing plate 1200 can adopt stainless steel material to make.
In order to further describe the position relationship of above-mentioned each plate and described stand column device 140.Please first with reference to Figure 13 and Figure 14, it shows respectively the column that comprises in stand column device 140 and corresponding sleeve front elevational schematic and the generalized section in an embodiment 1300.Described column 1320 comprises that thinner thicker columniform the second middle part 1325 and the cross section of columniform the first middle part 1323, diameter of columniform top 1321, diameter that diameter is the thinnest is hexagonal bottom 1327, and the top outer surface on described top 1321 also comprises the first screw thread (not shown) of predetermined length.One end outer surface that described the first middle part 1323 is close to described top 1321 also comprises the second screw thread (not shown) of predetermined length, one end outer surface that described the second middle part 1325 is close to described hexagonal bottom 1327 also comprises the 3rd screw thread (not shown) of predetermined length, and the bottom 1327 of described column 1420 screwed hole 1329 that also extended internally along the axis of described column 1320.The internal diameter r of described sleeve 1340 is slightly larger than or equals the diameter at the second middle part 1325 of described column 1320, and the length of described sleeve 1340 is identical with the length at described the second middle part 1325.In the time that being enclosed within on described column 1320, described sleeve 1340 is also assembled into stand column device 140, now please also refer to Fig. 1 and Fig. 2.When after described sleeve 1340 and column 1320 assemblings, internal diameter or the beeline in the cross section of described stand column device 140 diminish from down to up successively, are also the external diameter on the external diameter > top 1321 at external diameter > first middle part 1323 at internal diameter r > second middle part 1325 of the external diameter R > sleeve 1340 of the beeline > sleeve 1340 in the cross section of described bottom 1327.In one embodiment, described the first intermediate plate 134 and base plate 132 can also be arranged on column bottom 1327, hole, the post position internal diameter of the first intermediate plate 134 and base plate 132 is slightly larger than the external diameter at the second middle part 1325 of described column 1320, coordinates corresponding to the 3rd nut of described the 3rd screw thread and described the first intermediate plate 134 and base plate can be fixed between the 3rd nut and column bottom 1327.Described the second intermediate plate 136, hole, the post position internal diameter of upper plate 138 and lower box device 128 is slightly larger than the external diameter of described sleeve 1340, also be described the second intermediate plate 136, the hole, post position of upper plate 138 and lower box device 128 can hold described sleeve 1340 and be positioned at the second middle part 1325 of sleeve 1340 inside, and the height of described lower box device 128 can not exceed the upper edge of described the second middle part 1325 or described sleeve 1340, now described the second intermediate plate 136, upper plate 138 and lower box device 128 can be under the driving of driver move up and down along described sleeve 1340 and 1325, the second middle part being positioned at sleeve 1340 inside.More than described dividing plate 125 and top box device 124 are positioned at the top edge of described the second middle part 1325 or described sleeve 1340, and hole, the post position internal diameter of described dividing plate 125 and top box device 124 is slightly larger than the diameter at described the first middle part 1323 but is not more than the external diameter at described the second middle part 1325.Also the lower surface that is described dividing plate 125 can or not move down by the top edge of described the second middle part 1325 and described sleeve 1340 supports.On the other hand, described smooth correction module 110 comprises the correcting plate 114 that is positioned at upper chamber's plate 122 tops and the top board 112 that is positioned at correcting plate 114 tops.Four jiaos of holes, post position that also include corresponding to described stand column device 140 of described correcting plate 114, the internal diameter in hole, described post position is slightly larger than the diameter at described the first middle part 1323, also be top box device 124 tops because described correcting plate 114 is positioned at described upper chamber plate 122 tops, can be by between fastening to correcting plate 114, top box device 124, dividing plate 125 and described the second nut 154 and the top edge of described the second middle part 1325 and described sleeve 1340 corresponding to the second nut 154 of described the second screw thread so coordinate.And the internal diameter in the hole, post position that the tetra-pack of top board 112 contains is slightly larger than the diameter on described column top 1321 and be less than the diameter at described the first middle part 1323, described top board 112 can be anchored on to (nut 153 and nut 154 are shown in Figure 17) between described the first nut 153 and the top edge at described the first middle part 1323 therefore coordinate corresponding to the first nut 153 of described the first screw thread.Especially, described column 1320 can adopt metal or alloy cutting or casting to make, and described sleeve 1340 adopts corrosion-resistant, the exotic material such as plastics to make.
In order to further describe described smooth means for correcting 110, please refer to Figure 15, Figure 16 and Figure 17.Figure 15 shows correcting plate 114 in the present invention elevational schematic view in an embodiment 1500.As previously mentioned, the tetra-pack of described correcting plate 1500 is slightly larger than the hole, post position 1520 of the diameter at described column the second middle part 1325 containing internal diameter.Described correcting plate 1500 one side is downward smooth one side (also illustrating face), described correcting plate 1500 one side upward also includes the fin 1540 being positioned on described correcting plate 1500 diagonal, and the cross section of described fin 1540 is rectangular.Described correcting plate 1500 one side downward fits tightly in the upper surface of described upper chamber plate 122, and described correcting plate 1500 upward four jiaos is fastening and produce downward pressure by 154, the second nut corresponding to the second screw thread, forces described upper chamber plate 122 to be closely contained in described top box device 124.On the other hand, four middle parts, limit of described correcting plate 1500 all include elongated strip shaped perforation 1560, can and other elements be installed for containing pipe line.
Figure 16 shows top board 112 1600 the schematic perspective view in one embodiment in the present invention.The tetra-pack of described top board 1600 is slightly larger than the diameter on described column top 1321 containing internal diameter and is less than the hole, post position 1620 of the diameter at described the first middle part 1323, utilizes and described top board 1600 can be anchored between the top edge at the first middle part 1323 of described the first nut 153 and described column corresponding to the first nut 153 of the first screw thread.On the diagonal of described top board 1600 and opposite side mid point line, also include the screwed hole 1640 of some same inner diameter.Screwed hole 1640 on described diagonal is positioned at the fin 1540 on diagonal equally corresponding to described correcting plate 1500.Known in conjunction with Figure 17, screw in after described top board 1600 corresponding to the second screw 152 of described screwed hole 1540 when adopting, can produce pressure to the part of the correcting plate 1500 that is positioned at below.Second screw 152 that also can screw in position and screw-in length by difference can produce different pressure to the diverse location of described correcting plate 1500, the pressure that can make the below of described correcting plate 1500 produce through certain measurement means is not only contained in top box device 124 fastening described upper chamber plate 122, and make the lower working face of described upper chamber plate 122 there is suitable shape, that is to say, pressure that space between the lower working face of described upper chamber plate 122 and pending semiconductor crystal wafer is provided by described correcting plate 1500 regulates and meets the requirement for the treatment of process.On the other hand, four middle parts, limit of described top board 1600 all include elongated strip shaped perforation 1660, can and other elements be installed for containing pipe line.
In sum, described smooth means for correcting 110 can make the lower surface of described upper chamber plate 122 in comparatively suitable stationary state, and described drive unit 130 can make the upper surface of described lower chambers plate 126 decline or rise and make the micro chamber of the lower surface of described upper chamber plate 122 and the formation of the upper surface of described lower chambers plate 126 in opening or closed condition.Certainly, in order to obtain comparatively tight micro chamber, the lower surface of described upper chamber plate 122 and the upper surface of described lower chambers plate 126 can have corresponding laminating or coupled structure, and the joint place of described upper chamber plate 122, top box device 124, lower chambers plate 126 and lower box device 128 can also adopt elements such as the sealing O ring of rubber quality.Simultaneously in order to make chemicals or other fluids can inlet and outlet micro chamber, described upper chamber plate 122 and lower chambers plate 126 also should have the structure of the microtubule of hollow and guiding gutter and so on.For example need to make semiconductor crystal wafer in the time that described micro chamber is inner, the inwall of semiconductor crystal wafer and described micro chamber is formed with can be for the space of chemicals circulation, and the preset width in this space is conventionally between 0.01mm and 10mm.Such as the above-mentioned part that these are not described in detail herein, the content being well known to the skilled person, is not repeated at this.
In a specific embodiment, when adopting the semiconductor processing device 100 in the present invention to process semiconductor die bowlder, processing procedure probably can be divided into following several process: chamber panel Renewal process, smooth calibration process, chemical treating process.
At chamber panel Renewal process, can change according to semiconductor die size to be processed the chamber panel of coupling.First driver is produced to downward actuating force and lower box device 128 and lower chambers plate 126 are declined, then open or extract plug-in unit 160, more original lower chambers plate 126 is taken out along slip in the navigation groove of described lower box device 128.Suitable described lower chambers plate 126, along sliding and pack in the navigation groove of described lower box device 128, is installed to described plug-in unit 160 so that described lower chambers plate 126 is fixed in described lower box device 128.
At described smooth calibration phase, can proofread and correct the planarization of described upper chamber plate 122.First by regulating the second nut 154 of four jiaos of described correcting plate 114 tops to give four jiaos of suitable pressure of described correcting plate 114, can tentatively regulate the planarization of described upper chamber plate 122.The micro chamber that recycles existing level measurement device or observe closure state, according to measurement result or observed result, coordinate multiple the second installations of screw 152 on top board 112, can accurately adjust the pressure distribution on described correcting plate 122, thereby make described upper chamber plate 122 in comparatively meeting the state of technological requirement.Certainly, in certain embodiments, also may need to regulate the state of described upper chamber plate 122 in certain inclination angle, to facilitate, semiconductor crystal wafer be done to corresponding processing, now regulate the mode of described upper chamber plate 122 from foregoing description, to associate easily.
At chemical treating process, first utilize described drive unit 130 by described micro chamber closure, again the microtubule by the hollow in described upper chamber plate 122 by chemicals or other fluids introduce described micro chamber with the wafer to inner carry out such as analyzing, processing etching, then by inner pressure, such as the delivery of gas or gravity orders about described chemicals or other fluids are discharged via the structure within microtubule or the guiding gutter of the hollow in described lower chambers plate 126.This partial content is content well-known to those skilled in the art.Especially; because upper chamber's plate 122 and lower chambers plate 126 need to be considered the structure such as microtubule or the guiding gutter of hollow when the design; may there be various deformation and more complicated structure according to upper chamber's plate 122 described in specific embodiment and lower chambers plate 126; and not exclusively as herein for the description of upper chamber's plate 122 and lower chambers plate 126, therefore should not serve as the factor that restricts protection scope of the present invention about difference herein.
One of advantage of the present invention and bright spot are: such semiconductor processing device in prior art, adopts upper and lower two drive units to drive respectively the structure of described upper chamber plate 122 and described lower chambers plate 126 conventionally.And in the present invention, adopt smooth means for correcting 111 to substitute superposed drive unit of the prior art, and make the present invention not only there is more simple structure, also facilitate user's operation.
Another advantage of the present invention and bright spot are: such semiconductor processing device in prior art, in the time that pending semiconductor die size is different, need to be by whole table apparatus completely knocked down when upper chamber's plate 122 of replacing coupling and lower chambers plate 126, particularly the replacing of lower chambers plate 126 is loaded down with trivial details especially.And in the present invention, adopt pullable lower box device 128 and supporting plug-in unit 160 to make the loading of described lower chambers plate 126 and remove process more for convenience, only need to be by lower chambers plate 126 along the pull-out of sliding in the navigation groove of described lower box device 128, after changing the lower chambers plate 126 that size is suitable, slip into again described lower box device 128, and all can with plug-in unit 160 is fixing.
Another advantage of the present invention and bright spot are: such semiconductor processing device in prior art, if in chemical treating process, the not tight or poorly sealed lattice of described micro chamber closure, and microtubule in the described lower chambers plate situation that occurs to reveal and so on is while occurring, all may cause chemicals or other fluid leakages in described lower box device, and then may overflow whole semiconductor device.And the bottom surface of the lower box device 128 adopting in the present invention is not smooth, but it is identical with inclination mode, side by side and the identical slope of width to include three angles of inclination, by the structure being similar to described in Fig. 7, described lower box device 128 can be collected in the chemicals of leakage at the bottom of the slope of described slope 704 a side or a place, coordinate again the structure such as guiding gutter, pipeline, receiver just can collect the described chemicals being leaked out, and other position of avoiding described chemicals to flow to equipment is outward caused corrosion and is polluted.Meanwhile, only need to reveal and collect side or collection place and a transducer is set just can completes and monitor, in the time having chemicals leakage, send in time signal whether having chemicals to reveal at described chemicals.
Another advantage of the present invention and bright spot are: such semiconductor processing device in prior art, assembly such as stand column device 140 adopts integrated metal casting conventionally, and because the chemical pretreatment solution in micro chamber described in chemical treatment stage produces sometimes, band is corrosive and/or the gas of high temperature on the one hand, in the time that being with mordant gas to touch metal upright post surface, these can corrode described stand column device, on the other hand because described lower box device can cause mild wear to produce the contamination particle of containing metal composition to described stand column device in the process rising and decline.。And the stand column device 140 adopting in the present invention adopts the structure of column 1320 and sleeve 1340 combinations, its central post 1320 can adopt integrated Metal Cutting or casting to form, and described sleeve 1340 can adopt the corrosion-resistant and resistant to elevated temperatures material such as plastics to make.Even if abrasion and corrosion occurs described stand column device 140, only need to change described sleeve 1340.
Describe and can be easy to associate from here simultaneously, upper chamber's plate 122, top box device 124, lower chambers plate 126 and the lower box device 128 that may directly contact with chemical reagent and other fluids all should adopt corrosion-resistant and resistant to elevated temperatures material to make, and other assemblies all can adopt integrated Metal Cutting or casting to form.
On the other hand, described column 1320 has multistage stair-stepping cylindrical column and bolt hole, only need to coordinate corresponding screw and bolt just can very convenient other each assemblies fix and be fastened in described stand column device 140.
Above-mentioned explanation has fully disclosed the specific embodiment of the present invention.It is pointed out that and be familiar with the scope that any change that person skilled in art does the specific embodiment of the present invention does not all depart from claims of the present invention.Correspondingly, the scope of claim of the present invention is also not limited only to described embodiment.
Claims (5)
1. comprise a semiconductor processing device that improves pillar construction, utilize processing fluid to process semiconductor crystal wafer and similar workpiece, it is characterized in that, it comprises: smooth correction module, micro chamber module, driver module and stand column device,
Described micro chamber module comprises that one for closely holding and process the micro chamber of semiconductor crystal wafer, described micro chamber comprises the lower chambers portion that forms the portion of upper chamber of upper working surface and/or upper periphery part and form lower working surface and/or following peripheral part, the edge of portion of described upper chamber and lower chambers portion comprises corresponding hole, post position, portion of described upper chamber and/or described lower chambers portion can move for closely holding between the off-position of this semiconductor crystal wafer for the open position and that loads and/or remove this semiconductor crystal wafer along running through under the guiding of stand column device in hole, described post position one,
When portion of upper chamber or described lower chambers portion are time in the closed position, semiconductor crystal wafer is installed between described upper working surface and lower working surface, and be formed with for processing the mobile space of fluid with the inwall of described micro chamber, portion of described upper chamber and/or described lower chambers portion comprise that at least one enters entrance of described micro chamber and at least one for the outlet of processing micro chamber described in fluid expulsion for processing fluid
The lower chambers plate that described lower chambers portion comprises lower box device, supported by lower box device, portion of described upper chamber comprises dividing plate, the top box device of dividing plate top and the upper chamber's plate being supported by top box device,
Wherein said stand column device comprises column and the sleeve that is socketed in described column outer surface,
Described column comprises the columniform top that diameter is the thinnest, columniform the first middle part that diameter is thinner, columniform the second middle part and bottom that diameter is thicker, the top outer surface on described top also comprises the first screw thread of predetermined length, one end outer surface that described the first middle part is close to described top also comprises the second screw thread of predetermined length, one end outer surface that described the second middle part is close to described bottom also comprises the 3rd screw thread of predetermined length, the internal diameter r of described sleeve is slightly larger than or equals the diameter at the second middle part of described column, and the length of described sleeve is identical with the length at described the second middle part,
Described driver module comprises base plate from bottom to top successively, be positioned at base plate top the first intermediate plate, be positioned at the second intermediate plate of the first intermediate plate top and be positioned at the upper plate of the second intermediate plate top,
Described smooth correction module comprises the correcting plate that is positioned at upper chamber's plate top and the top board that is positioned at correcting plate top,
Described the first intermediate plate and base plate are arranged on the bottom of column, hole, the post position internal diameter of the first intermediate plate and base plate is slightly larger than the external diameter at the second middle part of described column, coordinate and corresponding to the 3rd nut of described the 3rd screw thread, described the first intermediate plate and base plate are fixed between the 3rd nut and the bottom of column
Hole, the post position internal diameter of described the second intermediate plate, upper plate and lower box device is slightly larger than the external diameter of described sleeve, and the height of described lower box device can not exceed the upper edge at described the second middle part, now described the second intermediate plate, upper plate and lower box device move up and down along described sleeve and the second middle part of being positioned at sleeve inner under the driving of driver
More than described dividing plate and top box device are positioned at the top edge at described the second middle part, and hole, the post position internal diameter of described dividing plate and top box device is slightly larger than the diameter at described the first middle part but is not more than the external diameter at described the second middle part,
The internal diameter in the hole, post position of described correcting plate is slightly larger than the diameter at described the first middle part, because described correcting plate is positioned at described upper chamber plate top, coordinate corresponding to the second nut of described the second screw thread correcting plate, top box device, dividing plate is fastened between described the second nut and the top edge of described the second middle part and described sleeve, and the internal diameter in the hole, post position of top board be slightly larger than described column top diameter and be less than the diameter at described the first middle part, described top board is anchored between described the first nut and the top edge at described the first middle part corresponding to the first nut of described the first screw thread therefore coordinate.
2. semiconductor processing device according to claim 1, it is characterized in that, the bottom of column also comprises a bulge, described bulge also comprises the screwed hole being positioned on axis, described cylinder place, utilizes the screw of the described screwed hole of coupling the assembly that comprises aperture can be held between described screw and described bulge.
3. semiconductor processing device according to claim 1, is characterized in that, described column adopts metal or alloy manufacture, and described sleeve adopts plastics manufacture.
4. semiconductor processing device according to claim 1, it is characterized in that, described smooth correction module provides and points to the pressure of micro chamber inside in the chamber portion that cannot move, and makes the space between each several part and the semiconductor crystal wafer of working surface of this chamber portion meet preset width.
5. semiconductor processing device according to claim 4, it is characterized in that, be formed with the threaded perforations of some diverse locations in the on-fixed region of described top board, can screw in described threaded perforations and provide pressure in the another side of described correcting plate corresponding to the screw of described threaded perforations, the direction of described pressure is different and different with length with the position that size screws according to described screw.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110094306.4A CN102738033B (en) | 2011-04-15 | 2011-04-15 | Semiconductor processing apparatus provided with modified column structure |
| EP12770708.1A EP2693461B1 (en) | 2011-04-15 | 2012-04-14 | Semiconductor processing device |
| US14/111,859 US10121681B2 (en) | 2011-04-15 | 2012-04-14 | Semiconductor processing device |
| EP15187073.0A EP2998990B1 (en) | 2011-04-15 | 2012-04-14 | Semiconductor processing device |
| PCT/CN2012/074053 WO2012139527A1 (en) | 2011-04-15 | 2012-04-14 | Semiconductor processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110094306.4A CN102738033B (en) | 2011-04-15 | 2011-04-15 | Semiconductor processing apparatus provided with modified column structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102738033A CN102738033A (en) | 2012-10-17 |
| CN102738033B true CN102738033B (en) | 2014-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110094306.4A Active CN102738033B (en) | 2011-04-15 | 2011-04-15 | Semiconductor processing apparatus provided with modified column structure |
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| CN (1) | CN102738033B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1225747A (en) * | 1996-06-05 | 1999-08-11 | 兰姆研究公司 | Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support |
| US6239038B1 (en) * | 1995-10-13 | 2001-05-29 | Ziying Wen | Method for chemical processing semiconductor wafers |
| CN2508044Y (en) * | 2001-09-03 | 2002-08-28 | 河南石油勘探局水电厂 | Check fixing bolt |
| CN1806312A (en) * | 2003-06-13 | 2006-07-19 | 温子瑛 | Method and apparatus for thin-layer chemical processing of semiconductor wafers |
| CN101443244A (en) * | 2003-11-07 | 2009-05-27 | 安堤格里斯公司 | Front opening substrate container with bottom plate |
-
2011
- 2011-04-15 CN CN201110094306.4A patent/CN102738033B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6239038B1 (en) * | 1995-10-13 | 2001-05-29 | Ziying Wen | Method for chemical processing semiconductor wafers |
| CN1225747A (en) * | 1996-06-05 | 1999-08-11 | 兰姆研究公司 | Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support |
| CN2508044Y (en) * | 2001-09-03 | 2002-08-28 | 河南石油勘探局水电厂 | Check fixing bolt |
| CN1806312A (en) * | 2003-06-13 | 2006-07-19 | 温子瑛 | Method and apparatus for thin-layer chemical processing of semiconductor wafers |
| CN101443244A (en) * | 2003-11-07 | 2009-05-27 | 安堤格里斯公司 | Front opening substrate container with bottom plate |
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| CN102738033A (en) | 2012-10-17 |
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