CN102744677A - Polishing pad wear detecting apparatus - Google Patents
Polishing pad wear detecting apparatus Download PDFInfo
- Publication number
- CN102744677A CN102744677A CN2011101443906A CN201110144390A CN102744677A CN 102744677 A CN102744677 A CN 102744677A CN 2011101443906 A CN2011101443906 A CN 2011101443906A CN 201110144390 A CN201110144390 A CN 201110144390A CN 102744677 A CN102744677 A CN 102744677A
- Authority
- CN
- China
- Prior art keywords
- grinding pad
- arm
- checkout gear
- wear condition
- height sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
Abstract
A polishing pad wear detecting apparatus suitable for a chemical mechanical polishing (CMP) apparatus is provided. The polishing pad wear detecting apparatus includes an arm and a height detector. One end of the arm is fastened on the CMP apparatus. The height detector is disposed on the arm for detecting height variation of a polishing pad. The apparatus provided can accurately detect the polishing condition of the polishing pad in real time.
Description
Technical field
The present invention relates to a kind of checkout gear of chemical mechanical grinder, relate in particular to a kind of grinding pad wear condition checkout gear.
Background technology
Along with size of components continues reduction, little shadow exposure resolution ratio increases relatively, is accompanied by the reduction of the exposure depth of field, and is more harsh for the requirement of the height fluctuating quantity of chip surface.Therefore when getting into the processing procedure of deep-sub-micrometer; The planarization of chip just relies on the cmp processing procedure and accomplishes; Its unique anisotropic mill removes character except the planarization that is used for the chip surface profile, also can be applicable to vertically to reach making, MEMS planarization and the flat-panel screens making etc. of the making of assembly shallow trench isolation and advanced assembly in the making, FEOL of the mosaic texture of horizontal metal interconnect.
Cmp mainly is to utilize to grind the chemical assistant (reagent) in the slurry; On the front of wafer, produce chemical reaction, form the easy grinding layer, cooperate wafer again on grinding pad; By the auxiliary mechanical lapping of abrasive grains (abrasive particles) of grinding in the slurry; The overhang of easy grinding layer is ground, and above-mentioned repeatedly chemical reaction and mechanical lapping can form smooth surface.
At the employed grinding pad of cmp is consumptive material, can in process of lapping, wear and tear.When specific products is ground, can preestablish the wafer number that the single mill pad can grind, when grinding pad has ground the wafer of predetermined sheet number, carry out the replacing of grinding pad.Yet this kind changed the rule (rule) of grinding pad and can't be reflected the actual wear condition of grinding pad.When grinding pad is ground to predetermined abrasive sheet number as yet, but grinding pad excessive wear and when can't bear to use, use this grinding pad to proceed to grind processing procedure and can produce the not good problem of grinding efficiency.When grinding pad has ground predetermined abrasive sheet number, in the time of can continuing to use but the wear condition of grinding pad is not serious, change the replacement cost that this grinding pad can improve consumptive material.
Summary of the invention
The present invention provides a kind of grinding pad wear condition checkout gear, and it can be in real time and measures the wear condition of grinding pad exactly.
The present invention proposes a kind of grinding pad wear condition checkout gear, is applicable to chemical mechanical grinder, and comprises arm and height sensor.One end of arm is fixed on the chemical mechanical grinder.Height sensor is arranged on the arm, in order to measure the height change of grinding pad.
Said according to one embodiment of the invention, in above-mentioned grinding pad wear condition checkout gear, the mode that arm is fixed on the chemical mechanical grinder for example is to articulate, so that arm can scan above grinding pad.
Said according to one embodiment of the invention, in above-mentioned grinding pad wear condition checkout gear, the length of arm for example is to make height sensor be positioned at the length of the middle position top of grinding pad.
Said according to one embodiment of the invention, in above-mentioned grinding pad wear condition checkout gear, the material of arm for example is a rigid material.
Said according to one embodiment of the invention, in above-mentioned grinding pad wear condition checkout gear, height sensor for example is contactless height sensor or contact height sensor.
Said according to one embodiment of the invention, in above-mentioned grinding pad wear condition checkout gear, contactless height sensor for example is that electromagnetic resistivity checkout gear, laser transmitting and receiving device or ultrasonic send and receiving system.
Said according to one embodiment of the invention, in above-mentioned grinding pad wear condition checkout gear, the contact height sensor for example is a probe unit.
Based on above-mentioned, in grinding pad wear condition checkout gear proposed by the invention, but owing to be arranged at the height change of the height sensor real-time measurement grinding pad on the arm, by this can be in real time and learn the wear condition of grinding pad exactly.
For letting the above-mentioned characteristic of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and conjunction with figs. elaborates as follows.
Description of drawings
Sketch map when Fig. 1 is grinding with chemical mechanical grinder of one embodiment of the invention.
Fig. 2 is the side view of Fig. 1.
The primary clustering symbol description
100: grinding pad wear condition checkout gear
102: arm
104: height sensor
106: back shaft
200: chemical mechanical grinder
202: microscope carrier
204: grinding pad
206: milling zone
208: non-milling zone
D: direction of rotation
W: wafer
Δ H: height change
The specific embodiment
Sketch map when Fig. 1 is grinding with chemical mechanical grinder of one embodiment of the invention.Fig. 2 is the side view of Fig. 1, in Fig. 2, omits illustrating of wafer.
Please be simultaneously with reference to Fig. 1 and Fig. 2, grinding pad wear condition checkout gear 100 is applicable to chemical mechanical grinder 200.In this embodiment, the base material that grinds for example is to be that example describes with wafer W.Chemical mechanical grinder 200 comprises microscope carrier 202 and grinding pad 204.Grinding pad 204 is arranged on the microscope carrier 202, and comprises milling zone 206 and non-milling zone (non-polish area) 208.Wafer W is placed in the milling zone 206 of grinding pad 204 and grinds.Grinding pad 204 in non-milling zone 208 can't contact with wafer W, so the grinding pad 204 in the non-milling zone 208 can not produce wearing and tearing.In addition, chemical mechanical grinder 200 also can comprise rotating disc and grind other member such as slurry carrier pipe etc., and this is known for have common knowledge the knowledgeable institute in this technical field, so in Fig. 1, do not draw and omit its explanation.
Grinding pad wear condition checkout gear 100 comprises arm 102 and height sensor 104.One end of arm 102 is fixed on the chemical mechanical grinder 200.The mode that arm 102 is fixed on the chemical mechanical grinder 200 for example is to articulate, so that arm 102 can scan above grinding pad 204.For instance, back shaft 106 capable of using articulates the microscope carrier 202 of arm 102 with chemical mechanical grinder 200, but not in order to limit scope of the present invention.The length of arm 102 for example is to make height sensor 104 be positioned at the length of the middle position top of grinding pad 204.The middle position of grinding pad 204 for example is the non-milling zone 208 of grinding pad 204.The material of arm 102 for example is a rigid material.
Can know based on the foregoing description; When using 200 couples of wafer W of chemical mechanical grinder to grind; Because grinding pad 204 rotates along direction of rotation D; So utilize the milling zone 206 be arranged at the 104 pairs of grinding pads 204 of height sensor on the arm 102 to scan, and be benchmark, can measure the height change H of each position on the grinding pad 204 with the height of the non-milling zone 208 of grinding pad 204 with non-milling zone 208.Therefore, the height change H of the grinding pad 204 that is measured by grinding pad wear condition checkout gear 100 can be in real time and learn the wear condition of grinding pad 204 exactly, so the opportunity of the replacing grinding pad 204 that can judge rightly out.
In addition; The opportunity of replacing grinding pad 204 because grinding pad wear condition checkout gear 100 can assist to judge rightly out; Therefore can avoid continuing to overuse wearing and tearing and the not good grinding pad 204 of grinding efficiency grinds, and can reduce the replacement cost that the grinding pad 204 that still can continue to use because of too early replacing is caused.
In sum, the film used of the grinding head of the foregoing description has feature at least:
1, the grinding pad wear condition checkout gear that the foregoing description proposed can be in real time and is measured the wear condition of grinding pad exactly.
2, can correctly learn the opportunity of changing grinding pad by the grinding pad wear condition checkout gear that the foregoing description proposed.
Though the present invention discloses as above with embodiment, so it is not in order to limiting the present invention, any under those of ordinary skill in the technical field, when can doing a little change and retouching, and do not break away from the spirit and scope of the present invention.
Claims (7)
1. grinding pad wear condition checkout gear is applicable to a chemical mechanical grinder, and comprises:
One arm, an end are fixed on this chemical mechanical grinder; And
One height sensor is arranged on this arm, in order to measure the height change of a grinding pad.
2. grinding pad wear condition checkout gear according to claim 1 is characterized in that the mode that this arm is fixed on this chemical mechanical grinder comprises pivot joint, so that this arm can scan above this grinding pad.
3. grinding pad wear condition checkout gear according to claim 1, the length that it is characterized in that this arm are to make this height sensor be positioned at the length of the middle position top of this grinding pad.
4. grinding pad wear condition checkout gear according to claim 1 is characterized in that the material of this arm comprises rigid material.
5. grinding pad wear condition checkout gear according to claim 1 is characterized in that this height sensor comprises a contactless height sensor or a contact height sensor.
6. grinding pad wear condition checkout gear according to claim 5 is characterized in that this contactless height sensor comprises that electromagnetic resistivity checkout gear, laser transmitting and receiving device or ultrasonic send and receiving system.
7. grinding pad wear condition checkout gear according to claim 5 is characterized in that this contact height sensor comprises probe unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/090,284 | 2011-04-20 | ||
| US13/090,284 US20120270474A1 (en) | 2011-04-20 | 2011-04-20 | Polishing pad wear detecting apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102744677A true CN102744677A (en) | 2012-10-24 |
Family
ID=47021686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101443906A Pending CN102744677A (en) | 2011-04-20 | 2011-05-31 | Polishing pad wear detecting apparatus |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120270474A1 (en) |
| CN (1) | CN102744677A (en) |
| TW (1) | TW201243277A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105371796A (en) * | 2015-11-27 | 2016-03-02 | 芜湖银星汽车零部件有限公司 | Wear detection device of milling cutter for automatic milling equipment |
| CN108687648A (en) * | 2018-05-22 | 2018-10-23 | 武汉新芯集成电路制造有限公司 | A kind of monitoring device and monitoring method of grinding pad |
| CN110743950A (en) * | 2019-09-19 | 2020-02-04 | 宿迁学院 | Punching machine equipment capable of intelligently detecting abrasion degree |
| CN111185845A (en) * | 2018-10-29 | 2020-05-22 | 台湾积体电路制造股份有限公司 | Apparatus for polishing a substrate, method for operating a polishing system and polishing system for a polishing process |
| CN111998809A (en) * | 2020-07-28 | 2020-11-27 | 成都唐源电气股份有限公司 | Steel-aluminum composite contact rail abrasion measuring device and measuring method based on ultrasonic measurement |
| CN112638585A (en) * | 2018-08-02 | 2021-04-09 | 圣戈班磨料磨具有限公司 | Abrasive article including wear detection sensor |
| CN113561060A (en) * | 2021-07-28 | 2021-10-29 | 北京烁科精微电子装备有限公司 | Control method, device and system of diamond collator |
| CN114227528A (en) * | 2021-12-07 | 2022-03-25 | 长江存储科技有限责任公司 | Chemical mechanical polishing equipment |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014091190A (en) * | 2012-11-02 | 2014-05-19 | Toho Engineering Kk | Service life detection method for abrasive pad |
| JP2015208840A (en) * | 2014-04-30 | 2015-11-24 | 株式会社荏原製作所 | Polishing device, jig for measuring abrasive pad profile, and method for measuring abrasive pad profile |
| KR102581481B1 (en) | 2016-10-18 | 2023-09-21 | 삼성전자주식회사 | Method of chemical mechanical polishing, method of manufacturing semiconductor device and apparatus of manufacturing semiconductor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6186864B1 (en) * | 1997-11-10 | 2001-02-13 | International Business Machines Corporation | Method and apparatus for monitoring polishing pad wear during processing |
| US6517414B1 (en) * | 2000-03-10 | 2003-02-11 | Appied Materials, Inc. | Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus |
| US20030129925A1 (en) * | 2002-01-09 | 2003-07-10 | Yoshiaki Toyoshima | Polishing apparatus |
| US20070232193A1 (en) * | 2006-03-31 | 2007-10-04 | Hozumi Yasuda | Substrate holding apparatus, polishing apparatus, and polishing method |
| JP2007283462A (en) * | 2006-04-19 | 2007-11-01 | Disco Abrasive Syst Ltd | Control method for grinder |
| CN201331321Y (en) * | 2008-12-30 | 2009-10-21 | 宁波祥瑞机械有限公司 | Double-column height gauge |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5733171A (en) * | 1996-07-18 | 1998-03-31 | Speedfam Corporation | Apparatus for the in-process detection of workpieces in a CMP environment |
| US5823853A (en) * | 1996-07-18 | 1998-10-20 | Speedfam Corporation | Apparatus for the in-process detection of workpieces with a monochromatic light source |
| US5433650A (en) * | 1993-05-03 | 1995-07-18 | Motorola, Inc. | Method for polishing a substrate |
| US5875559A (en) * | 1995-10-27 | 1999-03-02 | Applied Materials, Inc. | Apparatus for measuring the profile of a polishing pad in a chemical mechanical polishing system |
| US5618447A (en) * | 1996-02-13 | 1997-04-08 | Micron Technology, Inc. | Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers |
| US5787595A (en) * | 1996-08-09 | 1998-08-04 | Memc Electric Materials, Inc. | Method and apparatus for controlling flatness of polished semiconductor wafer |
| JPH1086056A (en) * | 1996-09-11 | 1998-04-07 | Speedfam Co Ltd | Management method and device for polishing pad |
| US5934974A (en) * | 1997-11-05 | 1999-08-10 | Aplex Group | In-situ monitoring of polishing pad wear |
| US6633379B2 (en) * | 2001-06-08 | 2003-10-14 | Semiconductor 300 Gmbh & Co. Kg | Apparatus and method for measuring the degradation of a tool |
| EP1270148A1 (en) * | 2001-06-22 | 2003-01-02 | Infineon Technologies SC300 GmbH & Co. KG | Arrangement and method for conditioning a polishing pad |
| US6752694B2 (en) * | 2002-11-08 | 2004-06-22 | Motorola, Inc. | Apparatus for and method of wafer grinding |
| US6951503B1 (en) * | 2004-06-28 | 2005-10-04 | Lam Research Corporation | System and method for in-situ measuring and monitoring CMP polishing pad thickness |
| US7198546B2 (en) * | 2004-06-29 | 2007-04-03 | Lsi Logic Corporation | Method to monitor pad wear in CMP processing |
| JP2008305875A (en) * | 2007-06-06 | 2008-12-18 | Renesas Technology Corp | Method of manufacturing semiconductor integrated circuit device |
| JP5481472B2 (en) * | 2008-05-08 | 2014-04-23 | アプライド マテリアルズ インコーポレイテッド | CMP pad thickness and profile monitoring system |
| US8221193B2 (en) * | 2008-08-07 | 2012-07-17 | Applied Materials, Inc. | Closed loop control of pad profile based on metrology feedback |
| JP2010173052A (en) * | 2009-02-02 | 2010-08-12 | Sumco Corp | Method and apparatus for measuring thickness of polishing pad |
-
2011
- 2011-04-20 US US13/090,284 patent/US20120270474A1/en not_active Abandoned
- 2011-04-29 TW TW100115166A patent/TW201243277A/en unknown
- 2011-05-31 CN CN2011101443906A patent/CN102744677A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6186864B1 (en) * | 1997-11-10 | 2001-02-13 | International Business Machines Corporation | Method and apparatus for monitoring polishing pad wear during processing |
| US6517414B1 (en) * | 2000-03-10 | 2003-02-11 | Appied Materials, Inc. | Method and apparatus for controlling a pad conditioning process of a chemical-mechanical polishing apparatus |
| US20030129925A1 (en) * | 2002-01-09 | 2003-07-10 | Yoshiaki Toyoshima | Polishing apparatus |
| US20070232193A1 (en) * | 2006-03-31 | 2007-10-04 | Hozumi Yasuda | Substrate holding apparatus, polishing apparatus, and polishing method |
| JP2007283462A (en) * | 2006-04-19 | 2007-11-01 | Disco Abrasive Syst Ltd | Control method for grinder |
| CN201331321Y (en) * | 2008-12-30 | 2009-10-21 | 宁波祥瑞机械有限公司 | Double-column height gauge |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105371796A (en) * | 2015-11-27 | 2016-03-02 | 芜湖银星汽车零部件有限公司 | Wear detection device of milling cutter for automatic milling equipment |
| CN108687648A (en) * | 2018-05-22 | 2018-10-23 | 武汉新芯集成电路制造有限公司 | A kind of monitoring device and monitoring method of grinding pad |
| CN112638585A (en) * | 2018-08-02 | 2021-04-09 | 圣戈班磨料磨具有限公司 | Abrasive article including wear detection sensor |
| CN112638585B (en) * | 2018-08-02 | 2024-02-27 | 圣戈班磨料磨具有限公司 | Abrasive article including wear detection sensor |
| CN111185845A (en) * | 2018-10-29 | 2020-05-22 | 台湾积体电路制造股份有限公司 | Apparatus for polishing a substrate, method for operating a polishing system and polishing system for a polishing process |
| CN110743950A (en) * | 2019-09-19 | 2020-02-04 | 宿迁学院 | Punching machine equipment capable of intelligently detecting abrasion degree |
| CN110743950B (en) * | 2019-09-19 | 2021-04-02 | 宿迁学院 | Punching machine equipment capable of intelligently detecting abrasion degree |
| CN111998809A (en) * | 2020-07-28 | 2020-11-27 | 成都唐源电气股份有限公司 | Steel-aluminum composite contact rail abrasion measuring device and measuring method based on ultrasonic measurement |
| CN111998809B (en) * | 2020-07-28 | 2021-11-16 | 成都唐源电气股份有限公司 | Steel-aluminum composite contact rail abrasion measuring device and measuring method based on ultrasonic measurement |
| CN113561060A (en) * | 2021-07-28 | 2021-10-29 | 北京烁科精微电子装备有限公司 | Control method, device and system of diamond collator |
| CN113561060B (en) * | 2021-07-28 | 2022-10-21 | 北京烁科精微电子装备有限公司 | Control method, device and system of diamond collator |
| CN114227528A (en) * | 2021-12-07 | 2022-03-25 | 长江存储科技有限责任公司 | Chemical mechanical polishing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201243277A (en) | 2012-11-01 |
| US20120270474A1 (en) | 2012-10-25 |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121024 |