CN102893377A - Pad window insert - Google Patents
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- CN102893377A CN102893377A CN2011800239708A CN201180023970A CN102893377A CN 102893377 A CN102893377 A CN 102893377A CN 2011800239708 A CN2011800239708 A CN 2011800239708A CN 201180023970 A CN201180023970 A CN 201180023970A CN 102893377 A CN102893377 A CN 102893377A
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- CN
- China
- Prior art keywords
- window
- polishing pad
- platform
- polissoir
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Abstract
A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.
Description
Technical field
Described a kind of with fenestrate polishing pad, contain the system of this polishing pad, and in order to make and to use the technique of this polishing pad.
Background
In the technique of making modern semiconductors integrated circuit (IC), often need to be with the outer surface planarization of substrate.For example, may need planarization to throw except the conductive fill layer, until the top surface of below layer exposes, between the raised design of insulating barrier, stay electric conducting material, to form through hole, embolism and circuit, these through holes, embolism and circuit provide conductive path between the thin film circuit on the substrate.In addition, may need planarization to flatten and thin oxide skin(coating), be applicable to photolithographic flat surface to provide.
Reaching a kind of method that semiconductor substrate planarization or surface topography remove is chemico-mechanical polishing (chemical mechanical polishing; CMP).Conventional chemico-mechanical polishing (CMP) technique relates in the situation that grinding milk exists, and substrate is compressed the polishing pad of rotation.
Usually, need to detect when reached expectation surface flatness or layer thickness in order to determine whether to stop polishing, to have, or when exposed the below layer.Developed many technology are used for carrying out terminal point during CMP technique in situ detection.For example, the Optical Surveillance System of the uniformity in order to the layer in site measurement substrate during the polishing of layer is employed.Optical Surveillance System can comprise: light source, and this light source can be guided light beam towards substrate during polishing; Detector, this detector can be measured reflection from the light of substrate; And computer, this computer can analyze the signal of self-detector, and calculates whether detected terminal point.In some CMP system, light beam is led by the window in the polishing pad and is drawn towards substrate.
Summary of the invention
Window can be affixed to the downside of polishing pad, cause the part of window to be supported in the groove in the platform.This tolerable window contacts with high surface area between the polishing pad, in order to increase the bond strength between window and the polishing pad.
On the one hand, polissoir comprises platform, this platform has flat upper surfaces, be formed at the groove in the upper surface, this groove has basal surface, and the passage that is connected to the basal surface of groove, polissoir also comprises polishing pad, the perforate that this polishing pad comprises polishing layer, polished surface, downside and passes this downside, perforate have the lateral dimension little than groove, perforate aligned with channel.The solid-state light transmissive window has first, first is placed in the perforate in the polishing pad at least in part, the solid-state light transmissive window also has second portion, second portion is placed in the groove in the platform at least in part, second portion has the lateral dimension large than first, and in the extension of polishing layer below, be affixed to the second portion adherence of window the downside of polishing pad.
Realization of the present invention can comprise one or more following characteristics.The first of window can clog the perforate in the polishing pad.The top surface of the first of window can with the upper surface copline of platform.The basal surface of groove can be parallel to the upper surface of platform.The lower surface of the second portion of window can contact the lower surface of groove.The lower surface of the second portion of window can not be adhered to the lower surface of groove.Polissoir also can comprise the adhesion coating of crossing over polishing layer.Adhesion coating can comprise double-face adhesive tape.Adhesion coating can be in abutting connection with polishing layer.The downside of polishing pad can by the adhesion coating adherence be affixed to the upper surface of platform.The top surface of the second portion of window can by the adhesion coating adherence be affixed to the downside of polishing pad.But be affixed to the top surface adherence of the second portion of window the downside of polishing pad.Polishing pad can comprise polishing layer.Polishing pad can comprise polishing layer and below layer, and the below layer is more incompressible than polishing layer.Second portion can have than first large two to ten times, about octuple for example, lateral dimension.But the second portion side direction of window is filled the groove in the platform.Polishing pad can have the thickness less than 1mm.Polissoir also can comprise optical fiber, and this optical fiber is in the passage and through settling with the first by window guides or receive light.Optical fiber can be wider than the first of window.The side of groove can be inclination, and the side of the second portion of window can be inclination.
In another aspect, assembling comprises the following steps: to pass polishing pad formation perforate for the method for the used window of polissoir, and this polishing pad comprises polishing layer, and this polishing layer has polished surface and downside; Form the solid-state light transmissive window, this solid-state light transmissive window has first and second portion, and second portion has the lateral dimension greater than first; The first of window is inserted the perforate of polishing pad; The top surface of the second portion of window is affixed to the downside of polishing pad; And polishing pad and window be placed on the platform, cause the second portion of window to be fitted into groove in the flat upper surfaces of platform, and the downside of polishing pad adhere to the flat upper surfaces of platform.
Realization of the present invention can comprise one or more following characteristics.Adhesive layer can be formed on the bottom of polishing layer, and lining covers this stick, and the part of lining is removed around perforate, and the top surface of the second portion of window can be in the contact adhesive in the part that is removed of lining.
Realization of the present invention can comprise following potential advantage.Can between window and thin polishing pad, form strong bond, reduce the possibility of slurries seepage, and reduce because causing window to be pulled away from the possibility of polishing pad from the shearing that is subjected to polishing substrate.In addition, polishing pad can be promoted the wafer of the spectrum that reflects from substrate to wafer uniformity, particularly under the short wavelength.
The details of one or more embodiment will be illustrated in alterations and following description.Can from specification and accompanying drawing and claim, understand other side of the present invention, feature and advantage.
Description of drawings
Fig. 1 is the cross section view that contains the CMP equipment of polishing pad.
Fig. 2 is the top view with the embodiment of fenestrate polishing pad.
Fig. 3 A is that the polishing pad of Fig. 2 is installed on the cross section view on the platform.
Fig. 3 B is the cross section view of the polishing pad of Fig. 2.
Fig. 4 to 7 diagram forms the method for polishing pad.
Fig. 8 is the cross section view that is installed on another realization of the polishing pad on the platform.
Similar components symbol indication similar components in a plurality of accompanying drawings.
Embodiment
Window can be affixed to the downside of polishing pad, cause the part of window to be supported in the groove in the platform.This tolerable window contacts with high surface area between the polishing pad, in order to increase the bond strength between window and the polishing pad.
As shown in Figure 1, CMP equipment 10 comprises rubbing head 12, in order to grasp the polishing pad 18 of semiconductor substrate 14 on the platform 16.CMP equipment can be such as United States Patent (USP) the 5th, 738, carries out construction as described in No. 574, and the complete disclosure of this United States Patent (USP) is incorporated this paper into reference pattern.
Substrate can be, for example, the product substrate (as, comprise the product substrate of a plurality of memories or processor tube core), test base, naked substrate and gate substrate (gating substrate).Substrate can be in the various stages that integrated circuit is made, as, substrate can be naked wafer, or substrate can comprise one or more deposition and/or patterned layer.The term substrate can comprise circular disc and rectangular sheet.
The live part of polishing pad 18 can comprise polishing layer 20, and polishing layer 20 is with polished surface 24 and basal surface 22, and polished surface 24 is used for contact substrate, and basal surface 22 is fixed to platform 16 by adhesion coating 28 (such as, adhesion zone).Adhesion coating 28 can be the pressure sensitivity stick.Except adhesion zone and any lining, polishing pad can for example be made of single-layer pad, and wherein the polishing layer 20 thin durable material that goes for CMP (Chemical Mechanical Polishing) process forms.Therefore, the layer of polishing pad can be made of individual layer polishing layer 20 and adhesion coating 28 (and optional lining, this lining can be removed when polishing pad is mounted on the polished land).
Referring to Fig. 2, in some implementations, polishing pad 18 has 15.0 inches (381.00mm) to the radius R of 15.5 inches (393.70mm), and has 30 inches to 31 inches respective diameters.In some implementations, polishing pad 18 can have 21.0 inches (533.4mm) to the radius of 21.5 inches (546.1mm), and has 42 inches to 43 inches respective diameters.
Referring to Fig. 3 A, in some implementations, can in polished surface 24, form groove 26.Groove can present " Waffle (waffle) " pattern, and for example, the crosshatch pattern of the vertical trench of tool sloped sidewall is divided into a plurality of rectangles (such as, square) zone with polished surface.
Get back to Fig. 1, typically, pad material can be got wet by chemical brightening solution 30, and chemical brightening solution 30 can comprise abrasive grains.For example, slurries can comprise potassium hydroxide (potassium hydroxide; KOH) and pyrolytic silicon dioxide (fumed-silica) particle.Yet some glossing can be " without (abrasive-free) that grind ".
During around the rotation of the central shaft of platform, rubbing head 12 is exerted pressure to substrate 14, makes substrate 14 against polishing pad 18 at platform.In addition, rubbing head 12 is usually around the central shafts rotation of rubbing head 12, and by power transmission shaft or translation arms 32 and the surface of platform 16 is crossed in translation.Pressure between substrate and the polished surface and relative motion, the associating polishing solution causes the polishing of substrate together.
Optics perforate 34 is formed in the top surface of platform 16.The Optical Surveillance System that comprises light source 36 (such as laser) and detector 38 (such as photodetector) can be positioned at below the top surface of platform 16.For example, Optical Surveillance System can be arranged in the chamber of platform 16, this optics perforate 34 of this chamber optical communication, and can rotate along with platform.One or more optical fibers 50 can be sent to substrate from light source 36 with light, and are sent to detector 38 from substrate.For example, optical fiber 50 can be the optical fiber of bifurcated, tool stem portion 52, this stem portion 52 near (as, in abutting connection with) window 40 in the polishing pad; Be connected to the first foot 54 of light source 36; And the second foot 56 that is connected to detector 38.
Can transparent solid-state lamellar body (such as quartz wedge) fill optics perforate 34 (in this case, optical fiber can be in abutting connection with window 40, but can in abutting connection with the solid-state lamellar body in the optics perforate), perhaps optics perforate 34 can be the cavity.In one realized, Optical Surveillance System and optics perforate formed the parts of module, and this module is fitted in the respective slot in the platform.Perhaps, Optical Surveillance System can be the fixed system that is positioned at the platform below, and the extensible platform that passes of optics perforate.Light source 36 can utilize from far infrared to any wavelength between the ultraviolet ray, and such as ruddiness (although also can use such as broadband frequency spectrums such as white lights), and detector 38 can be spectrometer.
Solid-state window 40 is formed in the polishing pad 18 of top, and the optics perforate 34 in the alignment stage.Window 40 and perforate 34 can be through settling, cause no matter the translation position of rubbing head 12 how, window 40 and perforate 34 can be seen the substrate 14 by 12 fixings of rubbing head during at least a portion of platform rotation.
At least window 40 and substrate 14 adjacent during, light source 36 projecting beams are by perforate 34 and window 40, with the surface of the substrate 14 above the bump.Light formation from the substrate reflection can be by the synthetic light beam of detector 38 detections.Light source and detector are coupled to not shown computer, and computer self-test is surveyed device and received measured luminous intensity and use measured luminous intensity to decide polishing end point, for example, and by the reflexive flip-flop of substrate of the exposure that detects the new layer of indication; By using principle of interference to calculate the thickness that removes from extexine (such as the transparent oxide layer); By monitoring catoptrical spectrum and detecting target optical spectrum; By with a series of through the measure spectrum coupling reference spectra from data bank, and where the linear function of the index value of definite match reference spectra reaches in desired value; The signal that perhaps meets the predesigned end point standard by supervision.
One of problem of general larger rectangular window (such as, 2.25 inches windows of taking advantage of 0.75 inch) the very thin polishing layer of packing into is peeling off during the polishing.Particularly, the side-friction force from substrate can be greater than the adhesion of molded window to the polishing pad sidewall during the polishing.
Get back to Fig. 2, window 40 can be less, such as diameter less than about 3mm, in order to reduce the frictional force that is applied by substrate during the polishing.For example, the upper section of window 40 can be the wide border circular areas of about 3mm, the distance B at the center of the polishing pad 18 of centre distance 30 to 31 inch diameters of this border circular areas is about 7.5 inches (190.50mm), or the distance B at the center of the polishing pad 18 of centre distance 42 to 43 inch diameters of this border circular areas is about 9 inches to 11 inches.
Referring to Fig. 3 A, window 40 comprises upper section 40a and below part 40b.Window 40 comprises upper section 40a and below part 40b, can be the single lamellar body of monomer-type of homogeneous material.Part 40b below upper section 40a vertically aligns, but (that is, be parallel on one or two direction of polished surface) less than below part 40b in the horizontal.Therefore, the part of polishing layer 20 below protrude on the part 40b, cause the edge that protrudes the below part 40b that exceeds upper section 40a to form flange 49.Below part 40b can protrude in all sides side direction of window 40 and exceed upper section 40a, and perhaps optionally, below part 40b can protrude in two relative side side direction of window 40 and exceed upper section 40a, but aligns along other side of window 40.The upper surface that protrusion exceeds the below part 40b of upper section 40a can be substantial flat surfaces.Upper section 40a can be arranged in the intracardiac of below part 40b, and for example, part 40b is concentric with the below.2 to 10 times of lateral dimension that the lateral dimension of below part 40b can be upper section 40a are large, as, about 8 times large.For example, if window 40 is circular, then upper section 40a can have the diameter of 3mm, and below part 40b can have the diameter of 25mm.
The thickness of upper section 40a can be approximately identical with below part 40b.Perhaps, the comparable below of upper section 40a part 40b is thick or thin.
The upper section 40a of window 40 can protrude into the perforate in the adhesion coating 28.The edge of adhesion coating 28 (such as, adhesion zone) can be in abutting connection with the side of the upper section 40a of window 40.The below part 40b of window can protrude in the groove 78 in the top surface 76 of platform 16.
The upper section 40a of window is equally thick with the combination that polishing layer 20 adds adhesion coating 28.Top surface 44 and polished surface 24 coplines of the upper section 40a of window 40.The bottom of the upper section 40a of window 40 can with the basal surface copline of adhesion coating 28.
The upper surface of below part 40b is fixed to the downside of polishing layer 20 by the part of adhesion coating 28.Randomly, the outer rim of the upper section 40a of window 40 can be fixed to the madial wall edge 48 of polishing layer 20, for example, and by extra stick.
Can provide strong bond by the connecting surface zone that increases between the window 40 that provides in the connection on the flange 49 and the polishing layer 20, reduce the possibility of slurries seepage, and reduce because causing window 40 to be pulled away from the possibility of polishing pad 18 from the shearing that is subjected to polishing substrate.Fibre-optic stem portion 52 in abutting connection with or almost in abutting connection with below part 40b.In some implementations, the upper section 40a of stem portion 52 comparable windows 40 is wider.
The basal surface of the below part 40b of window can not have the bottom of the groove 78 in the upper surface 76 of adherence ground abutment platforms 16, for example, is supported on the bottom of the groove 78 in the upper surface 76 of platform 16, or otherwise is fixed to this bottom.In some implementations, the below part 40b filling groove 78 of window.
Referring to Fig. 3 B, before being installed on the platform 16, polishing pad 18 also can comprise lining 70, and except by the sticking the block that below part 40b covers of window 40, lining 70 is crossed over the adhesion coating 28 on the basal surface 22 of polishing pads 18.Lining 70 can be thin flexible material (such as, paper), and the tool release coat, and lining 70 can be divested from adhesion coating 28.In some implementations, lining can be the layer of non-compressible and common fluid impermeable, for example, and polyethylene terephthalate (PET), as,
In the use, manually divest lining 70 from adhesion coating 28, and utilize adhesion coating 28 that polishing layer 20 is applied to platform 16.Yet lining 70 is not crossed over window 40, but below window 40 in the block of part 40b (for example, the block that about 25cm is wide) and be close to and locate to be removed around this block, to form hole 72, the below part 40b of window 40 can assemble in the hand-hole 72.
In order to make polishing pad, initial, form polishing layer 20, and cover the basal surface of polishing layers 20 with pressure sensitivity adhesion coating 28 and lining 70, as shown in Figure 4.Can before pressure sensitivity adhesion coating 28 is attached, in polishing layer 20, form groove 26 as the parts of pad moulding processs, or can be after polishing pad forms, in polishing layer 20 interior cutting grooves 26.Can before or after lining 70 is attached, form groove 26.
Referring now to Fig. 5,, in some implementations, can form window 40 by the polymer of shape that casting and sclerosis are window 40.In one realized, polymer was the mixture of 2 parts of Calthane A 2300 and 3 parts of Calthane B 2300 (can obtain Cal Polymers, Inc. from California causeway city).Before inserting perforate, the liquid polymer mixture can be through degassing, as reach 15 to 30 minutes.Polymer can at room temperature harden and reach about 24 hours, maybe can shorten firm time with heating lamp or baking box.In some implementations, polymer can be poured in the model, and sclerosis or otherwise solidify to form the window 40 that is net shape.In some implementations, the form that window 40 can the Large Solid State block is hardened, and then forms the window 40 that is net shape by this solid-state block of processable polymer.
In some implementations, the sidewall 84 of below part 40b can be in fact perpendicular to the basal surface 46 of window 40.In some implementations, can form the sidewall 84 with basal surface 46 folder one angle, as will be further in discussing in the description of Fig. 7.
Divest or otherwise remove the part 72 of lining 70 from adhesion coating 28.At this moment, lining 70 must not divested fully from polishing pad 18.The quilt of lining 70 divests the part that part exposes the basal surface 22 of the adhesion coating 28 around 82 that portals.Also can be cut by the part 72 that divested, for example, through determining that size divides with the bottom of accommodating window 40 in the block of flange 49 of 40b, although this step also can after carry out.
Referring to Fig. 5 and Fig. 6, window 40 is fixed to polishing pad 18, causes upper section 40a to extend into hand-hole 82, and upper surface (such as, flange 49) the contact adhesion coating 28 of 40b is divided in the bottom.In certain embodiments, the size that can determine upper section 40a causes when flange 49 adheres to adhesion coating 28 to extend through in fact and filler opening 82 in fact, polished surface 24 coplines of upper surface 44 and polishing layer 20.
Except lining 70, the optional window of crossing over window 40 can be set support lamellar body 74.For example, window supports the part that lamellar body 74 can be fixed to the adhesion coating 28 on every side of next-door neighbour's window 40.The thickness that supports lamellar body 74 can be identical with lining 70, or thinner than lining 70.Support lamellar body 74 and can be polytetrafluoroethylene (polytetrafluoroethylene; PTFE), as
Or another kind of non-cohesive material.Then, the polishing pad 18 of combination and window 40 can be ready to transport to the client, for example, are contained in the sealed plasthetic bag.
Referring now to Fig. 7,, when the client receives the polishing pad 18 of combination and window 40, the removable lining 70 of client (and window support lamellar body 74, if the words that exist), and then use adhesion coating 28 that polishing pad 18 is attached on the platform 16.The below part 40b of window 40 is inserted in the groove 78 in the upper surface 76 of platform 16.In some method, can partly divest the lining 70 in the peripheral region of window 40, the below part 40b of window 40 is inserted in the groove, and then the remainder of lining is divested and the remainder of polishing pad is fixed to platform 16.
Can determine the shape of below part 40b and size so that below part 40b filling groove 78 in fact, for example, in the upper surface 76 contact adhesion coatings 28 of platform 16, the sidewall 84 of below part 40b can contact in fact all sidewalls 86 of groove 78, and the basal surface 46 of window 40 contacts in fact the base plate 88 of groove 78.
In some implementations, the base plate 88 of groove 78 can be parallel in fact the upper surface 76 of platform 16.In some implementations, the sidewall 84 of below part 40b is perpendicular to basal surface 46, and the sidewall 86 of groove 78 is perpendicular to polished surface 75.Referring to Fig. 8, in some implementations, the sidewall 84 of below part 40b can form non-perpendicular to the angle of basal surface 46, as, between 20 ° and 80 °, as, 45 °, and the sidewall 86 of groove 78 in fact similarly angle forms, and causes when quadrate part divides 40b to insert groove 78 instantly, and sidewall 84 contacts with each other in fact with sidewall 86.For example, sidewall 84 can slope inwardly from flange 49 to basal surface 46, causes below part 40b to form the tapered cross-section.Similarly, can form sidewall 86 to engage this tapered cross-section.So, when groove in window 40 inserts the sidewall 86 that tilts 78 is interior, the sidewall 84 of inclination can cause window 40 and polishing pad 18 show the oneself put in (self-centering) characteristic.
So, polishing pad 18 is adhered to platform 16 by adhesion coating 28, thereby window 40 is remained in the groove 78 in the platform 16.Window 40 can be by base plate 88 vertical support of groove 78, and can be kept by sidewall 86 side direction of groove 78.Can contact identical adhesion coating by the top surface that makes flange 49, so that window 40 is adhered to polishing pad, this adhesion coating is fixed to platform 16 with the downside of polishing pad.
Although described some embodiment, the present invention is not as limit.For example, although described the window of tool simple circular, window also can be more complicated, such as rectangular, ellipse or star.The top of window is divided can protrude one or more side that divides above the bottom.Should understand under not departing from spirit of the present invention and category, can finish multiple other modification.Therefore, other embodiment also falls into the category of following claim.
Claims (15)
1. polissoir comprises:
Platform, described platform has flat upper surfaces, is formed at the groove in the described upper surface, and described groove has basal surface, and the passage that is connected to the described basal surface of described groove;
Polishing pad, described polishing pad comprises polishing layer, polished surface, downside, and the perforate of passing described downside, and described perforate has the lateral dimension less than described groove, and described passage is aimed in described perforate; And
The solid-state light transmissive window, described window has first, in at least part of described perforate that is placed in the described polishing pad of described first, and second portion, in at least part of described groove that is placed in the described platform of described second portion, described second portion has the lateral dimension greater than described first, and the extension below described polishing layer of described second portion, and the described second portion adherence of described window is affixed to a downside of described polishing pad.
2. polissoir as claimed in claim 1 also comprises adhesion coating, and described adhesion coating is crossed over described polishing layer.
3. polissoir as claimed in claim 2, the described downside of wherein said polishing pad is affixed to the described upper surface of described platform by described adhesion coating adherence.
4. polissoir as claimed in claim 3, the top surface of the described second portion of wherein said window is affixed to the downside of described polishing pad by described adhesion coating adherence.
5. polissoir as claimed in claim 1, the described first of wherein said window clogs the described perforate in the described polishing pad.
6. polissoir as claimed in claim 5, the described upper surface copline of the top surface of the described first of wherein said window and described platform.
7. polissoir as claimed in claim 1, the lower surface of the described second portion of wherein said window contacts the described lower surface of described groove.
8. polissoir as claimed in claim 7, the described lower surface of the described second portion of wherein said window does not adhere to the described lower surface of described groove.
9. polissoir as claimed in claim 1, wherein said second portion has large two to the ten times lateral dimension of more described first.
10. polissoir as claimed in claim 1, wherein said polishing pad has the thickness less than 1mm.
11. polissoir as claimed in claim 1 more comprises optical fiber, described optical fiber is in the described passage and through settling with the described first by described window guides or receives light.
12. such as the polissoir of claim 11, the described first of the more described window of wherein said optical fiber is wider.
13. a method of assembling for the used window of polissoir comprises:
The perforate of polishing pad is passed in formation, and described polishing pad comprises polishing layer, and described polishing layer has polished surface and downside;
Form the solid-state light transmissive window, described solid-state light transmissive window has first and second portion, and described second portion has the lateral dimension greater than described first;
The described first of described window is inserted the described perforate of described polishing pad;
The top surface of the described second portion of described window is affixed to the described downside of described polishing pad; And
Described polishing pad and window are placed on the platform, cause the described second portion of described window to be fitted into groove in the flat upper surfaces of described platform, and the described downside of described polishing pad are adhered to the described flat upper surfaces of described platform.
14. the method such as claim 13, wherein adhesive layer is formed on the bottom surface of described polishing layer, and lining covers described stick, the part of described lining is removed around described perforate, and the described top surface of the described second portion of described window contacts described stick in described being removed of described lining in the part.
15. the method such as claim 14 also comprises: before being placed in described polishing pad on the described platform, remove the remainder of described lining, cause described stick the described downside of described polishing pad to be adhered to this flat upper surfaces of described platform.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/778,760 US20110281510A1 (en) | 2010-05-12 | 2010-05-12 | Pad Window Insert |
| US12/778,760 | 2010-05-12 | ||
| PCT/US2011/034215 WO2011142975A2 (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102893377A true CN102893377A (en) | 2013-01-23 |
| CN102893377B CN102893377B (en) | 2016-08-10 |
Family
ID=44912183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180023970.8A Active CN102893377B (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110281510A1 (en) |
| JP (1) | JP2013526420A (en) |
| KR (2) | KR101956848B1 (en) |
| CN (1) | CN102893377B (en) |
| TW (3) | TWI663020B (en) |
| WO (1) | WO2011142975A2 (en) |
Cited By (4)
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|---|---|---|---|---|
| CN104440519A (en) * | 2013-09-18 | 2015-03-25 | 德州仪器公司 | Permeated grooving in CMP polishing pads |
| CN104849218A (en) * | 2013-10-25 | 2015-08-19 | 应用材料公司 | Grouping spectral data from polishing substrates |
| CN108701600A (en) * | 2016-02-26 | 2018-10-23 | 应用材料公司 | Window in slim polishing pad |
| US11826875B2 (en) | 2016-02-26 | 2023-11-28 | Applied Materials, Inc. | Window in thin polishing pad |
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| US8535115B2 (en) * | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
| US8961266B2 (en) | 2013-03-15 | 2015-02-24 | Applied Materials, Inc. | Polishing pad with secondary window seal |
| US10058970B2 (en) | 2014-05-02 | 2018-08-28 | 3M Innovative Properties Company | Interrupted structured abrasive article and methods of polishing a workpiece |
| JP6883475B2 (en) * | 2017-06-06 | 2021-06-09 | 株式会社荏原製作所 | Polishing table and polishing equipment equipped with it |
| JP7015667B2 (en) * | 2017-10-02 | 2022-02-03 | 株式会社ディスコ | Polishing equipment |
| JP2020001162A (en) * | 2018-06-28 | 2020-01-09 | 株式会社荏原製作所 | Polishing pad laminate, polishing pad positioning jig, and method of applying polishing pad to polishing table |
| US11571782B2 (en) * | 2018-11-28 | 2023-02-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Single bodied platen housing a detection module for CMP systems |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20110281510A1 (en) | 2011-11-17 |
| TWI663021B (en) | 2019-06-21 |
| KR101762936B1 (en) | 2017-07-28 |
| CN102893377B (en) | 2016-08-10 |
| TW201217104A (en) | 2012-05-01 |
| TW201817541A (en) | 2018-05-16 |
| WO2011142975A3 (en) | 2012-03-01 |
| TWI611866B (en) | 2018-01-21 |
| TWI663020B (en) | 2019-06-21 |
| KR20130103674A (en) | 2013-09-24 |
| TW201742705A (en) | 2017-12-16 |
| KR20170088444A (en) | 2017-08-01 |
| KR101956848B1 (en) | 2019-03-11 |
| WO2011142975A2 (en) | 2011-11-17 |
| JP2013526420A (en) | 2013-06-24 |
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