CN102893377B - Pad window insert - Google Patents
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- CN102893377B CN102893377B CN201180023970.8A CN201180023970A CN102893377B CN 102893377 B CN102893377 B CN 102893377B CN 201180023970 A CN201180023970 A CN 201180023970A CN 102893377 B CN102893377 B CN 102893377B
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- Prior art keywords
- window
- polishing pad
- adhesion coating
- platform
- polishing
- Prior art date
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- 239000013307 optical fiber Substances 0.000 claims description 11
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- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
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- 238000000465 moulding Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
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- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Abstract
A kind of polishing pad includes: polishing layer, this polishing layer has polished surface；Adhesion coating；This adhesion coating is positioned at the side of polishing layer and relative with polished surface；And solid-state light transmissive window, this solid-state light transmissive window extends across polishing layer and takes shape in polishing layer.Solid-state light transmissive window has upper section, and this upper section has the first lateral dimension, and solid-state light transmissive window also has section below, and this section below tool is less than the second lateral dimension of the first lateral dimension.The top surface of solid-state light transmissive window and polished surface copline, and the lower surface copline of the basal surface of solid-state light transmissive window and adhesion coating.
Description
Technical field
Describe a kind of with fenestrate polishing pad, system containing this polishing pad, and in order to manufacture and to use
The technique of this polishing pad.
Background
In the technique manufacturing modern semiconductors integrated circuit (IC), it is often necessary to by smooth for the outer surface of substrate
Change.For example, it may be desirable to planarization is to throw except conductive filler layer, until the top surface of underlying layer exposes
Till, between the raised design of insulating barrier, leave conductive material, to form through hole, thromboembolism and circuit,
Conductive path is provided between these through holes, thromboembolism and the circuit thin flm circuit on substrate.Furthermore, it is possible to
Need planarization to flatten and thin oxide skin(coating), being applicable to photolithographic flat surface to provide.
Reach semiconductor substrate planarization or a kind of method that surface topography removes is chemically mechanical polishing
(chemical mechanical polishing；CMP).Conventional chemically mechanical polishing (CMP) technique relates to
In the presence of grinding milk, substrate is compressed the polishing pad of rotation.
Generally, in order to decide whether to stop polishing, there is a need to detect when to reach expectation surface flatness
Or layer thickness, or the most expose underlying layer.Have been developed for many technology for during CMP
Carry out the in situ detection of terminal.For example, in order to the layer in site measurement substrate during the polishing of layer
The Optical Surveillance System of the uniformity is employed.Optical Surveillance System comprises the steps that light source, and this light source can thrown
Light beam is guided towards substrate during light；Detector, this detector can measure the light reflected from substrate；And meter
Calculation machine, this computer can be analyzed the signal of self-detector, and calculate whether have detected that terminal.At some
In CMP system, light beam is led by the window in polishing pad and is drawn towards substrate.
Summary of the invention
Window can be affixed to the downside of polishing pad, cause a part for window to be supported in the groove in platform.This
High surface area between tolerable window and polishing pad contacts, in order to increase the joint between window and polishing pad strong
Degree.
In one aspect, polissoir includes platform, and this platform has flat upper surfaces, is formed at upper surface
In groove, this groove has a basal surface, and is connected to the passage of the basal surface of groove, and polissoir is also
Including polishing pad, this polishing pad comprises polishing layer, polished surface, downside and opening through this polishing pad
Hole, perforate has the lateral dimension little compared with groove, perforate aligned with channel.Solid-state light transmissive window has first
Point, Part I is at least partially located in the perforate in polishing pad, and solid-state light transmissive window also has the
Two parts, Part II is at least partially located in the groove in platform, and Part II has relatively first
The biggest lateral dimension, and extend below polishing layer, it is affixed to polishing the Part II cohesiveness of window
The downside of pad.
The realization of the present invention can include one or more following characteristics.The Part I of window can clog in polishing pad
Perforate.The top surface of the Part I of window can be with the upper surface copline of platform.The basal surface of groove can be parallel
Upper surface in platform.The lower surface of the Part II of window can contact the lower surface of groove.The Part II of window
Lower surface can not be adhered to the lower surface of groove.Polissoir may also comprise the adhesion coating crossing over polishing layer.
Adhesion coating can include double-face adhesive tape.Adhesion coating can adjoin polishing layer.The downside of polishing pad can be by adhesion coating
It is affixed to the upper surface of platform cohesiveness.The top surface of the Part II of window can be by adhesion coating cohesiveness ground
It is affixed to the downside of polishing pad.The top surface of the Part II of window can be affixed under polishing pad cohesiveness
Side.Polishing pad can include polishing layer.Polishing pad can include polishing layer and underlying layer, underlying layer relatively polishing layer
The most incompressible.Part II can have big compared with Part I two to ten times, e.g., from about octuple, horizontal
Size.The Part II of window can laterally fill the groove in platform.Polishing pad can have the thickness less than 1mm
Degree.Polissoir may also comprise optical fiber, at this optical fiber in the channel and be disposed to by window
Part I guides or receives light.Optical fiber can be wider compared with the Part I of window.The side of groove can be to incline
Oblique, and the side of the Part II of window can be inclination.
In another aspect, assemble the method for the window used by polissoir to comprise the following steps: through polishing
Pad forms perforate, and this polishing pad comprises polishing layer, and this polishing layer has polished surface and downside；Formed solid
State light-transmissive window, this solid-state light transmissive window has Part I and Part II, and Part II has and is more than
The lateral dimension of Part I；The Part I of window is inserted the perforate of polishing pad；By the Part II of window
Top surface is affixed to the downside of polishing pad；And polishing pad and window are placed on platform, cause the second of window
The groove that is fitted in the flat upper surfaces of platform of part, and the downside of polishing pad adhere to platform smooth on
Surface.
The realization of the present invention can include one or more following characteristics.Adhesive layer can be formed at the bottom of polishing layer
On, and lining covers this stick, a part for lining is removed around perforate, and the Part II of window
Top surface can be removed contact adhesive in part in lining.
The realization of the present invention can include following potential advantage.Can be formed between window with thin polishing pad and engage by force,
Reduce the probability of serosity seepage, and reduce because causing window to be pulled away from polishing pad from the shearing by polishing substrate
Probability.Additionally, polishing pad can promote the wafer of the spectrum reflected from substrate to wafer uniformity, special
It is not under short wavelength.
The details of one or more embodiment will illustrate in alterations and following description.Can from description and
Accompanying drawing and claim understand the other side of the present invention, feature and advantage.
Accompanying drawing explanation
Fig. 1 is the cross section view of the CMP tool containing polishing pad.
Fig. 2 is the top view of the embodiment with fenestrate polishing pad.
Fig. 3 A is the cross section view that the polishing pad of Fig. 2 is installed on platform.
Fig. 3 B is the cross section view of the polishing pad of Fig. 2.
The method that Fig. 4 to 7 diagram forms polishing pad.
Fig. 8 is another cross section view realized of the polishing pad being installed on platform.
Similar reference numbers instruction similar components in multiple accompanying drawings.
Detailed description of the invention
Window can be affixed to the downside of polishing pad, cause a part for window to be supported in the groove in platform.This
High surface area between tolerable window and polishing pad contacts, in order to increase the joint between window and polishing pad strong
Degree.
As it is shown in figure 1, CMP tool 10 includes rubbing head 12, in order to grasp semiconductor substrate 14 against
Polishing pad 18 on platform 16.CMP tool can enter as described in U.S. Patent No. 5,738,574
Row construction, the complete disclosure of this United States Patent (USP) is expressly incorporated herein with reference pattern.
It may be that such as, product substrate is (e.g., including the product base of multiple memorizeies or processor tube core for substrate
Plate), test substrate, naked substrate and gate substrate (gating substrate).Substrate can be in integrated circuit
In the various stages manufactured, e.g., substrate can be bare crystalline sheet, or substrate can include one or more deposition and/or pattern
Change layer.Term substrate can include circular disc and rectangular sheet.
The live part of polishing pad 18 can include polishing layer 20, polishing layer 20 with polished surface 24 and
Basal surface 22, polished surface 24 is used for contacting substrate, and basal surface 22 is by adhesion coating 28 (e.g., adhesion
Band) it is fixed to platform 16.Adhesion coating 28 can be pressure sensitivity stick.In addition to adhesion zone and any lining, throw
Light pad can be such as made up of single-layer pad, and wherein polishing layer 20 goes for CMP process
Thin durable material is formed.Therefore, the layer of polishing pad can by monolayer polishing layer 20 and adhesion coating 28 (and
Optional lining, this lining can be removed when polishing pad is installed to polished land) constituted.
Polishing layer 20 can be such as made up of polyurathamc, and has at least some to open on polished surface 24
Hole.Adhesion coating 28 can be double-face adhesive tape, and such as, all there is the poly-to benzene of stick (e.g., pressure sensitivity stick) both sides
Dioctyl phthalate second diester (PET) thin layer is (e.g.,).This polishing pad is available from the Fujibo of Tokyo,
This polishing pad brand name is H7000HN.
Seeing Fig. 2, in some implementations, polishing pad 18 has 15.0 inches (381.00mm) to 15.5 English
The radius R of very little (393.70mm), and there is the respective diameters of 30 inches to 31 inches.In some implementations,
Polishing pad 18 can have 21.0 inches (533.4mm) radius to 21.5 inches (546.1mm), and has
The respective diameters of 42 inches to 43 inches.
See Fig. 3 A, in some implementations, groove 26 can be formed in polished surface 24.Groove can present
" Waffle (waffle) " pattern, such as, the intersection hatch patterns of the vertical trench of tool sloped sidewall will polishing
Surface segmentation is multiple rectangle (e.g., square) region.
Returning to Fig. 1, typically, pad material can be got wet with chemical polishing solution 30, chemical polishing solution 30
Abrasive grains can be included.For example, serosity can include potassium hydroxide (potassium hydroxide；KOH)
And pyrolytic silicon dioxide (fumed-silica) granule.But, some glossing can be " without grind
(abrasive-free)”。
When platform is around the central shaft rotation of platform, rubbing head 12 presses to substrate 14, makes substrate 14 support
By polishing pad 18.Additionally, rubbing head 12 generally rotates around the central shaft of rubbing head 12, and pass through transmission
Axle or translation arms 32 and translate the surface of crossing over platform 16.Pressure between substrate with polished surface and relative
Motion, associating polishing solution causes the polishing of substrate together.
Optical aperture 34 is formed in the top surface of platform 16.Including light source 36 (such as laser) and detector
The Optical Surveillance System of 38 (such as photodetectors), can be located at below the top surface of platform 16.For example, light
School superintendent's viewing system can be located in the chamber in platform 16, and this chamber optical connects this optical aperture 34, and can
Along with platform rotates.Light can be sent to substrate from light source 36 by one or more optical fibers 50, and from substrate
It is sent to detector 38.For example, optical fiber 50 can be the optical fiber of bifurcated, has stem portion 52,
This stem portion 52 is close to the window 40 in (e.g., adjacent) polishing pad；It is connected to the first foot 54 of light source 36；
And it is connected to the second foot 56 of detector 38.
(in this case, optical fiber is not can to fill optical aperture 34 with transparent solid-state lamellar body (such as quartz wedge)
Window 40 can be adjoined, but the solid pellet in optical aperture can be adjoined), or optical aperture 34 can be cavity.
In one implementation, Optical Surveillance System and optical aperture are formed as the parts of module, and this module is fitted into platform
In respective slot in.Or, Optical Surveillance System can be to be positioned at the fixed system below platform, and light
Learn perforate and can extend across platform.The available any wavelength between far infrared to ultraviolet of light source 36,
Such as HONGGUANG (although being used as such as broader frequency spectrums such as white lights), and detector 38 can be spectrogrph.
Solid-state window 40 is formed in the polishing pad 18 of top, and the optical aperture 34 in alignment stage.Window
40 and perforate 34 may be disposed, how cause the translation position of no matter rubbing head 12, window 40 and perforate 34
In at least some of period that platform rotates it can be seen that the substrate 14 held by rubbing head 12.
At least in the period that window 40 is adjacent with substrate 14, light source 36 projecting beam passes through perforate 34 and window 40,
Surface with the substrate 14 above clashing into.The synthesis that can be detected is formed by detector 38 from the light of substrate reflection
Light beam.Light source and detector are coupled to not shown computer, and computer self-test surveys the light measured by device reception
Light intensity measured by intensity use determines polishing end point, such as, indicates the exposure of new layer by detection
The reflexive unexpected change of substrate；Calculate from extexine (such as transparent oxide layer) by using principle of interference
The thickness removed；By monitoring the spectrum of reflection light and detecting target optical spectrum；By by a series of through survey
Amount Spectral matching is from the reference spectra of information bank, and determines the linear function of the index value of Fitted reference spectrum
Desired value is reached in where；Or by monitoring the signal meeting predesigned end point standard.
Generally large rectangular window (e.g., 2.25 inches of windows taking advantage of 0.75 inch) is loaded the thinnest polishing layer
One of problem is the stripping during polishing.Specifically, during polishing, side-friction force from substrate can be big
In the molding window adhesion to polishing pad sidewall.
Returning to Fig. 2, window 40 can be less, as diameter is less than about 3mm, in order to reduces during polishing by substrate
The frictional force applied.For example, the upper section of window 40 can be about the border circular areas that 3mm is wide,
Distance D at the center of the polishing pad 18 of centre distance 30 to 31 inch diameter of this border circular areas is about 7.5
Inch (190.50mm), or the polishing pad 18 of centre distance 42 to 43 inch diameter of this border circular areas
Distance D at center is about 9 inches to 11 inches.
Window 40 can have the shape (being likely to have other shape, such as rectangle) of near circular.If window is narrow
Long, the longer dimension of window can be substantially parallel to the radius of the polishing pad at the center by window.Window 40 can
Having a uneven outer rim 42, such as, this outer rim can be longer than circle or the rectangle of analogous shape, e.g., (from
It is seen in top) indentation or other zigzag pattern.This can increase the surface of window and the sidewall contact of polishing pad
Long-pending, and can thus promote the window adhesiveness to polishing pad.
Seeing Fig. 3 A, window 40 includes upper section 40a and section below 40b.Window 40, including top
Part 40a and section below 40b, can be the single lamellar body of single-body type of homogeneous material.Upper section 40a indulges
To alignment section below 40b, but little (that is, on one or two direction being parallel to polished surface) in the horizontal
In section below 40b.Therefore, a part the protruding above in section below 40b of polishing layer 20, cause convex
The edge going out section below 40b beyond upper section 40a forms flange 49.Section below 40b can be at window
The all sides of 40 is laterally protruding beyond upper section 40a, or optionally, and section below 40b can be
Two relative sides of window 40 are laterally protruding beyond upper section 40a, but along other side alignment of window 40.
The upper surface protruding section below 40b beyond upper section 40a can be substantial flat surfaces.Top
Part 40a can be located in section below 40b intracardiac, such as, concentric with section below 40b.Lower section
The lateral dimension of point 40b can be 2 to 10 times of the lateral dimension of upper section 40a big, e.g., about 8 times are greatly.
For example, if window 40 is circular, then upper section 40a can have the diameter of 3mm, and section below
40b can have the diameter of 25mm.
The thickness of upper section 40a can be about the same with section below 40b.Or, upper section 40a can
Thicker than section below 40b or thin.
The upper section 40a of window 40 can protrude into the perforate in adhesion coating 28.Adhesion coating 28 (e.g., adhesion zone)
Edge can adjoin the side of upper section 40a of window 40.Section below 40b of window can protrude into platform 16
Top surface 76 in groove 78 in.
The upper section 40a of window is thick as the combination that polishing layer 20 adds adhesion coating 28.The top of window 40
Top surface 44 and polished surface 24 copline of part 40a.The bottom of the upper section 40a of window 40 can be with
The basal surface copline of adhesion coating 28.
The upper surface of section below 40b is fixed to the downside of polishing layer 20 by a part for adhesion coating 28.
Optionally, the outer rim of the upper section 40a of window 40 can be fixed to the edge, medial wall 48 of polishing layer 20, example
As, by extra stick.
The connection surface increased between the window 40 and the polishing layer 20 that are provided by the connection on flange 49
Region can provide strong joint, reduces the probability of serosity seepage, and reduces because of from the shearing by polishing substrate
Window 40 is caused to be pulled away from the probability of polishing pad 18.The stem portion 52 of optical fiber is adjacent or almost adjoins
Section below 40b.In some implementations, stem portion 52 is wider than the upper section 40a of window 40.
The basal surface of section below 40b of window can be without in the upper surface 76 of cohesiveness ground abutment platforms 16
The bottom of groove 78, such as, the bottom of the groove 78 being supported in the upper surface 76 of platform 16, or with
Other modes are fixed to bottom this.In some implementations, section below 40b of window fills groove 78.
Seeing Fig. 3 B, before being installed on platform 16, polishing pad 18 may also comprise lining 70, except
By window 40 stick the block that section below 40b is covered outside, the end of polishing pad 18 crossed over by lining 70
Adhesion coating 28 on surface 22.Lining 70 can be thin flexible material (e.g., paper), and tool release coating,
Make lining 70 can divest from adhesion coating 28.In some implementations, lining can be non-compressible and usual fluid
Impermeable layer, such as, polyethylene terephthalate (PET), e.g.,On using,
Manually divest lining 70 from adhesion coating 28, and utilize adhesion coating 28 to apply polishing layer 20 to platform 16.
But, lining 70 is not across window 40, but in the block of section below 40b of window 40 (such as, about
The block that 25cm is wide) and be close to place around this block and be removed, to form hole 72, the lower section of window 40
Divide 40b can assemble in hand-hole 72.
Polishing pad 18 is the thinnest, e.g., less than 2mm, e.g., less than 1mm.For example, polishing layer
20, the gross thickness of adhesion coating 28 and lining 70 can be about 0.8 or 0.9mm.Polishing layer 20 can be about 0.7
Or 0.8mm is thick, and adhesion coating 28 and lining 70 provide the thickness of about 0.1mm.The thickness of groove 26
Degree is about the half of polishing pad thickness, such as, similar 0.5mm.
In order to manufacture polishing pad, initially, form polishing layer 20, and with pressure sensitivity adhesion coating 28 and lining 70
Cover the basal surface of polishing layer 20, as shown in Figure 4.Can be before pressure sensitivity adhesion coating 28 be attached, in polishing
Layer 20 is formed the groove 26 part as pad moulding process, or can be after polishing pad is formed, in throwing
Photosphere 20 internal cutting groove 26.Groove 26 can be formed before or after lining 70 is attached.
Referring now to Fig. 5, in some implementations, can be by casting and the polymer of the shape of 40 that hardens in window
Form window 40.In one implementation, polymer is 2 parts of Calthane A 2300 and 3 parts of Calthane B 2300
The mixture of (being available from the Cal Polymers, Inc. in causeway city, California).Before inserting perforate, liquid is gathered
Polymer mixtures can be through degassing, as reached 15 to 30 minutes.Polymer can at room temperature harden, and to reach about 24 little
Time, heating lamp or baking box maybe can be used to shorten firm time.In some implementations, polymer can be poured into
Enter in model, and harden or otherwise solidify to form the window 40 in net shape.In some implementations,
Window 40 can harden with the form of Large Solid State block, and then by this solid slug of processable polymer
Form the window 40 in net shape.
In some implementations, the sidewall 84 of section below 40b can be substantially perpendicular to the basal surface 46 of window 40.
In some implementations, can be formed and press from both sides the sidewall 84 of an angle, as by further in Fig. 7 with basal surface 46
As description is discussed.
Punching press portals 82, and this hole 82 penetrates the whole throwing including polishing layer 20, adhesion coating 28 and lining 70
Light pad 18.Can the size of decision bore 82 with the upper section 40a of accommodating window 40.In some implementations, on
Side's part 40a substantially clogs the hole 82 of polishing pad 18.Can be from top (that is, the tool polished surface of polishing pad
This side) punching press portals 82, such as, by forcing press (machine press).This measure allows with pin-point accuracy
Property and repeatability position position and the size of decision bore 32 in hole 82.
Divest or otherwise remove the part 72 of lining 70 from adhesion coating 28.Now, it is not necessary to serve as a contrast
In 70 divest completely from polishing pad 18.The part that is stripped of lining 70 exposes the adhesion coating portalling around 82
A part for the basal surface 22 of 28.The part 72 being stripped also can be cut, such as, through determining size
Divide with the bottom of accommodating window 40 in the block of flange 49 of 40b, although this step also can be carried out later.
Seeing Fig. 5 and Fig. 6, window 40 is fixed to polishing pad 18, causes upper section 40a to extend into hand-hole
82, and bottom divide 40b upper surface (e.g., flange 49) contact adhesion coating 28.In certain embodiments, may be used
Determine that the size of upper section 40a, to extend substantially across and substantially to fill hole 82, causes when flange 49
When adhering to adhesion coating 28, upper surface 44 and polished surface 24 copline of polishing layer 20.
In addition to lining 70, the optional window support lamellar body 74 crossing over window 40 can be set.For example,
Window supports lamellar body 74 can be fixed to be close to a part for the adhesion coating 28 of the surrounding of window 40.Support lamellar body 74
Thickness can be identical with lining 70 or thinner than lining 70.Supporting lamellar body 74 can be politef
(polytetrafluoroethylene；PTFE), asOr another kind non-cohesive material.Then, group
The polishing pad 18 and the window 40 that close are ready for being shipped for client, such as, are contained in sealed plasthetic bag.
Referring now to Fig. 7, when client receives polishing pad 18 and the window 40 of combination, the removable lining of client,
70 (and window supports lamellar body 74, if present), and is then used by adhesion coating 28 and is attached by polishing pad 18
On platform 16.Section below 40b of window 40 is inserted the groove 78 in the upper surface 76 of platform 16
In.In some method, can partly divest the lining 70 in the peripheral region of window 40, by the lower section of window 40
Part 40b is inserted in groove, and is then divested by the remainder of lining and the remainder of polishing pad is solid
Fixed to platform 16.
Can determine the shape of section below 40b and size so that section below 40b substantially fills groove 78,
Such as, while the upper surface 76 of platform 16 contacts adhesion coating 28, the sidewall 84 of section below 40b
Can all sidewalls 86 of substantial contact groove 78, and the basal surface 46 substantial contact groove 78 of window 40
Base plate 88.
In some implementations, the base plate 88 of groove 78 can be substantially parallel to the upper surface 76 of platform 16.
In some implementations, the sidewall 84 of section below 40b is perpendicular to basal surface 46, and the sidewall of groove 78
86 are perpendicular to polished surface 75.Seeing Fig. 8, in some implementations, the sidewall 84 of section below 40b can
Formed with the angle non-perpendicular to basal surface 46, e.g., between 20 ° and 80 °, e.g., 45 °, and groove
The sidewall 86 of 78 can substantially like angle formed, cause when section below 40b insert groove 78 time,
Sidewall 84 substantially contacts with each other with sidewall 86.For example, sidewall 84 can be from flange 49 to basal surface
46 slope inwardly, and cause section below 40b to form tapered cross-section.Similarly, sidewall 86 can be formed to connect
Close this tapered cross-section.So, when in the groove 78 in window 40 inserts the sidewall 86 tilted, inclination
Sidewall 84 can cause window 40 and polishing pad 18 to show (self-centering) characteristic during oneself puts.
So, polishing pad 18 is adhered to platform 16 by adhesion coating 28, so that window 40 is maintained at platform
In groove 78 in 16.Window 40 can be by base plate 88 vertical support of groove 78, and can be by groove 78
Sidewall 86 laterally keeps.Identical adhesion coating can be contacted, to be glued by window 40 by the top surface making flange 49
Being attached to polishing pad, the downside of polishing pad is fixed to platform 16 by this adhesion coating.
Although having described that some embodiment, but the present invention being not limited thereto.For example, although describe
The window of tool simple circular, but window also can be more complicated, such as rectangular, oval or star.The top of window is divided can
Protrude beyond one or more side of bottom point.It should be appreciated that without departing from the spirit and under the scope of,
Other amendment multiple can be completed.Therefore, during other embodiments also falls into the category of following claims.
Claims (10)
1. a polissoir, including:
Platform, described platform has flat upper surfaces, is formed at the groove in described upper surface, and described groove has
There is lower surface, and be connected to the passage of the described lower surface of described groove；
Polishing pad, described polishing pad includes polishing layer, polished surface, downside, and through described polishing pad
Perforate, described perforate has the lateral dimension less than described groove, and described perforate is directed at described passage；
Crossing over the adhesion coating of described polishing layer, described adhesion coating has a perforate, and wherein said polishing pad is described
Downside is affixed to the described upper surface of described platform by described adhesion coating cohesiveness；And
Solid-state light transmissive window, described solid-state light transmissive window is the single lamellar body of single-body type of homogeneous material and includes
Side's part and section below, the described upper section of described window protrudes into the described perforate in described adhesion coating, institute
Stating upper section to be at least partially located in the described perforate in described polishing pad, described section below is by least
Partly being placed in the described groove in described platform, described section below has the horizontal stroke more than described upper section
To size, and described section below extends below described polishing layer, the top surface of the described section below of described window
It is affixed on the downside of the one of described polishing pad by described adhesion coating cohesiveness, causes the described window flange by described window
Top surface be adhered to described polishing pad with identical contacting of adhesion coating, described adhesion coating is by described polishing pad
Described downside is fixed to described platform.
2. polissoir as claimed in claim 1, the described upper section of wherein said window clogs in described polishing pad
Described perforate.
3. polissoir as claimed in claim 2, the top surface of the described upper section of wherein said window and described throwing
Optical surface copline.
4. polissoir as claimed in claim 1, the lower surface contact of the described section below of wherein said window is described
The described lower surface of groove.
5. polissoir as claimed in claim 4, the described lower surface of the described section below of wherein said window does not glues
It is attached to the described lower surface of described groove.
6. polissoir as claimed in claim 1, wherein said section below have more described upper section big two to
The lateral dimension of ten times.
7. polissoir as claimed in claim 1, wherein said polishing pad has the thickness less than 1mm.
8. polissoir as claimed in claim 1, further includes optical fiber, and described optical fiber is in described passage
In and be disposed to guided by the described upper section of described window or receive light.
9. polissoir as claimed in claim 8, the described upper section of the more described window of wherein said optical fiber is more
Wide.
10. assemble the method for the window used by polissoir, including:
Punching hole passes whole polishing pad, and described whole polishing pad includes polishing layer, adhesion coating and lining,
Described polishing layer has polished surface and downside；
Forming solid-state light transmissive window, described solid-state light transmissive window has upper section and a section below, described under
Side's part has the lateral dimension more than described upper section；
A part for described lining is removed to expose the end table of the described adhesion coating around described hole from described adhesion coating
The part in face；
The described upper section of described window is inserted the described hole in described polishing pad, the upper portion of wherein said window
Divide and protrude in the described hole in described adhesion coating；
The top surface of the described section below of described window is affixed to the described downside of described polishing layer, described window
The described top surface of described section below is affixed to the described downside of described polishing layer by described adhesion coating cohesiveness；
Remove the remainder of described lining；And
Described polishing pad and window are placed on platform and use described adhesion coating that described polishing pad is affixed to institute
State on platform, cause the described section below of described window to be fitted into the groove in the flat upper surfaces of described platform, and
The described downside of described polishing layer is adhered to the described flat upper surfaces of described platform and described window by described window
The top surface of flange is adhered to described polishing pad with identical contacting of adhesion coating, and described adhesion coating is by polishing layer
Described downside is fixed to described platform.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/778,760 | 2010-05-12 | ||
| US12/778,760 US20110281510A1 (en) | 2010-05-12 | 2010-05-12 | Pad Window Insert |
| PCT/US2011/034215 WO2011142975A2 (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102893377A CN102893377A (en) | 2013-01-23 |
| CN102893377B true CN102893377B (en) | 2016-08-10 |
Family
ID=44912183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180023970.8A Active CN102893377B (en) | 2010-05-12 | 2011-04-27 | Pad window insert |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110281510A1 (en) |
| JP (1) | JP2013526420A (en) |
| KR (2) | KR101762936B1 (en) |
| CN (1) | CN102893377B (en) |
| TW (3) | TWI611866B (en) |
| WO (1) | WO2011142975A2 (en) |
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| US8535115B2 (en) * | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
| US8961266B2 (en) | 2013-03-15 | 2015-02-24 | Applied Materials, Inc. | Polishing pad with secondary window seal |
| US9308620B2 (en) * | 2013-09-18 | 2016-04-12 | Texas Instruments Incorporated | Permeated grooving in CMP polishing pads |
| US10012494B2 (en) | 2013-10-25 | 2018-07-03 | Applied Materials, Inc. | Grouping spectral data from polishing substrates |
| JP6838811B2 (en) | 2014-05-02 | 2021-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | Method of polishing intermittent structured polished articles and workpieces |
| SG11201806662WA (en) * | 2016-02-26 | 2018-09-27 | Applied Materials Inc | Window in thin polishing pad |
| US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
| JP6883475B2 (en) * | 2017-06-06 | 2021-06-09 | 株式会社荏原製作所 | Polishing table and polishing equipment equipped with it |
| JP7015667B2 (en) * | 2017-10-02 | 2022-02-03 | 株式会社ディスコ | Polishing equipment |
| JP2020001162A (en) * | 2018-06-28 | 2020-01-09 | 株式会社荏原製作所 | Polishing pad laminate, polishing pad positioning jig, and method of applying polishing pad to polishing table |
| US11571782B2 (en) * | 2018-11-28 | 2023-02-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Single bodied platen housing a detection module for CMP systems |
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- 2011-04-27 KR KR1020127032411A patent/KR101762936B1/en active IP Right Grant
- 2011-04-27 JP JP2013510125A patent/JP2013526420A/en not_active Withdrawn
- 2011-04-27 CN CN201180023970.8A patent/CN102893377B/en active Active
- 2011-04-27 KR KR1020177020536A patent/KR101956848B1/en active IP Right Grant
- 2011-04-28 TW TW100114926A patent/TWI611866B/en active
- 2011-04-28 TW TW106137496A patent/TWI663021B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| US20110281510A1 (en) | 2011-11-17 |
| CN102893377A (en) | 2013-01-23 |
| KR101956848B1 (en) | 2019-03-11 |
| KR20130103674A (en) | 2013-09-24 |
| TWI663020B (en) | 2019-06-21 |
| WO2011142975A2 (en) | 2011-11-17 |
| KR20170088444A (en) | 2017-08-01 |
| TWI663021B (en) | 2019-06-21 |
| TW201217104A (en) | 2012-05-01 |
| KR101762936B1 (en) | 2017-07-28 |
| JP2013526420A (en) | 2013-06-24 |
| TW201742705A (en) | 2017-12-16 |
| WO2011142975A3 (en) | 2012-03-01 |
| TWI611866B (en) | 2018-01-21 |
| TW201817541A (en) | 2018-05-16 |
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