CN102950856A - Polyimide composite film for printed circuit boards - Google Patents
Polyimide composite film for printed circuit boards Download PDFInfo
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- CN102950856A CN102950856A CN2011102485709A CN201110248570A CN102950856A CN 102950856 A CN102950856 A CN 102950856A CN 2011102485709 A CN2011102485709 A CN 2011102485709A CN 201110248570 A CN201110248570 A CN 201110248570A CN 102950856 A CN102950856 A CN 102950856A
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Abstract
The invention discloses a polyimide composite film for printed circuit boards. The polyimide composite film comprises a plurality of monolayer polyimide film layers and a plurality of adhesive layers, each adhesive layer is positioned between each two adjacent polyimide film layers and adheres the same, the polyimide film layers and the adhesive layers form a composite laminated structure, and warping height of the polyimide composite film adhered to a circuit board is decreased by the aid of the specific thickness of the composite laminated structure of the polyimide composite film and the specific thickness of each material layer in the composite laminated structure. The polyimide composite film with a printing ink layer is capable of further decreasing the warping height and is more applicable to consumption electronic products with the requirement on circuit pattern protection.
Description
Technical field
The present invention relates to a kind of polyimides coverlay, especially a kind of smooth and have a polyimide composite film that covers the circuit effect.
Background technology
The polyimide resin heat endurance is high and have excellent insulating properties, mechanical strength, reach resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As being used for the insulating barrier of flexible printed wiring board (Flexible Printed Circuit), perhaps be used for further electronic components, for example the reinforcement purposes of printed circuit board (PCB).
Kapton has been widely used in electronic material, wherein, the polyimides stiffening plate that printed circuit board (PCB) is used, generally can divide into individual layer slab or combined type polyimides stiffening plate, and the combined type stiffening plate, such as the disclosed polyimides plate structure of Taiwan patent I257898, it is the combined type polyimide plate that forms different-thickness with the thermmohardening solid of the polyimide plate of 2 Mills (mil, 1mil=0.0254mm) and different-thickness.Yet polyimide composite film is to be subject to the thickness of polyimide film cost and composite membrane in using the problem that meets with, and can't cover the circuit layout pattern and is easy to be plagiarized by the same trade.In addition, composite membrane is by the combination of polyimides and adhesion agent layer and get, but its two thermal expansion coefficient difference often causes pasting to flexible circuit board for the composite membrane of reinforcement the phenomenon of generation warpage.
Therefore, still need a kind of polyimide composite film that is difficult for warpage and has screening effect.
Summary of the invention
In order to overcome defects, the invention provides a kind of polyimide composite film for printed circuit board (PCB), described polyimide composite film for printed circuit board (PCB) can reduce composite membrane and paste depth of camber to the circuit board.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of polyimide composite film for printed circuit board (PCB), polyimide film and some layers of adhesion agent layer of comprising some layers of individual layer, described adhesion agent layer is between adjacent polyimide film and bonding adjacent polyimide film, described some strata acid imide films and some layers of adhesion agent layer consist of composite lamainated structure, and the gross thickness Z of described composite lamainated structure meets the relation of following formula (I):
mX
1+m’X
2+nY＝Z (I)
(I) in the formula, X
1Expression thickness is the polyimide film of the individual layer of 1mil, X
2Expression thickness is the polyimide film of the individual layer of 2mil; M is X
1The number of plies of represented polyimide film, m ' is X
2The number of plies of represented polyimide film; N represents the number of plies of described adhesion agent layer; Y represents the thickness of every layer of described adhesion agent layer, and described Y value decides according to specific Z value, and wherein, described Z value is 6 to 15mil, and described composite lamainated structure is symmetrical structure.
The present invention also can adopt following technical measures further to realize in order to solve its technical problem:
Preferably, described m be 2, m ' be 1 and Z be 6mil.That is, the gross thickness of composite lamainated structure is 6mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 1, the number of plies of solid be 2 and thickness be 25 μ m.
Preferably, described m be 1, m ' be 2 and Z be 7mil.That is, the gross thickness of composite lamainated structure is 7mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 1, thickness is polyimide film-X of 2mil
2The number of plies be 2, the number of plies of solid be 2 and thickness be 25 μ m.
Preferably, described m is that 2, m ' is that 2, Z is one of 8mil and 9mil.That is, when the gross thickness of composite lamainated structure was 8mil, wherein, thickness was polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 2, the number of plies of solid be 3 and thickness be 16.7 μ m; When the gross thickness of composite lamainated structure was 9mil, wherein, thickness was polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 2, the number of plies of solid be 3 and thickness be 25 μ m.Preferably, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
Preferably, described m be 4, m ' be 1 and Z be 10mil.That is, the gross thickness of composite lamainated structure is 10mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 4, thickness is polyimide film-X of 2mil
2The number of plies be 1, the number of plies of solid be 4 and thickness be 25 μ m.
Preferably, described m be 2, m ' be 3 and Z be 11mil.That is, the gross thickness of composite lamainated structure is 11mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 3, the number of plies of solid be 4 and thickness be 18.7 μ m.The outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
Preferably, described m be 2, m ' be 3 and Z be 12mil.That is, the gross thickness of composite lamainated structure is 12mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 3, the number of plies of solid be 4 and thickness be 25 μ m.The outermost layer of described composite lamainated structure is all the polyimide film that thickness is 1mil.
Preferably, described m be 1, m ' be 4 and Z be 13mil.That is, the gross thickness of composite lamainated structure is 13mil, and wherein, thickness is polyimide film-X of 1mil
1The number of plies be 1, thickness is polyimide film-X of 2mil
2The number of plies be 4, the number of plies of solid be 4 and thickness be 25 μ m.
Preferably, described m is that 2, m ' is that 4, Z is one of 14mil and 15mil.That is, when the gross thickness of composite lamainated structure was 14mil, wherein, thickness was polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 4, the number of plies of solid be 5 and thickness be 20 μ m; When the gross thickness of composite lamainated structure was 15mil, wherein, thickness was polyimide film-X of 1mil
1The number of plies be 2, thickness is polyimide film-X of 2mil
2The number of plies be 4, the number of plies of solid be 5 and thickness be 25 μ m.The outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
Preferably, described polyimide composite film for printed circuit board (PCB) also comprises pure glue-line, and described pure glue-line is formed on the bottom surface of described composite lamainated structure, and pure glue-line is used for described polyimide composite film is covered on circuit board, preferably, the thickness of described pure glue-line is 10 to 40 μ m.
Preferably, described polyimide composite film for printed circuit board (PCB) also comprises ink lay, and described composite lamainated structure is folded between described pure glue-line and the ink lay, and preferably, the thickness of described ink lay is 13 to 15 μ m.In addition, described ink lay can comprise the developers such as carbon dust, carbon nanotube or titanium dioxide, or even the heat radiation powder of one or more the mixing formations in carborundum, boron nitride, aluminium oxide and the aluminium nitride, therefore, has more the circuit screening effect.
The invention has the beneficial effects as follows: the polyimide composite film for printed circuit board (PCB) of the present invention is the specific thicknesses of utilizing the specific thickness of its composite lamainated structure and each material layer of composite lamainated structure; reduce polyimide composite film and paste depth of camber to the circuit board; when having ink lay; can further reduce depth of camber, and be more suitable for be used to the consumption electronic products that holding circuit pattern demand is arranged.
Description of drawings
Fig. 1 is polyimide compound film structure of the present invention (not having ink lay);
Fig. 2 is the polyimide compound film structure with ink lay of the present invention;
Fig. 3 is that the gross thickness Z of composite lamainated structure of the present invention is 8 or 9 polyimide compound film structure schematic diagram;
Fig. 4 is that the gross thickness Z of composite lamainated structure of the present invention is 11 polyimide compound film structure schematic diagram;
Fig. 5 is that the gross thickness Z of composite lamainated structure of the present invention is 12 polyimide compound film structure schematic diagram;
Fig. 6 is that the gross thickness Z of composite lamainated structure of the present invention is 14 or 15 polyimide compound film structure schematic diagram.
The specific embodiment
Below by specific instantiation explanation embodiments of the present invention, be familiar with this skill personage and can understand easily advantage of the present invention and effect by content disclosed in the present specification.The present invention also can be implemented in other different mode,, under not departing from disclosed category, can give different modifications and change that is.
As shown in Figure 1, polyimide composite film 100 of the present invention, comprise some strata acid imide films 101 and be formed at adhesion agent layer 102 between the described polyimide film 101, described some strata acid imide films 101 and some layers of adhesion agent layer 102 consist of composite lamainated structure, the pure glue-line 103 that also can comprise the bottom surface that is formed at described composite lamainated structure, described polyimide composite film 100 is to be provided as stiffening plate.
As shown in Figure 2, be another polyimide composite film 100 ' structure of the present invention, polyimide composite film 100 ' shown in Figure 2 is roughly the same with polyimide composite film 100 structures shown in Figure 1, difference is, polyimide composite film 100 ' shown in Figure 2 is than polyimide composite film shown in Figure 1 one deck more than 100 ink lay 104, and described ink lay 104 is formed at the end face of described composite lamainated structure.
Among the present invention, the thickness of described ink lay is between 13 to 15 μ m; And the thickness of described pure glue-line is between 10 to 40 μ m.
The ink lay that polyimide composite film of the present invention comprises comprises the developer of white or black.Described ink lay also can comprise epoxy resin, one or more are selected from the heat radiation powder of carborundum, boron nitride, aluminium oxide and group that aluminium nitride becomes, and has heat sinking function to make polyimide composite film of the present invention.For satisfying various electronic product demand, white products application demand person, this white developer is selected from one or more of titanium dioxide and group that Chinese white forms.And the preferred circuit of needs pattern screening effect person is arranged, and can select the black developer, it is selected from black pigment, carbon dust and group that carbon nanotube forms one or more.In this article, the toner that pigment is also contained dyestuff or is commonly called as, and pigment can comprise with the obtained person of organic or inorganic material.
Find after deliberation, the used white developer of the present invention is with after epoxy resin mixes, can make composite membrane have excellent reflectivity, wherein, the white developer account for this epoxy resin solid content 60 to 95wt%, even and if white developer content is up to the 95wt% of resin solid content, but the thickness of control reflection layer still can make the reflecting layer be unlikely to come off between 5 to 50 microns.As for the content of black developer then with account for this epoxy resin solid content 3 to 15wt%, and with 4 to 8wt% for better.
In this polyimide composite film, there is no particular restriction for the material category of employed polyimide film and adhesion agent layer, is preferably the not halogen-containing polyimide material of use and solid, and better is to use to have from stickiness and not halogen-containing solid.
Institute is stressed that, in the polyimide composite film of the present invention, can be according to the gross thickness needs of composite lamainated structure, and adjust individual layer polyimide film number of stories m and the m ' of 1mil and 2mil in the composite membrane according to formula (I), thickness Y and the adhesion agent layer number of plies n of each adhesion agent layer adjusted in collocation, to form the composite lamainated structure of required gross thickness:
mX
1+m’X
2+nY＝Z (I)
(I) in the formula, X
1Expression thickness is the polyimide film of the individual layer of 1mil, X
2Expression thickness is the polyimide film of the individual layer of 2mil; M is X
1The number of plies of represented polyimide film, m ' is X
2The number of plies of represented polyimide film; N represents the number of plies of described adhesion agent layer; Y represents the thickness of every layer of described adhesion agent layer, and described Y value decides according to specific Z value, and wherein, described Z value is 6 to 15mil, and described composite lamainated structure is symmetrical structure.
That is, polyimide composite film of the present invention can be adjusted the composition number of plies and the thickness of polyimide film and adhesion agent layer according to want composite lamainated structure gross thickness, has the polyimide composite film of high flatness with formation.
The present invention utilizes the specific thicknesses of polyimide film in the specific thickness of composite lamainated structure and the composite lamainated structure and the thickness of adhesion agent layer, reduce polyimide composite film and paste depth of camber to the circuit board, in addition, in order to improve the flatness of described polyimide film, though without more concrete theoretical foundation, the present invention applies ink lay and pure glue-line respectively at end face and the bottom surface of described composite lamainated structure, described composite lamainated structure is folded between described pure glue-line and the described ink lay, further reduces depth of camber.
In the present invention, do not limit employed solid and pure glue material, but usually, be to use the epoxide resin type resin.
The various embodiments of the present invention general configuration is identical, and difference is thickness and the number of plies of the thickness of polyimide film and the number of plies, adhesion agent layer and whether has ink lay, below the distinctive points of various embodiments of the present invention is shown in the following table 1 with tabular form:
Table 1:
Wherein, in embodiment 5,6,7 and 8, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 3, described polyimide composite film comprises two layers of polyimide film 101a that is positioned at the outermost 2mil of composite lamainated structure; Two layers of polyimide film 101b that is folded in the 1mil in the middle of the described polyimide film 101a; And be formed at adhesion agent layer 102 between described polyimide film 101a or the 101b.
Wherein, in embodiment 11 and 12, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 4, described polyimide composite film comprises two layers of polyimide film 101a that is positioned at the outermost 2mil of composite lamainated structure; Sequentially be folded in the polyimide film 101a of polyimide film 101b, 2mil of the 1mil in the middle of the described polyimide film 101a and the polyimide film 101b of 1mil; And be formed at adhesion agent layer 102 between described polyimide film 101a or the 101b.
Wherein, in embodiment 13 and 14, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 5, described polyimide composite film comprises two layers of polyimide film 101b that is positioned at the outermost 2mil of composite lamainated structure; Be folded in the polyimide film 101a of 3 layers of middle 2mil of described polyimide film 101b; And be formed at adhesion agent layer 102 between described polyimide film 101a or the 101b.
Wherein, in embodiment 17,18,19 and 20, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 6, described polyimide composite film comprises two layers of polyimide film 101a that is positioned at the outermost 2mil of composite lamainated structure; Sequentially be folded in the polyimide film 101b of polyimide film 101b, 1mil of polyimide film 101a, 1mil of the 2mil in the middle of the described polyimide film 101a and the polyimide film 101a of 2mil; And be formed at adhesion agent layer 102 between described polyimide film 101a or the 101b.
The preparation method of polyimide composite film of the present invention is as follows:
At first, individual layer polyimide film surface-coated one deck thermmohardening solid (Asia electricity material epoxide-resin glue at 1mil, model AEM-HQLV-N-002), also can adopt the thermoplasticity polyimide resin of model AEM-TPI-N-001, after placing the baking oven heat drying, individual layer polyimide film pressing by hot roller and another layer 2mil, then, slaking is 1 hour under 180 ℃ of conditions, then in this composite membrane sample surfaces coating one deck thermmohardening solid, after placing the baking oven heat drying, be the individual layer polyimide film pressing of 1mil or 2mil by hot roller and another layer, again slaking 1 hour under 180 ℃ of conditions, so repeat above-mentioned steps, at last, apply pure glue-line in an outermost polyimide film lateral surface, form the polyimide composite film sample.
Also can be last, respectively at this some strata acid imide film two outermost surface coating printing ink layers and pure glue, form the polyimide composite film sample.
On the other hand, polyimide compound film structure of the present invention can be formed through stacked pressing by the individual layer polyimide film of odd-level 1mil and the individual layer polyimide film of even level 2mil.Perhaps, polyimide compound film structure of the present invention can be formed by the individual layer polyimide film of odd-level 2mil and the stacking pressing of individual layer polyimide film of even level 1mil.
Test case: the measurement of polyimide composite film angularity
Data by each embodiment in the above-mentioned table 1 prepare polyimide composite film of the present invention.In including the polyimide composite film of ink lay, described ink lay comprises epoxy resin, carbon dust or titanium dioxide powder (E.I.Du Pont Company produces, and model is R-103).
In addition, prepare again the reference examples sample, the composite membrane of described reference examples sample is that it does not comprise ink lay such as the disclosed polyimides plate structure of Taiwan patent I257898, only forms the combined type polyimide plate of different-thickness with the thermmohardening solid of the polyimide plate of 2mil and different-thickness.The reference examples sample of same sequence number is identical with the gross thickness of embodiment sample.
The composite membrane of embodiment and reference examples sample all is the pure glue (trade name D3430) that uses Sony Corporation to produce.Then, composite membrane is cut into the size of 25cm * 25cm, and on 3-Layer (three layers) double-surface flexible copper foil substrate that is pressure bonded to 74.5 ± 1um under 180 ℃ of conditions, carry out slaking with 160 ℃ condition again, again each embodiment sample is placed on the smooth flat, leave standstill 20 minutes after, measure four corners depth of camber (centimetre), carry out the flatness test, the result is embedded in table 2.
Table 2:
Shown in table 2 result, under the identical condition of gross thickness (Z), compared to reference examples only with 2mil polyimide plate and the formed polyimide composite film of different-thickness solid, the depth of camber less of polyimide composite film of the present invention, thereby has a better flatness, and along with gross thickness increases, flatness is more obvious.In addition, compare, the depth of camber of polyimide composite film sample that is covered with ink lay is less.
Above-mentioned specification and embodiment only are illustrative principle of the present invention and effect thereof, but not are used for restriction the present invention.The scope of the present invention should be listed such as claims.
Claims (15)
1. polyimide composite film that is used for printed circuit board (PCB), polyimide film and some layers of adhesion agent layer of comprising some layers of individual layer, described adhesion agent layer is between adjacent polyimide film and bonding adjacent polyimide film, described some strata acid imide films and some layers of adhesion agent layer consist of composite lamainated structure, and it is characterized in that: the gross thickness Z of described composite lamainated structure meets the relation of following formula (I):
mX
1+m’X
2+nY＝Z (I)
(I) in the formula, X
1Expression thickness is the polyimide film of the individual layer of 1mil, X
2Expression thickness is the polyimide film of the individual layer of 2mil; M is X
1The number of plies of represented polyimide film, m ' is X
2The number of plies of represented polyimide film; N represents the number of plies of described adhesion agent layer; Y represents the thickness of every layer of described adhesion agent layer, and described Y value decides according to specific Z value, and wherein, described Z value is 6 to 15mil, and described composite lamainated structure is symmetrical structure.
2. the polyimide composite film for printed circuit board (PCB) according to claim 1 is characterized in that: described m is 2, m ' be 1 and Z be 6mil.
3. the polyimide composite film for printed circuit board (PCB) according to claim 1 is characterized in that: described m is 1, m ' be 2 and Z be 7mil.
4. the polyimide composite film for printed circuit board (PCB) according to claim 1, it is characterized in that: described m is that 2, m ' is that 2, Z is one of 8mil and 9mil.
5. the polyimide composite film for printed circuit board (PCB) according to claim 4, it is characterized in that: the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
6. the polyimide composite film for printed circuit board (PCB) according to claim 1 is characterized in that: described m is 4, m ' be 1 and Z be 10mil.
7. the polyimide composite film for printed circuit board (PCB) according to claim 1 is characterized in that: described m is 2, m ' be 3 and Z be 11mil.
8. the polyimide composite film for printed circuit board (PCB) according to claim 7, it is characterized in that: the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
9. the polyimide composite film for printed circuit board (PCB) according to claim 1 is characterized in that: described m is 2, m ' be 3 and Z be 12mil.
10. the polyimide composite film for printed circuit board (PCB) according to claim 9, it is characterized in that: the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 1mil.
11. the polyimide composite film for printed circuit board (PCB) according to claim 1 is characterized in that: described m is 1, m ' be 4 and Z be 13mil.
12. the polyimide composite film for printed circuit board (PCB) according to claim 1 is characterized in that: described m is that 2, m ' is that 4, Z is one of 14mil and 15mil.
13. the polyimide composite film for printed circuit board (PCB) according to claim 12 is characterized in that: the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
14. to 13 described polyimide composite films for printed circuit board (PCB), it is characterized in that according to claim 1: comprise pure glue-line, described pure glue-line is formed on the bottom surface of described composite lamainated structure, and the thickness of described pure glue-line is 10 to 40 μ m.
15. according to claim 1 to 13 described polyimide composite films for printed circuit board (PCB), it is characterized in that: comprise pure glue-line and ink lay, described composite lamainated structure is folded between described pure glue-line and the ink lay, the thickness of described ink lay is 13 to 15 μ m, and the thickness of described pure glue-line is 10 to 40 μ m.
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| CN201110248570.9A CN102950856B (en) | 2011-08-26 | 2011-08-26 | Polyimide composite film for printed circuit boards |
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|---|---|---|---|
| CN201110248570.9A CN102950856B (en) | 2011-08-26 | 2011-08-26 | Polyimide composite film for printed circuit boards |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107253860A (en) * | 2017-06-19 | 2017-10-17 | 广东思泉新材料股份有限公司 | A kind of preparation method of graphite temperature-uniforming plate |
| WO2021120116A1 (en) * | 2019-12-19 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Flexible polyimide plate |
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| JP2003008159A (en) * | 2001-06-22 | 2003-01-10 | Toray Ind Inc | Flexible printed circuit board |
| KR20060050662A (en) * | 2004-08-31 | 2006-05-19 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Preparation of flexible copper foil/polyimido laminate |
| CN101422979A (en) * | 2007-10-29 | 2009-05-06 | 亚洲电材股份有限公司 | Polyimide composite film |
| TWM366471U (en) * | 2009-05-27 | 2009-10-11 | Asia Electronic Material Co | Polyimide composite film and reinforcement plate used for printed circuit board |
| TWM380180U (en) * | 2010-01-06 | 2010-05-11 | Asia Electronic Material Co | Polyimide composite film used for printed circuit board |
| CN202242153U (en) * | 2011-08-26 | 2012-05-30 | 昆山雅森电子材料科技有限公司 | Polyimide composite film for printed circuit board |
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| US4543295A (en) * | 1980-09-22 | 1985-09-24 | The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration | High temperature polyimide film laminates and process for preparation thereof |
| JP2003008159A (en) * | 2001-06-22 | 2003-01-10 | Toray Ind Inc | Flexible printed circuit board |
| KR20060050662A (en) * | 2004-08-31 | 2006-05-19 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Preparation of flexible copper foil/polyimido laminate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107253860A (en) * | 2017-06-19 | 2017-10-17 | 广东思泉新材料股份有限公司 | A kind of preparation method of graphite temperature-uniforming plate |
| WO2021120116A1 (en) * | 2019-12-19 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Flexible polyimide plate |
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| Publication number | Publication date |
|---|---|
| CN102950856B (en) | 2014-10-29 |
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