CN102950856B - Polyimide composite film for printed circuit boards - Google Patents
Polyimide composite film for printed circuit boards Download PDFInfo
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- CN102950856B CN102950856B CN201110248570.9A CN201110248570A CN102950856B CN 102950856 B CN102950856 B CN 102950856B CN 201110248570 A CN201110248570 A CN 201110248570A CN 102950856 B CN102950856 B CN 102950856B
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Abstract
The invention discloses a polyimide composite film for printed circuit boards. The polyimide composite film comprises a plurality of monolayer polyimide film layers and a plurality of adhesive layers, each adhesive layer is positioned between each two adjacent polyimide film layers and adheres the same, the polyimide film layers and the adhesive layers form a composite laminated structure, and warping height of the polyimide composite film adhered to a circuit board is decreased by the aid of the specific thickness of the composite laminated structure of the polyimide composite film and the specific thickness of each material layer in the composite laminated structure. The polyimide composite film with a printing ink layer is capable of further decreasing the warping height and is more applicable to consumption electronic products with the requirement on circuit pattern protection.
Description
Technical field
The present invention relates to a kind of polyimides coverlay, especially a kind of smooth and there is the polyimide composite film that covers circuit effect.
Background technology
Polyimide resin heat endurance is high and have excellent insulating properties, mechanical strength and resistance to chemical corrosion, is usually used in multiple electronics rapidoprint.As the insulating barrier for flexible printed wiring board (Flexible Printed Circuit), or further for electronic components, the reinforcement purposes of printed circuit board (PCB) for example.
Kapton has been widely used in electronic material, wherein, the polyimides stiffening plate that printed circuit board (PCB) is used, generally can divide into individual layer slab or combined type polyimides stiffening plate, and combined type stiffening plate, polyimides plate structure as disclosed in Taiwan patent I257898, it is with the thermmohardening solid of the polyimide plate of 2 Mills (mil, 1mil=0.0254mm) and different-thickness, to form the combined type polyimide plate of different-thickness.Yet polyimide composite film, in the upper problem meeting with of application, is to be limited to the thickness of polyimide film cost and composite membrane, cannot covers circuit layout pattern and be easy to be plagiarized by the same trade.In addition, composite membrane is by the combination of polyimides and adhesion agent layer and obtain, but its two thermal expansion coefficient difference often causes pasting to flexible circuit board for the composite membrane of reinforcement, the phenomenon of generation warpage.
Therefore, still need a kind of polyimide composite film that is difficult for warpage and there is screening effect.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of polyimide composite film for printed circuit board (PCB), the described polyimide composite film for printed circuit board (PCB) can reduce composite membrane and paste to the depth of camber after circuit board.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of polyimide composite film for printed circuit board (PCB), the polyimide film and the some layers of adhesion agent layer that comprise some layers of individual layer, described adhesion agent layer is between adjacent polyimide film and bonding adjacent polyimide film, described some layers of polyimide film and some layers of adhesion agent layer form composite lamainated structure, and the gross thickness Z of described composite lamainated structure meets the relation of following formula (I):
mX
1+m’X
2+nY＝Z (I)
(I) in formula, X
1the polyimide film that represents the individual layer that thickness is 1mil, X
2the polyimide film that represents the individual layer that thickness is 2mil; M is X
1the number of plies of represented polyimide film, m ' is X
2the number of plies of represented polyimide film; N represents the number of plies of described adhesion agent layer; Y represents the thickness of every layer of described adhesion agent layer, and described Y value determines according to specific Z value, and wherein, described Z value is 6 to 15mil, and described composite lamainated structure is symmetrical structure.
The present invention also can adopt following technical measures further to realize in order to solve its technical problem:
Preferably, described m be 2, m ' be 1 and Z be 6mil.That is, the gross thickness of composite lamainated structure is 6mil, wherein, and polyimide film-X that thickness is 1mil
1the number of plies be 2, polyimide film-X that thickness is 2mil
2the number of plies be 1, the number of plies of solid be 2 and thickness be 25 μ m.
Preferably, described m be 1, m ' be 2 and Z be 7mil.That is, the gross thickness of composite lamainated structure is 7mil, wherein, and polyimide film-X that thickness is 1mil
1the number of plies be 1, polyimide film-X that thickness is 2mil
2the number of plies be 2, the number of plies of solid be 2 and thickness be 25 μ m.
Preferably, described m is that 2, m ' is that 2, Z is one of 8mil and 9mil.That is, when the gross thickness of composite lamainated structure is 8mil, wherein, polyimide film-X that thickness is 1mil
1the number of plies be 2, polyimide film-X that thickness is 2mil
2the number of plies be 2, the number of plies of solid be 3 and thickness be 16.7 μ m; When the gross thickness of composite lamainated structure is 9mil, wherein, polyimide film-X that thickness is 1mil
1the number of plies be 2, polyimide film-X that thickness is 2mil
2the number of plies be 2, the number of plies of solid be 3 and thickness be 25 μ m.Preferably, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
Preferably, described m be 4, m ' be 1 and Z be 10mil.That is, the gross thickness of composite lamainated structure is 10mil, wherein, and polyimide film-X that thickness is 1mil
1the number of plies be 4, polyimide film-X that thickness is 2mil
2the number of plies be 1, the number of plies of solid be 4 and thickness be 25 μ m.
Preferably, described m be 2, m ' be 3 and Z be 11mil.That is, the gross thickness of composite lamainated structure is 11mil, wherein, and polyimide film-X that thickness is 1mil
1the number of plies be 2, polyimide film-X that thickness is 2mil
2the number of plies be 3, the number of plies of solid be 4 and thickness be 18.7 μ m.The outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
Preferably, described m be 2, m ' be 3 and Z be 12mil.That is, the gross thickness of composite lamainated structure is 12mil, wherein, and polyimide film-X that thickness is 1mil
1the number of plies be 2, polyimide film-X that thickness is 2mil
2the number of plies be 3, the number of plies of solid be 4 and thickness be 25 μ m.The outermost layer of described composite lamainated structure is all the polyimide film that thickness is 1mil.
Preferably, described m be 1, m ' be 4 and Z be 13mil.That is, the gross thickness of composite lamainated structure is 13mil, wherein, and polyimide film-X that thickness is 1mil
1the number of plies be 1, polyimide film-X that thickness is 2mil
2the number of plies be 4, the number of plies of solid be 4 and thickness be 25 μ m.
Preferably, described m is that 2, m ' is that 4, Z is one of 14mil and 15mil.That is, when the gross thickness of composite lamainated structure is 14mil, wherein, polyimide film-X that thickness is 1mil
1the number of plies be 2, polyimide film-X that thickness is 2mil
2the number of plies be 4, the number of plies of solid be 5 and thickness be 20 μ m; When the gross thickness of composite lamainated structure is 15mil, wherein, polyimide film-X that thickness is 1mil
1the number of plies be 2, polyimide film-X that thickness is 2mil
2the number of plies be 4, the number of plies of solid be 5 and thickness be 25 μ m.The outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
Preferably, the described polyimide composite film for printed circuit board (PCB) also comprises pure glue-line, and described pure glue-line is formed on the bottom surface of described composite lamainated structure, and pure glue-line is for being covered on circuit board by described polyimide composite film, preferably, the thickness of described pure glue-line is 10 to 40 μ m.
Preferably, the described polyimide composite film for printed circuit board (PCB) also comprises ink layer, and described composite lamainated structure is folded between described pure glue-line and ink layer, and preferably, the thickness of described ink layer is 13 to 15 μ m.In addition, described ink layer can comprise the developers such as carbon dust, carbon nanotube or titanium dioxide, or even the heat radiation powder of one or more the mixing formations in carborundum, boron nitride, aluminium oxide and aluminium nitride, therefore, has more circuit screening effect.
The invention has the beneficial effects as follows: the polyimide composite film for printed circuit board (PCB) of the present invention is the specific thicknesses of utilizing the specific thickness of its composite lamainated structure and each material layer of composite lamainated structure; reducing polyimide composite film pastes to the depth of camber after circuit board; while thering is ink layer; can further reduce depth of camber, and be more suitable for for there being the consumption electronic products of holding circuit pattern demand.
Accompanying drawing explanation
Fig. 1 is polyimide compound film structure of the present invention (not having ink layer);
Fig. 2 is the polyimide compound film structure with ink layer of the present invention;
Fig. 3 is that the gross thickness Z of composite lamainated structure of the present invention is 8 or 9 polyimide compound film structure schematic diagram;
Fig. 4 is the polyimide compound film structure schematic diagram that the gross thickness Z of composite lamainated structure of the present invention is 11;
Fig. 5 is the polyimide compound film structure schematic diagram that the gross thickness Z of composite lamainated structure of the present invention is 12;
Fig. 6 is that the gross thickness Z of composite lamainated structure of the present invention is 14 or 15 polyimide compound film structure schematic diagram.
The specific embodiment
Below, by specific instantiation explanation embodiments of the present invention, be familiar with this skill personage and can understand easily advantage of the present invention and effect by content disclosed in the present specification.The present invention also can be implemented in other different mode,, under not departing from disclosed category, can give different modifications and change that is.
As shown in Figure 1, polyimide composite film 100 of the present invention, comprise some layers of polyimide film 101 and be formed at the adhesion agent layer 102 between described polyimide film 101, described some layers of polyimide film 101 and some layers of adhesion agent layer 102 form composite lamainated structure, the pure glue-line 103 that also can comprise the bottom surface that is formed at described composite lamainated structure, described polyimide composite film 100 is to be provided as stiffening plate.
As shown in Figure 2, for another polyimide composite film 100 ' structure of the present invention, polyimide composite film 100 ' shown in Fig. 2 is roughly the same with polyimide composite film 100 structures shown in Fig. 1, difference is, polyimide composite film 100 ' shown in Fig. 2 is than the one deck more than 100 of the polyimide composite film shown in Fig. 1 ink layer 104, and described ink layer 104 is formed at the end face of described composite lamainated structure.
In the present invention, the thickness of described ink layer is between 13 to 15 μ m; And the thickness of described pure glue-line is between 10 to 40 μ m.
The ink layer that polyimide composite film of the present invention comprises comprises the developer of white or black.Described ink layer also can comprise epoxy resin, one or more are selected from the heat radiation powder of carborundum, boron nitride, aluminium oxide and aluminium nitride Suo Cheng group, to make polyimide composite film of the present invention have heat sinking function.For meeting various electronic product demand, white products application demand person, this white developer is selected from one or more of titanium dioxide and group that Chinese white forms.And have the preferred circuit of needs pattern screening effect person, and can select black developer, it is selected from black pigment, carbon dust and group that carbon nanotube forms one or more.In this article, the toner that pigment is also contained dyestuff or is commonly called as, and pigment can comprise with the obtained person of organic or inorganic material.
Find after deliberation, after the present invention's white developer used mixes with epoxy resin, can make composite membrane there is excellent reflectivity, wherein, white developer account for this epoxy resin solid content 60 to 95wt%, and even if white developer content is up to the 95wt% of resin solid content, but the thickness of controlling reflection layer still can make reflecting layer be unlikely to come off between 5 to 50 microns.As for the content of black developer with account for this epoxy resin solid content 3 to 15wt%, and with 4 to 8wt% for better.
In this polyimide composite film, there is no particular restriction for the polyimide film using and the material category of adhesion agent layer, is preferably the not halogen-containing polyimide material of use and solid, and better is to use to have from stickiness and not halogen-containing solid.
Institute is stressed that, in polyimide composite film of the present invention, can be according to the gross thickness needs of composite lamainated structure, and according to individual layer polyimide film number of stories m and the m ' of 1mil and 2mil in formula (I) adjustment composite membrane, thickness Y and the adhesion agent layer number of plies n of each adhesion agent layer adjusted in collocation, to form the composite lamainated structure of required gross thickness:
mX
1+m’X
2+nY＝Z (I)
(I) in formula, X
1the polyimide film that represents the individual layer that thickness is 1mil, X
2the polyimide film that represents the individual layer that thickness is 2mil; M is X
1the number of plies of represented polyimide film, m ' is X
2the number of plies of represented polyimide film; N represents the number of plies of described adhesion agent layer; Y represents the thickness of every layer of described adhesion agent layer, and described Y value determines according to specific Z value, and wherein, described Z value is 6 to 15mil, and described composite lamainated structure is symmetrical structure.
That is, polyimide composite film of the present invention, can, according to want composite lamainated structure gross thickness, adjust the composition number of plies and the thickness of polyimide film and adhesion agent layer, to form the polyimide composite film with high flatness.
The present invention utilizes the specific thicknesses of polyimide film and the thickness of adhesion agent layer in the specific thickness of composite lamainated structure and composite lamainated structure, reducing polyimide composite film pastes to the depth of camber after circuit board, in addition, in order to improve the flatness of described polyimide film, though without more concrete theoretical foundation, the present invention applies ink layer and pure glue-line respectively at end face and the bottom surface of described composite lamainated structure, described composite lamainated structure is folded between described pure glue-line and described ink layer, further reduces depth of camber.
In the present invention, do not limit solid and the pure glue material using, but conventionally, be to use epoxide resin type resin.
Various embodiments of the present invention general configuration is identical, and difference is thickness and the number of plies of the thickness of polyimide film and the number of plies, adhesion agent layer and whether has ink layer, below the distinctive points of various embodiments of the present invention is shown in following table 1 with tabular form:
Table 1:
Wherein, in embodiment 5,6,7 and 8, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 3, described polyimide composite film comprises two layers of polyimide film 101a that is positioned at the outermost 2mil of composite lamainated structure; Two layers of polyimide film 101b that is folded in the 1mil in the middle of described polyimide film 101a; And be formed at the adhesion agent layer 102 between described polyimide film 101a or 101b.
Wherein, in embodiment 11 and 12, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 4, described polyimide composite film comprises two layers of polyimide film 101a that is positioned at the outermost 2mil of composite lamainated structure; Sequentially be folded in the polyimide film 101a of polyimide film 101b, 2mil and the polyimide film 101b of 1mil of the middle 1mil of described polyimide film 101a; And be formed at the adhesion agent layer 102 between described polyimide film 101a or 101b.
Wherein, in embodiment 13 and 14, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 5, described polyimide composite film comprises two layers of polyimide film 101b that is positioned at the outermost 2mil of composite lamainated structure; Be folded in the polyimide film 101a of 3 layers of middle 2mil of described polyimide film 101b; And be formed at the adhesion agent layer 102 between described polyimide film 101a or 101b.
Wherein, in embodiment 17,18,19 and 20, the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.For example, as shown in Figure 6, described polyimide composite film comprises two layers of polyimide film 101a that is positioned at the outermost 2mil of composite lamainated structure; Sequentially be folded in the polyimide film 101b of polyimide film 101b, 1mil and the polyimide film 101a of 2mil of polyimide film 101a, the 1mil of the middle 2mil of described polyimide film 101a; And be formed at the adhesion agent layer 102 between described polyimide film 101a or 101b.
The preparation method of polyimide composite film of the present invention is as follows:
First, individual layer polyimide film surface-coated one deck thermmohardening solid (Asia electricity material epoxide-resin glue at 1mil, model AEM-HQLV-N-002), also can adopt the thermoplasticity polyimide resin of model AEM-TPI-N-001, be placed in after baking oven heat drying, by the individual layer polyimide film pressing of hot roller and another layer of 2mil, then, under 180 ℃ of conditions, slaking is 1 hour, then in this composite membrane sample surfaces coating one deck thermmohardening solid, be placed in after baking oven heat drying, it by hot roller and another layer, is the individual layer polyimide film pressing of 1mil or 2mil, slaking 1 hour under 180 ℃ of conditions again, so repeat above-mentioned steps, finally, in an outermost polyimide film lateral surface, apply pure glue-line, form polyimide composite film sample.
Also can be last, respectively at this some layers of polyimide film two outermost surface coating printing ink layers and pure glue, form polyimide composite film sample.
On the other hand, polyimide compound film structure of the present invention can be formed through stacked pressing by the individual layer polyimide film of odd-level 1mil and the individual layer polyimide film of even level 2mil.Or polyimide compound film structure of the present invention can be formed by the individual layer polyimide film of odd-level 2mil and the stacking pressing of individual layer polyimide film of even level 1mil.
Test case: the measurement of polyimide composite film angularity
Data by each embodiment in above-mentioned table 1 are prepared polyimide composite film of the present invention.In including the polyimide composite film of ink layer, described ink layer comprises epoxy resin, carbon dust or titanium dioxide powder (E.I.Du Pont Company produces, and model is R-103).
In addition, prepare again reference examples sample, the composite membrane of described reference examples sample is polyimides plate structure as disclosed in Taiwan patent I257898, and it does not comprise ink layer, only with the polyimide plate of 2mil and the thermmohardening solid of different-thickness, forms the combined type polyimide plate of different-thickness.The reference examples sample of same sequence number is identical with the gross thickness of embodiment sample.
The composite membrane of embodiment and reference examples sample is all the pure glue (trade name D3430) that uses Sony Corporation to produce.Then, composite membrane is cut into the size of 25cm * 25cm, and under 180 ℃ of conditions, be pressure bonded on 3-Layer (three layers) double-surface flexible copper foil substrate of 74.5 ± 1um, with the condition of 160 ℃, carry out slaking again, again each embodiment sample is placed in smooth flat, after standing 20 minutes, the depth of camber of four corners of measurement (centimetre), carry out flatness test, result is embedded in table 2.
Table 2:
As shown in table 2 result, under the identical condition of gross thickness (Z), compared to reference examples only with 2mil polyimide plate and the formed polyimide composite film of different-thickness solid, the depth of camber of polyimide composite film of the present invention is relatively little, thereby there is preferably flatness, and along with gross thickness increases, flatness is more obvious.In addition, compare, the depth of camber of polyimide composite film sample that is covered with ink layer is less.
Above-mentioned description and embodiment are only illustrative principle of the present invention and effect thereof, but not for limiting the present invention.The scope of the present invention, should be as listed in claims.
Claims (15)
1. the polyimide composite film for printed circuit board (PCB), the polyimide film and the some layers of adhesion agent layer that comprise some layers of individual layer, described adhesion agent layer is between adjacent polyimide film and bonding adjacent polyimide film, described some layers of polyimide film and some layers of adhesion agent layer form composite lamainated structure, it is characterized in that: the gross thickness Z of described composite lamainated structure meets the relation of following formula (I):
mX
1+m’X
2+nY＝Z (I)
(I) in formula, X
1the polyimide film that represents the individual layer that thickness is 1mil, X
2the polyimide film that represents the individual layer that thickness is 2mil; M is X
1the number of plies of represented polyimide film, m ' is X
2the number of plies of represented polyimide film; N represents the number of plies of described adhesion agent layer; Y represents the thickness of every layer of described adhesion agent layer, and described Y value determines according to specific Z value, and wherein, described Z value is 6 to 15mil, and described composite lamainated structure is symmetrical structure.
2. the polyimide composite film for printed circuit board (PCB) according to claim 1, is characterized in that: described m is 2, m ' be 1 and Z be 6mil.
3. the polyimide composite film for printed circuit board (PCB) according to claim 1, is characterized in that: described m is 1, m ' be 2 and Z be 7mil.
4. the polyimide composite film for printed circuit board (PCB) according to claim 1, is characterized in that: described m is that 2, m ' is that 2, Z is one of 8mil and 9mil.
5. the polyimide composite film for printed circuit board (PCB) according to claim 4, is characterized in that: the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
6. the polyimide composite film for printed circuit board (PCB) according to claim 1, is characterized in that: described m is 4, m ' be 1 and Z be 10mil.
7. the polyimide composite film for printed circuit board (PCB) according to claim 1, is characterized in that: described m is 2, m ' be 3 and Z be 11mil.
8. the polyimide composite film for printed circuit board (PCB) according to claim 7, is characterized in that: the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
9. the polyimide composite film for printed circuit board (PCB) according to claim 1, is characterized in that: described m is 2, m ' be 3 and Z be 12mil.
10. the polyimide composite film for printed circuit board (PCB) according to claim 9, is characterized in that: the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 1mil.
11. polyimide composite films for printed circuit board (PCB) according to claim 1, is characterized in that: described m is 1, m ' be 4 and Z be 13mil.
12. polyimide composite films for printed circuit board (PCB) according to claim 1, is characterized in that: described m is that 2, m ' is that 4, Z is one of 14mil and 15mil.
13. polyimide composite films for printed circuit board (PCB) according to claim 12, is characterized in that: the outermost layer of described composite lamainated structure is all the polyimide film that thickness is 2mil.
14. according to the polyimide composite film for printed circuit board (PCB) described in any one in claim 1 to 13, it is characterized in that: comprise pure glue-line, described pure glue-line is formed on the bottom surface of described composite lamainated structure, and the thickness of described pure glue-line is 10 to 40 μ m.
15. according to the polyimide composite film for printed circuit board (PCB) described in any one in claim 1 to 13, it is characterized in that: comprise pure glue-line and ink layer, described composite lamainated structure is folded between described pure glue-line and ink layer, the thickness of described ink layer is 13 to 15 μ m, and the thickness of described pure glue-line is 10 to 40 μ m.
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| CN201110248570.9A CN102950856B (en) | 2011-08-26 | 2011-08-26 | Polyimide composite film for printed circuit boards |
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| CN107253860A (en) * | 2017-06-19 | 2017-10-17 | 广东思泉新材料股份有限公司 | A kind of preparation method of graphite temperature-uniforming plate |
| WO2021120116A1 (en) * | 2019-12-19 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Flexible polyimide plate |
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| US4543295A (en) * | 1980-09-22 | 1985-09-24 | The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration | High temperature polyimide film laminates and process for preparation thereof |
| CN101422979A (en) * | 2007-10-29 | 2009-05-06 | 亚洲电材股份有限公司 | Polyimide composite film |
| TWM366471U (en) * | 2009-05-27 | 2009-10-11 | Asia Electronic Material Co | Polyimide composite film and reinforcement plate used for printed circuit board |
| TWM380180U (en) * | 2010-01-06 | 2010-05-11 | Asia Electronic Material Co | Polyimide composite film used for printed circuit board |
| CN202242153U (en) * | 2011-08-26 | 2012-05-30 | 昆山雅森电子材料科技有限公司 | Polyimide composite film for printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003008159A (en) * | 2001-06-22 | 2003-01-10 | Toray Ind Inc | Flexible printed circuit board |
| JP2006068920A (en) * | 2004-08-31 | 2006-03-16 | Shin Etsu Chem Co Ltd | Manufacturing method of flexible copper foil/polyimide laminate |
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| US4543295A (en) * | 1980-09-22 | 1985-09-24 | The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration | High temperature polyimide film laminates and process for preparation thereof |
| CN101422979A (en) * | 2007-10-29 | 2009-05-06 | 亚洲电材股份有限公司 | Polyimide composite film |
| TWM366471U (en) * | 2009-05-27 | 2009-10-11 | Asia Electronic Material Co | Polyimide composite film and reinforcement plate used for printed circuit board |
| TWM380180U (en) * | 2010-01-06 | 2010-05-11 | Asia Electronic Material Co | Polyimide composite film used for printed circuit board |
| CN202242153U (en) * | 2011-08-26 | 2012-05-30 | 昆山雅森电子材料科技有限公司 | Polyimide composite film for printed circuit board |
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