CN102955976B - A kind of frangible false proof RFID etches electronic tag and manufacturing process thereof - Google Patents
A kind of frangible false proof RFID etches electronic tag and manufacturing process thereof Download PDFInfo
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- CN102955976B CN102955976B CN201210007952.7A CN201210007952A CN102955976B CN 102955976 B CN102955976 B CN 102955976B CN 201210007952 A CN201210007952 A CN 201210007952A CN 102955976 B CN102955976 B CN 102955976B
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Abstract
The open a kind of frangible false proof RFID of the present invention etches electronic tag and manufacturing process thereof, comprises carrying base material, the first glue-line, etch layer, RFID chip, the 2nd glue-line and frangible ply of paper; First glue-line is between carrying base material and etch layer, etch layer is that Copper Foil or aluminium foil are shaping through etch process, this carrying base material, the first glue-line, etch layer and RFID chip form core material assembly, frangible ply of paper bonds over the etch layer by the 2nd glue-line, and the viscosity of the 2nd glue-line is better than the viscosity of the first glue-line. Manufacturing process comprises the following steps: form etching accuracy tolerance in the step of ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna; Core material assembly is made together with being assembled in RFID chip by etching antenna; Get frangible ply of paper and it is coated with the 2nd glue-line at a surface thereof; By the 2nd glue-line on frangible ply of paper and on core material assembly etching antenna compound and formed frangible false proof RFID etch electronic tag. The present invention relates to electronic tag and there is and feature that performance high big by degree of damaging during tear-off.
Description
Technical field
The present invention relates to RFID of Internet-of-things field, say that relating to a kind of frangible false proof RFID etches electronic tag and manufacturing process thereof more specifically, it is applicable to, and various needs are false proof, the RFID application scenario of tamper, especially become the expensive goods such as vehicle management, drinks, medicine, makeup and trace to the source and false proof ideal chose.
Background technology
Common frangible label is taking frangible printing material as fabric, and the back side scribbles extraordinary Strong Adhesive, and its fabric breaking tenacity is far below tackiness agent adhesive capacity; When frangible label sticked uncover again after base material time, material path scission, the display packing of product was opened, and cannot restore. But common frangible label is mainly made up of the bar code printing out, its information storage amount is little, and needs scanner to read one by one.
RFID label tag has that volume is little, capacity is big, life-span length and the feature such as reusable, and it can support that fast reading and writing, non-visual recognition, mobile identifications, multi-targets recognition, location and long-term follow manage; RFID technique combines with the technology such as internet, communication, it may be achieved item tracking and information sharing in global range. In recent years, along with the development of the technology such as large-scale integrated circuit, network communication and information security, RFID technique enters the commercial applications stage. Owing to having the features such as high-speed mobile object identification, multi-targets recognition and contactless identification, RFID technique demonstrates huge development potentiality and application space, is considered as one of 21st century the most rising information technology.
At present along with property safety, food safety, drug safety etc. are more and more paid attention to by country, frangible false proof RFID tracing to the source with false proof more and more important above, at the common frangible label of more and more fields replacement.
But, the frangible false proof RFID label tag on market its at least there is following defect:
One, the technical scheme that existing frangible false proof RFID label tag adopts usually, be by electrically conductive ink or metallic particles by silk screen printing on fragile paper material and PET base material, form printing RFID antenna, but owing to printing antenna precision is low, conducting material resistive impedance is inconsistent, therefore high-quality RFID cannot be made all the time, the scope of application is narrow;
Two, existing frangible antifalsification label is only often that part damages this label, is not namely fundamentally damage this label, thus it is inadequate to have damage intensity, and then has the shortcoming of antifalsification difference.
In view of this, the present inventor furthers investigate for the above-mentioned defect of existing frangible false proof RFID, then has this case to produce.
Summary of the invention
First object of the present invention is to provide a kind of frangible false proof RFID to etch electronic tag, has the defect of antifalsification difference not to solve electronic tag damage intensity when tearing to pieces in prior art.
In order to reach above-mentioned purpose, the solution of the present invention is:
A kind of frangible false proof RFID etches electronic tag, wherein, comprising: carrying base material, the first glue-line, etch layer, RFID chip, the 2nd glue-line and frangible ply of paper; This first glue-line is between carrying base material and etch layer, this etch layer is that Copper Foil or aluminium foil are shaping through etch process, this carrying base material, the first glue-line, etch layer and RFID chip form core material assembly, this frangible ply of paper bonds over the etch layer by the 2nd glue-line, and the viscosity of the 2nd glue-line is better than the viscosity of the first glue-line.
Further, on this etch layer the etching accuracy tolerance of circuit at ± 0.02mm and/or the minimum spacing≤0.12mm of circuit end points.
Further, this carrying base material is selected from PI film or PET film.
Further, the 2nd glue-line be selected from polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, dimeracid asphalt mixtures modified by epoxy resin ester gum one or more; This first glue-line be selected from polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, acrylate pressure sensitive adhesive, silica gel one or more.
2nd object of the present invention is to provide a kind of frangible false proof RFID to etch the manufacturing process of electronic tag, wherein, comprises the steps:
1., select aluminium foil or Copper Foil, and carry out compound with carrying base material after being coated with the first glue-line thereon, and form composite base material;
2., on the aluminium foil or Copper Foil of composite base material, photosensitive type matrix material is formed;
3., by the sky line graph needing etching make film egative film, adopt exposure method, above wire portion line transitions to photosensitive type matrix material;
4. the composite base material, by exposure get well and post photosensitive type matrix material carries out developing, etch and stripping, and so formation etches accuracy tolerance at ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna;
5. together with, by etching antenna with RFID chip being assembled in, and core material assembly is made;
6., get frangible ply of paper, and it is coated with the 2nd glue-line that viscosity is better than the first glue-line at a surface thereof; Etching antenna place surface recombination on the surface at the 2nd glue-line place on frangible ply of paper and core material assembly is formed frangible false proof RFID and etches electronic tag.
Further, the thickness of this aluminium foil or Copper Foil selects 9～38um, and the thickness of this carrying base material is then chosen as 12～200um, and this frangible ply of paper is then chosen as 30～100um.
Further, this photosensitive type matrix material is photosensitive type dry film material, photosensitive type wet film material or photosensitive type dielectric ink material.
Further, this carrying base material is selected from PI film or PET film.
Further, the 2nd glue-line be selected from polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, dimeracid asphalt mixtures modified by epoxy resin ester gum one or more; This first glue-line be selected from polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, acrylate pressure sensitive adhesive, silica gel one or more.
Further, this step 2. in shaping employing volume to volume laminating between photosensitive type matrix material and aluminium foil or Copper Foil, this step 3. in exposure be then adopt volume to volume exposure machine to expose.
Further, in this step etching step 4., etching solution is the hydrochloric acid of 30%～35% and the water mixed liquid of hydrogen peroxide, and wherein the volume ratio of hydrochloric acid and hydrogen peroxide is 3:1.
After adopting said structure, a kind of frangible false proof RFID that the present invention relates to etches electronic tag and manufacturing process thereof, and it at least has following useful effect:
One, owing to this etch layer side is bonding with carrying base material (then identified thing is substituted when etching electronic tag and come into operation) by the first glue-line, another side is bonding with fragile paper by the 2nd glue-line; Viscosity based on the 2nd glue-line is greater than the first glue-line in addition, therefore when the illegal tear-off electronic tag of people, namely this frangible ply of paper by tear-off together with etch layer, can allow etch layer be out of shape completely, so make whole electronic tag be damaged completely;
Two, owing to it have employed carrying base material, the first glue-line and aluminium foil or Copper Foil manufacturing in moulding process, so that it is guaranteed that the implementation condition of etch process; Simultaneously owing to have employed the mode of formation photosensitive type matrix material and exposure and realizing line transitions, then leading to overetched technique again, the etching accuracy tolerance so making to be formed in circuit on the etch layer on carrying base material and the first glue-line is at ± 0.02mm and/or the minimum spacing≤0.12mm of circuit end points. Thus make circuit precision in the present invention greatly improve, thus improve the overall performance of whole etching electronic tag.
Accompanying drawing explanation
Fig. 1 is the sectional view that a kind of frangible false proof RFID that the present invention relates to etches electronic tag;
Fig. 2 is the schematic diagram that a kind of frangible false proof RFID that the present invention relates to etches a kind of specific embodiment of etching antenna in electronic tag.
In figure:
Etching electronic tag 100
Carrying base material 1 first glue-line 2
Etch layer 3 the 2nd glue-line 4
Frangible ply of paper 5.
Embodiment
In order to explain the technical scheme of the present invention further, below by specific embodiment, the present invention will be described in detail.
As shown in Figure 1, a kind of frangible false proof RFID that the present invention relates to etches electronic tag 100, comprise carrying base material 1, first glue-line 2, etch layer 3, RFID chip (not shown), 2nd glue-line 4 and frangible ply of paper 5, this first glue-line 2 is between carrying base material 1 and etch layer 3, concrete, this first glue-line 2 is selected from from polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, acrylate pressure sensitive adhesive, one or more of silica gel, thus play effect that carrying base material 1 is bonded together with etch layer 3 on the one hand, also playing on the other hand allows etch layer can realize good cohesive action from different surperficial objects.
This etch layer 3 for aluminium foil or Copper Foil shaping through etch process, and on this etch layer 3, the etching accuracy tolerance of circuit is at ± 0.02mm and/or the minimum spacing≤0.12mm of circuit end points. Preferably, this carrying base material 1 can be selected from PI film or PET film. As shown in Figure 2, it is the schematic diagram of etch layer 3 one kinds of embodiments in this etching electronic tag 100.
This carrying base material 1, first glue-line 2, etch layer 3 form core material assembly with RFID chip, and this frangible ply of paper 5 is bonded on etch layer 3 by the 2nd glue-line 4, and the viscosity of the 2nd glue-line 4 is better than the viscosity of the first glue-line 2. Preferably, the 2nd glue-line 4 can be selected from polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, dimeracid asphalt mixtures modified by epoxy resin ester gum one or more.
Thus, due to this etch layer 3 side by the first glue-line 2 with carrying base material 1(etch electronic tag 100 come into operation time then identified thing substituted) bonding, another side pass through the 2nd glue-line 4 and bonding with fragile paper; Viscosity based on the 2nd glue-line 4 is greater than the first glue-line 2 in addition, therefore when the illegal tear-off electronic tag of people, namely this frangible ply of paper 5 by tear-off together with etch layer 3, can allow etch layer 3 be out of shape completely, so make whole electronic tag be damaged completely;
A kind of frangible false proof RFID that the present invention relates to allow etches electronic tag 100 can by fully open, and the present invention also provides its manufacturing process, first its first better embodiment is described in detail below:
Embodiment one:
This manufacturing process, comprises the steps:
1., select thickness to be the aluminium foil of 9～38um, and it is that the carrying base material of 12～200um carries out compound with thickness after being coated with the first glue-line thereon, and form composite base material;
2., on the aluminium foil of composite base material, photosensitive type matrix material is formed; In the present embodiment, this photosensitive type matrix material adopts photosensitive type dry film material, and it can also be substituted by photosensitive type wet film material or photosensitive type dielectric ink material certainly;
3., by the sky line graph needing etching make film egative film, adopt exposure method, above wire portion line transitions to photosensitive type matrix material;
4. the composite base material, by exposure get well and post photosensitive type matrix material carries out developing, etch and stripping, and so formation etches accuracy tolerance at ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna. Preferably, in this etching step, etching solution is the hydrochloric acid of 30%～35% and the water mixed liquid of hydrogen peroxide, and wherein the volume ratio of hydrochloric acid and hydrogen peroxide is 3:1, thus provides safeguard for preferably etching precision;
5. together with, by etching antenna with RFID chip being assembled in, and core material assembly is made, i.e. INLAY; Preferably, this etching antenna adopts the mode of upside-down mounting welding to be connected with RFID chip;
6., get the frangible ply of paper that thickness is 30～100um, and it is coated with the 2nd glue-line at a surface thereof; Etching antenna place surface recombination on the surface at the 2nd glue-line place on frangible ply of paper and core material assembly is formed frangible false proof RFID and etches electronic tag.
It should be noted that, in the present embodiment, this carrying base material can be selected from PI film or PET film; 2nd glue-line then can select polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, dimeracid asphalt mixtures modified by epoxy resin ester gum one or more, so that it is guaranteed that have enough cohesive strengths.
Embodiment two:
In the present embodiment, the step of itself and the first embodiment is substantially identical, and its difference is to substitute aluminium foil Copper Foil.
Embodiment three:
In the present embodiment, it can adopt the first embodiment and whole schemes of the 2nd embodiment, but it improves the object of production efficiency to reach, 3. 2. abovementioned steps all improved by it with abovementioned steps, concrete, this step 2. in shaping employing volume to volume laminating between photosensitive type matrix material and aluminium foil or Copper Foil, this step 3. in exposure be then adopt volume to volume exposure machine to expose.
As from the foregoing, a kind of frangible false proof RFID that the present invention relates to etches the manufacturing process of electronic tag, owing to it have employed carrying base material, the first glue-line and aluminium foil or Copper Foil manufacturing in moulding process, so that it is guaranteed that the implementation condition of etch process;Simultaneously owing to have employed the mode of formation photosensitive type matrix material and exposure and realizing line transitions, then leading to overetched technique again, the etching accuracy tolerance so making to be formed in circuit on the etch layer on carrying base material and the first glue-line is at ± 0.02mm and/or the minimum spacing≤0.12mm of circuit end points. Thus the present invention is compared with prior art, and it also has circuit precision and greatly improves, and improves the overall performance of whole etching electronic tag.
The product form of above-described embodiment and graphic and non-limiting the present invention and style, the suitable change that it is done by any person of an ordinary skill in the technical field or modification, all should be considered as not departing from the patent category of the present invention.
Claims (7)
1. a frangible false proof RFID etches electronic tag, it is characterised in that, comprising: carrying base material, the first glue-line, etch layer, RFID chip, the 2nd glue-line and frangible ply of paper; This first glue-line is between carrying base material and etch layer, this etch layer is that Copper Foil or aluminium foil are shaping through etch process, this carrying base material, the first glue-line, etch layer and RFID chip form core material assembly, this frangible ply of paper bonds over the etch layer by the 2nd glue-line, and the viscosity of the 2nd glue-line is better than the viscosity of the first glue-line;
The thickness of described etch layer is 9-38 μm, and the thickness of described carrying base material is 12-200 μm, and the thickness of described frangible ply of paper is 30-100 μm;
This carrying base material is selected from PI film or PET film; 2nd glue-line be selected from polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, dimeracid asphalt mixtures modified by epoxy resin ester gum one or more; This first glue-line be selected from polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, acrylate pressure sensitive adhesive, silica gel one or more.
2. a kind of frangible false proof RFID as claimed in claim 1 etches electronic tag, it is characterised in that, on this etch layer, the etching accuracy tolerance of circuit is at ± 0.02mm and/or the minimum spacing≤0.12mm of circuit end points.
3. the manufacturing process of a frangible false proof RFID etching electronic tag, it is characterised in that, comprise the steps:
1., select aluminium foil or Copper Foil, and carry out compound with carrying base material after being coated with the first glue-line thereon, and form composite base material;
2., on the aluminium foil or Copper Foil of composite base material, photosensitive type matrix material is formed;
3., by the sky line graph needing etching make film egative film, adopt exposure method, above wire portion line transitions to photosensitive type matrix material;
4. the composite base material, by exposure get well and post photosensitive type matrix material carries out developing, etch and stripping, and so formation etches accuracy tolerance at ± 0.02mm and/or end points minimum spacing≤0.12mm etching antenna;
5. together with, by etching antenna with RFID chip being assembled in, and core material assembly is made;
6., get frangible ply of paper, and it is coated with the 2nd glue-line that viscosity is better than the first glue-line at a surface thereof; Etching antenna place surface recombination on the surface at the 2nd glue-line place on frangible ply of paper and core material assembly is formed frangible false proof RFID and etches electronic tag;
The thickness of this aluminium foil or Copper Foil selects 9～38um, and the thickness of this carrying base material is then chosen as 12～200um, and this frangible ply of paper is then chosen as 30～100um;
2nd glue-line be selected from polyurethane modified epoxy glue, polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, dimeracid asphalt mixtures modified by epoxy resin ester gum one or more; This first glue-line be selected from polyether modified epoxy resin glue, acrylic acid modified asphalt mixtures modified by epoxy resin ester gum, acrylate pressure sensitive adhesive, silica gel one or more.
4. manufacturing process as claimed in claim 3, it is characterised in that, this photosensitive type matrix material is photosensitive type dry film material, photosensitive type wet film material or photosensitive type dielectric ink material.
5. manufacturing process as claimed in claim 3, it is characterised in that, this carrying base material is selected from PI film or PET film.
6. manufacturing process as claimed in claim 3, it is characterised in that, this step 2. in shaping employing volume to volume laminating between photosensitive type matrix material and aluminium foil or Copper Foil, this step 3. in exposure be then adopt volume to volume exposure machine to expose.
7. manufacturing process as claimed in claim 3, it is characterised in that, in this step etching step 4., etching solution is the hydrochloric acid of 30%～35% and the water mixed liquid of hydrogen peroxide, and wherein the volume ratio of hydrochloric acid and hydrogen peroxide is 3:1.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210007952.7A CN102955976B (en) | 2012-01-12 | 2012-01-12 | A kind of frangible false proof RFID etches electronic tag and manufacturing process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210007952.7A CN102955976B (en) | 2012-01-12 | 2012-01-12 | A kind of frangible false proof RFID etches electronic tag and manufacturing process thereof |
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| CN102955976A CN102955976A (en) | 2013-03-06 |
| CN102955976B true CN102955976B (en) | 2016-06-15 |
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| CN110676558B (en) * | 2019-11-04 | 2023-08-29 | 江苏科睿坦电子科技有限公司 | RFID local fragile tag antenna and production process thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265977B1 (en) * | 1998-09-11 | 2001-07-24 | Motorola, Inc. | Radio frequency identification tag apparatus and related method |
| CN101408950A (en) * | 2007-10-11 | 2009-04-15 | 株式会社日立制作所 | RFID tag |
| CN101799882A (en) * | 2009-02-06 | 2010-08-11 | 上海中京电子标签集成技术有限公司 | High-frequency small-size radio frequency identification and manufacturing method of etching antenna thereof |
| CN202632328U (en) * | 2012-01-12 | 2012-12-26 | 厦门英诺尔电子科技股份有限公司 | Frangible anti-fake RFID etching electronic label |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202067300U (en) * | 2011-05-27 | 2011-12-07 | 温州格洛博电子有限公司 | Second-use-prevented RFID anti-counterfeiting label |
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- 2012-01-12 CN CN201210007952.7A patent/CN102955976B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265977B1 (en) * | 1998-09-11 | 2001-07-24 | Motorola, Inc. | Radio frequency identification tag apparatus and related method |
| CN101408950A (en) * | 2007-10-11 | 2009-04-15 | 株式会社日立制作所 | RFID tag |
| CN101799882A (en) * | 2009-02-06 | 2010-08-11 | 上海中京电子标签集成技术有限公司 | High-frequency small-size radio frequency identification and manufacturing method of etching antenna thereof |
| CN202632328U (en) * | 2012-01-12 | 2012-12-26 | 厦门英诺尔电子科技股份有限公司 | Frangible anti-fake RFID etching electronic label |
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