CN103018260B - Defect detection method - Google Patents
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- CN103018260B CN103018260B CN201110298244.9A CN201110298244A CN103018260B CN 103018260 B CN103018260 B CN 103018260B CN 201110298244 A CN201110298244 A CN 201110298244A CN 103018260 B CN103018260 B CN 103018260B
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Abstract
A defect detection method comprises the following steps: providing a regional female threshold for a plurality of regions on a target unit sheet of a female substrate; providing a substrate to be detected, and selecting a to-be-detected unit sheet and a neighboring unit sheet in the to-be-detected substrate; partitioning the to-be-detected unit sheet and the adjacent unit sheet to a plurality of regions, and acquiring the regional to-be-detected pixel of each region on the to-be-detection unit sheet, and acquiring the regional reference pixel in each region on the neighboring region; calculating the regional to-be-detection value and the regional reference value of each region on the to-be-detected unit sheet and the neighboring unit sheet, and acquiring the difference between the regional to-be-detection value and the regional reference value as the regional difference, which is an absolute value; and comparing the regional difference with the regional female threshold, and determining that a defect exists if the regional difference is larger than the regional female threshold. The defect detection method provided by the invention can improve the defect detection accuracy and efficiency.
Description
Technical field
The present invention relates to semiconductor applications, particularly a kind of defect inspection method to substrate.
Background technology
Along with the develop rapidly of VLSI (very large scale integrated circuit) ULSI (Ultra Large Scale Integration), integrated circuit technology manufacture craft becomes and becomes increasingly complex with meticulous, this just requires to form semiconductor devices with higher precision and better homogeneity, and at actual integrated circuit production process, due to the impact of the Different factor such as technology and equipment, often can form not expected defect at substrate surface, such as: grain defect, finally cause the reduction of product yield, therefore, in integrated circuit is produced, the defects detection of Semiconductor substrate also becomes most important.
Fig. 1 is the schematic flow sheet of prior art defect inspection method, comprises step: S101, provides threshold value; S102, obtains an area reference pixel in the pixel to be checked in a region on unit sheet and adjacent dice; S103, according to the gray-scale value of an area reference pixel on the gray-scale value of the pixel to be checked in a region on unit sheet and adjacent dice, obtain the value to be checked of whole unit sheet and the reference value of adjacent dice, and obtain difference between described value to be checked and reference value, described difference is absolute value; S104, the size of more described difference and threshold value, when difference is greater than threshold value, judges defective existence.Gray-scale value represents that the technology of pixel is that known technology is not described in detail in this.The value to be checked of described whole unit sheet is the weighted mean value of the gray-scale value of the pixel to be checked in a region on described unit sheet.
More methods about defects detection please refer to the United States Patent (USP) that the patent No. is US5995218A.
The value to be checked of the sheet of unit described in prior art is obtain according to the gray-scale value in a region on unit sheet, although can sweep speed be improved, but value to be checked accurately can not reflect the actual shape characteristic of unit sheet, during Defect Scanning, very easily cause the incorrect detection of defect, reduce the accuracy and efficiency of Defect Scanning.
Summary of the invention
The problem that the present invention solves there is provided a kind of defect inspection method, improves accuracy and the efficiency of defects detection.
For solving the problem, the invention provides a kind of defect inspection method, comprising step:
There is provided the region in multiple region on maternal substrate one object element sheet maternal threshold value;
There is provided substrate to be checked, unit sheet to be checked and an adjacent dice on selected described substrate to be checked;
Described unit sheet to be checked and adjacent dice are divided into multiple region, and obtain the area reference pixel in each region in the region pixel to be checked in each region on described unit sheet to be checked and adjacent dice;
According to described region pixel to be checked and area reference pixel, calculate region value to be checked and the area reference value in each region in unit sheet to be checked and adjacent dice, obtain difference between described region value to be checked and area reference value and using as region difference, described region difference is absolute value; The size of the maternal threshold value of more described region difference and region, when described region difference is greater than region female parent threshold value, judges defective existence.
Optionally, described maternal substrate and substrate to be checked there is multiple unit sheet with same patterned.
Optionally, on described substrate to be checked, the region value to be checked of unit sheet to be checked is: the variance yields of the difference of the gray-scale value of region pixel to be checked, the maximum gradation value of region pixel to be checked and minimum gradation value, mean value or the region grey scale pixel value to be checked of region grey scale pixel value to be checked.
Optionally, on described substrate to be checked, the area reference value of adjacent dice is: the variance yields of the gray-scale value of area reference pixel, the maximum gradation value of area reference pixel and the difference of minimum gradation value, the mean value of area reference grey scale pixel value or area reference grey scale pixel value.
Optionally, the quantity of described adjacent dice is equal to or greater than 1.
Optionally, the preparation method of the maternal threshold value in described region is: provide maternal substrate; Object element sheet and an adjacent dice on selected described maternal substrate; Described object element sheet and adjacent dice are divided into the quantity N number of region identical with position, obtain the area reference pixel in corresponding 1st ~ N number of region in the maternal seized pixel in region in described object element sheet the 1st ~ N number of region and adjacent dice; According to the gray-scale value of the maternal seized pixel in described region and area reference pixel, calculate the area reference value in the maternal seized value 1st ~ N number of region corresponding to adjacent dice, region in described object element sheet the 1st ~ N number of region; Difference between the area reference value obtaining corresponding 1st ~ N number of region in the maternal seized value in region in the 1st ~ N number of region on described object element sheet and adjacent dice, the maternal threshold value using described difference as region, the maternal threshold value in described region is absolute value.
Optionally, the maternal seized value in the region of described n-quadrant is the weighted mean value of the maternal seized value in region in 1st ~ N-1 region.
Optionally, the reference value of described n-quadrant is the weighted mean value of the reference value in 1st ~ N-1 region.
Optionally, on described maternal substrate target unit sheet, the user that is divided in region is realized by human and machine interface unit.
Optionally, in described maternal substrate target unit sheet and adjacent dice, the division numbers N in region is equal to or greater than 3.
Optionally, also comprise, store the Region dividing line position information of object element sheet on the maternal seized value in described region, the maternal threshold value in region and maternal substrate.
Optionally, on described maternal substrate, the maternal seized value in the region of object element sheet is: the variance yields of the difference of the gray-scale value of the maternal seized pixel in region, the maximum gradation value of the maternal seized pixel in region and minimum gradation value, the maternal seized pixel gray-scale value of mean value or region of the maternal seized pixel gray-scale value in region.
Optionally, on described maternal substrate, the area reference value of adjacent dice is: the variance yields of the gray-scale value of area reference pixel, the maximum gradation value of area reference pixel and the difference of minimum gradation value, the mean value of area reference grey scale pixel value or area reference grey scale pixel value.
Optionally, the maternal threshold value in described region is the value that user is inputted by human and machine interface unit.
Optionally, on described substrate to be checked, unit sheet to be checked is identical with position with the quantity of Region dividing on maternal substrate one object element sheet with position with the quantity of Region dividing in adjacent dice.
Optionally, also comprise, provide the alerting signal that defect exists.
Compared with prior art, technical solution of the present invention has the following advantages:
The division of multizone is carried out to unit sheet on described substrate to be checked, and the value to be checked of respective regions is obtained according to the grey scale pixel value to be checked in each region, the value to be checked in described multiple region forms the value to be checked of whole unit sheet, obtained the value to be checked of whole unit sheet by the gray-scale value in a region compared to prior art, more accurately can reflect the actual shape characteristic of described unit sheet to be checked, therefore, when Defect Scanning, accuracy rate during raising Defect Scanning and efficiency.
Further, the user that is divided in described region is realized by human and machine interface unit, user is according to the repeatability of figure on unit sheet, closeness, the material of figure and the feature of technique determine quantity and the position of Region dividing, improve the selectivity of user operation, and the maternal threshold value in described region is the value that user is inputted by human and machine interface unit, user can carry out the maternal threshold value of setting regions with reference to the difference between the maternal seized value in the region of object element sheet on maternal substrate and the area reference value of adjacent dice, user thinks that the maternal threshold value in corresponding region, region important in technological process is set as the value of less than described difference 5% ~ 20%, the maternal threshold value in corresponding region, unessential region is set as the value of larger than described difference 5% ~ 20%, avoid the problem that real defect can't detect, improve accuracy rate and the efficiency of Defect Scanning.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of prior art defect inspection method;
Fig. 2 is the schematic flow sheet of defect inspection method of the present invention;
Fig. 3 is the structure simplified diagram of defect detection tool of the present invention;
Fig. 4 ~ Fig. 8 is the maternal substrate of the present invention and substrat structure schematic diagram to be checked.
Embodiment
Inventor finds in the process detecting defect in Semiconductor substrate, in prior art, the value to be checked of unit sheet is obtain according to the gray-scale value in a region on unit sheet, and the differentiation in region is obvious on product unit sheet, described value to be checked accurately can not reflect the actual shape characteristic of unit sheet, during Defect Scanning, very easily cause the incorrect detection of defect, defects detection efficiency and accuracy rate low, for overcoming the above problems, inventor proposes a kind of defect inspection method.
With reference to figure 2, it is the schematic flow sheet of defect inspection method embodiment of the present invention.
Step S201, provides the region in multiple region on maternal substrate one object element sheet maternal threshold value;
Step S202, provides substrate to be checked, unit sheet to be checked and an adjacent dice on selected described substrate to be checked;
Step S203, is divided into multiple region by described unit sheet to be checked and adjacent dice, and obtains the area reference pixel in each region in the region pixel to be checked in each region on described unit sheet to be checked and adjacent dice;
Step S204, according to described region pixel to be checked and area reference pixel, calculate region value to be checked and the area reference value in each region in unit sheet to be checked and adjacent dice, obtain difference between described region value to be checked and area reference value and using as region difference, described region difference is absolute value;
Step S205, the size of the maternal threshold value of more described region difference and region, when described region difference is greater than region female parent threshold value, judges defective existence.
With reference to figure 3, be the structure simplified diagram of Defect Scanning instrument used in the present invention, comprise: image acquisition units 310, for scanning the surface of substrate, Information Monitoring; CPU (central processing unit) 311, for carrying out communicating with described image acquisition units 310 and the information that gathers of Treatment Analysis image acquisition units 310, described CPU (central processing unit) 311 also has the function storing relevant information; Human and machine interface unit 312, for the Information Monitoring of the analysis result and image acquisition units 310 that show described CPU (central processing unit) 311, and communicates with CPU (central processing unit) 311 as user terminal.
Step S201, provides the region in multiple region on maternal substrate one object element sheet maternal threshold value.
With reference to figure 4, provide maternal substrate 30, described maternal substrate 30 is formed with many unit sheets (Die) with same patterned, such as unit sheet 301, unit sheet 302, unit sheet 303.Described unit sheet (Die) is formed with similar figure, the figure of such as, L-type shown in Fig. 5 and I type.Note can comprising a large amount of figures in each unit sheet, these figures are divided into again many layers, as a part for groove, through hole or grid etc.
Object element sheet and an adjacent dice on selected described maternal substrate 30, described object element sheet is generally positioned in the middle of described maternal substrate 30, also can be positioned at other positions; Described adjacent dice is positioned on the left of described object element sheet or right side.The object element sheet that the present embodiment is selected is 301, and adjacent dice is 302.
With reference to figure 6, described object element sheet 301 is divided into multiple region by human and machine interface unit 312 (shown in Fig. 3) by user, the division numbers N in described region is equal to or greater than 3, the shape of described Region dividing line is rectangle, or other suitable figures, the quantity of the sheet 301 of object element described in the present embodiment Region dividing is 3, comprising first area 3030, second area 3040, 3rd region 3050, described first area 3030, second area 3040 is that user determines to divide by described human and machine interface unit 312, described 3rd region 3050 confirms voluntarily for described Defect Scanning instrument, for described object element sheet 301 removes first area 3030, other regions beyond second area 3040, preserve described first area 3030, second area 3040, the positional information of the 3rd region 3050 Region dividing line, the defining method of described Region dividing line position information is: for described second area 3040 dividing line positional information, select a point on described object element sheet 301 as initial point, as 20 is initial point, the coordinate of initial point is (0, 0), calculate four summits 50 of the rectangle that described second area 3040 dividing line is formed, 60, 70, the coordinate position of 80, the coordinate position on described four summits is second area 3040 Region dividing line position information, obtain and store the maternal seized pixel in region in described first area 3030, second area 3040, the 3rd region 3050, the maternal seized pixel in described region is gray-scale value, namely pixel is represented with gray-scale value, represent that the technology of pixel is that known technology is not described in detail in this with gray-scale value, pixels all in the present invention is all represent with gray-scale value, selected adjacent dice 302, and described adjacent dice 302 is divided into 3 identical regions according to the Region dividing line position information of the described object element sheet 301 stored, comprise first area 3060, second area 3070, the 3rd region 3080, and obtain the area reference pixel of respective regions simultaneously.On described object element sheet 301, the selection of region quantity and position is determined according to the material of the repeatability of figure on unit sheet, closeness or figure and the importance of figure in processing step by user.
According to area reference pixel in the maternal seized pixel in region on described object element sheet 301 and adjacent dice 302, calculate the area reference value in first area 3060, second area 3070, the 3rd region 3080 in first area 3030 on described object element sheet 301, second area 3040, the maternal seized value in region in the 3rd region 3050 and adjacent dice 302; Obtain the difference between the maternal seized value in region of the described object element sheet 301 area reference value corresponding in described adjacent dice 302, the maternal threshold value using described difference as region, the maternal threshold value in described region is absolute value, stores the maternal threshold value in described region.
The maternal threshold value in described region also can be inputted by human and machine interface unit by user, according to process characteristic, user thinks that the maternal threshold value setting of the region in important region is a little bit smaller, such as: in the first area in object element sheet 301 and adjacent dice 302, be mainly memory block (comprising the region of a large amount of repetitive pattern), then the maternal threshold value in the region of corresponding first area be set to than the difference in the maternal seized value in region, first area 3030 on described object element sheet 301 and adjacent dice 302 between the area reference value of first area 3060 little 5% ~ 20% value, the region maternal threshold value setting in unessential region is a little large, such as: in object element sheet 301 and adjacent dice 302, the 3rd region is mainly background area (being generally the region of unusual light), then the maternal threshold value in the region in corresponding 3rd region be set to than the maternal seized value in the 3rd region, region 3050 on described object element sheet 301 and adjacent dice be difference on 302 between the 3rd region 3080 area reference value large 5% ~ 20% value, adopt such setting, avoid real defects detection less than problem, improve the accuracy and efficiency of Defect Scanning.
On maternal substrate, the maternal seized value in the region of object element sheet is: the variance yields of the difference of the gray-scale value of the maternal seized pixel in region, the maximum gradation value of the maternal seized pixel in region and minimum gradation value, the maternal seized pixel gray-scale value of mean value or region of the maternal seized pixel gray-scale value in region.Such as, on described object element sheet 301, the maternal seized value in the region of first area 3030 is: the variance yields of the difference of the gray-scale value of the maternal seized pixel in first area 3030, the maximum gradation value of the maternal seized pixel in first area 3030 and minimum gradation value, the maternal seized pixel gray-scale value of mean value or first area 3030 of first area 3030 maternal seized pixel gray-scale value.
The maternal seized value in region described in the present embodiment is the variance yields of the maternal seized pixel gray-scale value in region.
On maternal substrate, the area reference value of adjacent dice is: the variance yields of the gray-scale value of area reference pixel, the maximum gradation value of area reference pixel and the difference of minimum gradation value, the mean value of area reference grey scale pixel value or area reference grey scale pixel value.
On described maternal substrate, the selection of the maternal seized value of the selection of the area reference value of adjacent dice and the region of object element sheet is corresponding, and the area reference value of adjacent dice described in the present embodiment is the variance yields of area reference grey scale pixel value.
In other embodiments, on described object element sheet 301, the maternal seized value in the region in the 3rd region 3050 is the weighted mean value of the maternal seized value of the maternal seized value in region and second area 3040 region of first area 3030.In actual production process, 3rd region 3050 is regarded as requiring relatively on the low side to defect, the maternal seized value in the 3rd region, region 3050 obtained by the weighted mean value of the maternal seized value of the maternal seized value in the region of first area 3030 and second area 3040 region can reflect the shape characteristic in the 3rd region 3050 substantially, and do not need to be obtained by the 3rd maternal seized pixel in region 3050, save computing time, improve efficiency.In described adjacent dice 302, the area reference value in the 3rd region 3080 is the weighted mean value of first area 3060 and second area 3070 area reference value, and the flexible strategy of described weighted mean value are identical with the flexible strategy that the 3rd maternal seized value in region 3050 on object element sheet 301 calculates.
Step S202, provides substrate to be checked, unit sheet to be checked and an adjacent dice on selected described substrate to be checked.
With reference to figure 7 and Fig. 8, provide substrate 40 to be checked, described substrate 40 to be checked is formed with the unit sheet (Die) with described maternal substrate 30 (shown in Fig. 4) same patterned.
The quantity of described adjacent dice is equal to or greater than 1, and the quantity of adjacent dice described in the present embodiment is 2.
Unit sheet 401 on described substrate to be checked 40, unit sheet 402, unit sheet 403 are defined as first unit sheet on substrate 40 to be checked, second unit sheet, the 3rd unit sheet, the order of other unit sheet the like.The selection mode of adjacent dice has two kinds of situations: when described first unit sheet is as unit sheet to be checked, selects second unit sheet and the 3rd unit sheet as adjacent dice; When described second unit sheet is as unit sheet to be checked, using first unit sheet and the 3rd unit sheet as adjacent dice, this kind of mode is applicable to all unit sheets outside first unit sheet, namely selects the previous element sheet of unit sheet to be checked and a rear unit sheet as adjacent dice.Using unit sheet 401 as unit sheet to be checked in the present embodiment.
Step S203 and step S204, is divided into multiple region by described unit sheet to be checked and adjacent dice, and obtains the area reference pixel in each region in the region pixel to be checked in each region on described unit sheet to be checked and adjacent dice; According to described region pixel to be checked and area reference pixel, calculate region value to be checked and the area reference value in each region in unit sheet to be checked and adjacent dice, obtain difference between described region value to be checked and area reference value and using as region difference, described region difference is absolute value.
With reference to figure 8, selected described unit sheet 401 to be checked, described unit sheet 401 to be checked is divided into three regions according to the Region dividing line position information of object element sheet 301 on the maternal substrate stored by Defect Scanning instrument, comprise: first area 4030, second area 4040, 3rd region 4050, obtain described first area 4030 simultaneously, second area 4040, the region pixel to be checked in the 3rd region 4050, according to first area 4030, second area 4040, the region pixel to be checked in the 3rd region 4050 calculates described first area 4030, second area 4040, the region value to be checked in the 3rd region 4050, selected described adjacent dice 402, described adjacent dice 402 is divided into three regions according to the Region dividing line position information of object element sheet 301 on the maternal substrate stored by Defect Scanning instrument, comprise: first area 4060, second area 4070, 3rd region 4080, obtain first area 4060 simultaneously, second area 4070, 3rd region 4080 area reference pixel, according to first area 4060, second area 4070, the area reference pixel in the 3rd region 4080 calculates described first area 4060, second area 4070, the area reference value in the 3rd region 4080, selected described adjacent dice 403, adjacent dice 403 is divided into three regions according to the Region dividing line position information of object element sheet 301 on the maternal substrate stored by Defect Scanning instrument, comprise: first area 4090, second area 4010, 3rd region 4020, obtain first area 4090 simultaneously, second area 4010, the area reference pixel in the 3rd region 4020, according to first area 4090, second area 4010, the area reference pixel in the 3rd region 4020 obtains described first area 4090, second area 4010, the area reference value in the 3rd region 4020, obtain difference between the region value to be checked of described unit sheet 401 to be checked and described adjacent dice 402 respective regions and area reference value as region difference 1, obtain difference between the region value to be checked of described unit sheet 401 to be checked and described adjacent dice 403 respective regions and area reference value as region difference 2.Described region difference 1, region difference 2 are absolute value.The division of multizone is carried out to unit sheet on described substrate to be checked, and the value to be checked of respective regions is obtained according to the grey scale pixel value to be checked in each region, the value to be checked in described multiple region forms the value to be checked of whole unit sheet, obtained the value to be checked of whole unit sheet by the gray-scale value in a region compared to prior art, more accurately can reflect the actual shape characteristic of described unit sheet to be checked, therefore, when Defect Scanning, accuracy rate during raising Defect Scanning and efficiency.
On substrate to be checked, the region value to be checked of unit sheet to be checked is: the variance yields of the difference of the gray-scale value of region pixel to be checked, the maximum gradation value of region pixel to be checked and minimum gradation value, mean value or the region grey scale pixel value to be checked of region grey scale pixel value to be checked.Such as: on described unit sheet 401 to be checked, the region value to be checked of first area 4030 is: the variance yields of the difference of the gray-scale value of first area 4030 pixel to be checked, the maximum gradation value of first area 4030 pixel to be checked and minimum gradation value, mean value or first area 4030 grey scale pixel value to be checked of first area 4030 grey scale pixel value to be checked.
On substrate to be checked, the selection of the maternal seized value of the selection of the region value to be checked of unit sheet to be checked and the region of object element sheet on maternal substrate is corresponding, and on substrate to be checked described in the present embodiment, the region value to be checked of unit sheet to be checked is the variance yields of region grey scale pixel value to be checked.
On substrate to be checked, the area reference value of adjacent dice is: the variance yields of the gray-scale value of area reference pixel, the maximum gradation value of area reference pixel and the difference of minimum gradation value, the mean value of area reference grey scale pixel value or area reference grey scale pixel value.
On described substrate to be checked, the selection of the maternal seized value of the selection of the area reference value of adjacent dice and the region of object element sheet on maternal substrate is corresponding, and on substrate to be checked described in this example, the area reference value of adjacent dice is the variance yields of area reference grey scale pixel value.
Perform step S205, the size of the maternal threshold value of more described region difference and region, when described region difference is greater than region female parent threshold value, judge defective existence.
Judge that the detailed process of defect is: when described region difference 1 is less than described region female parent threshold value, then described to-be-measured cell sheet 401 does not have defective existence; When described region difference 1 is greater than described region female parent threshold value, and described region difference 2 is greater than the maternal threshold value in region, then the defective existence of described unit sheet 401 respective regions to be checked; When described region difference 1 is greater than described region female parent threshold value, and described region difference 2 is less than the maternal threshold value in described region, then described unit sheet 401 to be checked does not have defective existence.
When defect exists, described defect detection tool provides the alerting signal that defect exists.
To sum up, adopt defect inspection method provided by the invention, the division of multizone is carried out to unit sheet on described substrate to be checked, and the value to be checked of respective regions is obtained according to the grey scale pixel value to be checked in each region, the value to be checked in described multiple region forms the value to be checked of whole unit sheet, obtained the value to be checked of whole unit sheet by the gray-scale value in a region compared to prior art, more accurately can reflect the actual shape characteristic of described unit sheet to be checked, therefore, when Defect Scanning, accuracy rate during raising Defect Scanning and efficiency.
Further, the user that is divided in described region is realized by human and machine interface unit, user is according to the repeatability of figure on unit sheet, closeness, the material of figure and the feature of technique determine quantity and the position of Region dividing, improve the selectivity of user operation, and the maternal threshold value in described region is the value that user is inputted by human and machine interface unit, user can on reference target unit sheet in the maternal seized value in region and adjacent dice region reference value between difference carry out the maternal threshold value of setting regions, user thinks that the maternal threshold value in corresponding region, region important in technological process is set as the value of less than described difference 5% ~ 20%, the maternal threshold value in corresponding region, unessential region is set as the value of larger than described difference 5% ~ 20%, avoid the problem that real defect can't detect, improve accuracy rate and the efficiency of Defect Scanning.
Although the present invention with preferred embodiment openly as above; but it is not for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; the Method and Technology content of above-mentioned announcement can be utilized to make possible variation and amendment to technical solution of the present invention; therefore; every content not departing from technical solution of the present invention; the any simple modification done above embodiment according to technical spirit of the present invention, equivalent variations and modification, all belong to the protection domain of technical solution of the present invention.
Claims (14)
1. a defect inspection method, is characterized in that, comprises step:
There is provided the region in multiple region on maternal substrate one object element sheet maternal threshold value, the preparation method of the maternal threshold value in described region is: provide maternal substrate; Object element sheet and an adjacent dice on selected described maternal substrate; Described object element sheet and adjacent dice are divided into the quantity N number of region identical with position, obtain the area reference pixel in corresponding 1st ~ N number of region in the maternal seized pixel in region in described object element sheet the 1st ~ N number of region and adjacent dice; According to the gray-scale value of the maternal seized pixel in described region and area reference pixel, calculate the area reference value in the maternal seized value 1st ~ N number of region corresponding to adjacent dice, region in described object element sheet the 1st ~ N number of region; Difference between the area reference value obtaining corresponding 1st ~ N number of region in the maternal seized value in region in the 1st ~ N number of region on described object element sheet and adjacent dice, the maternal threshold value using described difference as region, the maternal threshold value in described region is absolute value;
There is provided substrate to be checked, unit sheet to be checked and an adjacent dice on selected described substrate to be checked;
Described unit sheet to be checked and adjacent dice are divided into multiple region, and obtain the area reference pixel in each region in the region pixel to be checked in each region on described unit sheet to be checked and adjacent dice;
According to described region pixel to be checked and area reference pixel, calculate region value to be checked and the area reference value in each region in unit sheet to be checked and adjacent dice, obtain difference between described region value to be checked and area reference value and using as region difference, described region difference is absolute value; The size of the maternal threshold value of more described region difference and region, when described region difference is greater than region female parent threshold value, judges defective existence.
2. defect inspection method as claimed in claim 1, is characterized in that described maternal substrate and substrate to be checked have multiple unit sheet with same patterned.
3. defect inspection method as claimed in claim 1, it is characterized in that, on described substrate to be checked, the region value to be checked of unit sheet to be checked is: the variance yields of the difference of the gray-scale value of region pixel to be checked, the maximum gradation value of region pixel to be checked and minimum gradation value, mean value or the region grey scale pixel value to be checked of region grey scale pixel value to be checked.
4. defect inspection method as claimed in claim 1, it is characterized in that, on described substrate to be checked, the area reference value of adjacent dice is: the variance yields of the gray-scale value of area reference pixel, the maximum gradation value of area reference pixel and the difference of minimum gradation value, the mean value of area reference grey scale pixel value or area reference grey scale pixel value.
5. defect inspection method as claimed in claim 1, it is characterized in that, the quantity of described adjacent dice is equal to or greater than 1.
6. defect inspection method as claimed in claim 1, is characterized in that, the maternal seized value in region of described n-quadrant is the weighted mean value of the maternal seized value in region in 1st ~ N-1 region.
7. defect inspection method as claimed in claim 1, it is characterized in that, the reference value of described n-quadrant is the weighted mean value of the reference value in 1st ~ N-1 region.
8. defect inspection method as claimed in claim 1, it is characterized in that, on described maternal substrate target unit sheet, the user that is divided in region is realized by human and machine interface unit.
9. defect inspection method as claimed in claim 1, is characterized in that, in described maternal substrate target unit sheet and adjacent dice, the division numbers N in region is equal to or greater than 3.
10. defect inspection method as claimed in claim 1, is characterized in that, also comprise, and stores the Region dividing line position information of object element sheet on the maternal seized value in described region, the maternal threshold value in region and maternal substrate.
11. defect inspection methods as claimed in claim 1, it is characterized in that, on described maternal substrate, the maternal seized value in the region of object element sheet is: the variance yields of the difference of the gray-scale value of the maternal seized pixel in region, the maximum gradation value of the maternal seized pixel in region and minimum gradation value, the maternal seized pixel gray-scale value of mean value or region of the maternal seized pixel gray-scale value in region.
12. defect inspection methods as claimed in claim 1, it is characterized in that, on described maternal substrate, the area reference value of adjacent dice is: the variance yields of the gray-scale value of area reference pixel, the maximum gradation value of area reference pixel and the difference of minimum gradation value, the mean value of area reference grey scale pixel value or area reference grey scale pixel value.
13. defect inspection methods as claimed in claim 1, is characterized in that, on described substrate to be checked, unit sheet to be checked is identical with position with the quantity of Region dividing on maternal substrate one object element sheet with position with the quantity of Region dividing in adjacent dice.
14. defect inspection methods as claimed in claim 1, is characterized in that, also comprise, and provide the alerting signal that defect exists.
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| CN201110298244.9A CN103018260B (en) | 2011-09-27 | 2011-09-27 | Defect detection method |
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| CN201110298244.9A CN103018260B (en) | 2011-09-27 | 2011-09-27 | Defect detection method |
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| CN107402218A (en) * | 2017-09-25 | 2017-11-28 | 武汉华星光电技术有限公司 | Microdefect detection method, device and the equipment of CF substrates |
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| CN108956616B (en) * | 2018-05-31 | 2021-02-02 | 南京航空航天大学 | Image-based workpiece defect detection method |
| CN110913682A (en) * | 2019-11-29 | 2020-03-24 | 深圳市智微智能软件开发有限公司 | SMT (surface Mount technology) reloading method and system |
| CN111289526B (en) * | 2020-02-28 | 2021-08-17 | 涿州滨海燃气有限公司 | Method and system for detecting defects on inner surface of gas conveying pipeline |
| CN112345544A (en) * | 2020-09-24 | 2021-02-09 | 海克斯康制造智能技术(青岛)有限公司 | Multifunctional connecting rod automatic detection line |
| CN113012120B (en) * | 2021-03-09 | 2022-11-15 | 普迪飞半导体技术(上海)有限公司 | Gray value validity analysis method and device, electronic equipment and storage medium |
| CN116754578B (en) * | 2023-08-18 | 2023-11-03 | 国镓芯科(成都)半导体科技有限公司 | Detection system for wafer scratch and detection method of system |
| CN117705822A (en) * | 2024-02-06 | 2024-03-15 | 中国科学院长春光学精密机械与物理研究所 | Cylinder surface detection method and device based on CIS and storage medium |
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| CN107402218A (en) * | 2017-09-25 | 2017-11-28 | 武汉华星光电技术有限公司 | Microdefect detection method, device and the equipment of CF substrates |
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