CN103037624B - Method of eliminating electroplate lead on ceramic substrate - Google Patents
Method of eliminating electroplate lead on ceramic substrate Download PDFInfo
- Publication number
- CN103037624B CN103037624B CN201110301778.2A CN201110301778A CN103037624B CN 103037624 B CN103037624 B CN 103037624B CN 201110301778 A CN201110301778 A CN 201110301778A CN 103037624 B CN103037624 B CN 103037624B
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- electroplate lead
- lead wire
- laser
- eliminating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 21
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 32
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 238000003698 laser cutting Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract 2
- 238000000608 laser ablation Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The invention applies to the technical field of laser processing and provides a method of eliminating a electroplate lead on a ceramic substrate. The method of eliminating the electroplate lead on the ceramic substrate includes the following steps of eliminating a gold-plating layer which is arranged on the electroplate lead through the laser and eliminating the electroplate lead. The method of eliminating the electroplate lead on the ceramic substrate eliminates the gold-plating layer which is arranged on the electroplate lead through the laser and then eliminates the electroplate lead. The ceramic substrate is not scratched and product quality is greatly improved.
Description
Technical field
The invention belongs to technical field of laser processing, particularly relate to a kind of method removing electroplate lead wire on ceramic substrate.
Background technology
Ceramic substrate have high temperature resistant, electrical insulation capability is good, dielectric constant and dielectric loss is low, thermal conductivity is large, chemical stability is good, with the major advantage such as the similar thermal expansion coefficient of element, but ceramic substrate is more crisp, and the chip area made is less, and cost is high.In the making of wiring board, electroplate lead wire is one section of circuit (circuit material is copper) that one whole product connects between each miscellaneous goods gold-plated time, so that electric current can pass through each miscellaneous goods when whole product is gold-plated, make whole product plated with gold, finally after the whole operation completing wiring board making, recycle grinding tool electroplate lead wire is thrust, and in the making of part ceramic substrate, also can relate to removal electroplate lead wire, ceramic wafer just cannot use grinding tool to thrust electroplate lead wire because material is very crisp.Electroplate lead wire is peeled off with blade by the artificial method of general employing under magnifying glass, now can scratch ceramic substrate, so that cause damage.
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of method removing electroplate lead wire on ceramic substrate, is intended to solve the problem that existing method can scratch ceramic substrate.
The embodiment of the present invention is achieved in that a kind of method removing electroplate lead wire on ceramic substrate, comprises the following steps:
By the Gold plated Layer on laser ablation electroplate lead wire;
Remove described electroplate lead wire.
The embodiment of the present invention first by the Gold plated Layer on laser ablation electroplate lead wire, then removes electroplate lead wire, can not scratch ceramic substrate like this, greatly improve product quality.
Accompanying drawing explanation
Fig. 1 is the realization flow figure of electroplate lead wire on the removal ceramic substrate that provides of the embodiment of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The embodiment of the present invention first by the Gold plated Layer on laser ablation electroplate lead wire, then removes electroplate lead wire, can not scratch ceramic substrate like this, greatly improve product quality.
Be described in detail below in conjunction with the realization of specific embodiment to invention.
Fig. 1 shows the realization flow of electroplate lead wire on removal ceramic substrate that the embodiment of the present invention provides, and details are as follows:
In step S101, by the Gold plated Layer on laser ablation electroplate lead wire;
In the embodiment of the present invention, laser is produced by ultraviolet laser cutting machine tool, and its centre wavelength is 355nm.This length ultraviolet laser energy is large, and each heavy metal species of suitable processing, as gold.
First, corresponding procedure is produced according to the position of electroplate lead wire to be removed and shape; Then, ceramic substrate to be processed is placed on the table top of laser cutting machine, by the CCD of laser cutting machine, shooting is carried out to target and locate, make procedure correspond to ceramic substrate on table top; Then, the focal height of adjustment laser beam, makes its focus be positioned on electroplate lead wire to be removed, and adjustment laser processing technology parameter, removes the Gold plated Layer on electroplate lead wire.
Wherein, procedure has the outline line that is covered with described laser scanning track, and adjacent laser track while scan is spaced apart the half of its spot diameter.Such as, when spot diameter is 20um, because the energy at hot spot edge is weak compared with the energy at center, so the distance between track is smaller, at this, interval is set as 10um, to remove Gold plated Layer sooner, and effect is good.
In step s 102, electroplate lead wire is removed.
Usually, electroplate lead wire is copper lead-in wire, is easy to etching, thus adopts etching method to be disposed by electroplate lead wire.Particularly, prior to laminating film on ceramic substrate, and carry out exposure-processed; Ceramic substrate after exposure is developed, etched, thus etches away electroplate lead wire.Cannot etch gold because etching solution copper can only be etched away, so first by the Gold plated Layer on laser ablation electroplate lead wire.
In addition, because lamination, exposure, development, etching are maturation process, automatic production line is formed.Compare manually with blade processing, efficiency significantly improves, and can not scratch ceramic substrate.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (2)
1. remove a method for electroplate lead wire on ceramic substrate, it is characterized in that, said method comprising the steps of:
Corresponding procedure is produced according to the position of electroplate lead wire to be removed and shape;
Ceramic substrate to be processed is placed on the table top of laser cutting machine, by the CCD of described laser cutting machine, shooting is carried out to target and locate, make described procedure corresponding to the ceramic substrate on table top;
The focal height of adjustment laser beam, makes its focus be positioned on described electroplate lead wire to be removed, and adjustment laser processing technology parameter, removes the Gold plated Layer on described electroplate lead wire;
Laminating film on described ceramic substrate, and carry out exposure-processed;
Ceramic substrate after exposure is developed, etched, etches away described electroplate lead wire;
Wherein, described laser is produced by ultraviolet laser cutting machine tool, and its centre wavelength is 355nm.
2. the method removing electroplate lead wire on ceramic substrate as claimed in claim 1, it is characterized in that, described procedure has the outline line that is covered with described laser scanning track, and adjacent laser track while scan is spaced apart the half of its spot diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110301778.2A CN103037624B (en) | 2011-10-09 | 2011-10-09 | Method of eliminating electroplate lead on ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110301778.2A CN103037624B (en) | 2011-10-09 | 2011-10-09 | Method of eliminating electroplate lead on ceramic substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103037624A CN103037624A (en) | 2013-04-10 |
| CN103037624B true CN103037624B (en) | 2015-06-03 |
Family
ID=48023954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110301778.2A Active CN103037624B (en) | 2011-10-09 | 2011-10-09 | Method of eliminating electroplate lead on ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103037624B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695121B (en) * | 2017-01-09 | 2019-12-10 | 上海交通大学 | Device and method for removing coating through compressed air assisted laser melting |
| CN109686514B (en) * | 2018-12-24 | 2020-06-02 | 河北中瓷电子科技股份有限公司 | Method for plating ceramic insulator circuit |
| CN110091069B (en) * | 2019-04-09 | 2021-09-24 | 大族激光科技产业集团股份有限公司 | Laser deplating method |
| CN111315148A (en) * | 2020-02-27 | 2020-06-19 | 惠州中京电子科技有限公司 | Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit |
| CN112218437B (en) * | 2020-10-19 | 2022-06-03 | 西安空间无线电技术研究所 | Method for removing electroplating connection line of thin film circuit pattern |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6660559B1 (en) * | 2001-06-25 | 2003-12-09 | Amkor Technology, Inc. | Method of making a chip carrier package using laser ablation |
| CN102014580A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Manufacturing technology of whole-plate gold-plated plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001073154A (en) * | 1999-09-06 | 2001-03-21 | Hitachi Cable Ltd | Production of partially plated plastic molding |
-
2011
- 2011-10-09 CN CN201110301778.2A patent/CN103037624B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6660559B1 (en) * | 2001-06-25 | 2003-12-09 | Amkor Technology, Inc. | Method of making a chip carrier package using laser ablation |
| CN102014580A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Manufacturing technology of whole-plate gold-plated plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103037624A (en) | 2013-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103037624B (en) | Method of eliminating electroplate lead on ceramic substrate | |
| CN106271089B (en) | A kind of laser film etching device and method | |
| CN101882578B (en) | Integral solid laser lift-off and cutting equipment | |
| CN102132378B (en) | Laser material removal methods and apparatus | |
| EP3193391A1 (en) | Electrode plate coating removal method | |
| CN103687309B (en) | A kind of production technology of high-frequency circuit board | |
| US9312177B2 (en) | Screen print mask for laser scribe and plasma etch wafer dicing process | |
| CN105006446A (en) | Method based on femtosecond laser technology for peeling GaN film and sapphire substrate | |
| US10874016B2 (en) | Method of manufacturing physical structure for high frequency signal transmission | |
| Li et al. | Multi-objective optimization of laser cutting for flash memory modules with special shapes using grey relational analysis | |
| CN109546521B (en) | Laser depainting method for polyimide coating enameled wire | |
| KR20140125474A (en) | Thinning method and apparatus of wafer | |
| CN103747636A (en) | Gold-plated circuit-board lead etch-back method | |
| KR20170123242A (en) | Semiconductor package and manufacturing method thereof | |
| CN104842077A (en) | Aluminum alloy microwave assembly brazing sheet processing method | |
| CN115666003B (en) | Circuit board blind slot manufacturing method and system | |
| CN107252982A (en) | A kind of method and device for laser machining wafer | |
| CN103874334A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN102806789A (en) | Method for forming metal pattern on surface of insulator | |
| CN111885834B (en) | Manufacturing method of 5G high-frequency board with interlayer accurate alignment | |
| EP3039710B1 (en) | Wafer dicing method for improving die packaging quality | |
| JP2010087041A (en) | Method of removing thin film by laser beam, and method of manufacturing thin-film solar cell panel | |
| CN103747626A (en) | Method for selectively removing conductive layer on baseplate material | |
| CN108436308A (en) | A kind of CO for micropore on microwave ceramics substrate2Laser processing | |
| CN103769749A (en) | Method for making electric conduction patterns on metal-foil-clad insulating substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 518000 Shenzhen Province, Nanshan District high tech park, North West New Road, No. 9 Applicant after: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Applicant after: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Address before: 518000 Shenzhen Province, Nanshan District high tech park, North West New Road, No. 9 Applicant before: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen Applicant before: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: DAZU LASER SCI. + TECH. CO., LTD., SHENZHEN TO: HAN'S LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200628 Address after: 518000 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518000 No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Co-patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518000 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |