CN103094148A - Cleaning machine with twin-jet nozzle - Google Patents
Cleaning machine with twin-jet nozzle Download PDFInfo
- Publication number
- CN103094148A CN103094148A CN2011103322111A CN201110332211A CN103094148A CN 103094148 A CN103094148 A CN 103094148A CN 2011103322111 A CN2011103322111 A CN 2011103322111A CN 201110332211 A CN201110332211 A CN 201110332211A CN 103094148 A CN103094148 A CN 103094148A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- wafer
- twin
- workbench
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to the equipment which is used for cleaning the chip in the workpiece process of semiconductor chips, in particular to a cleaning machine with a twin-jet nozzle used for optimizing the washing of the surface of the chip. The cleaning machine comprises a nozzle electric cylinder, a spindle motor, a supporting stage, a shell body, a nozzle arm, a spindle and a workbench. The spindle motor is installed on the workbench and one end of the spindle is connected with an output end of the spindle motor and the other end of the spindle motor is installed inside the shell body of the workbench. The other end of the spindle is connected with the supporting stage used for fixing and rotating the chip. The nozzle electric cylinder is installed on one side of the workbench and one end of the nozzle arm is connected with the nozzle electric cylinder and is in reciprocating motion through the drive of the nozzle electric cylinder. The other end of the nozzle arm is located above the chip and the other end of the nozzle arm is provided with the twin-jet nozzle corresponding to the chip. The cleaning machine with the twin-jet nozzle can meet the cleaning demand to the hilt through the control of the position of the nozzle and the characteristic of the rotation of the chip in the cleaning process and achieve the cleaning goal that all particles on the surface of the chip are cleared away.
Description
Technical field
The present invention relates in the semiconductor wafer course of processing equipment to wafer cleaning, specifically a kind of twin-jet nozzle cleaning device of realizing wafer surface is optimized cleaning.
Background technology
At present, need a height clean environment to reduce unnecessary particulate to the impact of technique in the semiconductor wafer course of processing.But along with improving constantly of precision, live width constantly dwindle and the requirement of cleanliness factor improves constantly, the environment purification that not only needs a high-cleanness, high also needs wafer surface is cleaned under many circumstances, to satisfy the requirement to processed wafer surface cleaning degree.
Wafer cleaning mode originally is that the mode of wafer by vacuum suction is fixed on wafer-supporting platform, and the way that adopts deionized water directly to rinse is cleaned lens surface.Centrifugal force when relying on like this wafer-supporting platform to drive the wafer rotation is added the scouring force of ionized water and the particulate on wafer is removed to reach the purpose of cleaning.But this method is directly injected to the center of wafer due to deionized water, and the cleansing power of edge is not enough, and the particulate with wafer surface that the edge of wafer can not be fully effective is rinsed out fully.But along with further developing of semiconductor applications, more and more higher to the cleannes requirement of crystal column surface, this traditional mode can not satisfy present general production requirement.
Summary of the invention
The problem that can not be completely effectively the particulate of wafer surface be rinsed out fully in order to solve the conventional clean mode the object of the present invention is to provide a kind of twin-jet nozzle cleaning device.This cleaning device adopts twin-jet nozzle, wafer surface is done the purpose of effective cleaning by distance and the operating time realization regulated between twin-jet nozzle.
The objective of the invention is to be achieved through the following technical solutions:
The present invention includes nozzle electricity cylinder, Spindle Motor, wafer-supporting platform, housing, nozzle arm, main shaft and workbench, wherein Spindle Motor is arranged on workbench, one end of described main shaft is connected with the output of Spindle Motor, the other end is positioned at the inside that is arranged on the housing on workbench, is connected with wafer-supporting platform fixing and the rotation wafer at the other end of main shaft; Described nozzle electricity cylinder is arranged on a side of workbench, and an end of nozzle arm is connected with nozzle electricity cylinder, the driving by the electric cylinder of nozzle moves back and forth, and the other end of nozzle arm is positioned at the top of wafer, at the other end of nozzle arm, the twin-jet nozzle corresponding with wafer is installed.
Wherein: described twin-jet nozzle is the first nozzle and second nozzle, and the distance between the first nozzle and second nozzle is adjustable; Described the first nozzle be positioned at center wafer directly over, second nozzle is positioned at a side of the first nozzle; On the direction that moves perpendicular to nozzle arm, described second nozzle be positioned at the first nozzle above or below, the distance between second nozzle and the first nozzle is
Wherein r is wafer radius.
Advantage of the present invention and good effect are:
1. cleaning device provided by the present invention by can satisfy to greatest extent the cleaning needs to the control of nozzle location and the characteristics of wafer rotation in cleaning process, is realized the purpose of cleaning, and the particulate that is about to wafer surface is all removed.
In the present invention when Spindle Motor drives wafer-supporting platform and wafer rotation, another nozzle electricity cylinder drives nozzle arm and makes twin-jet nozzle do transverse movement under the drive of nozzle arm, and the distance of twin-jet nozzle can be made any adjustment according to the different process needs.
The present invention have simple in structure, be swift in response, easy for installation, lower-price characteristic.
4. the present invention can improve cleaning efficiency and edge scavenging period by regulating nozzle location.
Description of drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is structure principle chart of the present invention, and the twin-jet nozzle in figure is in the optimum position of wafer cleaning;
Wherein: 1 is nozzle electricity cylinder, and 2 is Spindle Motor, and 3 is wafer-supporting platform, and 4 is housing, and 5 is the first nozzle, and 6 is second nozzle, and 7 is nozzle arm, and 8 is wafer, and 9 is main shaft, and 10 is workbench.
Embodiment
The invention will be further described below in conjunction with accompanying drawing.
As shown in Figure 1 and Figure 2, the present invention includes nozzle electricity cylinder 1, Spindle Motor 2, wafer-supporting platform 3, housing 4, nozzle arm 7, main shaft 9 and workbench 10, wherein Spindle Motor 2 is arranged on workbench 10, one end of described main shaft 9 is connected with the output of Spindle Motor 2, the other end is equipped with wafer-supporting platform 3, wafer 8 is fixed on wafer-supporting platform 3, is driven with wafer-supporting platform 3 rotations by Spindle Motor 2.Outer turning at wafer-supporting platform 3 is provided with the housing 4 that is arranged on workbench 10, and this housing 4 is cylindrical shape, is used for collecting the liquid that cleaned wafer 8, and wafer-supporting platform 3 is positioned at the centre of housing 4 inside.Nozzle electricity cylinder 1 is arranged on a side of workbench 10, one end of nozzle arm 7 and nozzle electricity cylinder 1 is connected, the driving by the electric cylinder 1 of nozzle moves back and forth, the other end of nozzle arm 7 is positioned at the top of wafer 8, at the other end of nozzle arm 7, the twin-jet nozzle corresponding with wafer 8 is installed.Nozzle arm 7 be shaped as numeral " 7 ", two limits are mutually vertical, wherein a limit is connected with nozzle electricity cylinder 1, another lower surface is equipped with twin-jet nozzle, i.e. the first nozzle 5 and second nozzle 6; The first nozzle 5 and second nozzle 6 are done rectilinear motion under the driving of nozzle electricity cylinder 1, can realize the cleaning to wafer 8, and the spacing between the height of two nozzles, rotational angle, position and two nozzles can be regulated all.The first nozzle 5 be positioned at wafer 8 centers directly over, on the direction that moves perpendicular to nozzle arm 7, described second nozzle 6 be positioned at the first nozzle 5 above or below, the distance between second nozzle 6 and the first nozzle 5 is
Wherein r is wafer radius; Such layout can improve cleaning efficiency and edge scavenging period.
Workpiece principle of the present invention is:
After starting cleaning device, be at first Spindle Motor 2 rotations, thereby drive the wafer-supporting platform direct-connected with it 3 rotations.Like this, the mode by vacuum suction is fixed on wafer 8 rotations on wafer-supporting platform 3, and its rotary speed and acceleration thereof are adjustable.At this moment, nozzle electricity cylinder 1 starts, and drives nozzle arm 7 motions that are attached thereto, and first and second nozzle 5,6 on nozzle arm moves thereupon, and its movement locus as shown by the arrows in Figure 2.
When first and second nozzle 5,6 by Fig. 3 in mode when putting, namely the first nozzle 5 be positioned at wafer 8 centers directly over, second nozzle 6 is positioned at the top of the first nozzle 5, and (top herein refers on the direction that moves perpendicular to nozzle arm 7, described second nozzle 6 is positioned at the top of the first nozzle 5), the distance between second nozzle 6 and the first nozzle 5 is
Nozzle arm 7 can be completed the cleaning of full wafer wafer when wafer 8 centers move to the A point, can save scavenging period 30%, improves cleaning efficiency; And 68 edge shadow place's times of clean wafers of second nozzle are in the past 2.5 times, and can solving single injector, to be in the cleansing power of center wafer position edge not enough, the problem that the particulate with wafer surface that edge can not be fully effective rinses out fully.
Claims (4)
1. twin-jet nozzle cleaning device, it is characterized in that: comprise nozzle electricity cylinder (1), Spindle Motor (2), wafer-supporting platform (3), housing (4), nozzle arm (7), main shaft (9) and workbench (10), wherein Spindle Motor (2) is arranged on workbench (10), one end of described main shaft (9) is connected with the output of Spindle Motor (2), the other end is positioned at the inside of the housing (4) that is arranged on workbench (10), the other end at main shaft (9) is connected with wafer-supporting platform (3) fixing and rotation wafer (8), described nozzle electricity cylinder (1) is arranged on a side of workbench (10), one end of nozzle arm (7) and nozzle electricity cylinder (1) is connected, the driving by the electric cylinder of nozzle (1) moves back and forth, the other end of nozzle arm (7) is positioned at the top of wafer (8), at the other end of nozzle arm (7), the twin-jet nozzle corresponding with wafer (8) is installed.
2. by twin-jet nozzle cleaning device claimed in claim 1, it is characterized in that: described twin-jet nozzle is the first nozzle (5) and second nozzle (6), and the distance between the first nozzle (5) and second nozzle (6) is adjustable.
3. by twin-jet nozzle cleaning device claimed in claim 2, it is characterized in that: described the first nozzle (5) be positioned at wafer (8) center directly over, second nozzle (6) is positioned at a side of the first nozzle (5).
4. by twin-jet nozzle cleaning device claimed in claim 3, it is characterized in that: on the direction mobile perpendicular to nozzle arm (7), described second nozzle (6) be positioned at the first nozzle (5) above or below, the distance between second nozzle (6) and the first nozzle (5) is
Wherein r is wafer radius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110332211.1A CN103094148B (en) | 2011-10-27 | 2011-10-27 | Cleaning machine with twin-jet nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110332211.1A CN103094148B (en) | 2011-10-27 | 2011-10-27 | Cleaning machine with twin-jet nozzle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103094148A true CN103094148A (en) | 2013-05-08 |
| CN103094148B CN103094148B (en) | 2015-06-17 |
Family
ID=48206570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110332211.1A Active CN103094148B (en) | 2011-10-27 | 2011-10-27 | Cleaning machine with twin-jet nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103094148B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097608A (en) * | 2014-05-22 | 2015-11-25 | 沈阳芯源微电子设备有限公司 | CUP structure preventing high-pressure water mist splashing |
| CN106623187A (en) * | 2016-12-13 | 2017-05-10 | 无锡南方声学工程有限公司 | Fast cleaning device for discs |
| CN106733832A (en) * | 2016-12-13 | 2017-05-31 | 无锡南方声学工程有限公司 | A kind of two-sided cleaning device of disk |
| CN107051940A (en) * | 2016-12-13 | 2017-08-18 | 无锡南方声学工程有限公司 | A kind of disk cleaning device |
| CN107665842A (en) * | 2016-07-29 | 2018-02-06 | 细美事有限公司 | Substrate board treatment and substrate processing method using same |
| CN108144761A (en) * | 2017-12-22 | 2018-06-12 | 宁波宏协股份有限公司 | A kind of double mass flywheel fat liquoring equipment |
| CN108296208A (en) * | 2018-02-13 | 2018-07-20 | 国网河南省电力公司电力科学研究院 | It is a kind of to spray or clean four nozzle stage apparatus |
| WO2022083125A1 (en) * | 2020-10-20 | 2022-04-28 | 长鑫存储技术有限公司 | Nozzle assembly and semiconductor device using same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4564280A (en) * | 1982-10-28 | 1986-01-14 | Fujitsu Limited | Method and apparatus for developing resist film including a movable nozzle arm |
| CN101393850A (en) * | 2007-09-19 | 2009-03-25 | 细美事有限公司 | Method of processing a substrate, spin unit for supplying processing materials to a substrate, and apparatus for processing a substrate |
| US20100163078A1 (en) * | 2008-12-31 | 2010-07-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Spinner and method of cleaning substrate using the spinner |
| CN102107197A (en) * | 2009-12-24 | 2011-06-29 | 联华电子股份有限公司 | Wafer cleaning device and wafer cleaning mode |
-
2011
- 2011-10-27 CN CN201110332211.1A patent/CN103094148B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4564280A (en) * | 1982-10-28 | 1986-01-14 | Fujitsu Limited | Method and apparatus for developing resist film including a movable nozzle arm |
| CN101393850A (en) * | 2007-09-19 | 2009-03-25 | 细美事有限公司 | Method of processing a substrate, spin unit for supplying processing materials to a substrate, and apparatus for processing a substrate |
| US20100163078A1 (en) * | 2008-12-31 | 2010-07-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Spinner and method of cleaning substrate using the spinner |
| CN102107197A (en) * | 2009-12-24 | 2011-06-29 | 联华电子股份有限公司 | Wafer cleaning device and wafer cleaning mode |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097608A (en) * | 2014-05-22 | 2015-11-25 | 沈阳芯源微电子设备有限公司 | CUP structure preventing high-pressure water mist splashing |
| CN105097608B (en) * | 2014-05-22 | 2018-04-24 | 沈阳芯源微电子设备有限公司 | A kind of CUP structures for preventing high-pressure water mist splash |
| CN107665842A (en) * | 2016-07-29 | 2018-02-06 | 细美事有限公司 | Substrate board treatment and substrate processing method using same |
| CN106623187A (en) * | 2016-12-13 | 2017-05-10 | 无锡南方声学工程有限公司 | Fast cleaning device for discs |
| CN106733832A (en) * | 2016-12-13 | 2017-05-31 | 无锡南方声学工程有限公司 | A kind of two-sided cleaning device of disk |
| CN107051940A (en) * | 2016-12-13 | 2017-08-18 | 无锡南方声学工程有限公司 | A kind of disk cleaning device |
| CN108144761A (en) * | 2017-12-22 | 2018-06-12 | 宁波宏协股份有限公司 | A kind of double mass flywheel fat liquoring equipment |
| CN108296208A (en) * | 2018-02-13 | 2018-07-20 | 国网河南省电力公司电力科学研究院 | It is a kind of to spray or clean four nozzle stage apparatus |
| WO2022083125A1 (en) * | 2020-10-20 | 2022-04-28 | 长鑫存储技术有限公司 | Nozzle assembly and semiconductor device using same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103094148B (en) | 2015-06-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103094148B (en) | Cleaning machine with twin-jet nozzle | |
| CN1684231A (en) | Proximity meniscus manifold | |
| CN108325930A (en) | A kind of lift Wafer Cleaning auxiliary device and its cleaning method | |
| CN206997305U (en) | A kind of Sapphire wafer surface cleaning device for different roughness and size | |
| CN102319693A (en) | Ultrasonic cleaning device with throwing device for solar cell silicon chips | |
| CN101673663B (en) | Device for cleaning wafer | |
| CN210757078U (en) | Plane magneto-rheological polishing machine | |
| CN114724992A (en) | Wafer cleaning and feeding device | |
| CN211938071U (en) | Efficient semiconductor wafer cleaning device | |
| CN109860079B (en) | Encrypted chip cleaning device | |
| CN101436521A (en) | Scanning and cleaning apparatus | |
| CN210497454U (en) | Silicon wafer cleaning device | |
| CN216460400U (en) | Reciprocating type belt cleaning device of wafer machinery | |
| CN111009484B (en) | Wafer cleaning device and wafer cleaning method | |
| CN211757120U (en) | Cleaning device for single crystal silicon carbide wafer | |
| CN210434903U (en) | Cleaning device for chip cutting | |
| CN210704184U (en) | Electromechanical integrated polishing machine | |
| CN218585928U (en) | Part holding structure, cleaning and loading and unloading device, machine table and vibrating brush | |
| US20080156360A1 (en) | Horizontal megasonic module for cleaning substrates | |
| CN219457539U (en) | Wafer cleaning equipment | |
| CN201126812Y (en) | Scanning and cleaning apparatus | |
| CN201523002U (en) | Silicon wafer self-rotating system | |
| CN220651971U (en) | Wafer cleaning device and trimming equipment | |
| CN105161399A (en) | Processing method and processing device of high-efficiency colorful polycrystalline solar cell sheet | |
| CN219303619U (en) | Cleaning machine for cleaning corroded silicon wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |