CN103094148B - Cleaning machine with twin-jet nozzle - Google Patents
Cleaning machine with twin-jet nozzle Download PDFInfo
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- CN103094148B CN103094148B CN201110332211.1A CN201110332211A CN103094148B CN 103094148 B CN103094148 B CN 103094148B CN 201110332211 A CN201110332211 A CN 201110332211A CN 103094148 B CN103094148 B CN 103094148B
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Abstract
The invention relates to the equipment which is used for cleaning the chip in the workpiece process of semiconductor chips, in particular to a cleaning machine with a twin-jet nozzle used for optimizing the washing of the surface of the chip. The cleaning machine comprises a nozzle electric cylinder, a spindle motor, a supporting stage, a shell body, a nozzle arm, a spindle and a workbench. The spindle motor is installed on the workbench and one end of the spindle is connected with an output end of the spindle motor and the other end of the spindle motor is installed inside the shell body of the workbench. The other end of the spindle is connected with the supporting stage used for fixing and rotating the chip. The nozzle electric cylinder is installed on one side of the workbench and one end of the nozzle arm is connected with the nozzle electric cylinder and is in reciprocating motion through the drive of the nozzle electric cylinder. The other end of the nozzle arm is located above the chip and the other end of the nozzle arm is provided with the twin-jet nozzle corresponding to the chip. The cleaning machine with the twin-jet nozzle can meet the cleaning demand to the hilt through the control of the position of the nozzle and the characteristic of the rotation of the chip in the cleaning process and achieve the cleaning goal that all particles on the surface of the chip are cleared away.
Description
Technical field
The present invention relates to the equipment to wafer cleaning in the semiconductor wafer course of processing, specifically a kind ofly realize twin-jet nozzle cleaning device wafer surface being optimized to cleaning.
Background technology
At present, in the semiconductor wafer course of processing, need the environment of a high level of cleanliness to reduce the impact of unnecessary particulate on technique.But along with improving constantly of precision, live width constantly reduce and the requirement of cleanliness factor improves constantly, not only need the environment purification of a high-cleanness, high, also need under many circumstances to clean wafer surface, to meet the requirement to processed wafer surface cleaning degree.
Wafer cleaning mode is originally fixed on wafer-supporting platform by wafer by the mode of vacuum suction, and the way adopting deionized water directly to rinse is cleaned lens surface.Centrifugal force when such dependence wafer-supporting platform drives wafer to rotate, the particulate on wafer is removed with the object reaching cleaning by the scouring force of adding ionized water.But this method is directly injected to the center of wafer due to deionized water, the cleansing power of edge is not enough, and what make that the edge of wafer can not be fully effective rinses out completely by the particulate of wafer surface.But along with further developing of semiconductor applications, require more and more higher to the cleannes of crystal column surface, this traditional mode can not meet current general production requirement.
Summary of the invention
Completely effectively by the problem that the particulate of wafer surface rinses out completely, a kind of twin-jet nozzle cleaning device can not be the object of the present invention is to provide to solve conventional clean mode.This cleaning device adopts twin-jet nozzle, by the object regulating the distance between twin-jet nozzle and operating time to realize doing wafer surface effectively cleaning.
The object of the invention is to be achieved through the following technical solutions:
The present invention includes nozzle electricity cylinder, Spindle Motor, wafer-supporting platform, housing, nozzle arm, main shaft and workbench, wherein Spindle Motor is installed on the table, one end of described main shaft is connected with the output of Spindle Motor, the other end is positioned at the inside of installation housing on the table, is connected with wafer-supporting platform that is fixing and rotation wafer at the other end of main shaft; Described nozzle electricity cylinder is arranged on the side of workbench, and one end of nozzle arm is connected with nozzle electricity cylinder, is moved back and forth by the driving of nozzle electricity cylinder, and the other end of nozzle arm is positioned at the top of wafer, is provided with the twin-jet nozzle corresponding with wafer at the other end of nozzle arm.
Wherein: described twin-jet nozzle is first jet and second nozzle, the distance between first jet and second nozzle is adjustable; Described first jet is positioned at directly over center wafer, and second nozzle is positioned at the side of first jet; On the direction perpendicular to nozzle arm movement, described second nozzle is positioned at above or below first jet, and the distance between second nozzle and first jet is
wherein r is wafer radius.
Advantage of the present invention and good effect are:
1. cleaning device provided by the present invention can meet cleaning needs to greatest extent by the feature rotated the control of nozzle location and wafer in cleaning process, and realize the object of cleaning, the particulate by wafer surface is all removed.
2., when the present invention drives wafer-supporting platform and wafer rotation when Spindle Motor, another nozzle electricity cylinder then drives nozzle arm to make twin-jet nozzle do transverse movement under the drive of nozzle arm, and the distance of twin-jet nozzle can need to make any adjustment according to different process.
3. the present invention have structure simple, be swift in response, easy for installation, lower-price characteristic.
4. the present invention can improve cleaning efficiency and edge clean time by regulating nozzle location.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is structure principle chart of the present invention, and the twin-jet nozzle in figure is in the optimum position of wafer cleaning;
Wherein: 1 is nozzle electricity cylinder, and 2 is Spindle Motor, and 3 is wafer-supporting platform, and 4 is housing, and 5 is first jet, and 6 is second nozzle, and 7 is nozzle arm, and 8 is wafer, and 9 is main shaft, and 10 is workbench.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figure 1 and Figure 2, the present invention includes nozzle electricity cylinder 1, Spindle Motor 2, wafer-supporting platform 3, housing 4, nozzle arm 7, main shaft 9 and workbench 10, wherein Spindle Motor 2 is arranged on workbench 10, one end of described main shaft 9 is connected with the output of Spindle Motor 2, the other end is provided with wafer-supporting platform 3, wafer 8 is fixed on wafer-supporting platform 3, is driven rotate with wafer-supporting platform 3 by Spindle Motor 2.Outer turn at wafer-supporting platform 3 is provided with the housing 4 be arranged on workbench 10, and this housing 4 is cylindrical shape, and for collecting the liquid of cleaned wafer 8, wafer-supporting platform 3 is positioned at the centre of housing 4 inside.Nozzle electricity cylinder 1 is arranged on the side of workbench 10, one end of nozzle arm 7 is connected with nozzle electricity cylinder 1, is moved back and forth by the driving of nozzle electricity cylinder 1, the other end of nozzle arm 7 is positioned at the top of wafer 8, is provided with the twin-jet nozzle corresponding with wafer 8 at the other end of nozzle arm 7.The shape of nozzle arm 7 is numeral " 7 ", and two limits are mutually vertical, and wherein a limit is connected with nozzle electricity cylinder 1, and another lower surface is provided with twin-jet nozzle, i.e. first jet 5 and second nozzle 6; First jet 5 and second nozzle 6 do rectilinear motion under the driving of nozzle electricity cylinder 1, can realize the cleaning to wafer 8, and spacing between the height of two nozzles, rotational angle, position and two nozzles is all adjustable.First jet 5 is positioned at directly over wafer 8 center, and on the direction perpendicular to nozzle arm 7 movement, described second nozzle 6 is positioned at above or below first jet 5, and the distance between second nozzle 6 and first jet 5 is
wherein r is wafer radius; Such layout can improve cleaning efficiency and edge clean time.
Functional principal of the present invention is:
After starting cleaning device, be first that Spindle Motor 2 rotates, thus drive the wafer-supporting platform 3 direct-connected with it to rotate.Like this, the wafer 8 be fixed on by the mode of vacuum suction on wafer-supporting platform 3 is rotated, its rotary speed and acceleration adjustable.Now, nozzle electricity cylinder 1 starts, and drive the nozzle arm 7 be attached thereto to move, first and second nozzle 5,6 in nozzle arm moves thereupon, and its movement locus as shown by the arrows in Figure 2.
When during first and second nozzle 5,6 is by Fig. 3, mode is put, namely first jet 5 is positioned at directly over wafer 8 center, second nozzle 6 is positioned at the top of first jet 5, and (top herein refers on the direction perpendicular to nozzle arm 7 movement, described second nozzle 6 is positioned at the top of first jet 5), the distance between second nozzle 6 and first jet 5 is
nozzle arm 7 can complete the cleaning of full wafer wafer when wafer 8 center moves to A point, can save scavenging period 30%, improves cleaning efficiency; And second nozzle 6 clean wafers 8 edge shadow place's time is in the past 2.5 times, the cleansing power deficiency that single injector is in center wafer position edge can be solved, the problem rinsed out completely by the particulate of wafer surface that edge can not be fully effective.
Claims (1)
1. a twin-jet nozzle cleaning device, it is characterized in that: comprise nozzle electricity cylinder (1), Spindle Motor (2), wafer-supporting platform (3), housing (4), nozzle arm (7), main shaft (9) and workbench (10), wherein Spindle Motor (2) is arranged on workbench (10), one end of described main shaft (9) is connected with the output of Spindle Motor (2), the other end is positioned at the inside of the housing (4) be arranged on workbench (10), wafer-supporting platform (3) that is fixing and rotation wafer (8) is connected with at the other end of main shaft (9), described nozzle electricity cylinder (1) is arranged on the side of workbench (10), one end of nozzle arm (7) is connected with nozzle electricity cylinder (1), is moved back and forth by the driving of nozzle electricity cylinder (1), the other end of nozzle arm (7) is positioned at the top of wafer (8), is provided with the twin-jet nozzle corresponding with wafer (8) at the other end of nozzle arm (7),
Described twin-jet nozzle is first jet (5) and second nozzle (6), and the distance between second nozzle (6) and first jet (5) is
wherein r is wafer radius;
Described first jet (5) is positioned at directly over wafer (8) center, and second nozzle (6) is positioned at the side of first jet (5);
On the direction perpendicular to nozzle arm (7) movement, described second nozzle (6) is positioned at above or below first jet (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110332211.1A CN103094148B (en) | 2011-10-27 | 2011-10-27 | Cleaning machine with twin-jet nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110332211.1A CN103094148B (en) | 2011-10-27 | 2011-10-27 | Cleaning machine with twin-jet nozzle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103094148A CN103094148A (en) | 2013-05-08 |
| CN103094148B true CN103094148B (en) | 2015-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110332211.1A Active CN103094148B (en) | 2011-10-27 | 2011-10-27 | Cleaning machine with twin-jet nozzle |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097608B (en) * | 2014-05-22 | 2018-04-24 | 沈阳芯源微电子设备有限公司 | A kind of CUP structures for preventing high-pressure water mist splash |
| KR20180013327A (en) * | 2016-07-29 | 2018-02-07 | 세메스 주식회사 | Substrate treating apparatus and substrate treating method |
| CN106623187A (en) * | 2016-12-13 | 2017-05-10 | 无锡南方声学工程有限公司 | Fast cleaning device for discs |
| CN106733832B (en) * | 2016-12-13 | 2023-06-06 | 无锡南方声学工程有限公司 | Disc double-sided cleaning device |
| CN107051940A (en) * | 2016-12-13 | 2017-08-18 | 无锡南方声学工程有限公司 | A kind of disk cleaning device |
| CN108144761B (en) * | 2017-12-22 | 2020-08-28 | 宁波宏协股份有限公司 | Double-mass flywheel greasing equipment |
| CN108296208A (en) * | 2018-02-13 | 2018-07-20 | 国网河南省电力公司电力科学研究院 | It is a kind of to spray or clean four nozzle stage apparatus |
| CN114388386A (en) * | 2020-10-20 | 2022-04-22 | 长鑫存储技术有限公司 | Nozzle assembly and semiconductor device using the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4564280A (en) * | 1982-10-28 | 1986-01-14 | Fujitsu Limited | Method and apparatus for developing resist film including a movable nozzle arm |
| CN101393850A (en) * | 2007-09-19 | 2009-03-25 | 细美事有限公司 | Method of processing a substrate, spin unit for supplying processing materials to a substrate, and apparatus for processing a substrate |
| CN102107197A (en) * | 2009-12-24 | 2011-06-29 | 联华电子股份有限公司 | Wafer cleaning device and wafer cleaning mode |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100163078A1 (en) * | 2008-12-31 | 2010-07-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Spinner and method of cleaning substrate using the spinner |
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2011
- 2011-10-27 CN CN201110332211.1A patent/CN103094148B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4564280A (en) * | 1982-10-28 | 1986-01-14 | Fujitsu Limited | Method and apparatus for developing resist film including a movable nozzle arm |
| CN101393850A (en) * | 2007-09-19 | 2009-03-25 | 细美事有限公司 | Method of processing a substrate, spin unit for supplying processing materials to a substrate, and apparatus for processing a substrate |
| CN102107197A (en) * | 2009-12-24 | 2011-06-29 | 联华电子股份有限公司 | Wafer cleaning device and wafer cleaning mode |
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| CN103094148A (en) | 2013-05-08 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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