CN103107116B - Solar wafer carrier - Google Patents
Solar wafer carrier Download PDFInfo
- Publication number
- CN103107116B CN103107116B CN201110355018.XA CN201110355018A CN103107116B CN 103107116 B CN103107116 B CN 103107116B CN 201110355018 A CN201110355018 A CN 201110355018A CN 103107116 B CN103107116 B CN 103107116B
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- solar wafer
- carrier
- lower plate
- upper plate
- hole
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Abstract
The invention provides a kind of solar wafer carrier, make substantially, comprising with metal: a upper plate and a lower plate, wherein, upper plate or lower plate are at least provided with pass through aperture, run through front and rear surfaces; A plurality of support bars, those bracing members are located between upper plate and lower plate, form accommodation space, to place multiple solar wafer; One clavate radio frequency label, records the relevant information of those solar wafer; And a nonmetal fixed bin, accommodating and fixed wireless radio-frequency (RF) tag, and the upper plate or lower plate that coordinate through hole size to be locked in comprise through hole, for the axis direction of reader from vertical clavate radio frequency label, read the information of those solar wafer, avoid the interference of metallic shield effect.
Description
Technical field
The present invention, about a kind of carrier of solar wafer, refers to a kind of solar wafer carrier embedding radio frequency label especially.
Background technology
In order to improve throughput rate, the processing procedure kenel trend of solar wafer is with tandem consecutive production (in-linecontinuous production line).In order to tracking and managing solar wafer, and make the production automation of solar wafer, the carrier that solar wafer production line uses, generally with word tag or bar-code label, as the identification of this batch of solar wafer.
But when using word tag, to quick and effective identification, the technology of image analysing computer need be adopted.But use this technology to carry out identification label, high cost, and easily there is the problem of identification mistake in the technology of image analysing computer.
Another kind of mode adopts bar-code label as identification, but after having grown service time, bar code is easily damaged, so that cannot identification, and when bar code reading label, has the restriction of Distance geometry barrier.
In order to more convenient tracking and managing kinds of goods, also start production line wireless radio-frequency being introduced solar wafer at present, carrier is installed radio frequency label (RFID).When using bar code in the past except overcoming, the restriction of distance and barrier, can strengthen again the amount of information of storage simultaneously.Figure 1A and Figure 1B is respectively end view and the bottom view of solar wafer carrier, and Figure 1A carrier 1 comprises a upper plate 10 and lower plate 11, and has a plurality of fixed levers 12 to be set up between upper plate 10 and lower plate 11, to place multiple solar wafer 100.
Because solar wafer carrier is after placement solar wafer, can weigh 6 ~ 7 kilograms, therefore, the material major part of carrier is made of metal.Have and usually know that the knowledgeable all knows, when reading the signal of radio frequency label, easily disturb by the screen effect of metal.
A kind of design of known solar wafer carrier offers a circular groove 110 in lower plate 11, after being inserted by radio frequency label 13, then fixes with screw.Further, the frequency that radio frequency label uses belongs to high band (13.56MHz), needs special reading device, could smooth reading tag information.
But high frequency waves easily cause interference to accurate board, if use low-frequency range radio frequency label common on the market at present instead, metallic shield effect cannot be avoided again with the design of current solar wafer carrier.
Therefore, be necessary again to develop a kind of solar wafer carrier, in conjunction with the radio frequency label of low-frequency range, the interference to accurate board can be reduced, the problem of metallic shield effect can be overcome again simultaneously.
Summary of the invention
Because above-mentioned problem, an object of the present invention is to provide a kind of solar wafer carrier, low-frequency range radio frequency label can be incorporated in solar wafer carrier, and overcome metallic shield effect, reach the convenient object to solar wafer tracking and managing.
Solar wafer is carried, and comprising: a upper plate and a lower plate, and wherein, upper plate or lower plate are at least provided with pass through aperture, run through front and rear surfaces, and the upper plate or the lower plate that are wherein provided with described through hole are metallic plates; A plurality of support bars, those bracing members are located between upper plate and lower plate, form accommodation space, to place multiple solar wafer; One clavate radio frequency label, records the relevant information of those solar wafer; And a nonmetal fixed bin, accommodating and fixed wireless radio-frequency (RF) tag, and the upper plate or lower plate that coordinate through hole size to be locked in comprise through hole, for the axis direction of reader from clavate radio frequency label, read the information of those solar wafer, to avoid the interference of metallic shield effect.
Solar wafer carrier of the present invention, makes solar wafer production line can combining wireless radio-frequency technique, is more convenient for managing kinds of goods.Meanwhile, when using low-frequency wireless radio-frequency (RF) tag on the market, comparatively can not affect board, during data reading-writing, also easily can not be subject to the interference of metallic shield effect.
Accompanying drawing explanation
Figure 1A and 1B shows known solar wafer carrier end view and bottom view;
Fig. 2 shows the solar wafer carrier stereogram of the embodiment of the present invention; And
Fig. 3 A and 3B shows top view and the bottom view of the solar wafer carrier of another embodiment of the present invention respectively.
Main element symbol description:
1: known solar wafer carrier 10,20: upper plate
11,21: lower plate 12,22: support bar
100: solar wafer 110: circular groove
2: solar wafer carrier 201,211: vertical section
202,212: horizontal segment 203,213: the first additional locking elements
200,210: through hole 13,23: radio frequency label
24: retaining element 25: the second additional locking elements
Embodiment
For making above-mentioned purpose of the present invention, feature and advantage become apparent, hereafter according to solar wafer carrier of the present invention, especially exemplified by preferred embodiment, and coordinating appended correlative type, being described in detail below.
In order to make solar wafer be convenient to tracking and managing, solar wafer carrier of the present invention, in conjunction with the radio frequency label of the information of storage solar wafer.Not only can know when wafer passes in and out warehouse or production line, board and wireless radio-frequency can also be integrated, wafer lot number can be sent to board through wireless radio-frequency during testing wafer, board is made automatically to download corresponding formula, save manual work, reach the object of production line automation.
Please refer to Fig. 2, is the stereogram of solar wafer carrier of the present invention.Solar wafer carrier 2 comprises upper plate 20, lower plate 21, a plurality of support bar 22, one radio frequency label 23 and fixed bins 24.
In the present embodiment, upper plate 20 and lower plate 21 subtend are arranged, and are all U-shaped plate, the about 1cm of thickness.U-shaped plate has two vertical section 201,211 and horizontal segments 202,212 (below dotted line part), support bar 22 two ends are respectively with the first additional locking elements 203,213 vertical sections 201 being set up in upper plate 20 and lower plate 21, between 211, form the accommodation space placing solar wafer.
The material of the upper plate 20 of solar wafer carrier, lower plate 21 and support bar 22 becomes preferred with metal, metal material can provide higher intensity and durability compared to plastic-steel, certainly, not as limit, such as, certain of carrier is a part of, as: support bar also can be plastic-steel or other similar materials.Upper plate 20 or lower plate 21 one of them, be at least provided with pass through aperture 210, the object that through hole 210 is formed embeds radio frequency label 23.The carrier of a preferred embodiment of the present invention, be provided with pass through aperture 210 at the edge of lower plate 21 1 side, run through lower plate 21 front and rear surfaces, form an open groove, wherein, the degree of depth d of open groove is about 2cm to 3cm, and width w is about 0.2cm ~ 0.3cm.Certainly, through hole 210 also can be located at upper plate 20, and this changes according to the position height of reader.
Radio frequency label 23, in order to record the information of this batch of solar wafer, can be clavate.Described fixed bin 24 is used for placing unlimited radio-frequency (RF) tag 23, and the upper plate 20 be fixed on containing through hole 210 or lower plate 21.
Fixed bin 24 is provided with and radio frequency label 23 size, accommodation space that shape is identical, and radio frequency label 23 can be fixed on wherein.The external form of fixed bin 24 also coordinates through hole 210 size, then be locked in the upper plate 20 or lower plate 21 that comprise through hole 210 with the second additional locking elements 25.Certainly, the mode of tenon coupling also can be used to fix, such as: offer chute at through hole 210 inwall, fixed bin arranges the draw runner that can coordinate chute to slide, again fixed bin 24 is pushed in through hole 210, then fix with additional locking elements, prevent fixed bin from skidding off.
Fixed bin 24 material must be nonmetallic, such as, be selected from Teflon, acryl or plastic cement etc.Wherein, Teflon is best, because it has certain weatherability and intensity, after having offered through hole 210, the intensity of solar wafer carrier 2 is affected unavoidably, so utilize Teflon to supply because offer through hole 210, causes the situation that carrier 2 intensity is too low.
Fixed bin 24 is embedded in after in through hole 210, for reader from the axis direction of vertical clavate radio frequency label, read the information of those solar wafer, to avoid the interference of metallic shield effect, namely along in Fig. 3 A and Fig. 3 B, the direction of incident paper is read.
Although the through hole 210 of the present embodiment is positioned at the outer ledge of U-shaped plate vertical section, in fact, through hole 210 is positioned at vertical section inside edge, or is positioned at central authorities, can reach same effect.Or offer through hole 200,210 outside U-shaped plate two vertical section simultaneously, as illustrated in each of figures 3 a and 3b.
Because reader is fixed on board, conveniently reader reads, through hole 200, and the position of 210 is preferably positioned at horizontal segment more than 212, also prevents in course of conveying meanwhile, and fixed bin 24 is knocked and impaired.
Solar wafer carrier of the present invention, can be combined with the radio identification frequency marking label of all size, does not need to utilize special read-write equipment just can read write tag content, compared to prior art, convenient.In preferred embodiment, the radio frequency label used is passive type, and frequency range is low frequency, and scope is by 125KHz to 134.2KHz, and the comparatively normal frequency used is 125KHz or 1342KHz.
The present invention also makes solar wafer carrier by being arranged at the reader test of board, reader and radio frequency label are at a distance of about 8 ~ 9 centimeters, test 1000 times, successfully can read the information of radio frequency label at every turn, prove the embedded mode of solar wafer carrier radio frequency label of the present invention, really can avoid metallic shield effect.In addition, inventor also finds, if be only directly radio frequency label is attached at carrier, unless used special read-write specification as prior art, otherwise still cannot solve the problem of metallic shield.
In sum, solar wafer carrier of the present invention offers pass through aperture by upper plate or lower plate, embeds the mode of radio frequency label, does not need, through special reading device, just can avoid metallic shield effect.So low-frequency range radio frequency label conventional on the market at present, can be incorporated into solar wafer carrier and use, and except can reducing the impact on accurate board, can use lower cost, just reach object kinds of goods being positioned to tracking and managing simultaneously.
Though the present invention illustrates as above with preferred embodiments, so itself and be not used to limit the present invention spirit with invention entity only terminate in above-described embodiment.All persons that is familiar with technique, when can understanding easily and utilizing other element or mode to produce identical effect.Therefore not departing from the amendment done in spirit of the present invention and category, all should be included within the scope of the claims in the present invention.
Claims (8)
1. a solar wafer carrier, is characterized in that, described solar wafer carrier comprises:
One upper plate and a lower plate, wherein, described upper plate or described lower plate are at least provided with pass through aperture, run through front and rear surfaces, and the upper plate or the lower plate that are wherein provided with described through hole are metallic plates;
A plurality of support bars, described bracing member is located between described upper plate and lower plate, forms accommodation space, to place multiple solar wafer;
One clavate radio frequency label, the relevant information of the solar wafer described in record; And
One fixed bin, for on-metallic article, in order to accommodating and fixing described radio frequency label, and the through hole size described in coordinating is locked in the upper plate or lower plate that comprise described through hole, for the axis direction of reader from vertical described clavate radio frequency label, the information of the solar wafer described in reading, to avoid the interference of metallic shield effect.
2. carrier as claimed in claim 1, it is characterized in that, described clavate radio frequency label is passive type, and the frequency range used is 125KHz to 134.2KHz.
3. carrier as claimed in claim 1, it is characterized in that, described through hole is positioned at described upper plate or described lower plate lateral edges forms an open groove, and the described open groove degree of depth is 2cm to 3cm, and openings of sizes is 0.2cm to 0.3cm.
4. carrier as claimed in claim 3, it is characterized in that, described upper plate and described lower plate are U-shaped plate, and described through hole is positioned at the arbitrary vertical section side of described U-shaped plate.
5. carrier as claimed in claim 1, it is characterized in that, the material of described fixed bin is selected from Teflon, acryl or plastic cement one wherein.
6. carrier as claimed in claim 1, it is characterized in that, described fixed bin is fixed with an additional locking elements.
7. carrier as claimed in claim 1, it is characterized in that, described through hole inwall is provided with at least one chute, and described fixed bin is provided with the draw runner with described chute relative sliding, fixing after the through hole that described fixed bin is slided described in embedding.
8. carrier as claimed in claim 1, is characterized in that, described fixed bin is provided with and described clavate radio frequency label size, accommodation space that shape is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110355018.XA CN103107116B (en) | 2011-11-10 | 2011-11-10 | Solar wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110355018.XA CN103107116B (en) | 2011-11-10 | 2011-11-10 | Solar wafer carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103107116A CN103107116A (en) | 2013-05-15 |
| CN103107116B true CN103107116B (en) | 2015-08-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110355018.XA Expired - Fee Related CN103107116B (en) | 2011-11-10 | 2011-11-10 | Solar wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103107116B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109698157B (en) * | 2018-12-27 | 2021-08-24 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Fixing device for wafer box |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6718223B1 (en) * | 1999-05-18 | 2004-04-06 | Lintec Corporation | Method of processing semiconductor wafer and semiconductor wafer supporting member |
| CN101553420A (en) * | 2006-11-24 | 2009-10-07 | 约纳斯雷德曼自动化技术有限公司 | Method for forming a back-to-back wafer batch to be positioned in a process boot, and handling system for forming the btb wafer batch |
| CN102236834A (en) * | 2010-05-06 | 2011-11-09 | 亚洲太阳科技有限公司 | System and method for applying RFID (Radio Frequency Identification) to thin-film solar cell material management |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6714121B1 (en) * | 1999-08-09 | 2004-03-30 | Micron Technology, Inc. | RFID material tracking method and apparatus |
| JPWO2006075359A1 (en) * | 2005-01-11 | 2008-06-12 | 富士通株式会社 | IC tag storage case |
| JP3728320B1 (en) * | 2005-06-21 | 2005-12-21 | ニッタ株式会社 | Magnetic shield sheet for tag and tag |
| WO2008035307A2 (en) * | 2006-09-20 | 2008-03-27 | Bacon, Brian | Structure for reading the information on rfid tags |
-
2011
- 2011-11-10 CN CN201110355018.XA patent/CN103107116B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6718223B1 (en) * | 1999-05-18 | 2004-04-06 | Lintec Corporation | Method of processing semiconductor wafer and semiconductor wafer supporting member |
| CN101553420A (en) * | 2006-11-24 | 2009-10-07 | 约纳斯雷德曼自动化技术有限公司 | Method for forming a back-to-back wafer batch to be positioned in a process boot, and handling system for forming the btb wafer batch |
| CN102236834A (en) * | 2010-05-06 | 2011-11-09 | 亚洲太阳科技有限公司 | System and method for applying RFID (Radio Frequency Identification) to thin-film solar cell material management |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103107116A (en) | 2013-05-15 |
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Granted publication date: 20150826 Termination date: 20211110 |