CN103219295A - Conformal mask packaging structure and detection method - Google Patents
Conformal mask packaging structure and detection method Download PDFInfo
- Publication number
- CN103219295A CN103219295A CN2012100179192A CN201210017919A CN103219295A CN 103219295 A CN103219295 A CN 103219295A CN 2012100179192 A CN2012100179192 A CN 2012100179192A CN 201210017919 A CN201210017919 A CN 201210017919A CN 103219295 A CN103219295 A CN 103219295A
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- substrate
- conductive structure
- conductive
- suitable shape
- encapsulating structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
A conformal mask packaging structure comprises a substrate, a chip module arranged on the substrate, a sealing glue body covering the chip module and the surface of the substrate, and a conductive mask layer covering the sealing glue body. The substrate is provided with a plurality of internally-grounding conductive structures which are electrically connected, and the plurality of internally-grounding conductive structures are connected with the conductive mask layer. The conformal mask packaging structure is characterized in that the substrate is provided with at least one exposed independent conductive structure which is connected with the conductive mask layer. After the conformal mask packaging structure is manufactured, a resistance value between the independent conductive structure and the conductive mask layer or another independent conductive structure or a grounding point is measured, and the resistance value is judged whether is smaller than a standard value, namely electromagnetic mask efficiency of the conformal mask packaging structure can be detected easily.
Description
Technical field
The present invention be with packaging technology in utilize suitable shape mask (conformal shielding) to reach electromagnetic interference (electromagnetic interference; Abbreviation EMI) technology of function of shielding is relevant, particularly about a kind of suitable shape mask encapsulating structure, and in order to detecting the detection method of its screening effectiveness, and aforementioned encapsulating structure and detection method are also applicable to the situation of using suitable shape mask (conformal shielding) with sectional type mask (compartment shielding) simultaneously.
Background technology
Suitable shape mask is meant in packaging technology and forms a conductive mask layer with metal sputtering, spraying or other plated film modes at the outer peripheral face of electronic module, because this module cut operation through substrate before plated film, thereby have a plurality of interior ground connection conductive structures that are exposed outside, this conductive mask layer can electrically connect with described interior ground connection conductive structure after covering this module, thus, this conductive mask layer can prevent that the circuit of this module is subjected to the external electromagnetic wave interference.
Yet, suitable shape mask encapsulating structure easily because of substrate cut bad, the conductive mask layer is inhomogeneous or with interior ground connection conductive structure bad connection, and then cause the not good problem of screening effectiveness, therefore, quality in order to ensure suitable shape shielding, screening effectiveness after encapsulating structure is finished detects just must be with x-ray scanning, perhaps the destructiveness detection of sectility (cross section) is carried out in sampling, thus, just need to utilize expensive x-ray scanning instrument, or even the destruction finished product, increased the waste of material, therefore still remain to be improved.
Summary of the invention
Because above-mentioned shortcoming, main purpose of the present invention is to provide a kind of suitable shape mask encapsulating structure and detection method, need not pass through expensive instrument, also need not destroy finished product, can detect the screening effectiveness of encapsulating structure.
For reaching above-mentioned purpose, suitable shape mask encapsulating structure provided by the present invention includes a substrate, at least one chip module on this substrate, adhesive body of this chip module of covering be located at, and the conductive mask layer of this adhesive body of covering, this substrate has the interior ground connection conductive structure of a plurality of mutual electric connections, and the ground connection conductive structure is to be connected with this conductive mask layer in wherein a plurality of; This encapsulating structure is characterised in that this substrate has more at least one separate conductive structure that is exposed outside, and this separate conductive structure is to be connected with this conductive mask layer.
Preferable, a plurality of sides of this substrate are respectively equipped with this separate conductive structure.In addition, when the quantity of this chip module is a plurality of and electromagnetic shielding compartment demand is arranged, at least one separate conductive structure is located between the described chip module, this substrate is provided with one first conductor with this separate conductive structure conduction, this adhesive body is provided with a groove being installed with one second conductor, and this second conductor is to electrically connect this first conductor and this conductive mask layer.
Suitable shape mask detection method provided by the present invention includes the following step:
A) provide an encapsulating structure, this encapsulating structure includes a substrate, and is located at the chip module on this substrate, the adhesive body of this chip module of covering, and the conductive mask layer of this adhesive body of covering, this substrate has the interior ground connection conductive structure of a plurality of mutual electric connections, and a separate conductive structure that is exposed outside, and this separate conductive structure and wherein a plurality of in the ground connection conductive structures be to be connected with this conductive mask layer; And
B) measure the resistance value between the earth point on this separate conductive structure and this conductive mask layer or another separate conductive structure or this substrate, and judge that whether this resistance value is less than a standard value.
Wherein, a ground plane in ground connection conductive structure or this substrate in this earth point connection is somebody's turn to do, and be exposed outside.
After completing, this encapsulating structure can detect by aforementioned detection method.If the resistance value overgauge value that records, then the separate conductive structure that is measured have cut bad or with the problem of this conductive mask layer bad connection, perhaps, this conductive mask layer has the problem of thickness distribution inequality.If each separate conductive structure is all passed through the step that resistance measures, and respectively this resistance value all is less than or equal to standard value, then this encapsulating structure can be determined and have good electromagnetism masking effect.
Detailed construction, characteristics, assembling or the occupation mode of relevant suitable shape mask encapsulating structure provided by the present invention and detection method will be described in follow-up execution mode describes in detail.Yet, in field of the present invention, having and know that usually the knowledgeable should be able to understand, described detailed description and the cited specific embodiment of enforcement the present invention only are to be used to illustrate the present invention, are not in order to limit patent claim of the present invention.
Description of drawings
Below will cooperate the accompanying drawing of enclosing, describe technology contents of the present invention and feature in detail by cited embodiment, wherein:
The cross-sectional schematic of the suitable shape mask encapsulating structure that Fig. 1 is provided for the present invention one first embodiment;
The schematic diagram of the side of the substrate of the suitable shape mask encapsulating structure that Fig. 2 is provided for the present invention one first embodiment;
The schematic diagram of one ground plane of one substrate internal layer of the suitable shape mask encapsulating structure that Fig. 3 is provided for this first embodiment of the present invention;
The schematic diagram of the bottom surface of the substrate of the suitable shape mask encapsulating structure that Fig. 4 is provided for this first embodiment of the present invention; And
The cross-sectional schematic of the suitable shape mask encapsulating structure that Fig. 5 is provided for the present invention one second embodiment.
Embodiment
See also each accompanying drawing, the suitable shape mask encapsulating structure 10 that the present invention one first embodiment is provided includes a substrate 20, at least one is located at the chip module 30 on this substrate 20, the adhesive body 60 of this chip module 30 of covering, and the conductive mask layer 70 of this adhesive body 60 of mask, wherein the quantity of this chip module 30 is two in the present embodiment.
This substrate 20 be with existing multilayer board roughly the same, its internal layer has at least one ground plane 22, and this substrate 20 has a plurality of interior ground connection conductive structures 23,24 that are arranged in ground connection passage in the printed circuit board (PCB) (Ground Via) respectively and are electrically connected at ground plane 22, aforementioned ground connection passage can adopt through hole, blind hole, buried via hole or other similar structures and combination thereof, ground connection conductive structure the 23, the 24th in described, common various conduction Connection Elements and the combination thereof of general reference multilayer circuit board, and electric connection mutually by ground plane 22.
Respectively this chip module 30 is and this substrate 20 electrically connects, and respectively the grounding leg (not shown) of this chip module 30 be connected in the interior ground connection conductive structure 23,24 of this substrate 20 or ground plane 22 at least one of them.
See also Fig. 2, this substrate 20 is to have a plurality of separate conductive structure 27,28 with the difference of existing substrate, so respectively the difference of this separate conductive structure 27,28 and interior ground connection conductive structure 23,24 is not being conducted electricity mutually with ground plane 22, and described separate conductive structure the 27, the 28th, be emerging in the bottom surface 26 of this substrate 20.
Additional disclosure be, though described separate conductive structure 27,28 is end face and the bottom surface that is not communicated with this substrate 20 in the present embodiment, but also can changing, described separate conductive structure 27,28 adopts the design that is communicated with these substrate 20 end faces, perhaps be formed by connecting, will illustrate in detail in aftermentioned embodiment by cabling (Trace).
In the present embodiment, electromagnetic wave interferes with each other between this two chip module 30 in order to avoid, ground connection conductive structure 23 and separate conductive structure 27 are to be located between this two chip module 30 in described, these substrate 20 tops be provided with can with described in one first conductor 81 (for example Copper Foil) of ground connection conductive structure 23 and separate conductive structure 27 conductions, described chip module 30 is sealed by this adhesive body 60 after being provided with and finishing, then, utilize laser to cut out a groove 62 in this adhesive body 60 along particular path, to manifest this first conductor 81, and electric conducting material (for example elargol) injected this groove 62, to form one second conductor 82.Then, the shape that this adhesive body 60 and this substrate 20 cropped one-tenth are predetermined, this conductive mask layer 70 just is formed at the outer surface of this adhesive body 60 and this second conductor 82 with metal sputtering, spraying or other plated film modes at last.
Through aforementioned cutting step, ground connection conductive structure 24 and separate conductive structure 28 can be cut open and be positioned at around this substrate 20 in described, and can interconnect with the conductive mask layer 70 that covers subsequently, though non-this substrate 20 ground connection conductive structure 23 and separate conductive structure 27 on every side that be positioned at is not cut open, and also can electrically connect by first, second conductor 81,82 and this conductive mask layer 70.As long as ground connection conductive structure 24 and separate conductive structure 28 cut proper in described, and, these conductive mask layer 70 thickness distribution are even and good with described interior ground connection conductive structure 24, separate conductive structure 28 and second conductor, 82 connection states, this conductive mask layer 70 can prevent this two chip module 30 Electromagnetic Interference to each other, also can avoid this two chip module 30 to be subjected to the Electromagnetic Interference of these encapsulating structure 10 outsides.
In addition, when this encapsulating structure 10 only has a chip module 30, the problem that does not have electromagnetic interference between the perhaps described chip module 30, then need not have structures such as described interior ground connection conductive structure 23, separate conductive structure 27 and first, second conductor 81,82, can reach the low-cost and convenient purpose that detects of the present invention equally.
After aforementioned encapsulating structure 10 completes, as long as measure the wherein resistance value between the separate conductive structure 27,28 and this conductive mask layer 70, and judge that whether this resistance value is less than a standard value, for example 1 ohm (Ohm), then whether the conductive effect of the separate conductive structure 27,28 that measured of decidable and this conductive mask layer 70 is good.Thus, by measuring the resistance value between each separate conductive structure 27,28 and this conductive mask layer 70, can judge whether this encapsulating structure 10 has to cut or problem that plated film is bad.As long as respectively this resistance value all is less than or equal to this standard value, then this encapsulating structure 10 of decidable has good electromagnet shield effect.If the situation of resistance value greater than this standard value arranged, then must carry out meticulousr detection to this encapsulating structure 10 again.
Perhaps, measure in the described separate conductive structure 27,28 resistance value of appointing between the two, and whether judge this resistance value less than this standard value, also whether the conductive effect of this two separate conductive structure 27,28 of being measured of decidable and this conductive mask layer 70 is good.Therefore, by measuring the resistance value between any one in each separate conductive structure 27,28 and all the other separate conductive structure 27,28, make each separate conductive structure 27,28 all have and measured, can judge whether this encapsulating structure 10 has to cut or problem that plated film is bad.As long as respectively this resistance value all is less than or equal to this standard value, then this encapsulating structure 10 of decidable has good electromagnet shield effect.
What deserves to be mentioned is, in the detection method that previous embodiment is lifted, this standard value not necessarily will be set before measurement in advance, for example, all resistance values all measure finish after, obtain this standard value by described resistance value, that is to say, if described resistance value major part is all close and less, but the resistance value that has small part to measure is bigger, and the maximum is a standard value in the then desirable described less resistance value.
In the aforementioned embodiment, the cropped four side that goes out of this substrate 20 has at least one this separate conductive structure 28 respectively, and described separate conductive structure 27 is to be interspersed between the described interior ground connection conductive structure 23, therefore, with preceding method described separate conductive structure 27,28 being carried out resistance measures, can judge more accurately whether this encapsulating structure 10 is made well, and more can judge and make bad position.Yet, the quantity of the separate conductive structure 27,28 of this encapsulating structure 10 and position is set is not limited to them, nor must measure each separate conductive structure 27,28.
See also shown in Figure 5 again, the invention provides one second embodiment, its primary structure and aforementioned first embodiment are roughly the same, its main distinction is: this separate conductive structure 27 is to be distinguished at least two sections and be formed by connecting by cabling (Trace), and be electrically connected at this conductive mask layer 70 by first, second conductor 81,82, in addition, these substrate 20 bottom surfaces also are provided with connection and are somebody's turn to do interior ground connection conductive structure or this ground plane, and at least one earth point 25 that is exposed outside, the quantity of this earth point 25 are two in the present embodiment.Thus, the detection method that present embodiment adopted just can measure described separate conductive structure 27 or 28 and arbitrary earth point 25 between resistance value, to judge the electromagnet shield effect of this encapsulating structure 10.
Certainly, separate conductive structure 27 and 28 is to be revised as multi-segment structure according to circumstances in the previous embodiment, still belongs to equivalence techniques category of the present invention.
By suitable shape mask encapsulating structure 10 provided by the present invention and detection method, need be by expensive x-ray scanning instrument, also need not destroy finished product, as long as utilize simple resistance measuring instrument, can detect the electromagnetism mask usefulness of this encapsulating structure 10 apace, thereby can all finished products be detected one by one, further avoid taking the contingent error of finished product sampling Detection.
At last, must illustrate once more that the present invention takes off disclosed composed component among the embodiment in preceding, only for illustrating, be not the scope that is used for limiting this case, the alternative or variation of other equivalence elements, and the claim scope that also should be this case contains.
Claims (9)
1. suitable shape mask encapsulating structure, include a substrate, at least one adhesive body of being located at chip module, this chip module of covering and substrate surface on this substrate, and the conductive mask layer of this adhesive body of covering, this substrate has the interior ground connection conductive structure of a plurality of mutual electric connections, and the ground connection conductive structure is connected with this conductive mask layer in wherein a plurality of; This encapsulating structure is characterised in that:
This substrate also has at least one separate conductive structure that is exposed outside, and this separate conductive structure is connected with this conductive mask layer.
2. suitable shape mask encapsulating structure as claimed in claim 1, wherein each side of this substrate has at least one this separate conductive structure respectively.
3. suitable shape mask encapsulating structure as claimed in claim 1 or 2, wherein the quantity of this chip module is a plurality of and when the demand of electromagnetic shielding compartment is arranged, at least one separate conductive structure is located between the described chip module, this substrate is provided with one first conductor with this separate conductive structure conduction, this adhesive body is provided with a groove being installed with one second conductor, and this second conductor electrically connects this first conductor and this conductive mask layer.
4. suitable shape mask encapsulating structure as claimed in claim 1, wherein this separate conductive structure is distinguished into multistage and is formed by connecting by at least one cabling.
5. suitable shape mask encapsulating structure as claimed in claim 1, wherein this substrate also is provided with and is connected in ground connection conductive structure or the interior ground plane of this substrate in this, and at least one earth point that is exposed outside.
6. suitable shape mask encapsulating structure detection method includes the following step:
A) provide a suitable shape mask encapsulating structure, this encapsulating structure includes a substrate, at least one adhesive body of being located at chip module, this chip module of covering and substrate surface on this substrate, and the conductive mask layer of this adhesive body of covering, this substrate has the interior ground connection conductive structure of a plurality of mutual electric connections, and at least one separate conductive structure that is exposed outside, and this separate conductive structure and wherein a plurality of in the ground connection conductive structures be connected with this conductive mask layer; And
B) measure resistance value between this separate conductive structure and this conductive mask layer, and judge that whether this resistance value is less than a standard value.
7. suitable shape mask encapsulating structure detection method as claimed in claim 6, wherein the encapsulating structure that this step a) provided has at least one separate conductive structure, this step b) measures the resistance value between this separate conductive structure respectively or another separate conductive structure respectively, and judges that respectively whether this resistance value is less than this standard value.
8. suitable shape mask encapsulating structure detection method as claimed in claim 6, wherein the substrate of the encapsulating structure that this step a) provided also is provided with connection and is somebody's turn to do a ground plane in interior ground connection conductive structure or this substrate, and at least one earth point that is exposed outside, this step b) is the resistance value that measures between this separate conductive structure and this earth point, and judges that respectively whether this resistance value is less than this standard value.
9. suitable shape mask encapsulating structure detection method as claimed in claim 7, wherein each side of this substrate has at least one this separate conductive structure respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210017919.2A CN103219295B (en) | 2012-01-20 | 2012-01-20 | Conformal mask encapsulating structure and detection method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210017919.2A CN103219295B (en) | 2012-01-20 | 2012-01-20 | Conformal mask encapsulating structure and detection method |
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| CN103219295A true CN103219295A (en) | 2013-07-24 |
| CN103219295B CN103219295B (en) | 2015-12-16 |
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| US20010008301A1 (en) * | 1997-09-02 | 2001-07-19 | Makoto Terui | Semiconductor device |
| JP2004172176A (en) * | 2002-11-18 | 2004-06-17 | Taiyo Yuden Co Ltd | Circuit module |
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| CN103219295B (en) | 2015-12-16 |
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